Electromagnetic shielding structure and electronic equipment

Abstract

The utility model provides an electromagnetic shielding structure and electronic equipment, and relates to the technical field of electromagnetic protection. The electromagnetic shielding structure comprises a circuit board which comprises a main board and an electronic element arranged on the surface of the main board; the shielding cover is connected with the mainboard, a part of the structure of the shielding cover is sunken in the thickness direction of the shielding cover to form a packaging space, and the electronic element is contained in the packaging space; the shielding cover comprises a base body and a conductive layer, the base body is a composite material piece, and the conductive layer is arranged on at least one side surface of the base body in the thickness direction of the base body. According to the electromagnetic shielding structure, the shielding cover comprising the matrix made of the composite material and the conductive layer is adopted, the weight of the shielding cover can be reduced on the premise that the structural strength of the shielding cover is ensured, the weight of the electromagnetic shielding structure can be reduced, and when the electronic equipment adopts the electromagnetic shielding structure, the lightweight design of the electronic equipment can be achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electromagnetic protection, and in particular to an electromagnetic shielding structure and an electronic device. BACKGROUND

[0002] Based on the requirements of users wearing, carrying and using, more and more electronic products are developing towards the direction of lighter and smaller, especially some consumer electronic products. However, the circuit board in the electronic product occupies a certain proportion because it integrates more circuits and electronic components, and electromagnetic compatibility (EMC) / electrostatic discharge (ESD) protection function modules.

[0003] At present, because the circuit board such as a PCB contains devices that can interfere with each other electromagnetically, such as radio frequency devices, high-speed signal units, antennas, and large currents, a certain number of EMC protection structures are usually added according to requirements to achieve electromagnetic isolation protection, such as surface mounted technology (SMT) shielding covers or clamping shielding covers. However, considering the strength requirements of the PCB, the flatness requirements of the shielding cover for the SMT welding process, the grounding resistance and shielding effect requirements, the shielding cover is usually made of metal materials such as white copper and stainless steel, which is not conducive to the lightweight design of the product. CONTENT OF THE INVENTION

[0004] The present application provides an electromagnetic shielding structure and an electronic device, which can reduce the weight of the shielding cover and facilitate the lightweight design of the electronic device.

[0005] In a first aspect, the present application provides an electromagnetic shielding structure, comprising: a circuit board, the circuit board comprising a main board and an electronic component arranged on the surface of the main board; a shielding cover, the shielding cover being connected with the main board, and part of the structure of the shielding cover being recessed along the thickness direction of the shielding cover to form an encapsulation space, and the electronic component being accommodated in the encapsulation space; wherein the shielding cover comprises a base body and a conductive layer, the base body being a composite material piece, and the conductive layer being arranged on at least one side surface of the base body along the thickness direction of the base body.

[0006] The electromagnetic shielding structure of the present application adopts a shielding cover comprising a base body of a composite material and a conductive layer, which can reduce the weight of the shielding cover under the premise of ensuring the structural strength of the shielding cover, is conducive to reducing the weight of the electromagnetic shielding structure, and facilitates the lightweight design of the electronic device when the electronic device adopts the electromagnetic shielding structure, and is convenient for users to use, carry or wear.

[0007] In some embodiments, the conductive layer is arranged on both side surfaces of the base body along the thickness direction of the base body.

[0008] In some embodiments, the conductive layer comprises an electroplated layer plated on the surface of the substrate or a conductive coating coated on the surface of the substrate.

[0009] In some embodiments, the composite material piece comprises at least one of a carbon fiber composite material piece or a Kevlar composite material piece.

[0010] In some embodiments, the thickness of the substrate is 0.1mm-0.15mm.

[0011] In some embodiments, a flange structure is formed on the periphery of the shielding cover, and the flange structure is used to connect with the mainboard.

[0012] In some embodiments, the shielding cover and the mainboard are connected by conductive glue.

[0013] In some embodiments, the conductive glue connects the conductive layer on the flange structure of the mainboard and the shielding cover, respectively.

[0014] In some embodiments, the conductive layer comprises at least one of gold, silver, copper, nickel, or graphene.

