Pin-free semiconductor lead frame

Abstract

The utility model discloses a no-pin type semiconductor lead frame, which comprises a frame main body, a plurality of substrates distributed in an array are arranged in the frame main body, a plurality of connecting leads distributed annularly are fixedly connected in the plurality of substrates, one ends of the plurality of connecting leads are fixedly connected with mounting plates, and the other ends of the plurality of connecting leads are fixedly connected with the mounting plates. The front face of the mounting plate is fixedly connected with two symmetrically-distributed positioning rods, the front face of the mounting plate is fixedly connected with a positioning frame, and a positioning hole is formed in the mounting plate. According to the utility model, through the arrangement of the positioning rod, when the chip is installed, the positioning frame positions the chip, the fixing rod is arranged at the lower end of the chip, the positioning groove is arranged in the chip, and through the cooperation of the fixing rod and the positioning hole and the cooperation of the positioning rod and the positioning groove, the chip is positioned. And the chip is prevented from deviating in the mounting and welding processes.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor lead frame technical field, concretely is a kind of leadless semiconductor lead frame. BACKGROUND

[0002] Leadless semiconductor lead frame is an important component for semiconductor packaging, which has unique design and structural characteristics. Leadless semiconductor lead frame is mainly used in the packaging process of semiconductor devices, providing electrical connection and support. It adopts leadless design to replace traditional leaded lead frame, with higher reliability and stability. Compared with traditional leaded lead frame, leadless lead frame has higher reliability, reduces the failure caused by lead breakage or looseness; leadless design makes the packaging process more simple and efficient, improves production efficiency. Leadless lead frame is suitable for high-density packaging, meeting the demand of modern electronic equipment for miniaturization and high performance.

[0003] Prior art provides matrix type semiconductor lead frame (announcement number: CN220367914U), the device matrix type semiconductor lead frame, including frame substrate and the plurality of installation units arranged in matrix type in frame substrate, the installation unit includes first installation unit and second installation unit, first installation unit and second installation unit structure are same;The first installation unit includes lead frame body, the inner wall of lead frame body one side is equipped with a plurality of first pins, the inner wall of lead frame body other side is equipped with a plurality of second pins corresponding with the position of first pin;A plurality of first pins are connected to each other by the outer wall of one end of second pin through connecting sheet.

[0004] But the device still has the following defects:

[0005] The device, when in use, the chip is installed on the mounting plate, and the chip and the mounting plate need to be welded. During the installation process of the chip and the welding process of the chip, the position of the chip is easy to deviate, which can cause the chip to be welded out of position and affect the use of the chip. Therefore, we need to propose a leadless semiconductor lead frame. Utility model content

[0006] The utility model aims at providing a leadless semiconductor lead frame. When installing the chip, the positioning frame positions the chip. A fixing rod is arranged at the lower end of the chip, and a positioning slot is formed in the interior of the chip. The fixing rod cooperates with the positioning hole, and the positioning rod cooperates with the positioning slot, which positions the chip and prevents it from deviating during installation and welding, thereby solving the problems in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0008] A pinless semiconductor lead frame, comprising a frame body, an array of substrates is arranged in the frame body, a plurality of connecting leads in annular arrangement are fixedly connected to the substrates, an installation plate is fixedly connected to one end of the connecting leads, two positioning rods in symmetrical arrangement are fixedly connected to the front face of the installation plate, a positioning frame is fixedly connected to the front face of the installation plate, and a positioning hole is arranged in the installation plate.

[0009] Preferably, the substrate is frame-shaped, and the substrate is made of copper.

[0010] Preferably, a plurality of installation holes in annular arrangement are arranged in the frame body, and a thread is arranged in each installation hole.

[0011] Preferably, a plurality of fixing rods in array arrangement are fixedly connected to the upper end of the frame body, and each fixing rod is made of metal.

[0012] Preferably, a protruding strip is fixedly connected to the front face of the installation plate, and the protruding strip is made of rubber.

