Space division multiplexing silicon optical module

Abstract

The utility model provides a space division multiplexing silicon optical module which can be used in the technical field of optical communication. The space division multiplexing silicon optical module comprises a circuit board, an optical transmitting module, an optical receiving module and a multi-core fan-in and fan-out device, the optical transmitting module, the optical receiving module and the multi-core fan-in and fan-out device are arranged on the circuit board, a fan-out interface of the multi-core fan-in and fan-out device is respectively coupled with the optical transmitting module and the optical receiving module, and a fan-in interface of the multi-core fan-in and fan-out device is coupled with a multi-core optical fiber; the optical transmitting module is used for converting an input first electric signal into a first optical signal and outputting the first optical signal to the multi-core optical fiber through the multi-core fan-in and fan-out device; the optical receiving module is used for receiving a second optical signal input by the multi-core optical fiber through the multi-core fan-in and fan-out device and converting the second optical signal into a second electric signal. According to the space division multiplexing silicon optical module, the multi-core fan-in and fan-out device is arranged, and the multi-core fan-in and fan-out device can be directly coupled and connected with the multi-core optical fiber, so that the connection complexity between the space division multiplexing silicon optical module and the multi-core optical fiber is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical communication technology, in particular to a space division multiplexing silicon optical module. BACKGROUND

[0002] The silicon optical module is a new generation of optical communication device based on silicon photonics technology. The silicon optical technology mainly uses an SOI (silicon on insulator) substrate manufacturing platform to realize monolithic integration of optoelectronic devices and microelectronic devices through a traditional microelectronic CMOS process, and is a silicon-based large-scale integration technology that researches and develops photonic and electronic information carriers.

[0003] The space division multiplexing technology is a technology that uses the segmentation of space to realize channel multiplexing, so as to improve the transmission efficiency and capacity of optical communication. The space division multiplexing technology using a multi-core optical fiber as a carrier is widely used in the fields of optical fiber communication and mobile communication.

[0004] At present, the connection scheme of the multi-core optical fiber and the silicon optical module is to transmit optical signals between the optical fiber end and the multi-channel optical module through a multi-channel MPO connector, and each core of the optical module for signal transmission is still a single core. This transmission scheme can solve the problem of multi-channel signal transmission between the multi-core optical fiber and the optical module, but the multi-channel MPO connector has a high cost, the fusion process is complex, and the connection complexity of the optical device is increased, which is not conducive to the popularization and application of the multi-core optical fiber transmission scheme. CONTENT OF THE INVENTION

[0005] The present application provides a space division multiplexing silicon optical module to solve the technical problem of high connection complexity between the existing space division multiplexing silicon optical module and the multi-core optical fiber.

[0006] According to a first aspect of the present application, a space division multiplexing silicon optical module is provided, comprising a circuit board, and a light emitting module, a light receiving module and a multi-core fan-in fan-out device arranged on the circuit board, a fan-out interface of the multi-core fan-in fan-out device is coupled and connected with the light emitting module and the light receiving module respectively, and a fan-in interface of the multi-core fan-in fan-out device is coupled and connected with a multi-core optical fiber.

[0007] The light emitting module is configured to convert an input first electrical signal into a first optical signal, and output the first optical signal to the multi-core optical fiber through the multi-core fan-in fan-out device.

[0008] The light receiving module is configured to receive a second optical signal input from the multi-core optical fiber through the multi-core fan-in fan-out device, and convert the second optical signal into a second electrical signal.

[0009] In a feasible implementation, the light emitting module comprises a digital signal processor, a light source unit and a modulator of a silicon optical chip.

[0010] The digital signal processor is configured to receive and process a first electrical signal input by an external communication system, and send the first electrical signal to the light source unit;

[0011] The light source unit is configured to provide a laser beam to the modulator according to the first electrical signal;

[0012] The modulator is configured to modulate the laser beam into a first optical signal.

[0013] In an embodiment, the light source unit comprises a laser driving unit and a laser emitting unit;

[0014] The laser emitting unit is configured to emit a laser beam, and inject the laser beam into an optical input port of the silicon photonic chip;

[0015] The laser driving unit is configured to drive the laser emitting unit to emit a laser beam according to the first electrical signal.

