Discharging device for monocrystalline silicon wafer production

Abstract

The utility model discloses a blanking device for monocrystalline silicon wafer production, which relates to the technical field of silicon wafer production and comprises a processing table, a placing groove is arranged at the top end of the processing table, a supporting side plate is fixedly connected to the top end of the processing table, a sliding groove is arranged on one side of the supporting side plate, and a threaded rod is rotatably connected in the sliding groove. The outer surface of the threaded rod is sleeved with a moving block in a threaded mode, an automatic pushing assembly is arranged on one side of the moving block and comprises a pushing plate, the bottom end of the pushing plate is slidably connected with the top end of the machining table, a semicircular pushing block is fixedly connected to the bottom end of the pushing plate, and the semicircular pushing block is driven by the pushing plate to continuously push the silicon rods. According to the silicon rod cutting and discharging device, silicon chips can automatically fall into the movable collecting vehicle after silicon rods are cut, so that the silicon chips are automatically discharged after being cut, meanwhile, a certain fixing force can be reserved when the silicon rods move by matching with the arrangement of a semicircular pressing plate, the silicon rods can be more stable when being cut and discharged, and the discharging device is better used.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer production technology, and in particular to a feeding device for monocrystalline silicon wafer production. Background Technology

[0002] Monocrystalline silicon is a relatively reactive non-metallic element and an important component of crystalline materials. It is at the forefront of new material development and its main uses are as a semiconductor material and for solar photovoltaic power generation and heating. In the production process of monocrystalline silicon wafers, the cutting of silicon rods and the collection of silicon wafers are two closely linked and crucial steps. In traditional production methods, after the silicon rods are cut, the silicon wafers are mostly transported on a conveyor belt and then unloaded. This makes the unloading process of silicon wafers cumbersome and inconvenient to directly put the silicon wafers into the collection box. As a result, it is not convenient to automatically unload and collect the silicon wafers after cutting, which may affect the practicality of the unloading device. Utility Model Content

[0003] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide a feeding device for monocrystalline silicon wafer production that can solve the problem that it is inconvenient to directly put silicon wafers into the inside of the collection box, thus making it inconvenient to automatically feed and collect silicon wafers after cutting.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a feeding device for monocrystalline silicon wafer production, comprising a processing table, a placement groove at the top of the processing table, a supporting side plate fixedly connected to the top of the processing table, a sliding groove on one side of the supporting side plate, a threaded rod rotatably connected inside the sliding groove, a moving block threadedly sleeved on the outer surface of the threaded rod, an automatic feeding assembly on one side of the moving block, the automatic feeding assembly comprising a push plate, the bottom end of the push plate slidably connected to the top of the processing table, a semi-circular push block fixedly connected to the bottom end of the push plate, the outer surface of the semi-circular push block slidably connected to the inside of the placement groove, the end of the push plate near the moving block fixedly connected to one end of the moving block, a limiting sliding groove on one side of the push plate, a limiting slider slidably connected to the inner wall of the limiting sliding groove, a semi-circular pressure plate fixedly connected to one side of the limiting slider, and a pull ring fixedly installed at the top of the semi-circular pressure plate.

[0005] Preferably, a pressure spring is fixedly connected to the top of the limiting slider, and the top of the pressure spring is fixedly connected to the top surface of the inner wall of the limiting groove.

[0006] Preferably, a gantry frame is fixedly connected to the top of the processing table, and an electric telescopic rod is fixedly connected to the top of the gantry frame.

[0007] Preferably, the output end of the electric telescopic rod slides through to the bottom of the gantry and is fixedly installed with a cutting blade.

[0008] Preferably, a T-shaped limiting groove is provided on one side of the processing table, a T-shaped limiting block is slidably connected to the inner wall of the T-shaped limiting groove, and a mobile collection vehicle is fixedly installed on one side of the T-shaped limiting block.

[0009] Preferably, the outer surface of the T-shaped limiting block is slidably connected to the inner wall of the T-shaped limiting groove.

[0010] Preferably, a drive motor is fixedly connected to one side of the support side plate, and the output end of the drive motor rotates through the interior of the slide groove and is fixedly connected to one end of the threaded rod.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This single-crystal silicon wafer production unloading device uses a pusher plate to drive a semi-circular pusher block to continuously push the silicon rod for cutting. This allows the silicon rod to automatically fall into the interior of a mobile collection cart after cutting, thus enabling automatic unloading of the silicon wafer after cutting. In addition, the semi-circular pressure plate helps to maintain a certain fixing force on the silicon rod during movement, making the cutting and unloading of the silicon rod more stable and thus improving the usability of the unloading device. Attached Figure Description

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0014] Figure 1 This is a three-dimensional structural diagram of a feeding device for producing monocrystalline silicon wafers according to the present invention;

[0015] Figure 2 This is a schematic diagram of the T-shaped limiting groove structure of this utility model;

[0016] Figure 3 For the present utility model Figure 1 Enlarged view of point A in the image;

[0017] Figure 4 This is a schematic diagram of the semi-circular pressure plate structure of this utility model.

