Light guide block for liquid cooling optical module

Abstract

The utility model provides a light guide block for a liquid cooling optical module. The light guide block comprises a light guide block body; the element cavity is formed in the bottom surface of the light guide block body; the bottom face of the light guide block body comprises a first ring frame bonding area arranged outside the element cavity in a surrounding mode and a second ring frame bonding area arranged outside the first ring frame bonding area in a surrounding mode. The light guide block provides a structural basis and a convenient condition for applying at least two layers of sealing mucilage glue between the light guide block and the circuit board, ensures that the photoelectric conversion unit of the liquid-cooled optical module has a more excellent sealing effect, and can reduce the risk that a cooling liquid permeates into the light guide block and damages a photoelectric conversion element; and the liquid cooling optical module can stably run in the cooling liquid for a long time and efficiently transmit data with high quality.

Description

TECHNICAL FIELD

[0001] The embodiments of the present application relate to the technical field of optical communication. More specifically, the present application relates to a light guide block for a liquid-cooled optical module. BACKGROUND

[0002] The liquid-cooled optical module is mainly used to realize the conversion between electrical signals and optical signals, and is one of the core components of an optical communication system. It has the advantages of fast heat dissipation, low energy consumption, and large data rate, and has been widely used in the fields of data centers, cloud computing, and high-speed communication.

[0003] The liquid-cooled optical module mainly consists of a shell, an optoelectronic conversion unit, and an optical fiber jumper connected to the optoelectronic conversion unit. The optoelectronic conversion unit includes a circuit board on which an optoelectronic conversion element (such as a chip) is mounted, and a light guide block bonded on the circuit board and covering the optoelectronic conversion element and coupled with the optical fiber jumper. The function of the light guide block is to build an optical path between the optical fiber jumper and the circuit board, so that the optoelectronic conversion element on the circuit board can receive the optical signal from the optical fiber jumper through the light guide block, or transmit the optical signal to the optical fiber jumper.

[0004] At present, the liquid-cooled optical module adopts a series of sealing measures to prevent the cooling liquid from entering the light guide block and damaging (corrosion or accelerated aging) the optoelectronic conversion element. These measures include potting adhesive material covering the optical fiber jumper and the light guide block, and a sealing adhesive layer arranged between the light guide block and the circuit board. However, the existing light guide block is only suitable for building a single-layer sealing structure between the light guide block and the circuit board. In a long-term cooling liquid immersion environment, the reliability of the single-layer sealing is insufficient, and there is still a risk of sealing failure due to aging or corrosion, so that the cooling liquid may penetrate into the light guide block and damage the optoelectronic conversion element, ultimately affecting the normal operation of the optoelectronic conversion element and even the entire liquid-cooled optical module. Therefore, there is an urgent need for an improved solution that can break through the limitations of the existing light guide block structure to achieve a higher sealing level. SUMMARY

[0005] In order to solve one or more technical problems mentioned above, the present application provides a light guide block for a liquid-cooled optical module, which provides a structural basis and convenient conditions for applying at least two layers of sealing adhesive between the light guide block and the circuit board, ensuring that the optoelectronic conversion unit of the liquid-cooled optical module has a more excellent sealing effect, reducing the risk of cooling liquid penetrating into the light guide block and damaging the optoelectronic conversion element, and ensuring that the liquid-cooled optical module can operate stably in the cooling liquid for a long time and transmit data efficiently and with high quality.

[0006] The utility model provides a light guide block for liquid cooling light module, it includes: light guide block body, element cavity, its opening is established on the bottom surface of light guide block body, the bottom surface of light guide block body includes first ring frame sticking area which is arranged around outside element cavity, and second ring frame sticking area which is arranged around outside first ring frame sticking area.

[0007] Further, the light guide block further comprises an annular glue containing groove arranged on the bottom surface of the light guide block body and between the first ring frame sticking area and the second ring frame sticking area, and a glue injection hole arranged on the top surface of the light guide block body and communicating with the annular glue containing groove.

[0008] Further, the light guide block further comprises a light signal interface arranged on the light guide block body, wherein the light guide block body is configured to establish an optical path between the light signal interface and the element cavity, and a projection of the light signal interface and the annular glue containing groove on the bottom surface of the light guide block body intersects.

[0009] Further, the annular glue containing groove comprises a first cavity top and a second cavity top closer to the top surface of the light guide block body than the first cavity top, the first cavity top is between the light signal interface and the bottom surface of the light guide block body, the second cavity top is higher than the first cavity top but lower than the top surface of the light guide block body, and the glue injection hole communicates with the annular glue containing groove at a position where the second cavity top is located.