[0015] In a second aspect, the present application provides an electronic device comprising the electromagnetic shielding structure of the first aspect.

[0016] The electronic device of the present application adopts the electromagnetic shielding structure described above, which can reduce the weight of the electronic device, facilitate the lightweight design of the electronic device, and facilitate the wearing, use and carrying of the user, thereby improving the user experience. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0018] Figure 1 A schematic view of the electromagnetic shielding structure provided by the embodiments of the present application is shown in the figure;

[0019] Figure 2 A cross-sectional view of the electromagnetic shielding structure provided by the embodiments of the present application is shown in the figure;

[0020] Figure 3 A Figure 2 An enlarged view of the position A in the middle circle is shown in the figure;

[0021] Figure 4a A schematic view of the step of obtaining a substrate workpiece in the manufacturing method of the electromagnetic shielding structure provided by the embodiments of the present application is shown in the figure;

[0022] Figure 4bA schematic view of a step of stamping a base workpiece in a method of manufacturing an electromagnetic shielding structure according to an embodiment of the present application;

[0023] Figure 4c A schematic view of a step of cutting off excess material around the base in a method of manufacturing an electromagnetic shielding structure according to an embodiment of the present application;

[0024] Figure 4d A schematic view of a step of providing a conductive layer on the base in a method of manufacturing an electromagnetic shielding structure according to an embodiment of the present application;

[0025] Figure 4e A schematic view of a step of adhering the shielding cover and the circuit board in a method of manufacturing an electromagnetic shielding structure according to an embodiment of the present application.

[0026] Reference Signs:

[0027] 100 - electromagnetic shielding structure;

[0028] 1 - circuit board;

[0029] 11 - main board; 12 - electronic component;

[0030] 2 - shielding cover;

[0031] 21 - base; 22 - conductive layer; 23 - packaging space; 24 - flange structure;

[0032] 3 - conductive adhesive;

[0033] 200 - base workpiece.

[0034] The specific embodiments of the present application have been shown by way of example in the above-described drawings, and will be described in more detail hereafter. These drawings and the written description are not intended to restrict the scope of the inventive concept in any way, but are merely to illustrate specific embodiments of the inventive concept to those skilled in the art. DETAILED DESCRIPTION

[0035] The exemplary embodiments will be described in detail herein below with reference to the drawings. In the following description, the same drawings can have the same components, and repeated descriptions can be omitted. The following exemplary embodiments described in the detailed description section do not represent all of the aspects of the present application. Instead, they are merely a variety of embodiments in keeping with the spirit of the present application as detailed in the appended claims.

[0036] Based on the requirements of users wearing, carrying and using, more and more electronic products are developing towards the direction of lighter and smaller, especially some consumer electronics. However, the circuit board in the electronic product occupies a certain proportion because it integrates more circuits and electronic components, EMC / ESD protection functions and other elements. At present, because the PCB and other circuit boards contain RF devices, high-speed signal units, antennas, large current devices and other devices that can interfere with each other, a certain number of EMC protection structures are usually added according to the needs, such as SMT or clamping type shielding cover to achieve electromagnetic isolation protection. However, considering the strength requirements of the PCB, the flatness requirements of the shielding cover for the SMT welding process, the grounding resistance and shielding effect requirements, the shielding cover is usually made of metal materials such as white copper and stainless steel, which is not conducive to the lightweight design of the product.

[0037] Therefore, the electromagnetic shielding structure and the electronic device provided in the embodiments of the present application adopt a shielding cover including a base of a composite material and a conductive layer, which can reduce the weight of the shielding cover under the premise of ensuring the structural strength of the shielding cover, is conducive to reducing the weight of the electromagnetic shielding structure, and is conducive to realizing the lightweight design of the electronic device when the electronic device adopts the electromagnetic shielding structure, facilitating the use, carrying or wearing of the user.

[0038] The electromagnetic shielding structure 100 of the first aspect of the present application will be described below.

[0039] The electromagnetic shielding structure 100 of the present embodiment includes a circuit board 1 and a shielding cover 2.

[0040] Specifically, the circuit board 1 can include a printed circuit board (PCB), a flexible printed circuit board (FPC), a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, an ultrathin circuit board, an ultrathin circuit board, etc. Of course, it can also be other types, which are not limited by the present application.

