DFN lead frame

Abstract

The utility model relates to a DFN lead frame, which comprises a frame and a plurality of installation units arranged on the frame, each installation unit comprises a base island, the base island is provided with at least two convex plates used for placing chips, and the convex plates are sequentially arranged at intervals. The DFN lead frame obtained by the utility model has the following advantages: the design of the plurality of convex plates on the base island enables one chip to be placed on each convex plate, so that other chips can be spanned without mutual influence, the structural strength of the base island is improved, the overall heat dissipation area is large, and the heat dissipation effect is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field especially relates to a DFN lead frame. BACKGROUND

[0002] Lead frame is the basic material of semiconductor IC and device molded package, as the chip carrier of integrated circuit, lead frame is a kind of key structural member that makes the inside circuit lead-out end (bonding point) of chip through the electrical connection of inner lead and outer lead, forms electrical circuit, it plays the bridge role of connection with external wire.The existing lead frame product, only one chip can be installed on one base island, cannot realize across other chips. SUMMARY

[0003] The purpose of the present application is to provide a kind of DFN lead frame, can cross other chips.

[0004] The technical scheme adopted by the present application is as follows: a kind of DFN lead frame, including frame and the multiple mounting units of being arranged on the frame, the mounting unit includes base island, at least two lugs for chip placement are provided on the base island, and lug is sequentially spaced arrangement.

[0005] Compared with the prior art, the design of multiple lugs on the base island can place a chip on each lug, realize across other chips, do not affect each other, while improving the structural strength of base island, the overall heat dissipation area is large, guarantee the heat dissipation effect of multiple chips.

[0006] In some embodiments of the present application, one side of the lug extends to one side of the base island, and the other side of the lug is spaced apart from the other side of the base island.

[0007] Further, the length of the lug is greater than half the length of the base island.

[0008] In some embodiments of the present application, the thickness of the lug is the same as the thickness of the base island.

[0009] In some embodiments of the present application, the protrusion height of each lug is the same;The protruding direction of each lug is the same.

[0010] In some embodiments of the present application, the width of the lug is greater than the width between adjacent lugs.

[0011] In some embodiments of the present application, a first stress hole is provided between adjacent lugs.

[0012] In some embodiments of the present application, a pin connection portion is provided on the base island;Pin connection portion is located at the top end of base island.

[0013] Further, the pin connecting part is provided with a second stress hole.

[0014] In some embodiments of the present application, the base island is provided with pins on both sides; the two ends of the pins are connected with the frame and the base island respectively. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a structural schematic view of embodiment 1 of the present application.

[0016] Figure 2 is a sectional view in A-A direction of Figure 1 .

[0017] Figure 3 is a sectional view in B-B direction of Figure 1 .

[0018] In the figure: 1, frame; 3, base island; 4, protruding plate; 5, first stress hole; 6, pin connecting part; 7, second stress hole; 8, pin; 9, first plate body; 10, second plate body; 11, third plate body. DETAILED DESCRIPTION

[0019] In order to further illustrate the technical means and effects adopted by the present application to achieve the predetermined utility model purposes, the specific embodiments, structures, features and effects according to the present application are described in detail as follows in combination with the drawings and preferred embodiments.

[0020] Embodiment 1:

[0021] The DFN lead frame provided in the present embodiment, as shown in Figure 1 , Figure 2 , Figure 3 , comprises a frame 1 and a plurality of mounting units arranged on the frame 1, the mounting unit comprises a base island 3, the base island 3 is provided with a plurality of protruding plates 4 for chip placement, the plurality of protruding plates 4 are arranged in sequence and at intervals, and the top surface of the protruding plate 4 extends out of the top surface of the base island 3. In the present embodiment, three protruding plates 4 are arranged.

[0022] The design of the plurality of protruding plates 4 on the base island 3 can place one chip on each protruding plate 4 without affecting each other, realize crossing other chips, and at the same time improve the structural strength of the base island 3, the overall heat dissipation area is large, and the heat dissipation effect of the multi-chip is guaranteed.

[0023] In order to make the convex plate 4 reliable, one side of the convex plate 4 extends to one side of the base island 3, the other side of the convex plate 4 is spaced apart from the other side of the base island 3, three sides of the convex plate 4 are connected with the base island 3, and the connection between the convex plate 4 and the base island 3 is a diagonal transition, the left side of the convex plate 4 is flush with the left side of the base island 3, which reduces the machining precision of the left side and improves the machining efficiency, and the right side of the convex plate 4 is spaced apart from the right side of the base island 3, so that the base island 3 has a bending structure in the length direction of the convex plate 4, and the structural strength of the base island 3 in the length direction of the convex plate 4 is strengthened.