[0010] Further, the distance from the first cavity top of the annular glue containing groove to the bottom surface of the light guide block body is 0.4-0.5 mm.

[0011] Further, the central axis of the light signal interface is parallel to the bottom surface of the light guide block body, and the light guide block further comprises a first converging lens arranged on the light guide block body and located in the light signal interface, a second converging lens arranged on the light guide block body and located in the element cavity, and a cavity arranged on the top surface of the light guide block body and having a reflecting surface, wherein the optical axes of the first converging lens and the second converging lens perpendicularly intersect on the reflecting surface and are both in the optical path.

[0012] Further, the light guide block is an integral forming structure, the light guide block body comprises a base and a block main body fixedly arranged on the base, the light signal interface, the first converging lens, the second converging lens and the cavity are formed in the block main body, the annular glue containing groove and the element cavity are formed in the base and the block main body, and the cross-sectional area of the base is greater than that of the block main body.

[0013] Further, the groove width of the annular glue containing groove is 1-2 mm.

[0014] Further, the second ring frame adhesive area and the frame edge width of the second ring frame adhesive area are both 0.5-1mm.

[0015] Further, the second ring frame adhesive area is arranged at the edge of the bottom surface.

[0016] In the light guide block provided above, the applicant innovatively designs a double-layer ring frame adhesive area structure on the bottom surface of the light guide block body, specifically including a first ring frame adhesive area arranged around the outside of the element cavity, and a second ring frame adhesive area arranged around the outside of the first ring frame adhesive area. By pre-setting a double-layer ring frame adhesive area on the bottom surface of the light guide block, it provides a structural basis and convenient conditions for subsequently applying at least two layers of sealing adhesive between the light guide block and the circuit board. Compared with the single-layer adhesive area design commonly used in the prior art, the double-layer ring frame adhesive area design provided by the present application is easier to realize double-layer sealing protection, creates favorable conditions for enhancing the sealing protection capability of the photoelectric conversion unit, and builds a double potential protection barrier, thereby more effectively reducing the risk of cooling liquid seeping into the light guide block and damaging the photoelectric conversion element. Therefore, the light guide block designed by the present application is more likely to ensure long-term stable operation of the liquid-cooled light module in a cooling liquid environment and achieve efficient and high-quality data transmission.

[0017] In addition, based on the double-layer ring frame adhesive area structure described above, the present application further innovatively provides an annular glue containing groove and a glue injection hole communicating therewith on the light guide block body. The annular glue containing groove is located between the first ring frame adhesive area and the second ring frame adhesive area, and the glue injection hole is arranged on the top surface of the light guide block and communicates with the annular glue containing groove, so that the adhesive can be conveniently injected into the annular glue containing groove through the glue injection hole and formed into a third sealing adhesive. The third sealing adhesive can bond and reseal the light guide block and the circuit board between the first sealing adhesive and the second sealing adhesive. The third sealing adhesive not only can further reduce the risk of cooling liquid seeping into the light guide block and damaging the photoelectric conversion element, ensure that the liquid-cooled light module can operate more stably for a longer period in the cooling liquid and transmit data efficiently and with high quality, but also can improve the bonding area and bonding strength of the light guide block on the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0018] The above and other objects, features and advantages of the exemplary embodiments of the present application will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0019] Figure 1 A perspective view of a photoelectric conversion unit of an embodiment of the present application is shown;

[0020] Figure 2 A cross-sectional view of a photoelectric conversion unit of an embodiment of the present application is shown;

[0021] Figure 3 A perspective view of a light guide block of the photoelectric conversion unit is shown. Figure 1 A perspective view of a light guide block of the photoelectric conversion unit is shown.

[0022] Figure 4 A perspective view of a light guide block of the photoelectric conversion unit is shown. Figure 1 A perspective view of a light guide block of the photoelectric conversion unit is shown.

[0023] Figure 5 A perspective view of a light guide block of the photoelectric conversion unit is shown. Figure 1 A perspective view of a light guide block of the photoelectric conversion unit is shown.

[0024] Reference signs: 1, circuit board; 11, photoelectric conversion element; 2, light guide block; 20, potting adhesive material; 21, light guide block body; 21a, block body; 21b, base; 211, top surface; 212, bottom surface; 2121, first ring frame adhesive area; 2122, second ring frame adhesive area; 22, optical signal interface; 23, element cavity; 24, annular adhesive containing groove; 24a, first cavity top; 24b, second cavity top; 25, glue injection hole; 26, first converging lens; 27, second converging lens; 28, cavity; 281, reflecting surface; 29, cover; 3, first sealing adhesive; 4, second sealing adhesive; 5, third sealing adhesive; 100, photoelectric conversion unit; 300, optical fiber jumper. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present disclosure will be described clearly and completely below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present disclosure.