[0041] The circuit board 1 can include a main board 11 and an electronic component 12 arranged on the surface of the main board 11. The electronic component 12 can include a variety of components such as resistive components, inductive components, antenna components, RF components, diodes, triodes, etc.

[0042] The shielding cover 2 is connected with the main board 11, and part of the structure of the shielding cover 2 is recessed along the thickness direction of the shielding cover 2 to form an encapsulation space 23. The cooperation of the main board 11 and the shielding cover 2 forms a closed space for the encapsulation space 23, and the electronic component 12 is accommodated in the encapsulation space 23. In this way, the shielding cover 2 can protect the electronic component 12 from external electromagnetic interference and ensure the normal operation of the circuit board 1.

[0043] The shielding cover 2 can include a base body 21 and a conductive layer 22. The base body 21 is a composite material piece. For example, the base body 21 can be a carbon composite material piece, a Kevlar composite material piece, or the like. Since the base body 21 is a composite material piece, compared with the base body 21 being a metal piece such as white brass, the weight of the base body 21 can be greatly reduced, thereby reducing the overall weight of the shielding cover 2. In addition, the base body 21 being a composite material piece can also have sufficient strength to maintain a stable shape and structure.

[0044] The conductive layer 22 is arranged on at least one side surface of the base body 21 along the thickness direction of the base body 21. For example, the base body 21 can include a first surface and a second surface opposite to each other along the thickness direction. The conductive layer 22 can be arranged only on the first surface, only on the second surface, or on both the first surface and the second surface. The base body 21 provides attachment support for the conductive layer 22, and the conductive layer 22 plays a role of electromagnetic shielding.

[0045] According to the electromagnetic shielding structure 100 of the embodiments of the present application, the shielding cover 2 including the base body 21 of the composite material and the conductive layer 22 can reduce the weight of the shielding cover 2 while ensuring the structural strength of the shielding cover 2, which is conducive to reducing the weight of the electromagnetic shielding structure 100. When the electronic device adopts the electromagnetic shielding structure 100, the lightweight design of the electronic device can be realized, which is convenient for users to use, carry, or wear.

[0046] In some embodiments, the base body 21 is provided with the conductive layer 22 on both opposite side surfaces along the thickness direction of the base body 21. Optionally, the conductive layers 22 on the two surfaces of the base body 21 can be the same material or different materials. The thickness of the conductive layers 22 on the two surfaces of the base body 21 can be the same or different. The shape of the conductive layers 22 on the two surfaces of the base body 21 can be the same or different. The composite process of the conductive layers 22 on the two surfaces of the base body 21 and the base body 21 can be the same or different.

[0047] By arranging the conductive layer 22 on the upper surface of the base body 21, the electromagnetic shielding capability of the shielding cover 2 can be enhanced, and the electronic elements 12 in the packaging space 23 can be better protected.

[0048] In some embodiments, the conductive layer 22 can include an electroplated layer plated on the surface of the base body 21 or a conductive coating coated on the surface of the base body 21. In this way, the conductive layer 22 can be formed in various ways, and can be flexibly selected as needed. That is, the conductive layer 22 can be plated on the surface of the base body 21 by electroplating, or the conductive layer 22 can be coated on the surface of the base body 21 by brushing.

[0049] Of course, in addition to the above, the conductive layer 22 can also be combined to the surface of the base body 21 by chemical vapor deposition, physical vapor deposition, spraying, printing, or injection molding, so that the base body 21 and the conductive layer 22 are better combined.

[0050] In some embodiments, the composite material piece includes at least one of a carbon fiber composite material piece and a Kevlar composite material piece.

[0051] It should be noted that the carbon fiber composite material piece herein includes a structural piece made of carbon fiber material and a composite material piece with carbon fiber as a reinforcing fiber material, such as a composite material piece formed by combining carbon fiber material with resin, metal, ceramic, Kevlar, and the like.

[0052] The Kevlar composite material piece herein includes a structural piece made of Kevlar material and a composite material piece formed by combining Kevlar material with carbon fiber, basalt fiber, resin, special ceramic, special steel material, and the like.