[0024] In order to make the convex plate 4 reliable, the length of the convex plate 4 is greater than half the length of the base island 3, the length of the convex plate 4 is large, the placement area is large, the chip is convenient to place, and the structure strength of the base island 3 as a whole is higher.

[0025] In order to facilitate machining, the thickness of the convex plate 4 is the same as the thickness of the base island 3, so that the same plate part can be used for stamping machining, the machining and procurement costs are reduced, and the machining efficiency is improved.

[0026] In order to facilitate machining, the protrusion heights of the plurality of convex plates 4 are the same, the structural strength of each part is ensured to be the same, the protrusion directions of the plurality of convex plates 4 are the same, machining stretching caused by different directions of protrusion is prevented, deformation is reduced, the structural strength is ensured, the machining efficiency is high, the chip is placed on the same side, and the assembly efficiency is improved.

[0027] In order to reliably connect with the chip, the width of the convex plate 4 is greater than the width between adjacent convex plates 4, the width of the convex plate 4 is large, the placement area is large, the chip is convenient to place, and the width of the convex plate 4 is large, so that the structure strength of the base island 3 as a whole is higher.

[0028] In order to reliably package, first stress holes 5 are arranged between adjacent convex plates 4, during packaging, plastic sealing material flows through the first stress holes 5, so that a pin made of plastic sealing material is formed, and the fixing effect is ensured.

[0029] In order to reliably connect, a pin connection part 6 is arranged on the base island 3, and the pin connection part 6 is used for pin contact.

[0030] The pin connection part 6 comprises a first plate body 9, a second plate body 10 and a third plate body 11 connected in sequence, one side of the first plate body 9 away from the second plate body 10 is connected with the base island 3, the bottom surface of the first plate body 9 is lower than the bottom surface of the base island 3, the top surface of the third plate body 11 protrudes out of the top surface of the convex plate 4, the overall structural strength is high, the heat dissipation surface is large, and the heat dissipation effect is good; the length of the first plate body 9 is the same as the length of the base island 3; the length of the third plate body 11 is less than the length of the first plate body 9; the thicknesses of the first plate body 9, the second plate body 10 and the third plate body 11 are the same as the thickness of the base island 3.

[0031] To ensure reliable encapsulation, the first plate 9 is provided with a second force-bearing hole 7. During encapsulation, the encapsulant flows through the second force-bearing hole 7, thereby forming a pin made of encapsulant to ensure a fixing effect.

[0032] For reliable connection, pins 8 are provided on both sides of the first plate 9; the two ends of the pins 8 are connected to the frame 1 and the first plate 9 respectively.

[0033] In this embodiment, length refers to Figure 1 The distance along the X-axis, where width refers to... Figure 1 The distance along the Y-axis.

[0034] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A DFN leadframe, characterized by, The utility model relates to a chip mounting device, which comprises a frame (1) and a plurality of mounting units arranged on the frame (1), wherein the mounting units comprise base islands (3) provided with at least two convex plates (4) for chip placement, and the convex plates (4) are arranged in sequence and at intervals.

2. The DFN leadframe of claim 1, wherein: One side of the convex plate (4) extends to one side of the base island (3), and the other side of the convex plate (4) is provided with a spacing from the other side of the base island (3).

3. The DFN leadframe of claim 2, wherein: The length of the convex plate (4) is greater than half the length of the base island (3).

4. The DFN leadframe of claim 1, wherein: The thickness of the convex plate (4) is the same as the thickness of the base island (3).

5. A DFN lead frame according to claim 1, characterized in that: The protruding height of each convex plate (4) is the same, and the protruding direction of each convex plate (4) is the same.

6. The DFN leadframe of claim 1, wherein: The width of the convex plate (4) is greater than the width between adjacent convex plates (4).

7. A DFN lead frame according to claim 1, characterized in that: First stress holes (5) are arranged between adjacent convex plates (4).

8. The DFN leadframe of claim 1, wherein: The base island (3) is provided with a pin connection part (6), and the pin connection part (6) is located at the top end of the base island (3).

9. The DFN leadframe of claim 8, wherein: The pin connection part (6) is provided with a second stress hole (7).

10. The DFN leadframe of claim 1, wherein: The base island (3) is provided with pins (8) on both sides, and the two ends of the pins (8) are connected with the frame (1) and the base island (3), respectively. ​

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