[0026] The present embodiment provides a photoelectric conversion unit 100, which is mainly applied in a liquid-cooled optical module, and is used to realize the core function of the liquid-cooled optical module, i.e., to realize the conversion between electrical signals and optical signals. Figure 1 And Figure 2 Both show the photoelectric conversion unit 100 of the embodiment of the utility model. As shown in Figure 1 And Figure 2As shown, the photoelectric conversion unit 100 includes a circuit board 1, a light guide block 2 disposed on the circuit board 1, and a first sealing adhesive 3 and a second sealing adhesive 4 for bonding the light guide block 2 to the circuit board 1. The circuit board 1 includes a photoelectric conversion element 11 disposed on its body. The photoelectric conversion element 11 mainly consists of an optical chip and an electrical chip electrically connected to it. When the photoelectric conversion unit 100 is used to receive optical signals and convert them into electrical signals, the optical chip receives the optical signals (from the fiber optic patch cord 300) through the light guide block 2 and converts them into electrical signals. The electrical chip is used to perform processing on the electrical signals, such as signal amplification and filtering, and output them externally. Conversely, when the photoelectric conversion unit 100 is used to receive electrical signals and convert them into optical signals, the electrical chip is used to drive the optical chip so that the optical chip can convert the received electrical signals into optical signals and output them externally through the light guide block 2. It can be understood that the fiber optic patch cord 300 is a cable with a fiber optic connector at one end. It may or may not have an outer sheath, depending on its application scenario.

[0027] Next, combine Figures 2 to 5 The light guide block 2 mentioned above will be described by way of example. Figures 2 to 4 As shown, the light guide block 2 mentioned above mainly includes a light guide block body 21 disposed on the circuit board 1, an optical signal interface 22 disposed on the light guide block body 21, and a component cavity 23 disposed on the bottom surface 212 (i.e., the surface that is joined with the circuit board 1) of the light guide block body 21 for accommodating the photoelectric conversion element 11. The light guide block body 21 is used to establish an optical path between the optical signal interface 22 and the component cavity 23. The optical signal interface 22 is used to connect the fiber optic patch cord 300 of the liquid-cooled optical module, so that the fiber optic patch cord 300 can communicate optically with the photoelectric conversion unit 100 through the light guide block 2. The fiber optic patch cord 300 can be one fiber or multiple fibers. When multiple fibers are included, the optical signals output from the multiple fibers can propagate in multiple optical paths of the light guide block 2 and enter the photoelectric conversion unit 100, where the photoelectric conversion unit 100 performs signal conversion.

[0028] To improve the sealing and protection level of the photoelectric conversion unit 100, such as Figure 4 and Figure 5 As shown, the bottom surface 212 of the light guide block body 21 includes a first annular frame adhesive area 2121 arranged around the component cavity 23, and a second annular frame adhesive area 2122 arranged around the first annular frame adhesive area 2121. The second annular frame adhesive area 2122 is preferably located at the edge of the bottom surface 212 of the light guide block body 21. The photoelectric conversion unit 100 also includes a first sealing adhesive 3 and a second sealing adhesive 4 disposed between the bottom surface 212 of the light guide block body 21 and the circuit board 1. See [link to documentation]. Figure 2 and Figure 5The first sealing adhesive 3 is arranged on the first annular adhesive area 2121 of the bottom surface 212 of the light guide block body 21 and surrounds the element cavity 23, and the second sealing adhesive 4 is arranged on the second annular adhesive area 2122 of the bottom surface 212 of the light guide block body 21 and surrounds the first sealing adhesive 3. Since the prior art only arranges one layer of sealing adhesive between the bottom surface 212 of the light guide block body 21 and the circuit board 1, while the present embodiment arranges at least two layers of sealing adhesives, the isolation effect between the photoelectric conversion unit 100 and the cooling liquid can be significantly enhanced, the risk of the cooling liquid seeping into the light guide block 2 and damaging (corroding or accelerating aging) the photoelectric conversion element 11 is further reduced, and it is ensured that the liquid-cooled optical module can be stably operated in the cooling liquid for a long time and efficiently and high-quality data transmission.

