High-frequency and high-speed multilayer board with exposed inner layer bonding pad

Abstract

The utility model discloses a high-frequency and high-speed multilayer board with an exposed inner-layer bonding pad. The multi-layer substrate is provided with an exposed bonding pad; the curing plate is pressed on the multi-layer substrate and is provided with a first hole position opposite to the bonding pad; the single-sided board is pressed on the curing board and is provided with a second hole position opposite to the first hole position; a copper layer is arranged at the lower end of the multi-layer substrate, the product is more resistant to bending by additionally arranging the copper layer, so that the structural stability is better, and the copper layer can be arranged to be thinner.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of PCB especially relates to a high frequency high speed inner layer pad exposed multilayer board. BACKGROUND

[0002] At present, the circuit board of high frequency high speed is poor in bending, and the copper skin will be broken after the product is bent for many times. INVENTION CONTENTS

[0003] In order to solve the above problems, the technical scheme provides a high frequency high speed inner layer pad exposed multilayer board.

[0004] In order to achieve the above object, the technical scheme is as follows:

[0005] A kind of high frequency high speed inner layer pad exposed multilayer board, comprising;

[0006] Multilayer substrate, the multilayer substrate is provided with exposed pad;

[0007] Curing plate, press in the multilayer substrate, it is provided with first hole site relative to the pad;

[0008] Single-sided board, press in the curing plate, it is provided with second hole site relative to the first hole site;

[0009] The lower end of the multilayer substrate is provided with copper layer.

[0010] In some embodiments, the curing plate is not glue half-solidified sheet PP material.

[0011] In some embodiments, the multilayer substrate includes upper plate and lower plate, the upper plate is covered with first heat dissipation copper foil, the lower plate is covered with second heat dissipation copper foil, the upper plate and lower plate are located in the first heat dissipation copper foil and second heat dissipation copper foil are provided with heat dissipation hole, the heat dissipation hole is through with heat conduction strip, the second heat dissipation copper foil is provided with window.

[0012] In some embodiments, the second heat dissipation copper foil area is larger than first heat dissipation copper foil.

[0013] The application has the following beneficial effects:

[0014] The application adds copper layer to make the product more resistant to bending, so that the structure is more stable, and the copper layer can be made thinner.

[0015] The application is provided with curing plate and single-sided board on the upper end of multilayer substrate in sequence, drilling is carried out on the corresponding position of pad, so that the pad is cut open and exposed, since two plates are added, there is certain pressure when drilling, so that the drilling intensity is better controlled, to prevent the pad from being damaged, through the design, laser technology is replaced, process optimization is realized, the scrap rate is reduced, and the quality is more guaranteed.BRIEF DESCRIPTION OF DRAWINGS BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows.

[0017] Figure 1 is a structural schematic diagram of the embodiment of the present application Figure 1 ;

[0018] Figure 2 is a structural schematic diagram of the embodiment of the present application Figure 2 . DETAILED DESCRIPTION

[0019] In order to make the technical problems, technical solutions and beneficial effects solved by the present application more clearly understood, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0020] Please refer to Figures 1-2 A high-frequency high-speed inner layer pad exposed multilayer board, comprising:

[0021] A multilayer substrate 1, which is provided with an exposed pad 101;

[0022] A curing plate 2 is pressed on the multilayer substrate 1, and a first hole site 201 is provided opposite the pad 101;

[0023] A single-sided plate 3 is pressed on the curing plate 2, and a second hole site 301 is provided opposite the first hole site 3.

[0024] The lower end of the multilayer substrate 1 is provided with a copper layer 4. The present application adds a copper layer to make the product more resistant to bending, so that the structure is more stable, and the copper layer can be made thinner.

[0025] The curing plate and the single-sided plate are sequentially arranged on the upper end of the multilayer substrate, and the pad is drilled at the corresponding position to expose the pad. Since two plates are added, there is a certain pressure when drilling, so that the drilling force can be better controlled to prevent the pad from being damaged. Through this design, the laser technology is replaced, the process is optimized, the scrap rate is reduced, and the quality is more guaranteed.

[0026] In the present embodiment, the curing plate 2 is a no-flow gel half-cured sheet PP material.

[0027] In the embodiment, the multilayer substrate 1 comprises an upper plate 11 covered with a first heat dissipation copper foil 13 and a lower plate 12 covered with a second heat dissipation copper foil 14, the upper plate 11 and the lower plate 12 are provided with heat dissipation holes, the heat dissipation holes are penetrated by heat conduction strips 15, and the second heat dissipation copper foil 14 is provided with windows 16.

[0028] The application effectively increases the heat dissipation area through the first heat dissipation copper foil, and then transmits the absorbed heat to the second heat dissipation copper foil of the lower plate through the heat conduction strips, and the heat is well discharged from the windows of the second heat dissipation copper foil, thereby obtaining good heat dissipation performance.

[0029] In the embodiment, the area of the second heat dissipation copper foil 14 is larger than that of the first heat dissipation copper foil 13, thereby further improving the heat dissipation performance.

[0030] The above is only the preferred embodiment of the application, and is not used to limit the scope of the application, and other applications with the same or similar principles and basic structures as the application are within the protection scope of the application.

Claims

1. A high-frequency high-speed inner-layer pad-exposed multilayer board, characterized by, Comprise; Multilayer substrate (1), the multilayer substrate (1) is provided with exposed pad (101); Curing plate (2) is pressed together on the multilayer substrate (1), and the first hole site (201) is provided opposite the pad (101); Single-sided board (3) is pressed together on the curing plate (2), and the second hole site (301) is provided opposite the first hole site (201); The lower end of the multilayer substrate (1) is provided with a copper layer (4).

2. The multilayer board of claim 1, wherein: the high frequency high speed inner pad is exposed to the outside. The curing plate (2) is a no-flow prepreg PP material.

3. The multi-layer board of claim 2, wherein: the high frequency high speed inner layer pad is exposed on the surface of the board. The multilayer substrate (1) comprises an upper plate (11) and a lower plate (12), the upper plate (11) is covered with a first heat dissipation copper foil (13), the lower plate (12) is covered with a second heat dissipation copper foil (14), the upper plate (11) and the lower plate (12) are provided with heat dissipation holes on the first heat dissipation copper foil (13) and the second heat dissipation copper foil (14), the heat dissipation holes are provided with heat conduction strips (15), and the second heat dissipation copper foil (14) is provided with a window (16).

4. The multi-layer board of claim 3, wherein: the high frequency high speed inner layer pad is exposed on the surface of the board. The area of the second heat dissipation copper foil (14) is larger than that of the first heat dissipation copper foil (13).

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