Circuit substrate screen printing offset detection equipment
By using automated circuit board screen printing offset detection equipment and image acquisition and processing technology, the problems of low efficiency and poor accuracy of manual inspection are solved, achieving efficient and stable screen printing inspection and ensuring the consistency of inspection standards for each circuit board.
Patent Information
- Application Number
- CN202423167055.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2034-12-20
AI Technical Summary
In the existing technology, the inspection of screen printing on circuit boards relies on manual observation, which results in low inspection efficiency, poor accuracy, poor stability and high cost, and the inspection standards cannot be quantified.
The circuit board screen printing offset detection equipment, which consists of an image acquisition module, a position movement module, an image processing module, a transparent detection platform, and a display module, can automatically detect the screen printing images on chip circuit boards. Through the coordinated work of the image acquisition, processing, and display modules, the position and offset of the screen printing can be automatically confirmed.
It has improved testing efficiency and accuracy, reduced labor costs, standardized testing standards, and enhanced the stability and precision of testing.
Smart Images

Figure CN223727727U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The embodiment of the utility model relates to the technical field of detection, especially relates to a circuit substrate silk screen printing offset detection equipment. BACKGROUND
[0002] The current mainstream silk screen printing detection method adopts a positioning plate to press a chip on a substrate, and whether the silk screen printing position of each chip is within a specified range is observed manually to confirm whether the silk screen printing content on the chip to be detected is clear and visible and whether there is a printing error or not. Obviously, relying on manual detection of the silk screen printing content on the chip has problems such as high labor cost, low detection efficiency, low detection accuracy, poor detection stability, and unquantifiable detection standard. UTILITY MODEL CONTENT
[0003] The embodiment of the utility model provides a circuit substrate silk screen printing offset detection equipment to reduce labor input, improve detection efficiency, detection accuracy and detection stability, and unify the detection standard of each circuit substrate silk screen printing.
[0004] The embodiment of the utility model provides a circuit substrate silk screen printing offset detection equipment, which comprises an image acquisition module, a position moving module, an image processing module, a transparent detection platform and a display module.
[0005] The position moving module is arranged directly below the transparent detection platform, the image acquisition module is arranged on the position moving module, the position moving module is used for driving the image acquisition module to move, and the image acquisition module is used for acquiring image data of a printing surface of a chip circuit substrate to be detected placed on the transparent detection platform; wherein the printing surface of the chip circuit substrate to be detected faces the transparent detection platform.
[0006] The image acquisition module is connected with the image processing module, the image processing module is connected with the display module, the display module is used for generating a detection instruction, the image processing module is used for generating a silk screen printing detection result by performing silk screen printing detection on the image data according to the detection instruction, and the display module is also used for displaying the image data and the silk screen printing detection result.
[0007] Optionally, the position moving module comprises a motion motor, a guide rail, a running control unit and a plurality of position detection units.
[0008] The motion motor and each position detection unit are connected with the motion control unit, each position detection unit is arranged at different positions of the guide rail, the motion control unit is used for controlling the motion motor to move along the guide rail, each position detection unit is used for detecting the moving position and moving speed of the motion motor, and the motion control unit is used for adjusting the operation state and moving speed of the motion motor according to the moving position and the moving speed.
[0009] Optionally, the position detection unit comprises an optical sensor.
[0010] The optical sensor is arranged on the guide rail.
[0011] Optionally, the image acquisition module comprises an SIC camera.
[0012] Optionally, the image processing module comprises a PC mainboard.
[0013] The PC mainboard is connected with the image acquisition module and the display module.
[0014] Optionally, the display module comprises a display screen.
[0015] The display screen is connected with the image processing module.
[0016] Optionally, the circuit board silk screen offset detection device further comprises a detection device housing.
[0017] The image acquisition module, the position moving module, the image processing module and the transparent detection platform are arranged in the detection device housing.
[0018] Optionally, the detection device housing comprises a USB interface, an HDMI interface, a power supply interface, a device power supply switch and a device start button.
[0019] The USB interface and the HDMI interface are connected with the image processing module, and the power supply interface is connected with the position moving module and the image processing module through the device power supply switch and the device start button in sequence.
[0020] Optionally, the detection device housing further comprises a first ventilation opening and a second ventilation opening.
[0021] The first ventilation opening is arranged at a position of the detection device housing close to a position of the position moving module arranged in the detection device housing.
[0022] The second ventilation opening is arranged at a position of the detection device housing close to a position of the image processing module arranged in the detection device housing.