[0029] It needs to be particularly emphasized that even if the width of the one layer of sealing adhesive of the prior art is relatively wide, even the sum of the aforementioned two layers of sealing adhesives of the present embodiment, the sealing effect of the present embodiment is still better. The reason is that the double-layer sealing adhesive design in the present embodiment not only provides physical redundancy protection, but also enhances the service life of the sealing protection. First, two layers of sealing adhesives require two molding processes, and even if one of them has quality defects due to poor molding, the other can be immediately remedied. Second, the two layers of sealing adhesives do not contact the cooling liquid at the same time, the second sealing adhesive 4 on the outside is in contact with the cooling liquid before the first sealing adhesive 3 on the inside, which ensures that the first sealing adhesive 3 is less likely to be damaged by the cooling liquid than the second sealing adhesive 4, thereby significantly reducing the risk of the cooling liquid seeping into the light guide block 2 and ensuring that the aforementioned double-layer sealing protection has more obvious advantages in long-term protection effect.

[0030] In order to further improve the sealing protection level of the photoelectric conversion unit 100, the photoelectric conversion unit 100 of the present embodiment further increases a sealing protection. As shown in Figure 2 and Figure 3 The light guide block 2 can further include an annular glue containing groove 24 arranged on the bottom surface 212 of the light guide block body 21, and a glue injection hole 25 arranged on the light guide block body 21 and communicating with the annular glue containing groove 24. At the same time, the photoelectric conversion unit 100 can further include a third sealing adhesive 5 (see Figure 2Since the annular adhesive groove 24 is located between the first annular frame adhesive area 2121 and the second annular frame adhesive area 2122, and the first sealing adhesive 3 and the second sealing adhesive 4 are sequentially located in the first annular frame adhesive area 2121 and the second annular frame adhesive area 2122, the third sealing adhesive 5 is located between the first sealing adhesive 3 and the second sealing adhesive 4. This third sealing adhesive 5 can not only further reduce the risk of coolant seeping into the light guide block 2 and damaging the photoelectric conversion element 11, ensuring that the liquid-cooled optical module can operate stably for a longer period of time in the coolant and transmit data efficiently and with high quality, but also increase the bonding area and bonding strength of the light guide block 2 on the circuit board 1.

[0031] As an example, such as Figure 4 The central axis of the optical signal interface 22 is parallel to the bottom surface 212 of the light guide block body 21. The light guide block 2 may also include a first converging lens 26 disposed on the light guide block body 21 and located within the optical signal interface 22, a second converging lens 27 disposed on the light guide block body 21 and located within the component cavity 23, and a cavity 28 disposed on the top surface 211 of the light guide block body 21 (the surface opposite to the bottom surface 212 and away from the circuit board 1) and having a reflective surface 281. The optical axes of the first converging lens 26 and the second converging lens 27 intersect perpendicularly on the reflective surface 281 and are both within the optical path of the light guide block 2. The placement of the first converging lens 26 and the second converging lens 27 results in lower optical signal loss and a more concentrated beam during transmission, thereby improving the stability and reliability of the transmission process. Furthermore, the reflective surface 281 can alter the optical path and promote a more compact size for the light guide block 2, thus ensuring a more compact layout of the photoelectric conversion unit 100 and the liquid-cooled optical module and reducing their space occupation.

[0032] To effectively control the volume of the light guide block 2, the optical signal interface 22 and the annular adhesive groove 24 are configured such that their orthographic projections on the bottom surface 212 of the light guide block body 21 intersect, which helps to reduce the volume of the light guide block 2. Furthermore, the annular adhesive groove 24 includes a first cavity top 24a and a second cavity top 24b that is closer to the top surface 211 of the light guide block body 21 than the first cavity top 24a. The first cavity top 24a is located between the optical signal interface 22 and the bottom surface 212 of the light guide block body 21, while the second cavity top 24b is higher than the first cavity top 24a but lower than the top surface 211 of the light guide block body 21. The adhesive injection hole 25 connects to the annular adhesive groove 24 at the location of the second cavity top 24b. The cavity top of the annular adhesive groove 24 adopts a stepped surface design, and the adhesive injection hole 25 is positioned at a higher cavity top position. This arrangement allows the adhesive to be smoothly and evenly added to the annular adhesive groove 24, especially filling the lower area of ​​the cavity top. In this way, the third sealing adhesive 5, which is cured by the adhesive, can effectively perform the functions of bonding and sealing.