[0016] In an embodiment, the laser emitting unit comprises a laser, an isolator and a lens, which are sequentially arranged along the emission direction of the laser beam.

[0017] In an embodiment, the laser beam and the optical input port have a preset included angle.

[0018] In an embodiment, the included angle ranges from 11.3° to 11.9°.

[0019] In an embodiment, the light receiving module comprises a digital signal processor, a transimpedance amplifier and a detector of the silicon photonic chip;

[0020] The detector is configured to convert a second optical signal input by the multi-core fan-in fan-out device into a second electrical signal;

[0021] The transimpedance amplifier is configured to amplify the second electrical signal, and send the second electrical signal to the digital signal processor;

[0022] The digital signal processor is configured to process the second electrical signal, and send the second electrical signal to an external communication system.

[0023] In an embodiment, the multi-core fan-in fan-out device is arranged on the silicon photonic chip in a stacked manner;

[0024] The fan-out interface is arranged at the bottom of the multi-core fan-in fan-out device, the fan-in interface is arranged at one side of the multi-core fan-in fan-out device, and the top of the silicon photonic chip is provided with a grating interface corresponding to the position of the fan-out interface.

[0025] In an implementable embodiment, the fan-in interface comprises a plurality of ring-distributed fan-in ports, which are one-to-one interfaced and coupled with the cores of the multi-core optical fiber.

[0026] In an implementable embodiment, the grating interface comprises a plurality of array-distributed grating ports, and the fan-out interface comprises a plurality of array-distributed fan-out ports.

[0027] The grating ports and the fan-out ports are one-to-one interfaced and coupled.

[0028] Compared with the prior art, the present application has the following beneficial effects:

[0029] The present application provides a kind of space division multiplexing silicon light module, by being arranged in space division multiplexing silicon light module multi-core fan-in fan-out device, utilize multi-core fan-in fan-out device to realize the coupling connection of light emitting module, optical receiving module and multi-core optical fiber, and multi-core fan-in fan-out device can be directly coupled with multi-core optical fiber and connected, compared with the existing MOP connector, multi-core fan-in fan-out device and multi-core optical fiber between connection is simple, reduce the complexity and cost of connection between space division multiplexing silicon light module and multi-core optical fiber, will effectively promote the application of silicon light technology in optical module, be conducive to the promotion of space division multiplexing transmission scheme in optical communication field, play an active role to subsequent multi-core optical fiber development. BRIEF DESCRIPTION OF DRAWINGS

[0030] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0031] Figure 1 A structure schematic diagram of an existing space division multiplexing silicon light module provided by the embodiment of the present application;

[0032] Figure 2 A structure schematic diagram of a space division multiplexing silicon light module provided by the embodiment of the present application;

[0033] Figure 3 An assembly structure schematic diagram of a silicon light chip and a multi-core fan-in fan-out device provided by the embodiment of the present application;

[0034] Figure 4 A distribution schematic diagram of fan-in port of multi-core fan-in fan-out device provided by the embodiment of the present application;

[0035] Figure 5 A distribution schematic diagram of fan-out port of multi-core fan-in fan-out device provided by the embodiment of the present application.

[0036] Explanation of reference signs:

[0037] 100-circuit board;

[0038] 200 - transimpedance amplifier

[0039] 300 - silicon photonic chip

[0040] 400 - MOP connector

[0041] 401 - splice

[0042] 500 - digital signal processor

[0043] 600 - laser drive unit

[0044] 700 - lens

[0045] 800 - isolator

[0046] 900 - laser

[0047] 1000 - multi-core fan-in fan-out device

[0048] 1001 - fan-in port

[0049] 1002 - fan-out port

[0050] 1100 - multi-core optical fiber

[0051] The specific embodiments of the present application have been shown by way of example in the above-described figures and will be described in greater detail below. These figures and the written description are not intended to restrict or limit the scope of the inventive concepts in any way, but rather to illustrate the inventive concepts by reference to specific embodiments. DETAILED DESCRIPTION

[0052] Exemplary embodiments will be described in detail with reference to the drawings, wherein like reference numerals refer to like elements throughout. The following detailed description is not intended to restrict or limit the scope of the inventive concepts, but rather to explain the inventive concepts by reference to specific embodiments.

