Heat dissipation structure of electronic equipment
By combining a metal heat sink and an electromagnetic induction coil on a circuit board, and using the electromagnetic induction coil to generate eddy current heating chips, the cost and reliability problems caused by the separation of heat dissipation and heating devices in the prior art are solved, achieving efficient heat dissipation while ensuring heating effect.
Patent Information
- Application Number
- CN202520009985.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2035-01-02
AI Technical Summary
In the existing technology, heat dissipation and heating devices are installed on the circuit board separately, which leads to increased costs, increased assembly difficulty, and reduced reliability. In addition, the heating devices cannot directly contact the chip, resulting in high power consumption, long heating time, and high resource consumption.
The structure combines a metal heat sink with an electromagnetic induction coil. The electromagnetic induction coil generates a high-frequency alternating electromagnetic field at low temperatures, which causes the metal heat sink to generate eddy currents to heat the chip. Uniform heating is achieved through direct contact between the metal heat sink and the chip. When heating is not required, the metal heat sink conducts heat away from the chip.
It achieves both heating effect and heat dissipation effect without affecting heat dissipation. The electromagnetic induction heating efficiency is as high as 90%, the resource utilization rate is high, and it does not occupy the space on the bottom of the radiator.
Smart Images
Figure CN223694189U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electronic equipment, in particular to a heat dissipation structure of electronic equipment. BACKGROUND
[0002] Electronic devices have temperature specification requirements when working. When the specification is not met, some heat dissipation and heating measures are added to heat at low temperature and dissipate heat at high temperature. In product design, the heat dissipation and heating devices are usually installed on the circuit board separately, which may cause problems such as cost increase, assembly difficulty, and reliability reduction, and the heat dissipation and heating devices are not convenient to contact the chip at the same time. For example, the heating device can only be indirectly heated through the internal air of the heating device, the circuit board, etc., which has large power consumption, long heating time, and high resource consumption.
[0003] In related technologies, the heating sheet is often embedded or overlapped with the heat sink to form an integrated design. When the chip needs to be cooled, the heating sheet directly contacts the chip, which increases the thermal resistance between the chip and the heat sink and affects the cooling effect. Therefore, it is necessary to study and improve the existing structure, provide a heat dissipation structure of electronic equipment, and achieve a more practical purpose. SUMMARY
[0004] To solve one or more of the above problems, the embodiments of the present application provide a heat dissipation structure of electronic equipment, which can consider the heating effect while not affecting the cooling effect, and meet the cooling and heating requirements of electronic devices.
[0005] The embodiments of the present application provide a heat dissipation structure of electronic equipment, which includes:
[0006] A circuit board, the circuit board is provided with a chip;
[0007] A metal heat sink, the metal heat sink is arranged on the circuit board and connected with the surface of the chip;
[0008] An electromagnetic induction coil, the electromagnetic induction coil is used for inductively heating the metal heat sink.
[0009] In some embodiments, the electromagnetic induction coil surrounds the metal heat sink, and the circuit board is provided with a fixing assembly for restraining the electromagnetic induction coil.
[0010] In some embodiments, the fixing assembly includes a plurality of fixing columns fixedly connected with the circuit board, the plurality of fixing columns surround the metal heat sink and are distributed in a circumferential interval, and the electromagnetic induction coil is sequentially wound on the plurality of fixing columns to surround the metal heat sink.
[0011] In some embodiments, a plurality of limiting grooves for limiting the electromagnetic induction coil are arranged on the fixing column in a vertical direction.
[0012] In some embodiments, a coil holder is fixedly connected to the metal heat sink, and the electromagnetic induction coil is wound on the coil holder to surround the metal heat sink.
[0013] In some embodiments, the metal heat sink comprises a bottom plate and a plurality of fins connected to the bottom plate.
[0014] An annular support block is fixedly connected between the circuit board and the bottom plate, and the chip is located in an enclosed space formed by the annular support block, the circuit board and the bottom plate.
[0015] In some embodiments, a heat-conducting layer is arranged between the bottom plate and the chip, and the heat-conducting layer is any one of heat-conducting silicone grease, heat-conducting silica gel sheet and heat-conducting double-sided adhesive tape.
[0016] In some embodiments, the material of the metal heat sink is any one of copper, aluminum and iron.
[0017] In some embodiments, a power supply and a controller electrically connected to the power supply are further included, and the electromagnetic induction coil is electrically connected to the power supply.
[0018] In some embodiments, a temperature sensor for detecting the temperature of the chip is arranged around the chip on the circuit board, and the temperature sensor is electrically connected to the controller.