[0033] In order to further improve the bonding and sealing effects of the third sealing adhesive 5, the distance from the first cavity top 24a of the annular adhesive groove 24 to the bottom surface 212 of the light guide block body 21 is preferably 0.4-0.5 mm. Through a large number of experiments, it is verified that when the distance from the first cavity top 24a of the annular adhesive groove 24 to the bottom surface 212 of the light guide block body 21 is 0.4-0.5 mm, the light guide block body 21 has sufficient intensity at the first cavity top 24a of the annular adhesive groove 24, and the adhesive can more fully and uniformly fill the annular adhesive groove 24.

[0034] In the present embodiment, the first sealing adhesive 3, the second sealing adhesive 4, and the third sealing adhesive 5 are all cured by light-curing or heat-curing adhesives. The light-curing adhesive is quickly cured under light conditions, and the heat-curing adhesive is cured by heating. These two curing methods ensure that the adhesive can quickly form strong adhesion during the curing process, thereby improving the reliability and efficiency of the connection and sealing. As a preferred, the first sealing adhesive 3 and the third sealing adhesive 5 can be made of heat-curing adhesives. The light guide block 2 is made of transparent material and can allow curing light such as ultraviolet light to pass through, but the brightness and uniformity of the light irradiated to the light-curing adhesive is significantly reduced, which affects the molding quality and effect of the first sealing adhesive 3 and the third sealing adhesive 5. Therefore, in order to improve the molding quality and effect, the first sealing adhesive 3 and the third sealing adhesive 5 are more recommended to be made of heat-curing adhesives, so that the molding quality and effect of the first sealing adhesive 3 and the third sealing adhesive 5 can be more optimal.

[0035] As an example, the frame edge width of the first ring frame adhesive area 2121 and the second ring frame adhesive area 2122 is 0.5-1 mm. When the frame edge width of the first ring frame adhesive area 2121 and the second ring frame adhesive area 2122 is accurately controlled within the range of 0.5-1 mm, not only can sufficient joint area be provided for the adhesion of the first sealing adhesive 3 and the second sealing adhesive 4, but also the connection function and the sealing function of the first sealing adhesive 3 and the second sealing adhesive 4 can be fully played, and the wall structure of the light guide block body 21 for molding the first ring frame adhesive area 2121 and the second ring frame adhesive area 2122 has good mechanical strength, and the wall structure is not prone to breakage and other adverse conditions during assembly and use.

[0036] Similarly, the groove width of the annular adhesive groove 24 is 1-2 mm. The groove width of the annular adhesive groove 24 is accurately controlled within 1-2 mm, which ensures that the adhesive can flow and distribute smoothly and uniformly in the glue injection hole 25 and the annular adhesive groove 24, and form a uniform and continuous third sealing adhesive 5 between the light guide block 2 and the circuit board 1, thereby ensuring that the third sealing adhesive 5 can achieve more outstanding effects in adhesion and sealing.

[0037] Preferably, the glue injection hole 25 is a through hole with a diameter of 0.5-1mm. Such a diameter is large enough to accommodate the size of a common glue gun nozzle, ensuring that the adhesive can be smoothly injected into the annular glue groove 24, and small enough to reduce the impact on the structural strength of the light guide block body 21. In addition, the diameter of the glue injection hole 25 is not more than the groove width (1-2mm) of the annular glue groove 24 and can smoothly communicate with it, ensuring that the adhesive can completely fill the groove space during injection and curing, forming a uniform sealing glue.

[0038] Preferably, the shortest distance between the side wall of the element cavity 23 and the photoelectric conversion element 11 is 0.5-1mm. This distance ensures that the side wall of the element cavity 23 of the light guide block 2 is not easy to contact and damage the sensitive photoelectric conversion element 11. In particular, the aforementioned adverse situation is avoided during the process of adhering the light guide block 2 to the circuit board 1. It should be noted that the side wall of the element cavity 23 is the face that is connected to the face where the second converging lens 27 is located. It can be understood that in practice, in order to reduce the processing difficulty of the circuit board 1, the photoelectric conversion element 11 is generally arranged close to the vertical face of the element cavity 23 on the side close to the optical signal interface 22.

[0039] In this embodiment, the light guide block 2 is preferably an integrally formed structure to simplify the manufacturing process and improve overall quality and performance. At the same time, the light guide block body 21 includes a base 21b and a block main body 21a fixedly arranged on the base 21b, wherein the optical signal interface 22, the first converging lens 26, the second converging lens 27 and the cavity 28 are all formed in the block main body 21a, and the annular glue groove 24 and the element cavity 23 are formed in the base 21b and the block main body 21a. The cross-sectional area of the base 21b is larger than that of the block main body 21a. Due to the requirement of high-precision structure of the block main body 21a, high-precision manufacturing molds and manufacturing processes are usually used to ensure the accuracy of its optical and mechanical properties. The base 21b mainly serves as a connection and accommodation function, and its processing precision requirement is relatively low. That is, only a recess for forming the base 21b needs to be opened in the existing manufacturing mold, and the existing manufacturing mold and process can be used to manufacture the aforementioned light guide block 2, which is beneficial to reduce the manufacturing cost and processing difficulty.

