SMT (Surface Mount Technology) reflow soldering temperature control device with partitioned heating function

Abstract

The utility model relates to the technical field of reflow soldering, and discloses an SMT reflow soldering temperature control device with partition heating, which comprises a reflow soldering machine tool, one end of the top of the reflow soldering machine tool is fixedly connected with a cooling box, and the top of the cooling box is fixedly sleeved with a filter screen. A square hole matched with the filter screen is formed in the top of the cooling box, a same rotating plate is rotationally connected between the two ends of the inner side of the cooling box, a micro motor is fixedly connected to the middle of the top of the rotating plate, the bottom of the micro motor penetrates through the rotating plate to be fixedly connected with fan blades, and vertical rods are fixedly connected to the two ends of the bottom of the rotating plate; the side, close to the middle of the reflow soldering machine tool, of the cooling box is provided with a shielding mechanism. According to the utility model, the technical effects that the thermal load in the cooling box is reduced, the cooling box can more efficiently cool a workpiece, the production efficiency is obviously improved, and the production cost is reduced are realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to reflow soldering technical field especially relates to a partition heating's SMT reflow solder temperature control device. BACKGROUND

[0002] In the electronic manufacturing field, surface mount technology (SMT) has been widely used in the production process of various electronic products. As a key link in SMT process, the welding quality of SMT reflow solder directly affects the performance and reliability of electronic products.

[0003] In the prior art, the temperature of the reflow solder temperature control device is easy to control, but the heating zone and the cooling zone are often close to each other in the temperature control of SMT reflow solder, which causes temperature mutual stringing and mutual interference between the heating zone and the cooling zone, thereby reducing the heating and cooling effect of SMT reflow solder and affecting the processing efficiency of reflow solder. Therefore, a partition heating's SMT reflow solder temperature control device is designed. UTILITY MODEL CONTENT

[0004] The utility model discloses a partition heating's SMT reflow solder temperature control device to solve the shortcoming in prior art.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] A partition heating's SMT reflow solder temperature control device, including reflow soldering machine bed, the top of reflow soldering machine bed one end is connected with cooling box, the top of cooling box is fixedly provided with filter screen, and the top of cooling box is provided with square hole that is suitable for filter screen, the same rotating plate is rotatably connected between the inner side of cooling box two ends, the rotating plate top middle position is fixedly connected with micro motor, and the bottom of micro motor is fixedly connected with fan blade through rotating plate, the bottom of rotating plate both ends is fixedly connected with vertical rod, and the bottom of vertical rod both ends is fixedly connected with arc rack, the side of cooling box close to the middle part of reflow soldering machine bed is provided with shielding mechanism.

[0007] As a further scheme of the utility model, the shielding mechanism includes the shielding plate that is slidably inserted into the top of cooling box close to the middle part of reflow soldering machine bed one end, the top of cooling box is provided with strip hole that is suitable for shielding plate, the top of shielding plate is fixedly connected with top rod, the outer wall of cooling box both ends is fixedly connected with fixed plate, the top of two fixed plates is fixedly connected with electric push rod, and the top of two electric push rods is fixedly connected in the bottom of two ends of top rod.

[0008] As a further scheme of the utility model, the shielding mechanism further includes a visual sensor fixedly connected to one side of the shielding plate away from the rotating plate, straight racks are fixedly embedded at both ends of the side of the shielding plate close to the arc-shaped rack, and each straight rack is engaged with the arc-shaped rack close thereto, so that when the shielding plate rises, the bottom of the fan blade is automatically inclined toward the bottom of the shielding plate, and heat on one side of the heating box is less likely to enter one side of the heating box.

[0009] As a further scheme of the utility model, the top of the reflow soldering machine further fixedly connects a heating box, and the heating box is in contact with the cooling box, a sleeve is fixedly sleeved at the top of the heating box, a circular hole matched with the sleeve is formed in the top of the heating box, a protective net is fixedly connected to the top of the sleeve, and a blowing fan is fixedly installed in the sleeve through a mounting plate.

[0010] As a further scheme of the utility model, the heating box is fixedly connected with mounting racks at both ends of the inner side, and a plurality of electric heating pipes are fixedly connected between the two mounting racks, so that the workpiece can be fully contacted with heat through the cooperation of the electric heating pipe and the blowing fan.

[0011] As a further scheme of the utility model, the top of the reflow soldering machine further fixedly connects a heating box, and the heating box is in contact with the cooling box, a sleeve is fixedly sleeved at the top of the heating box, a circular hole matched with the sleeve is formed in the top of the heating box, a protective net is fixedly connected to the top of the sleeve, and a blowing fan is fixedly installed in the sleeve through a mounting plate.