[0018] Reference numerals: 1. Processing table; 2. Supporting side plate; 3. Slide groove; 4. Threaded rod; 5. Moving block; 6. Push plate; 7. Placement slot; 8. Gantry frame; 9. Electric telescopic rod; 10. Cutting blade; 11. Limiting slide groove; 12. Limiting slider; 13. Semi-circular pressure plate; 14. Pressure spring; 15. Semi-circular push block; 16. Mobile collection cart; 17. T-shaped limiting block; 18. Drive motor; 19. T-shaped limiting groove; 20. Pull ring. Detailed Implementation

[0019] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0020] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] In the description of this utility model, terms such as greater than, less than, and exceeding are understood to exclude the stated number, while terms such as above, below, and within are understood to include the stated number. The use of terms like "first" and "second" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the quantity or sequence of the indicated technical features.

[0022] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0023] Please see Figure 1-4 This utility model provides a technical solution: a feeding device for monocrystalline silicon wafer production, including a processing table 1, a placement groove 7 at the top of the processing table 1, a support side plate 2 fixedly connected to the top of the processing table 1, a sliding groove 3 on one side of the support side plate 2, a threaded rod 4 rotatably connected inside the sliding groove 3, a moving block 5 threadedly sleeved on the outer surface of the threaded rod 4, an automatic feeding assembly on one side of the moving block 5, the automatic feeding assembly including a push plate 6, the bottom end of the push plate 6 slidably connected to the top of the processing table 1, a semi-circular push block 15 fixedly connected to the bottom end of the push plate 6, the outer surface of the semi-circular push block 15 slidably connected to the inside of the placement groove 7, one end of the push plate 6 near the moving block 5 fixedly connected to one end of the moving block 5, a limiting sliding groove 11 on one side of the push plate 6, a limiting slider 12 slidably connected to the inner wall of the limiting sliding groove 11, a semi-circular pressure plate 13 fixedly connected to one side of the limiting slider 12, and a pull ring 20 fixedly installed at the top of the semi-circular pressure plate 13.

[0024] Furthermore, a pressure spring 14 is fixedly connected to the top of the limiting slider 12, and the top of the pressure spring 14 is fixedly connected to the top surface of the inner wall of the limiting groove 11.

[0025] Furthermore, a gantry frame 8 is fixedly connected to the top of the processing table 1, and an electric telescopic rod 9 is fixedly connected to the top of the gantry frame 8. The output end of the electric telescopic rod 9 slides through to the bottom of the gantry frame 8 and is fixedly installed with a cutting blade 10.

[0026] Furthermore, a T-shaped limiting groove 19 is provided on one side of the processing table 1, and a T-shaped limiting block 17 is slidably connected to the inner wall of the T-shaped limiting groove 19. A mobile collection vehicle 16 is fixedly installed on one side of the T-shaped limiting block 17, and the outer surface of the T-shaped limiting block 17 is slidably connected to the inner wall of the T-shaped limiting groove 19.

[0027] Furthermore, a drive motor 18 is fixedly connected to one side of the support side plate 2. The output end of the drive motor 18 rotates through the interior of the slide groove 3 and is fixedly connected to one end of the threaded rod 4.

[0028] Furthermore, the worker places the silicon rod to be cut inside the placement groove 7, and then pulls the pull ring 20 to pull the semi-circular pressure plate 13 upward. Then, one end of the silicon rod contacts one end of the semi-circular push block 15. Then, the pull ring 20 is released, so that the semi-circular pressure plate 13 is pressed tightly on the outer surface of the silicon rod, thereby enabling the silicon rod to maintain a certain fixing force.

[0029] Next, the drive motor 18 is started to drive the threaded rod 4 to move the moving block 5. Then, the moving block 5 drives the push plate 6 to move the semi-circular push block 15. Then, the semi-circular push block 15 will drive the silicon rod to move. Then, one end of the silicon rod will move to the bottom of the cutting blade 10. Then, the electric telescopic rod 9 is started to drive the cutting blade 10 to press down and cut the silicon rod. Then, the cut silicon wafer will automatically fall into the interior of the mobile collection vehicle 16, so that the mobile collection vehicle 16 can automatically collect the fallen silicon wafer.

[0030] Furthermore, after the silicon wafers inside the mobile collection cart 16 are full, the mobile collection cart 16 can be pushed to disengage the T-shaped limiting block 17 from the inside of the T-shaped limiting groove 19, thereby facilitating the disengagement of the mobile collection cart 16 from the processing table 1. This allows the T-shaped limiting block 17 to disengage from the inside of the T-shaped limiting groove 19, enabling the mobile collection cart 16 to be conveniently positioned on one side of the processing table 1, thus facilitating the collection of the cut silicon wafers.