[0019] The technical scheme provided by the present application has the following beneficial effects:
[0020] The heat dissipation structure of the electronic device provided by the embodiments of the present application has the following beneficial effects: a chip is arranged on a circuit board; a metal heat sink is arranged on the circuit board and connected to the surface of the chip; and an electromagnetic induction coil is used to inductively heat the metal heat sink.
[0021] Therefore, when the temperature is low, the electromagnetic induction coil is supplied with a high-frequency alternating current, so that the electromagnetic induction coil generates a high-frequency alternating electromagnetic field, the metal heat sink generates an induced electromotive force in the high-frequency alternating electromagnetic field, an eddy current is formed, the eddy current circulates in the metal heat sink, heat is generated, and the effect of heating the chip is achieved.
[0022] Since the metal heat sink is heated by the electromagnetic field to serve as a heat source to heat the chip, the connecting surface between the metal heat sink and the chip can be directly used to uniformly heat the chip. When heating is not needed, the power supply to the electromagnetic induction coil is stopped, and the heat of the chip is conducted away through the metal heat sink. The chip is heated by heating the metal heat sink through electromagnetic induction at low temperature, and the heat dissipation performance of the metal heat sink is not affected during normal heat dissipation. BRIEF DESCRIPTION OF DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0024] Figure 1 An implementation schematic diagram of the heat dissipation structure provided by the embodiments of the present application is shown.
[0025] Figure 2 A top view schematic diagram of the heat dissipation structure provided by the embodiments of the present application is shown.
[0026] Figure 3 Another implementation schematic diagram of the heat dissipation structure provided by the embodiments of the present application is shown.
[0027] In the drawings, the components represented by each number are listed as follows:
[0028] 1, circuit board; 2, chip; 3, metal heat sink; 31, bottom plate; 32, fin; 4, electromagnetic induction coil; 5, fixing column; 6, limiting groove; 7, coil holder; 8, annular support block; 9, heat conduction layer; 10, temperature sensor. DETAILED DESCRIPTION
[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the present application.
[0030] In view of the deficiencies or one of the deficiencies in the above background art, the heat dissipation structure of the electronic device provided by the embodiments of the present application can take into account the heating effect while not affecting the heat dissipation effect, and meet the heat dissipation and heating requirements of electronic devices.
[0031] Referring to Figures 1 to 3 As shown in the drawings, the heat dissipation structure of the electronic device provided by the embodiments of the present application comprises:
[0032] a circuit board 1, the circuit board 1 is provided with a chip 2;
[0033] a metal heat sink 3, the metal heat sink 3 is arranged on the circuit board 1 and connected with the surface of the chip 2;
[0034] an electromagnetic induction coil 4, the electromagnetic induction coil 4 is used for inductive heating of the metal heat sink 3.
[0035] The heat dissipation structure of the electronic device of the embodiment of the present application is provided with the metal heat sink 3 connected with the surface of the chip 2 on the circuit board 1, and is further provided with the electromagnetic induction coil 4 cooperating with the metal heat sink 3. In low temperature, the electromagnetic induction coil 4 is supplied with high frequency alternating current;
[0036] The electromagnetic induction coil 4 can generate high frequency alternating electromagnetic field, and the metal heat sink 3 can generate induced electromotive force in the high frequency alternating electromagnetic field, so as to form eddy current circulating in the metal heat sink 3, generate heat, and realize the heating effect of the chip 2.
[0037] Since the metal heat sink 3 is heated by the electromagnetic field to serve as a heat source to heat the chip 2, the connecting surface of the metal heat sink 3 and the chip 2 can be directly used to uniformly heat the chip 2. It does not need to occupy the space of the bottom surface of the metal heat sink 3 for arrangement, and the conversion efficiency of electromagnetic induction heating is as high as 90%, and the resource utilization rate is high.
[0038] When heating is not needed, the power supply to the electromagnetic induction coil 4 can be stopped, and the heat of the chip 2 is conducted away through the metal heat sink 3. Thus, the chip 2 can be heated by electromagnetic induction heating of the metal heat sink 3 in low temperature, and the heat dissipation performance of the metal heat sink 3 is not affected in normal heat dissipation work.
[0039] In some optional embodiments, referring to Figures 1 to 3 The heat dissipation structure of the electronic device of the embodiment of the present application is provided with the electromagnetic induction coil 4 surrounding the metal heat sink 3, and the circuit board 1 is provided with a fixing assembly for restraining the electromagnetic induction coil 4.