[0012] The utility model discloses the beneficial effect is:

[0013] The utility model discloses: since the technical means such as fan blade, arc-shaped rack, jacks, shielding plate, straight rack are adopted, when the heating box works, the heat at the heating box is less likely to enter the cooling box due to the shielding of the shielding plate, when the shielding plate rises and the workpiece moves to the cooling box, the fan blade is inclined to blow against the bottom of the shielding plate, so that hot air is difficult to enter the cooling box with the workpiece, the cooling efficiency of the cooling box is improved, the problem that the heating box and the cooling box are located at the same position in the background art, resulting in poor work efficiency is effectively solved, and then the technical effect that the heat load in the cooling box is reduced, the workpiece can be cooled and cooled more efficiently in the cooling box, the production efficiency is remarkably improved, and the production cost is reduced. ACCURACY OF DRAWINGS

[0014] Figure 1 The utility model discloses a kind of partition heating SMT reflow soldering temperature control device overall structure schematic diagram;

[0015] Figure 2 The utility model discloses a kind of partition heating SMT reflow soldering temperature control device heating box structure schematic diagram;

[0016] Figure 3 A sectional view structure schematic diagram of a cooling box of a partition heating SMT reflow soldering temperature control device is provided in the utility model.

[0017] Figure 4 A structure schematic diagram of a baffle of a partition heating SMT reflow soldering temperature control device is provided in the utility model.

[0018] In the drawing: 1, reflow soldering machine tool; 2, conveying mechanism; 3, heating box; 301, sleeve; 302, protective net; 4, cooling box; 401, filter screen; 5, blowing fan; 6, mounting frame; 601, electric heating tube; 7, rotating plate; 701, micro motor; 702, fan blade; 703, vertical rod; 704, arc-shaped rack; 8, baffle; 801, top rod; 802, electric push rod; 803, fixed plate; 804, visual sensor; 805, straight rack. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0020] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The utility model will be described in detail below with reference to the drawings and in combination with the embodiments.

[0021] Reference Figures 1-4 A partition heating SMT reflow soldering temperature control device, comprising a reflow soldering machine tool 1, the cooling box 4 is fixedly connected to one end of the top of the reflow soldering machine tool 1, the filter screen 401 is fixedly sleeved on the top of the cooling box 4, and the square hole matched with the filter screen 401 is formed in the top of the cooling box 4, the same rotating plate 7 is rotatably connected between the inner sides of both ends of the cooling box 4, the micro motor 701 is fixedly connected to the middle position of the top of the rotating plate 7, the fan blade 702 is fixedly connected to the bottom of the micro motor 701 and penetrates through the rotating plate 7, the vertical rod 703 is fixedly connected to both ends of the bottom of the rotating plate 7, the arc-shaped rack 704 is fixedly connected to both ends of the bottom of the vertical rod 703, the baffle mechanism is arranged on the side of the cooling box 4 close to the middle of the reflow soldering machine tool 1, the heat on one side of the heating box 3 is not easy to enter the inside of the cooling box 4 through the arrangement of the baffle mechanism, and the cooling quality of the cooling box 4 is improved.

[0022] In the embodiment, the shielding mechanism comprises a shielding plate 8 slidingly connected at one end of the top of the cooling box 4 near the middle of the reflow soldering machine 1, the top of the cooling box 4 is provided with a strip-shaped hole matched with the shielding plate 8, the top of the shielding plate 8 is fixedly connected with a top rod 801, the outer wall of the cooling box 4 is fixedly connected with a fixed plate 803 at both ends, the top of each fixed plate 803 is fixedly connected with an electric push rod 802, the top of each electric push rod 802 is fixedly connected with both ends of the bottom of the top rod 801, the position of the shielding plate 8 is controlled by the extension and retraction of the electric push rod 802, so that the hot air in the heating box 3 is prevented from flowing into one side of the cooling box 4.

[0023] In the embodiment, the shielding mechanism further comprises a visual sensor 804 fixedly connected to one side of the shielding plate 8 away from the rotating plate 7, straight racks 805 are fixedly embedded at both ends of one side of the shielding plate 8 close to the arc-shaped rack 704, and each straight rack 805 is engaged with the arc-shaped rack 704 close to it, so that when the shielding plate 8 rises, the fan blades 702 automatically blow towards the bottom of the shielding plate 8, preventing hot air from flowing into the cooling box 4.

[0024] In the embodiment, the top of the reflow soldering machine 1 is further fixedly connected with the heating box 3, and the heating box 3 is in contact with the cooling box 4, a sleeve 301 is fixedly sleeved on the top of the heating box 3, a circular hole matched with the sleeve 301 is formed in the top of the heating box 3, a protective net 302 is fixedly connected to the top of the sleeve 301, and a blowing fan 5 is fixedly installed in the sleeve 301 through a mounting plate, so that the blowing fan 5 can blow hot air towards the workpiece.

[0025] In the embodiment, the heating box 3 is fixedly connected with mounting frames 6 between both ends of the inside, a plurality of electric heating pipes 601 are fixedly connected between the two mounting frames 6, the electric heating pipes 601 can adjust the actual power in real time, so as to conveniently adjust the temperature in the heating box 3.