[0013] Preferably, a groove is arranged on the back face of the installation plate.

[0014] Compared with the prior art, the pinless semiconductor lead frame has the following beneficial effects:

[0015] The positioning frame positions the chip when the chip is installed, the fixing rod is arranged at the lower end of the chip, the positioning groove is arranged in the chip, the fixing rod cooperates with the positioning hole, and the positioning rod cooperates with the positioning groove, so that the chip is positioned, and the chip is prevented from being deviated during installation and welding. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 Fig. 1 is a structural schematic view of the pinless semiconductor lead frame;

[0017] Fig. 2 Fig. 2 is another structural schematic view of the pinless semiconductor lead frame;

[0018] Fig. 3 Fig. 3 is a structural schematic view of the substrate and the connecting lead of the pinless semiconductor lead frame.

[0019] In the drawings: 1, frame body; 2, installation hole; 3, fixing rod; 4, substrate; 5, connecting lead; 6, installation plate; 7, positioning rod; 8, positioning frame; 9, positioning hole; 10, protruding strip; 11, groove. DETAILED DESCRIPTION

[0020] Clearly, the described embodiments are merely a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0021] Please refer to Figs. 1-3 The present application provides a technical scheme:

[0022] A pinless semiconductor lead frame, comprising a frame body 1, a plurality of substrates 4 are arranged in an array in the interior of the frame body 1, a plurality of connecting leads 5 are arranged in a ring in the interior of each of the plurality of substrates 4, an installation plate 6 is fixedly connected to one end of each of the plurality of connecting leads 5, two positioning rods 7 are fixedly connected to the front surface of the installation plate 6 in a symmetrical manner, a positioning frame 8 is fixedly connected to the front surface of the installation plate 6, and a positioning hole 9 is formed in the interior of the installation plate 6.

[0023] The substrate 4 is frame-shaped, and the substrate 4 is made of copper.

[0024] Exemplarily, the copper substrate 4 has extremely high electrical conductivity, can effectively transmit electrical signals, reduce resistance and signal attenuation, the high thermal conductivity of the copper substrate 4 helps to quickly conduct and dissipate the heat generated by the chip, keeps the chip working at a suitable temperature, the copper substrate 4 provides mechanical support for the chip, ensures the stability and reliability of the chip during the packaging process, the copper substrate 4 helps to dissipate the heat generated by the chip, thereby protecting the chip from overheating damage, the copper substrate 4 has a relatively low cost compared to other materials, can meet the requirements of large-scale commercial applications, the copper substrate 4 has good brazing properties, is convenient to connect with the chip and other packaging materials, the thermal expansion coefficient of the copper substrate 4 matches the semiconductor chip, reduces the influence of thermal stress on the chip, the copper substrate 4 usually has sufficient strength and rigidity to withstand mechanical stress during the packaging process, the copper substrate 4 is easy to process and form, is suitable for complex lead frame design, the copper substrate 4 has good corrosion resistance and can resist corrosive substances in the environment.

[0025] A plurality of installation holes 2 are formed in the interior of the frame body 1 in a ring, and a plurality of installation holes 2 are formed in the interior of the frame body 1 in a ring.

[0026] Exemplarily, the inside of the mounting hole 2 is provided with threads, facilitating the installation of the frame body 1 through the mounting hole 2. The threaded mounting hole 2 can be used in conjunction with screws, providing a stable installation method that ensures the secure connection between the lead frame and other components, reducing looseness caused by vibration or impact. The threaded hole can provide precise fixing points, helping to achieve precise positioning during assembly, thereby improving the overall assembly accuracy of the product. The threaded hole can serve as a stress release point, helping to disperse and release internal stress caused by temperature changes or other external factors, thereby improving the structural strength and durability of the lead frame. The threaded mounting hole 2 can be selected according to different installation requirements, enhancing the adaptability of the lead frame to different application scenarios.