[0040] The electromagnetic induction coil 4 of the embodiment of the present application is arranged around the outer periphery of the metal heat sink 3, and the fixing assembly is installed on the circuit board 1. The fixing assembly can restrain the electromagnetic induction coil 4, so that the electromagnetic induction coil 4 and the metal heat sink 3 can meet the appropriate installation interval, avoid voltage mutual induction, help the electromagnetic induction coil 4 to keep stable in the heating process, and ensure the uniformity and efficiency of heating. Exemplarily, the fixing assembly can adopt screw, support, ceramic sintering and the like to fix the electromagnetic induction coil 4.
[0041] In some embodiments, in some optional embodiments, referring toFigures 1 to 3 As shown in the figure, the electronic equipment heat dissipation structure provided by the embodiment of the present application comprises a fixing assembly, the fixing assembly comprises a plurality of fixing columns 5 fixedly connected with the circuit board 1, the plurality of fixing columns 5 surround the metal heat sink 3 and are distributed in a circumferential direction at intervals, and the electromagnetic induction coil 4 is wound on the plurality of fixing columns 5 in sequence to surround the metal heat sink 3.
[0042] The fixing assembly of the embodiment of the present application comprises the plurality of fixing columns 5, the plurality of fixing columns 5 are all fixedly installed on the top surface of the circuit board 1 and circumferentially surround the metal heat sink 3, and the electromagnetic induction coil 4 is wound on the plurality of fixing columns 5 in sequence, so as to realize that the electromagnetic induction coil 4 surrounds the metal heat sink 3 and ensure that the electromagnetic induction coil 4 and the metal heat sink 3 can meet the appropriate installation interval.
[0043] In some optional embodiments, in some embodiments, as shown in the figure, Figures 1 to 3 As shown in the figure, the electronic equipment heat dissipation structure provided by the embodiment of the present application comprises a fixing assembly, the fixing assembly comprises a plurality of fixing columns 5 fixedly connected with the circuit board 1, the plurality of fixing columns 5 surround the metal heat sink 3 and are distributed in a circumferential direction at intervals, and the electromagnetic induction coil 4 is wound on the plurality of fixing columns 5 in sequence to surround the metal heat sink 3.
[0044] The fixing column 5 of the embodiment of the present application is provided with a plurality of limiting grooves 6, one side of the limiting groove 6 away from the metal heat sink 3 is provided with an opening, which facilitates winding of the electromagnetic induction coil 4, and the plurality of limiting grooves 6 are arranged in a vertical direction at intervals on the fixing column 5, so that the wound electromagnetic induction coil 4 does not contact each other, which can prevent turn-to-turn short circuit and ensure effective flow of current, improve the working efficiency and stability of the electromagnetic induction coil 4.
[0045] In some optional embodiments, in some embodiments, as shown in the figure, Figures 1 to 3 As shown in the figure, the electronic equipment heat dissipation structure provided by the embodiment of the present application comprises a fixing assembly, the fixing assembly comprises a plurality of fixing columns 5 fixedly connected with the circuit board 1, the plurality of fixing columns 5 surround the metal heat sink 3 and are distributed in a circumferential direction at intervals, and the electromagnetic induction coil 4 is wound on the plurality of fixing columns 5 in sequence to surround the metal heat sink 3.
[0046] The metal heat sink 3 of the embodiment of the present application is provided with the coil holder 7, and the electromagnetic induction coil 4 can be directly wound on the coil holder 7, so as to realize that the electromagnetic induction coil 4 surrounds the metal heat sink 3 and ensure that the electromagnetic induction coil 4 and the metal heat sink 3 can meet the appropriate installation interval. For example, the coil holder 7 can adopt a ring sleeve and is directly sleeved on the metal heat sink 3.
[0047] In some optional embodiments, in some embodiments, as shown in the figure, Figures 1 to 3 As shown in the figure, the electronic equipment heat dissipation structure provided by the embodiment of the present application comprises a fixing assembly, the fixing assembly comprises a plurality of fixing columns 5 fixedly connected with the circuit board 1, the plurality of fixing columns 5 surround the metal heat sink 3 and are distributed in a circumferential direction at intervals, and the electromagnetic induction coil 4 is wound on the plurality of fixing columns 5 in sequence to surround the metal heat sink 3.
[0048] The circuit board 1 is fixedly connected with the bottom plate 31, and the annular support block 8 is arranged between the circuit board 1 and the bottom plate 31. The chip 2 is located in a closed space formed by the annular support block 8, the circuit board 1 and the bottom plate 31.