[0023] Optionally, the detection equipment shell further comprises a back plate keyhole and a top cover handle.
[0024] The top cover handle is arranged on a top cover of the detection equipment shell.
[0025] The back plate keyhole is arranged on a back plate of the detection equipment shell.
[0026] The circuit board silk screen offset detection device provided by the embodiment of the present application is composed of an image acquisition module, a position moving module, an image processing module, a transparent detection platform and a display module, and can realize automatic detection of the silk screen image of the printing surface of the circuit board of the chip to be detected, fundamentally solves the problems of low detection efficiency, poor detection stability and high detection labor cost caused by manual detection, reduces the labor input, improves the detection efficiency, detection precision and detection stability, and unifies the detection standard of each circuit board silk screen. BRIEF DESCRIPTION OF DRAWINGS
[0027] In order to more clearly illustrate the technical scheme in the embodiment of the present application, the drawings needed in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained according to these drawings without creative labor for those skilled in the art.
[0028] Figure 1 A circuit board silk screen offset detection equipment electric connection structure schematic view provided by the embodiment of the present application;
[0029] Figure 2 A partial sectional view of a circuit board silk screen offset detection equipment provided by the embodiment of the present application;
[0030] Figure 3 A position moving module structure schematic view provided by the embodiment of the present application;
[0031] Figure 4 A detection equipment shell structure schematic view provided by the embodiment of the present application;
[0032] Figure 5 Another detection equipment shell structure schematic view provided by the embodiment of the present application. DETAILED DESCRIPTION
[0033] In order to make the person skilled in the art better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the scope of protection of the present application.
[0034] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.
[0035] Figure 1 A schematic diagram of an electrical connection structure of a circuit board silk screen offset detection device provided by the embodiments of the present application, Figure 2 A partial sectional view of a circuit board silk screen offset detection device provided by the embodiments of the present application. As shown in Figure 1 And Figure 2 The circuit board silk screen offset detection device includes an image acquisition module 110, a position moving module 120, an image processing module 130, a transparent detection platform 140 and a display module 150.
[0036] The position moving module 120 is arranged directly below the transparent detection platform 140, the image acquisition module 110 is arranged on the position moving module 120, the position moving module 120 is used to drive the image acquisition module 110 to move, and the image acquisition module 110 is used to acquire image data of the printing surface of the chip circuit board to be detected placed on the transparent detection platform 140; wherein the printing surface of the chip circuit board to be detected faces the transparent detection platform 140.
[0037] The image acquisition module 110 is connected with the image processing module 130, the image processing module 130 is connected with the display module 150; the display module 150 is used to generate a detection instruction; the image processing module 130 is used to perform silk screen detection on the image data according to the detection instruction to generate a silk screen detection result, and the display module 150 is further used to display the image data and the silk screen detection result.
[0038] Specifically, the printing surface of the chip circuit substrate to be detected faces the transparent detection platform 140, and the image acquisition module 110 can be moved under the transparent detection platform 140 by the position moving module 120 to acquire image data of the printing surface of the chip circuit substrate to be detected. The image acquisition module 110 transmits the acquired image data to the image processing module 130, and at the same time, the image processing module 130 acquires the detection instruction generated by the display module 150 and processes the image data according to the detection instruction to confirm the silk screen image offset condition and the silk screen offset amount of the chip circuit substrate to be detected, that is, to generate a silk screen detection result.
[0039] In addition, after the image acquisition module 110 transmits the image data to the image processing module 130, the image processing module 130 also transmits the image data to the display module 150, so that the display module 150 displays the image data. After the image data processing module generates the silk screen detection result, the silk screen detection result is transmitted to the display module 150, so that the display module 150 displays the silk screen detection result.
[0040] The circuit substrate silk screen offset detection device composed of the image acquisition module 110, the position moving module 120, the image processing module 130, the transparent detection platform 140 and the display module 150 can realize automatic detection of the silk screen image of the printing surface of the chip circuit substrate to be detected, fundamentally solve the problems of low detection efficiency, poor detection stability and high detection labor cost caused by manual detection, reduce the labor input, improve the detection efficiency, the detection precision and the stability of the detection, and unify the detection standard of each circuit substrate silk screen.
[0041] On the basis of the above-mentioned embodiments, optionally, Figure 3 A structural schematic diagram of a position moving module is provided for the embodiments of the present application. As shown in the figure, Figure 3 The position moving module 120 includes a motion motor 121, a guide rail 122, a running control unit 123 and a plurality of position detection units 124.