[0026] In the embodiment, the top of the reflow soldering machine 1 is provided with a conveying mechanism 2 in the middle, a controller is installed on one side of the reflow soldering machine 1, and the controller is electrically connected with the electric heating pipes 601, the electric push rods 802 and the visual sensor 804, so that the equipment automatically operates through the setting of the controller.

[0027] Working Principle: During operation, the heating element 601, fan 5, and micro motor 701 are turned on to ensure normal operation of the equipment. The workpiece to be welded is placed on the conveyor mechanism 2, whose drive motor is also controlled by the controller. When the workpiece is transported into the heating chamber 3, the vision sensor 804 detects it and controls the power of the heating element 601. Combined with the blowing of the fan 5, hot air contacts the workpiece, allowing the solder paste on the workpiece to melt smoothly and quickly. Upon detection by the vision sensor 804, two electric push rods 802 extend, causing the baffle plate 8 to rise a short distance to facilitate workpiece passage. As the baffle plate 8 rises, it rotates under the action of the straight rack 805 and the arc rack 704. Plate 7, along with fan blade 702, gradually tilts and blows air towards the bottom of baffle plate 8. This prevents hot air from entering the cooling box 4 along with the workpiece when baffle plate 8 is open. As the conveying mechanism 2 transports the workpiece a certain distance, it reaches the cooling box 4 completely. At this point, baffle plate 8 descends, and fan blade 702 blows air towards the workpiece below, achieving cooling welding. The baffle plate 8 prevents heat from entering the cooling box 4. Simultaneously, with the fan blade 702 tilting and blowing air, heat from the heating box 3 is also less likely to pass through baffle plate 8 when the workpiece passes through the bottom of baffle plate 8, reducing heat dispersion inside the heating box 3 and ensuring that no hot air enters the cooling box 4, thus improving cooling efficiency.

[0028] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0029] It is to be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments consistent with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components and / or combinations thereof, but do not preclude the presence or addition of one or more other features, steps, operations, devices, components and / or combinations thereof.

[0030] The preferred embodiments of the present application have been described above with the aid of drawing provided only by way of example and therefore changes in form and detail can be made therein without departing from the spirit and scope of the application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of the present application.

Claims

1. A temperature control device for zone-heated SMT reflow soldering, comprising a reflow soldering machine (1), characterized in that, The reflow soldering machine (1) top one end fixedly connected with cooling box (4), the cooling box (4) top fixedly sheathed with filter screen (401), and cooling box (4) top is equipped with square hole with filter screen (401) is matched, the inside of cooling box (4) both ends rotationally connected with same rotating plate (7), the rotating plate (7) top middle position fixedly connected with micro motor (701), and micro motor (701) bottom penetrates rotating plate (7) fixedly connected with fan blade (702), the rotating plate (7) bottom both ends are fixedly connected with vertical rod (703), and vertical rod (703) bottom both ends are fixedly connected with arc rack (704), the cooling box (4) is close to reflow soldering machine (1) middle part one side is provided with shielding mechanism.

2. The zoned heated SMT reflow solder temperature control apparatus of claim 1, wherein, The shielding mechanism includes slidingly inserted in the cooling box (4) top cooling box (4) top is equipped with strip-shaped hole with shielding plate (8) is matched, the shielding plate (8) top fixedly connected with top rod (801), the cooling box (4) outer wall both ends are fixedly connected with fixed plate (803), two the fixed plate (803) top are fixedly connected with electric push rod (802), two the electric push rod (802) top are fixedly connected in the two ends of top rod (801) bottom.

3. The zoned heated SMT reflow solder temperature control apparatus of claim 2, wherein, The shielding mechanism further includes a visual sensor (804) fixedly connected to the side of the shielding plate (8) away from the rotating plate (7), the shielding plate (8) is close to the side of the arc rack (704) both ends are fixedly embedded with straight rack (805), and each straight rack (805) is engaged with the arc rack (704) close to it.

4. The zoned heated SMT reflow solder temperature control apparatus of claim 1, wherein, The reflow soldering machine (1) top is also fixedly connected with a heating box (3), and the heating box (3) is in contact with the cooling box (4), the heating box (3) top fixedly sheathed with sleeve (301), the heating box (3) top is equipped with circular hole with sleeve (301) is matched, the sleeve (301) top fixedly connected with protective net (302), the sleeve (301) is fixedly installed with a blowing fan (5) in the inside through the mounting plate.

5. The zoned heated SMT reflow solder temperature control apparatus of claim 4, wherein, The heating box (3) inside both ends are fixedly connected with mounting bracket (6), two the mounting bracket (6) between them are fixedly connected with a plurality of electric heating pipes (601).

6. The zoned heated SMT reflow solder temperature control apparatus of claim 1, wherein, The reflow soldering machine (1) top middle part is provided with conveying mechanism (2), the reflow soldering machine (1) one side is provided with a controller, and the controller is electrically connected with electric heating pipe (601), electric push rod (802) and visual sensor (804) respectively.

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