[0040] As an example, the cross section of the base 21b and the block main body 21a of the light guide block body 21 in the vertical ground direction is circular, rectangular or polygonal, but preferably rectangular for easy manufacturing. In addition, some subtractive openings can be provided on the block main body 21a, for example, two subtractive openings symmetrically arranged with respect to the optical signal interface 22 on the rectangular block main body 21a, to reduce the material and weight of the light guide block 2 as much as possible.

[0041] In this embodiment, the light guide block 2 can also include a cover 29 fixedly arranged on the top surface 211 of the light guide block body 21 and sealing the cavity 28, as shown inFigure 2 The reflecting surface 281 is generally a full reflecting surface formed by the difference in refractive index between the material of the light guide block 2 and air. If there are impurities in the cavity 28, the effect of the reflecting surface 281 will be affected. The cover 29 can prevent dust, moisture and other harmful substances from entering the cavity 28 of the light guide block 2, so as to ensure that the performance of the reflecting surface 281 is always at the best level. In order to achieve better sealing of the photoelectric conversion unit 100, the photoelectric conversion unit 100 can further include a potting material 20 arranged on the circuit board 1 and covering the cover 29, the light guide block 2 and the part of the fiber jumper 300 close to the light guide block 2. The potting material 20 plays a role in sealing protection prior to the first sealing adhesive 3, the second sealing adhesive 4 and the third sealing adhesive 5, and provides reinforcement and sealing enhancement for the cover 29. In addition, the potting material 20 can also effectively prevent dust, bacteria and other pollutants from damaging the photoelectric conversion unit 100.

[0042] Next, the manufacturing method of the photoelectric conversion unit 100 is introduced. The steps include preparing the circuit board 1 and the light guide block 2 of the photoelectric conversion unit 100, then coating the first adhesive and the second adhesive on the bottom surface 212 of the light guide block body 21 of the light guide block 2, and then pasting the light guide block 2 on the circuit board 1 and accommodating the photoelectric conversion element 11 through the element cavity 23. The first adhesive is mainly coated in the first ring frame adhesive area 2121 of the bottom surface 212 of the light guide block body 21 of the light guide block 2, and can form the first sealing adhesive 3 of the photoelectric conversion unit 100 after curing; and the second adhesive is mainly coated in the second ring frame adhesive area 2122 of the bottom surface 212 of the light guide block body 21 of the light guide block 2, and can form the second sealing adhesive 4 of the photoelectric conversion unit 100 after curing. In the photoelectric conversion unit 100 obtained by the manufacturing method, the first sealing adhesive 3 and the second sealing adhesive 4 can further reduce the risk of cooling liquid seeping into the light guide block 2 and damaging the photoelectric conversion element 11, and ensure that the liquid-cooled optical module can operate stably in the cooling liquid for a long time and transmit data efficiently and with high quality.

[0043] In the embodiment, the steps of the manufacturing method can further include injecting the third adhesive into the annular glue containing groove 24 through the glue injection hole 25 until the annular glue containing groove 24 and the glue injection hole 25 are completely filled, wherein the third adhesive forms the third sealing adhesive 5 of the photoelectric conversion unit 100 after curing. The third adhesive is injected through the glue injection hole 25 and forms the third sealing adhesive 5, which can further reduce the risk of cooling liquid seeping into the light guide block 2 and damaging the photoelectric conversion element 11.

[0044] As an example, the first adhesive, the second adhesive and the third adhesive are all light-curing or heat-curing adhesives, and the sources can be the same or different. The light-curing adhesive is quickly cured under light conditions, and the heat-curing adhesive is cured by heating. These two curing methods ensure that the adhesives can quickly form strong adhesion during the curing process, thereby improving the reliability and efficiency of connection and sealing.