[0042] The motion motor 121 and each position detection unit 124 are connected with the motion control unit, each position detection unit 124 is arranged at different positions of the guide rail 122, the running control unit 123 is used for controlling the motion motor 121 to move along the guide rail 122, each position detection unit 124 is used for detecting the moving position and the moving speed of the motion motor 121, and the running control unit 123 is used for adjusting the running state and the moving speed of the motion motor 121 according to the moving position and the moving speed.
[0043] The position detection unit 124 comprises a photoelectric sensor arranged on the guide rail 122.
[0044] Specifically, the motion motor 121 can move on the guide rail 122 under the control of the operation control unit 123. During the movement of the motion motor 121 on the guide rail 122, each photoelectric sensor can detect the moving position and moving speed of the motion motor 121, and the operation control unit 123 can adjust the stop or start (operation state) and moving speed of the motion motor 121 according to the moving position and moving speed of the motion motor 121.
[0045] For example, when the photoelectric sensor detects that the moving position of the motion motor 121 approaches the end position of the guide rail 122, and the current moving speed is large, at this time, the operation control unit 123 can control the motion motor 121 to reduce the moving speed, and make the operation motor stop at the end position.
[0046] On the basis of the above-mentioned embodiment, optionally, the image acquisition module 110 comprises a SIC camera.
[0047] The SIC camera is mainly composed of an image intensifier, an sCMOS chip, a timing controller and the like. The image intensifier can enhance the weak light signal and convert the low light intensity input image into an image with higher brightness. The sCMOS chip can convert the enhanced optical image into an electrical signal and perform digital processing, and has the characteristics of high resolution, high quantum efficiency and low noise, and can accurately capture and record image information. The timing controller can accurately control the gating and delay time of the image intensifier, realize accurate control of image acquisition, ensure that the camera acquires images at the required time point, and improve the time resolution.
[0048] Specifically, the CIS camera can accurately restore the 1:1 imaging of the printing surface of the chip circuit substrate to be detected. After the CIS acquires a clear image of the printing surface of the object to be detected, the image processing module 130 can restore the pre-built cutting line grid image to the printing surface, and accurately measure the silk screen position and offset of each chip area of the printing surface.
[0049] On the basis of the above-mentioned embodiment, optionally, the image processing module 130 comprises a PC mainboard; the PC mainboard is connected with the image acquisition module 110 and the display module 150. The display module comprises a display screen; the display screen is connected with the image processing module 130.
[0050] On the basis of the above-mentioned embodiment, optionally, Figure 4 A structural schematic view of a detection equipment shell is provided for the embodiment of the utility model. As shown in Figure 4As shown, the circuit board screen printing offset detection device further comprises a detection device housing; the image acquisition module 110, the position moving module 120, the image processing module 130 and the transparent detection platform 140 are all arranged in the detection device housing.
[0051] The image acquisition module 110, the position moving module 120, the image processing module 130 and the transparent detection platform 140 are all arranged in the detection device housing, so that the detection device housing protects the image acquisition module 110, the position moving module 120, the image processing module 130 and the transparent detection platform 140 from the external environment, so as to prevent the external environment from affecting the internal detection environment and the detection period.
[0052] On the basis of the above embodiment, optionally, Figure 5 Another structural schematic diagram of the detection device housing is provided for the embodiment of the utility model. As shown in Figure 4 and Figure 5 The detection device housing comprises a USB interface 161, an HDMI interface 162, a power supply interface 163, a device power supply switch 164 and a device start button 165; the USB interface 161 and the HDMI interface 162 are connected with the image processing module 130, and the power supply interface 163 is connected with the position moving module 120 and the image processing module 130 through the device power supply switch 164 and the device start button 165 in sequence.
[0053] The power supply interface 163 can be connected with an external power supply, the device power supply switch 164 is turned on, and the device start button 165 is pressed, so that the external power supply can supply power to the position moving module 120 and the image processing module 130 through the power supply interface 163. The external display device can interact with the image processing module 130 through the HDMI interface 162, and the external device can interact with the image processing module 130 through the USB interface 161.
[0054] On the basis of the above embodiment, optionally, with reference to Figure 5 The detection device housing further comprises a first ventilation opening 166 and a second ventilation opening 167; the first ventilation opening 166 is arranged at a position of the detection device housing close to the position moving module 120 arranged in the detection device housing, and the second ventilation opening 167 is arranged at a position of the detection device housing close to the image processing module 130 arranged in the detection device housing.
[0055] The first ventilation opening 166 is used for heat dissipation of the position moving module 120, and the second ventilation opening 167 is used for heat dissipation of the image processing module 130.