[0049] The metal heat sink 3 of the embodiment of the present application comprises the bottom plate 31 and the fin 32. The bottom surface of the bottom plate 31 is in contact with the top surface of the chip 2. The fin 32 is integrally connected with the bottom plate 31, so as to ensure the heat dissipation performance. The annular support block 8 is fixedly connected between the circuit board 1 and the bottom plate 31. The annular support block 8 can support and position the bottom plate 31, so that the bottom plate 31 meets the installation position requirement. Exemplarily, the annular support block 8 can be fixedly installed in a manner of mounting bolt or glue joint.
[0050] Further, the annular support block 8, the circuit board 1 and the bottom plate 31 form a closed space therebetween, and the chip 2 is located in the closed space. The chip 2 can be isolated from the outside, so as to effectively protect the chip 2 and reduce the interference of external heat source on the chip 2.
[0051] In some embodiments, in some optional embodiments, referring to FIG. 1, the embodiment of the present application provides a heat dissipation structure of an electronic device. The heat dissipation structure of the electronic device comprises a chip 2, a circuit board 1, a bottom plate 31 and a metal heat sink 3. Figures 1 to 3 The heat dissipation structure of the electronic device comprises a chip 2, a circuit board 1, a bottom plate 31 and a metal heat sink 3. The bottom plate 31 is arranged between the circuit board 1 and the chip 2. The bottom plate 31 is provided with the metal heat sink 3.
[0052] The bottom plate 31 of the embodiment of the present application is connected with the chip 2 through the heat conduction layer 9. The heat conduction layer 9 can be any one of heat conduction silicone grease, heat conduction silica gel sheet and heat conduction double-sided adhesive tape. The heat conduction silicone grease, the heat conduction silica gel sheet and the heat conduction double-sided adhesive tape all have good heat conduction performance and electrical insulation performance, can fill the installation gap between the bottom plate 31 and the chip 2, reduce the thermal resistance between the bottom plate 31 and the chip 2, and improve the heat dissipation efficiency.
[0053] In some embodiments, in some optional embodiments, referring to FIG. 1, the embodiment of the present application provides a heat dissipation structure of an electronic device. The heat dissipation structure of the electronic device comprises a chip 2, a circuit board 1, a bottom plate 31 and a metal heat sink 3. Figures 1 to 3 The heat dissipation structure of the electronic device comprises a chip 2, a circuit board 1, a bottom plate 31 and a metal heat sink 3. The bottom plate 31 is arranged between the circuit board 1 and the chip 2. The bottom plate 31 is provided with the metal heat sink 3.
[0054] The material of the metal heat sink 3 of the embodiment of the present application is any one of copper, aluminum and iron. Copper, aluminum and iron all have good electrical conductivity and thermal conductivity, and can rapidly heat up in electromagnetic induction heating. In other embodiments, the metal heat sink 3 can be made of alloy material, such as copper alloy, aluminum alloy or iron alloy.
[0055] It should be noted that the metal heat sink 3 in the present application can be inductively heated by the electromagnetic induction coil 4, and therefore it can be understood that other metal heat sinks 3 that can achieve such a function can be used in the present application, and those skilled in the art can adapt the size, shape and material of the metal heat sink 3 according to the use scene and test conditions.
[0056] In some embodiments, in some optional embodiments: referring to Figures 1 to 3 As shown, the electronic equipment heat dissipation structure provided by the embodiment of the present application further comprises a power supply and a controller electrically connected with the power supply, and the electromagnetic induction coil 4 is electrically connected with the power supply.
[0057] The embodiment of the present application is provided with a power supply and a controller (not shown in the figure), the controller is electrically connected with the power supply, the power supply is electrically connected with the electromagnetic induction coil 4, and the controller can control the power supply to start and stop, thereby controlling the electromagnetic induction coil 4 to work. For example, when the power supply is an alternating power supply, it can directly power the electromagnetic induction coil 4; when the power supply is a direct current power supply, the power supply can connect the electromagnetic induction coil 4 through an inverter, and the inverter converts direct current into alternating current to supply the electromagnetic induction coil 4.
[0058] For example, in the embodiment, a plurality of turns of metal induction coils are fixedly installed around the metal heat sink 3, and the lead bundle is connected to the inverter drive module on the circuit board 1, and the inverter drive module is one of the key components of the inverter, responsible for converting direct current into alternating current, and controlling the output voltage, frequency and other parameters.
[0059] In the embodiment, the inverter drive module outputs a high-frequency alternating current of 25 to 30 KHZ, which is converted into a high-frequency alternating electromagnetic field by flowing through the metal coil, and the magnetic field generates an induced electromotive force in the metal heat sink 3, thereby forming an eddy current. This eddy current circulates in the metal heat sink 3, generates heat, and achieves the effect of heating the chip 2.