[0045] In one embodiment, the first adhesive and the second adhesive are light-curing and heat-curing adhesives, and the sources are the same. The multi-layer structure of the light guide block 2 blocks ultraviolet light, resulting in problems such as low curing efficiency and incomplete curing of the first sealing adhesive 3 and / or the second sealing adhesive 4, especially the first sealing adhesive 3 located below the light guide block with a thicker wall. Using the same source adhesive can not only save the trouble of changing the glue gun when gluing. It can be understood that when the first sealing adhesive 3 and the second sealing adhesive 4 of the photoelectric conversion unit 100 are cured, they are first cured by ultraviolet light and then baked at high temperature until the first sealing adhesive 3 and the second sealing adhesive 4 are completely cured. It should be noted that the ultraviolet curing of the first sealing adhesive 3 and the second sealing adhesive 4 causes the light guide block 2 to be bonded to the circuit board 1, ensuring that the light guide block 2 does not displace during high-temperature baking.

[0046] In one embodiment, the third adhesive is a low-viscosity heat-curing glue with good wettability. The third adhesive is injected into the annular glue groove 24 through the glue injection hole 25. The low-viscosity glue with good wettability has good flowability and can fully fill the annular glue groove 24. The third sealing adhesive 5 with a high thickness can easily cause internal curing problems when using a light-curing adhesive. The use of heat-curing glue has better forming effect. It can be understood that the third adhesive that completely fills the annular glue groove 24 and the glue injection hole 25 is cured and formed into the third sealing adhesive 5 by high-temperature baking.

[0047] In the present embodiment, the steps of the manufacturing method can further include: inserting and fixing the fiber jumper 300 into the optical signal interface 22 of the light guide block 2 of the optoelectronic conversion unit 100, so that the fiber jumper 300 can be in optical communication with the optoelectronic conversion element 11 of the optoelectronic conversion unit 100 through the light guide block 2; covering the cover 29; adding potting glue to the circuit board 1 of the optoelectronic conversion unit 100 and covering the cover 29, the light guide block 2 and the end of the fiber jumper 300 close to the light guide block 2, until the potting glue forms the potting glue material 20 of the optoelectronic conversion unit 100 after curing. Therefore, the potting glue material 20 formed by curing of the potting glue can provide additional sealing protection and structural reinforcement for the entire optoelectronic conversion unit 100. It can be understood that in the present application, the execution order of covering the cover and inserting the fiber jumper can be interchanged, that is, the fiber jumper can be inserted first and then the cover can be covered, or the cover can be covered first and then the fiber jumper can be inserted. Both orders can achieve the same technical effect.

[0048] Next, the application of the optoelectronic conversion unit 100 mentioned above in two types of liquid-cooled optical modules will be introduced. In one application scenario, the liquid-cooled optical module includes a housing with an optical port and an electrical port, an optoelectronic conversion unit arranged in the housing and electrically connected with the electrical port, and a fiber jumper 300 provided in the housing and inserted and fixed in the optical signal interface 22 of the light guide block 2 of the optoelectronic conversion unit at one end and located in the optical port of the optical module at the other end. Among them, the optoelectronic conversion unit is also selected as the optoelectronic conversion unit 100 mentioned above, because it has excellent sealing protection performance and can operate persistently and efficiently even when immersed in cooling liquid, therefore, the liquid-cooled optical module can improve its reliability and durability by using the optoelectronic conversion unit 100, and ensure that the liquid-cooled optical module becomes an ideal choice in high heat dissipation demand communication systems. It should be noted that the optical port of the optical module is used for optical communication with the outside, and the end of the fiber jumper 300 located in the optical port of the optical module is used for receiving optical signals or outputting optical signals of the optical module.

[0049] In another application scenario, the liquid-cooled optical module includes a shell with an electrical port, an optoelectronic conversion unit arranged in the shell and electrically connected with the electrical port, and an optical fiber jumper 300 provided in the shell and having one end extending out of the shell (connected with other optical fiber or another liquid-cooled optical module) and the other end inserted into and fixed in the optical signal interface 22 of the light guide block 2 of the optoelectronic conversion unit. Wherein, the optoelectronic conversion unit is also selected as the above-mentioned optoelectronic conversion unit 100, one end of the optical fiber jumper of the optical module extending out of the shell can be directly coupled with another jumper through an adapter, and a plastic member such as a boot is arranged on the side of the optical module away from the electrical interface, the shell can be interference-fitted with the boot, and the sealing performance of the liquid-cooled optical module is further optimized. Since the liquid-cooled optical module has excellent sealing and protection performance, it can operate durably and efficiently even when immersed in the cooling liquid, and therefore, the reliability and durability of the liquid-cooled optical module can be improved by the optoelectronic conversion unit 100, and the liquid-cooled optical module can be ensured to be an ideal choice for a high-heat-dissipation-demanding communication system.