[0056] On the basis of the above embodiment, optionally, with reference to Figure 4 and Figure 5The detection equipment shell further comprises a back plate keyhole 168 and a top cover handle 169; the top cover handle 169 is arranged on the top cover of the detection equipment shell; and the back plate keyhole 168 is arranged on the back plate of the detection equipment shell.
[0057] On the basis of the above-mentioned embodiment, optionally, the device power switch 164 is turned on, the start button is pressed, the running control unit 123 controls the movement motor 121 on the guide rail 122 to drive the CIS camera to move to the starting end of the guide rail 122, and the display screen is turned on. The chip printing detection software of the chip is turned on, the chip circuit board model to be detected is selected, the chip circuit board to be detected is placed in the specified area of the transparent detection platform 140 with the printing surface facing downward, the device top cover is covered, the start button of the detection software is clicked, and a detection instruction is generated. At the same time, in the process of the movement motor 121 driving the CIS camera to move from the starting end of the guide rail 122 to the terminal position, the image data of the printing surface of the chip circuit board is collected. After the CIS camera collects the image data, the image is processed through the PC mainboard to obtain the silk printing detection result, and the detection is completed.
[0058] It should be understood that the various forms of flow shown above can be used to reorder, add or delete steps. For example, the steps described in the present application can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions of the present application can be achieved, which are not limited herein.
[0059] The above specific embodiments do not constitute a limitation on the protection scope of the present application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A circuit board screen printing offset detection apparatus, characterized by comprising: The application relates to a transparent detection device. The device comprises an image acquisition module, a position moving module, an image processing module, a transparent detection platform and a display module. The position moving module is arranged below the transparent detection platform, the image acquisition module is arranged on the position moving module, the position moving module is used for moving the image acquisition module, and the image acquisition module is used for acquiring image data of a printing surface of a chip circuit substrate to be detected arranged on the transparent detection platform; wherein the printing surface of the chip circuit substrate to be detected faces the transparent detection platform. The image acquisition module is connected with the image processing module, the image processing module is connected with the display module, the display module is used for generating a detection instruction, the image processing module is used for generating a silk printing detection result by silk printing detection according to the detection instruction, and the display module is further used for displaying the image data and the silk printing detection result.
2. The circuit board screen misregistration inspection apparatus according to claim 1, wherein The position moving module comprises a motion motor, a guide rail, a running control unit and a plurality of position detection units. The motion motor and each position detection unit are connected with the motion control unit, each position detection unit is arranged at different positions of the guide rail, the running control unit is used for controlling the motion motor to move along the guide rail, each position detection unit is used for detecting the moving position and moving speed of the motion motor, and the running control unit is used for adjusting the running state and moving speed of the motion motor according to the moving position and moving speed.
3. The circuit board screen misregistration inspection apparatus according to claim 2, wherein The position detection unit comprises a photoelectric sensor. The photoelectric sensor is arranged on the guide rail.
4. The circuit board screen misregistration inspection apparatus according to claim 1, wherein The image acquisition module comprises an SIC camera.
5. The circuit board screen misregistration inspection apparatus according to claim 1, wherein The image processing module comprises a PC mainboard. The PC mainboard is connected with the image acquisition module and the display module.
6. The circuit board screen misregistration inspection apparatus according to claim 1, wherein The display module comprises a display screen. The display screen is connected with the image processing module.
7. The circuit board screen misregistration inspection apparatus according to claim 1, wherein The device further comprises a detection device shell. The image acquisition module, the position moving module, the image processing module and the transparent detection platform are arranged in the detection device shell.
8. The circuit board screen misregistration inspection apparatus according to claim 7, wherein The detection device shell comprises a USB interface, an HDMI interface, a power supply interface, a device power supply switch and a device start button. The USB interface and the HDMI interface are connected with the image processing module, the power supply interface is connected with the position moving module and the image processing module through the device power supply switch and the device start button in sequence.
9. The circuit board screen misregistration inspection apparatus according to claim 7, wherein The detection device shell further comprises a first ventilation opening and a second ventilation opening. The first ventilation opening is arranged at a position close to the position moving module in the detection device shell. The second ventilation opening is arranged at a position close to the image processing module in the detection device shell.
10. The circuit board screen misregistration inspection apparatus according to claim 7, wherein The detection device shell further comprises a back plate keyhole and a top cover handle. The top cover handle is arranged on the top cover of the detection device shell. The back plate keyhole is arranged on the back plate of the detection device shell.