[0053] For example, the base 21 can be made of only a carbon fiber composite material piece, or the base 21 can be made of only a Kevlar composite material piece, or a part of the base 21 is made of a carbon fiber composite material piece and another part of the base 21 is made of a Kevlar composite material piece.

[0054] In this way, the base 21 can have sufficient strength while the weight of the base 21 is relatively light.

[0055] In some embodiments, the thickness of the base 21 can be 0.1-0.15 mm, for example, the thickness of the base 21 can be 0.1, 0.11, 0.12, 0.13, 0.14, or 0.15 mm, of course, the present application is not limited thereto, and the thickness of the base 21 can be flexibly selected within the above range as needed.

[0056] In this way, the thickness of the base 21 can be avoided to be too small, for example, less than 0.1 mm, which is difficult in process and reduces the structural strength, and the thickness of the base 21 can be avoided to be too large, for example, greater than 0.15 mm, which causes waste of materials. Moreover, when the base 21 is made of a carbon fiber piece, a Kevlar piece, or the like fiber material, the base 21 has the above thickness, which can make the base 21 have sufficient structural strength to ensure the structural stability of the shielding cover 2.

[0057] In some embodiments, the periphery of the shielding cover 2 can be formed with a flange structure 24. For example, the flange structure 24 can extend along the circumference of the opening end of the packaging space 23, and the flange structure 24 is parallel to the surface of the mainboard 11, so as to facilitate the flange structure 24 to be attached to and connected with the mainboard 11.

[0058] By setting the flange structure 24 and fixing the flange structure 24 and the mainboard 11, on the one hand, the assembly of the shielding cover 2 on the mainboard 11 can be facilitated and simplified, and on the other hand, the connection contact area of the shielding cover 2 and the mainboard 11 can be increased to improve the installation stability.

[0059] In some possible examples, the flange structure 24 and the main plate 11 can be connected by screwing, gluing or by other means.

[0060] In one specific example, the shielding cover 2 and the main plate 11 are connected by the conductive glue 3, which can include conductive silver glue. By connecting the shielding cover 2 and the main plate 11 by the conductive glue 3, the electrical connection between the shielding cover 2 and the main plate 11 can be achieved, which is conducive to better eliminating static electricity. In a specific implementation, the conductive glue 3 can be first applied at a predetermined position of the main plate 11, and then the flange structure 24 of the shielding cover 2 is adhered to the conductive glue 3. In this way, the shielding cover 2 can be fixed by drawing the conductive glue 3 on the circuit board 1, which can avoid the SMT process and reduce the manufacturing control requirements for the shielding cover 2.

[0061] In some embodiments, the conductive glue 3 connects the conductive layer 22 on the flange structure 24 of the shielding cover 2 and the main plate 11, respectively. In this way, the electrical connection between the circuit board 1 and the shielding cover 2 can be formed by the conductive glue 3, which is conducive to eliminating static electricity on the shielding cover 2.

[0062] Optionally, the flange structure 24 can be provided with a groove recessed in the thickness direction, and when the shielding cover 2 is pressed on the conductive glue 3, the excess conductive glue 3 can enter the groove, thereby increasing the contact area of the shielding cover 2 and the conductive glue 3, and improving the bonding stability of the shielding cover 2.

[0063] In some embodiments, the conductive layer 22 includes at least one of gold, silver, copper, nickel, and graphene, that is, the material of the conductive layer 22 can be at least one of gold, silver, copper, nickel, and graphene. By using the above materials, the conductive layer 22 can have good electrical conductivity, stronger electromagnetic shielding ability, and better protection for the internal electronic components 12.

[0064] The manufacturing method of the electromagnetic shielding structure 100 described in the embodiments of the present application will be described below with reference to the drawings. Figures 4a-4e The manufacturing method of the electromagnetic shielding structure 100 described in the embodiments of the present application will be described below with reference to the drawings.