[0050] In the above description of the present application, unless otherwise explicitly specified and limited, the terms "fixed", "mounted", "connected" or "linked" and the like should be understood in a broad sense. For example, as to the term "connected", it can be fixed connection, detachable connection, or integral; it can be mechanical connection, electrical connection; it can be direct connection, or indirect connection through an intermediate medium, or it can be internal communication of two elements or interaction relationship between two elements. Therefore, unless otherwise explicitly limited in the present application, the above terms in the present application can be understood in the specific meaning in the present application by those skilled in the art according to the specific circumstances.

[0051] According to the above description of the present application, those skilled in the art can also understand that the terms used in the present application, such as "top", "bottom", "inner", "outer" and the like indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings of the present application, which is only for the purpose of facilitating the description of the scheme of the present application and simplifying the description, and does not mean or imply that the devices or elements involved must have the specific orientation, be constructed and operated in the specific orientation, therefore the above orientation or positional relationship terms cannot be understood or interpreted as a limitation on the scheme of the present application.

[0052] In addition, the terms "first" or "second" and the like used in the present application for referring to the numbering or ordinal terms are only for the purpose of description, and cannot be understood as explicitly or implicitly indicating relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" or "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three or more, unless otherwise explicitly specified and limited.

[0053] Although the embodiments of the present application have been shown and described herein, it should be apparent to those skilled in the art that the embodiments are provided by way of example. Many changes, modifications and substitutions can be made by one of ordinary skill in the art without departing from the spirit and scope of the present application. It should be understood that in the process of practicing the present application, various alternatives to the embodiments described herein can be employed. The appended claims are intended to cover such alternatives and equivalents.

Claims

1. A light guide block for a liquid-cooled light module, characterized by The application relates to a light guide block, comprising: a light guide block body; a component cavity formed on the bottom surface of the light guide block body; the bottom surface of the light guide block body comprises a first ring frame adhesive area arranged around the outside of the component cavity, and a second ring frame adhesive area arranged around the outside of the first ring frame adhesive area.

2. The light guide block of claim 1, wherein, The application further comprises a ring-shaped glue containing groove arranged on the bottom surface of the light guide block body and between the first ring frame adhesive area and the second ring frame adhesive area, and a glue injection hole arranged on the top surface of the light guide block body and communicating with the ring-shaped glue containing groove.

3. The light guide block of claim 2, wherein, The application further comprises a light signal interface arranged on the light guide block body, wherein the light guide block body is used for establishing an optical path between the light signal interface and the component cavity, and the light signal interface and the ring-shaped glue containing groove intersect in the orthographic projection on the bottom surface of the light guide block body.

4. The light guide block of claim 3, wherein, The ring-shaped glue containing groove comprises a first cavity top and a second cavity top closer to the top surface of the light guide block body than the first cavity top, the first cavity top is between the light signal interface and the bottom surface of the light guide block body, the second cavity top is higher than the first cavity top but lower than the top surface of the light guide block body, and the glue injection hole communicates with the ring-shaped glue containing groove at the position of the second cavity top.

5. The light guide block of claim 4, wherein, The distance from the first cavity top of the ring-shaped glue containing groove to the bottom surface of the light guide block body is 0.4-0.5 mm.

6. The light guide block of claim 3, wherein, The central axis of the light signal interface is parallel to the bottom surface of the light guide block body, and the light guide block further comprises a first converging lens arranged on the light guide block body and located in the light signal interface, a second converging lens arranged on the light guide block body and located in the component cavity, and a cavity arranged on the top surface of the light guide block body and having a reflecting surface, wherein the optical axes of the first converging lens and the second converging lens perpendicularly intersect on the reflecting surface and are both in the optical path.

7. The light guide block of claim 6, wherein, The light guide block is an integral forming structure, the light guide block body comprises a base and a block main body fixedly arranged on the base, the light signal interface, the first converging lens, the second converging lens and the cavity are formed in the block main body, the ring-shaped glue containing groove and the component cavity are formed in the base and the block main body, and the cross-sectional area of the base is larger than that of the block main body.

8. A light guide block according to any one of claims 2 to 7, wherein, The groove width of the ring-shaped glue containing groove is 1-2 mm.

9. The light guide block of any one of claims 1 to 7, wherein, The frame edge width of the first ring frame adhesive area and the second ring frame adhesive area is 0.5-1 mm.

10. The light guide block of any one of claims 1 to 7, wherein, The second ring frame adhesive area is arranged at the edge of the bottom surface.

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