[0027] The upper end of the frame body 1 is fixedly connected with a plurality of fixed rods 3 arranged in an array, and the plurality of fixed rods 3 are all made of metal.

[0028] Exemplarily, when the frame body 1 is being processed, the fixed rod 3 facilitates positioning of the frame body 1, preventing the frame body 1 from moving.

[0029] The front surface of the mounting plate 6 is fixedly connected with a protrusion 10, and the protrusion 10 is made of rubber.

[0030] Exemplarily, when the frame body 1 is being overmolded, the protrusion 10 can block the plastic, helping to offset the stress generated during the curing of the plastic during the packaging process, thereby protecting the chip from physical and chemical damage. The role of the rubber protrusion 10 on the lead frame is mainly to provide additional support and stability, as well as possible dust and water resistance. In addition, the rubber protrusion 10 can adapt to size changes caused by temperature changes, thereby maintaining the stability of the lead frame, which is crucial for the long-term reliability of semiconductor devices. Rubber materials generally have good insulation properties, so they can also provide additional electrical insulation protection. In some designs, the rubber protrusion 10 can also be used to absorb vibrations and reduce noise, improving the durability and performance of the device.

[0031] The back surface of the mounting plate 6 is provided with a groove 11.

[0032] Exemplarily, when the mounting plate 6 is in use, the groove 11 serves to position the mounting plate 6. The groove 11 can provide precise fixing points, helping to achieve precise positioning during assembly, thereby improving the overall assembly accuracy of the product. The groove 11 design can serve as a stress release point, helping to disperse and release internal stress caused by temperature changes or other external factors, thereby improving the structural strength and durability of the lead frame.

[0033] Working principle: the utility model uses, when installing the chip, the positioning frame 8 is positioned to the chip, is provided with the fixed rod 3 at the lower end of the chip simultaneously, and the positioning slot is set up in the inside of the chip, through the cooperation of fixed rod 3 and positioning hole 9, and the cooperation of positioning rod 7 and positioning slot, the chip is positioned, prevents the chip from deviating in the process of installation and welding;

[0034] When the frame main body 1 is processed, the inside of the mounting hole 2 is provided with a thread, so as to facilitate the installation of the frame main body 1 through the mounting hole 2, and the fixed rod 3 is convenient for positioning the frame main body 1, preventing the frame main body 1 from moving;

[0035] The convex strip 10 can strengthen the mounting plate 6, and when the frame main body 1 is plastic encapsulated, the convex strip 10 can limit the plastic, and the recess 11 can position the mounting plate 6.

[0036] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A leadless semiconductor lead frame, comprising a frame body (1), characterized in that: The frame body (1) has multiple base plates (4) arranged in an array inside. Multiple connecting leads (5) are fixedly connected in a ring inside each of the multiple base plates (4). One end of each of the multiple connecting leads (5) is fixedly connected to a mounting plate (6). Two symmetrically distributed positioning rods (7) are fixedly connected to the front of the mounting plate (6). A positioning frame (8) is fixedly connected to the front of the mounting plate (6). A positioning hole (9) is opened inside the mounting plate (6).

2. The leadless semiconductor lead frame according to claim 1, characterized in that: The substrate (4) is frame-shaped and is made of copper.

3. The leadless semiconductor lead frame according to claim 1, characterized in that: The frame body (1) has a plurality of mounting holes (2) arranged in a ring, and each of the mounting holes (2) has a thread inside.

4. A leadless semiconductor lead frame according to claim 3, characterized in that: The upper end of the frame body (1) is fixedly connected to a plurality of fixed rods (3) arranged in an array, and the plurality of fixed rods (3) are all made of metal.

5. A leadless semiconductor lead frame according to claim 1, characterized in that: The mounting plate (6) has a protruding strip (10) fixedly connected to its front side, and the protruding strip (10) is made of rubber.

6. A leadless semiconductor lead frame according to claim 5, characterized in that: The mounting plate (6) has a groove (11) on its back side.

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