[0065] S1, first cut the composite material plate into a base workpiece 200, such as Figure 4a ;

[0066] S2, the base workpiece 200 is subjected to a stamping process using a stamping die to form the base 21 of the shielding cover 2 on the base workpiece 200, such as Figure 4b ;

[0067] S3, the excess material around the shielding cover 2 is removed by a CNC (computer numerical control precision machining) process or a laser cutting process, such as Figure 4c ;

[0068] S4, the conductive layer 22 is arranged on the two surfaces of the substrate 21 after the excess material is removed, the conductive layer 22 can be arranged by electroplating, chemical vapor deposition, physical vapor deposition, spraying, printing or injection molding, such as Figure 4d ;

[0069] S5, the conductive adhesive 3 is coated on the main board 11 of the circuit board 1, the conductive adhesive 3 can extend along the flange structure 24 of the shielding cover 2, then the shielding cover 2 is attached to the main board 11 through the alignment and attachment device, then the conductive adhesive 3 is heated to solidify the conductive adhesive 3, and finally the electromagnetic shielding structure 100 is formed, such as Figure 4e .

[0070] The electronic device of the second aspect of the application will be described below.

[0071] The electronic device of the embodiment can be a mobile communication device such as a smart phone, a tablet computer, can also be a wearable device such as a smart bracelet, a smart watch, smart glasses, wireless earphones, etc., can also be a computer, a server, a projector, a communication base station, a smart TV, etc., can also be an Internet of Things device, a medical electronic device, etc.

[0072] The electronic device of the embodiment can include the electromagnetic shielding structure 100 in the above-mentioned embodiments.

[0073] By configuring the electronic device with the electromagnetic shielding structure 100 in the above-mentioned embodiments, the weight of the electronic device can be reduced, which is conducive to the lightweight design of the electronic device, and is convenient for the user to wear, use and carry, and is conducive to improving the user experience.

[0074] Finally, it should be noted that: other embodiments of the present application will be easily thought of by those skilled in the art after considering the specification and practicing the application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or conventional technical means in the technical field of the present application not disclosed by the present application, and is not limited to the precise structure described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present application is only limited by the appended claims.

Claims

1. An electromagnetic shielding structure (100), characterized by, The application relates to an electromagnetic shielding structure (100), comprising: a circuit board (1) comprising a main board (11) and an electronic component (12) arranged on the surface of the main board (11); a shielding cover (2) connected with the main board (11), part of the structure of the shielding cover (2) being recessed along the thickness direction of the shielding cover (2) to form an encapsulation space (23), and the electronic component (12) being arranged in the encapsulation space (23); wherein the shielding cover (2) comprises a base body (21) and a conductive layer (22), the base body (21) is a composite material piece, and the conductive layer (22) is arranged on at least one side surface of the base body (21) along the thickness direction of the base body (21). The base body (21) is provided with the conductive layer (22) on the opposite two side surfaces thereof along the thickness direction. The conductive layer (22) comprises an electroplated layer plated on the surface of the base body (21) or a conductive coating coated on the surface of the base body (21). The composite material piece comprises at least one of a carbon fiber composite material piece and a Kevlar composite material piece.

2. The electromagnetic shielding structure (100) according to claim 1, characterized in that The thickness of the base body (21) is 0.1-0.15 mm.

3. The electromagnetic shielding structure (100) of claim 1, wherein, The shielding cover (2) is provided with a flange structure (24) along the periphery, and the flange structure (24) is used for connecting with the main board (11).

4. The electromagnetic shielding structure (100) of claim 1, wherein, The shielding cover (2) and the main board (11) are connected through conductive glue (3).

5. The electromagnetic shielding structure (100) of claim 1, wherein, The conductive glue (3) is connected with the conductive layer (22) on the flange structure (24) of the main board (11) and the shielding cover (2) respectively.

6. The electromagnetic shielding structure (100) of claim 1, wherein, The conductive layer (22) comprises at least one of gold, silver, copper, nickel and graphene.

7. The electromagnetic shielding structure (100) according to claim 6, characterized in that The electromagnetic shielding structure (100) comprises any one of claims 1-9.

8. The electromagnetic shielding structure (100) according to claim 7, characterized in that ​ 9. The electromagnetic shielding structure (100) of claim 1, wherein, ​ 10. An electronic device, comprising: ​

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