[0031] Furthermore, by using the push plate 6 to drive the semi-circular push block 15 to continuously push the silicon rod for cutting, the silicon wafer can automatically fall into the mobile collection cart 16 after the silicon rod is cut, so that the silicon wafer is automatically unloaded after the cutting is completed. At the same time, with the setting of the semi-circular pressure plate 13, the silicon rod can retain a certain fixing force when moving, so that the silicon rod can be cut and unloaded more stably, thus making the unloading device work better.

[0032] Structural Description:

[0033] Processing table 1: Used to support and fix the supporting side plate 2 and the gantry frame 8 and other structures.

[0034] Support side plate 2: It is fixed at the top side of the processing table 1 and is used for the subsequent installation of the automatic feeding component.

[0035] Slide 3: It is opened on one side of the support side plate 2 to facilitate the installation of threaded rod 4 and sliding block 5.

[0036] Threaded rod 4: Used to cooperate with slide groove 3 so that moving block 5 can slide.

[0037] Movable block 5: It can slide inside the slide groove 3 so as to drive the push plate 6 to move.

[0038] Push plate 6: used to drive the semi-circular push block 15 to move inside the placement groove 7.

[0039] Placement slot 7: Used to place silicon rods and facilitates the semi-circular pusher 15 to push the silicon rods inside the placement slot 7.

[0040] Drive motor 18: As the output power of threaded rod 4, it can drive threaded rod 4 to run stably.

[0041] Semicircular push block 15: Its outer surface can slide and adapt to the inner wall of the placement groove 7.

[0042] Semicircular pressure plate 13: used to press the silicon rod, thereby cooperating with the semicircular pusher block 15 to move the silicon rod stably.

[0043] Mobile collection vehicle 16: Used for collecting the cut silicon wafers and transporting them.

[0044] Cutting blade 10: Used for pressing and cutting silicon rods, and is fixedly installed below the output end of the electric telescopic rod 9.

[0045] Pressure spring 14: used to reset the limit slider 12, and at the same time to give the semi-circular pressure plate 13 downward pressure when it contacts the silicon rod.

[0046] Pull ring 20: Used to pull the semi-circular pressure plate 13 upward, making it easy to move the semi-circular pressure plate 13 upward.

[0047] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A blanking device for single crystal silicon wafer production, comprising a processing table (1), characterized in that: The top end of the processing table (1) is provided with a placing groove (7), and the top end of the processing table (1) is fixedly connected with a supporting side plate (2). One side of the supporting side plate (2) is provided with a sliding groove (3), and the inside of the sliding groove (3) is rotatably connected with a threaded rod (4). The outer surface of the threaded rod (4) is threadedly connected with a moving block (5), and one side of the moving block (5) is provided with an automatic pushing assembly. The automatic pushing assembly comprises a push plate (6), and the bottom end of the push plate (6) is slidably connected with the top end of the processing table (1). The bottom end of the push plate (6) is fixedly connected with a semicircular push block (15), and the outer surface of the semicircular push block (15) is slidably connected with the inside of the placing groove (7). One end of the push plate (6) close to the moving block (5) is fixedly connected with one end of the moving block (5). One side of the push plate (6) is provided with a limiting sliding groove (11), and the inner wall of the limiting sliding groove (11) is slidably connected with a limiting sliding block (12). One side of the limiting sliding block (12) is fixedly connected with a semicircular pressing plate (13), and the top end of the semicircular pressing plate (13) is fixedly installed with a pull ring (20).

2. The blanking device for single crystal silicon wafer production according to claim 1, characterized in that: The top end of the limiting sliding block (12) is fixedly connected with a pressure spring (14), and the top end of the pressure spring (14) is fixedly connected with the top surface of the inner wall of the limiting sliding groove (11).

3. The blanking device for single crystal silicon wafer production according to claim 1, characterized in that: The top end of the processing table (1) is fixedly connected with a gantry (8), and the top end of the gantry (8) is fixedly connected with an electric telescopic rod (9).

4. The blanking device for single crystal silicon wafer production according to claim 3, characterized in that: The output end of the electric telescopic rod (9) is slidably penetrated to the lower side of the gantry (8) and is fixedly installed with a cutting knife (10).

5. The blanking device for single crystal silicon wafer production according to claim 1, characterized in that: One side of the processing table (1) is provided with a T-shaped limiting groove (19), and the inner wall of the T-shaped limiting groove (19) is slidably connected with a T-shaped limiting block (17). The T-shaped limiting block (17) is fixedly installed with a moving collection vehicle (16).

6. The blanking device for single crystal silicon wafer production according to claim 5, characterized in that: The outer surface of the T-shaped limiting block (17) is slidably connected with the inner wall of the T-shaped limiting groove (19).

7. The blanking device for single crystal silicon wafer production according to claim 1, characterized in that: One side of the supporting side plate (2) is fixedly connected with a driving motor (18), and the output end of the driving motor (18) is rotatably penetrated to the inside of the sliding groove (3) and is fixedly connected with one end of the threaded rod (4).

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