[0060] In some embodiments, in some optional embodiments: referring to Figures 1 to 3 Figures 1 to 3 As shown, the electronic equipment heat dissipation structure provided by the embodiment of the present application further comprises a power supply and a controller electrically connected with the power supply, and the electromagnetic induction coil 4 is electrically connected with the power supply.
[0061] The circuit board 1 of the embodiment of the present application is installed with at least one temperature sensor 10, and the temperature sensor 10 is electrically connected with the controller. The temperature sensor 10 can detect the temperature value of the environment where the chip 2 is located, so as to facilitate the controller to judge whether the chip 2 needs to be heated. It should be noted that in order to ensure the accuracy of temperature measurement, a plurality of temperature sensors 10 can be installed around the chip 2.
[0062] For example, when the ambient temperature drops below the lower limit of the stable working ambient temperature of the chip 2 (for example, 0℃), the temperature sensor 10 sends the ambient temperature value to the controller through the data transmission line, the controller controls the power supply to start, the electromagnetic induction coil 4 starts to work, the metal heat sink 3 is inductively heated, the metal heat sink 3 conducts heat to the chip 2, and the temperature of the chip 2 itself rises;
[0063] When the temperature sensor 10 detects that the temperature data is higher than a certain value (for example, 5℃), the controller is informed to turn off the power supply, so that the temperature of the chip 2 can be maintained within the stable working range, and the stable working of the chip 2 is ensured.
[0064] In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0065] It should be noted that in the present application, relational terms such as "first" and "second" and the like are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the sentence "including a…" does not exclude the presence of other identical elements in the process, method, article or device including the element.
[0066] The foregoing detailed description of the application has been presented for purposes of illustration and description. Various modifications and changes can be made to these embodiments without departing from the spirit and scope of the application. It is intended that the scope of the application should not be limited by the particular representative embodiments described above.
Claims
1. A heat dissipation structure of an electronic device, characterized by comprising: The application relates to a heat dissipation structure of an electronic device. The heat dissipation structure comprises a circuit board (1) provided with a chip (2); a metal heat sink (3) arranged on the circuit board (1) and connected with the surface of the chip (2); and an electromagnetic induction coil (4) used for inductively heating the metal heat sink (3).
2. The heat dissipation structure of the electronic device according to claim 1, wherein the electromagnetic induction coil (4) surrounds the metal heat sink (3), and the circuit board (1) is provided with a fixing assembly used for restraining the electromagnetic induction coil (4).
3. The heat dissipation structure of the electronic device according to claim 2, wherein the fixing assembly comprises a plurality of fixing columns (5) fixedly connected with the circuit board (1), the fixing columns (5) surround the metal heat sink (3) and are distributed in a circumferential direction, and the electromagnetic induction coil (4) is sequentially wound on the fixing columns (5) to surround the metal heat sink (3).
4. The heat dissipation structure of the electronic device according to claim 3, wherein the fixing columns (5) are provided with a plurality of limiting grooves (6) used for limiting the electromagnetic induction coil (4), and the limiting grooves (6) are arranged in a vertical direction on the fixing columns (5).
5. The heat dissipation structure of the electronic device according to claim 1, wherein the metal heat sink (3) is fixedly connected with a coil frame (7), and the electromagnetic induction coil (4) is wound on the coil frame (7) to surround the metal heat sink (3).
6. The heat dissipation structure of the electronic device according to claim 1, wherein the metal heat sink (3) comprises a bottom plate (31) and a plurality of fins (32) connected with the bottom plate (31).
7. The heat dissipation structure of the electronic device according to claim 6, wherein a heat conduction layer (9) is arranged between the bottom plate (31) and the chip (2), and the heat conduction layer (9) is any one of heat-conductive silicone grease, heat-conductive silica gel sheet and heat-conductive double-sided adhesive tape.
8. The heat dissipation structure of the electronic device according to claim 1, wherein the metal heat sink (3) is made of any one of copper, aluminum and iron.
9. The heat dissipation structure of the electronic device according to claim 1, further comprising a power supply and a controller electrically connected with the power supply, and the electromagnetic induction coil (4) is electrically connected with the power supply.
10. The heat dissipation structure of the electronic device according to claim 9, wherein the circuit board (1) is provided with a temperature sensor (10) arranged around the chip (2) and used for detecting the temperature of the chip (2), and the temperature sensor (10) is electrically connected with the controller.