[0053] Silicon optical module is a new generation of optical communication device based on silicon photonics technology. Silicon optical technology mainly uses SOI (silicon on insulator) substrate manufacturing platform to realize the monolithic integration of optoelectronic devices and microelectronic devices through traditional microelectronic CMOS process, and is a silicon-based large-scale integrated technology using photons and electrons as information carriers. At present, silicon optical field has realized the silicon-based integration of various optoelectronic devices, such as various silicon-based passive devices, germanium-silicon detectors and silicon modulators, which can meet the application of 400Gbps and above rate optical modules to a certain extent. At present, high-speed silicon optical modules have been widely used in data centers, 5G communication, artificial intelligence and high-performance computing fields, and have become the key technology carrier for the development of optical communication industry towards high bandwidth, low delay and low energy consumption.

[0054] The space division multiplexing technology is a technology for realizing channel multiplexing by using space division, which is widely used in optical fiber communication and mobile communication fields. The traditional space division multiplexing technology combines multiple optical fibers into a bundle to form a multi-core optical fiber for multi-channel transmission. With the development of communication technology, it has been realized to transmit multiple signals in one optical fiber by exciting different optical modes of the multi-core optical fiber, which greatly saves the wiring space of the machine room.

[0055] At present, the connection scheme of multi-core optical fiber and silicon optical module is to transmit optical signals between the optical fiber end and the multi-channel optical module through the multi-channel MPO connector. The optical module for transmitting signals still has single core. Taking a multi-core optical fiber with 8 cores as an example, referring to Figure 1 , the existing silicon optical module is directly coupled with the silicon optical chip 300 through an 8-channel optical fiber array (FA), and the output is an 8-core MPO connector 400. The connector 401 of the MOP connector is connected with another connector 401 arranged at the end of the multi-core optical fiber 1100, so as to realize the coupling connection between the silicon optical module and the multi-core optical fiber 1100. This transmission scheme can solve the problem of multi-channel signal transmission between the multi-core optical fiber 1100 and the optical module, but the multi-channel MPO connector 400 has high cost, the fusion process is complex, and the connection complexity of optical devices is increased, which is not conducive to the popularization and application of the multi-core optical fiber 1100 transmission scheme.

[0056] Therefore, since the existing silicon optical module output FA is a single-core optical fiber connection scheme, it cannot be directly connected with the multi-core optical fiber, causing the problem of complex application of the multi-core optical fiber in the silicon optical module.

[0057] In view of the above technical problems, the space division multiplexing silicon optical module is provided, which is directly coupled with the multi-core optical fiber through the multi-core fan-in and fan-out device, thereby reducing the connection complexity between the space division multiplexing silicon optical module and the multi-core optical fiber.

[0058] The technical solutions of the space division multiplexing silicon optical module provided in the application will be described in detail below through specific embodiments. It should be noted that the following embodiments can exist independently or be combined with each other. For the same or similar content, it can not be repeatedly described in different embodiments.

[0059] Figure 2 A structure diagram of a space division multiplexing silicon optical module provided in an embodiment of the application is shown in FIG. 1. Figure 2 In some embodiments, the space division multiplexing silicon optical module includes a circuit board 100, and a light emitting module, a light receiving module, and a multi-core fan-in fan-out device 1000 arranged on the circuit board 100. The fan-out interfaces of the multi-core fan-in fan-out device 1000 are respectively coupled to the light emitting module and the light receiving module, and the fan-in interface of the multi-core fan-in fan-out device 1000 is coupled to a multi-core optical fiber 1100. The light emitting module is configured to convert an input first electrical signal into a first optical signal, and output the first optical signal to the multi-core optical fiber 1100 through the multi-core fan-in fan-out device 1000. The light receiving module is configured to receive a second optical signal input from the multi-core optical fiber 1100 through the multi-core fan-in fan-out device 1000, and convert the second optical signal into a second electrical signal.

[0060] Specifically, the multi-core fan-in fan-out device 1000 is a core component for realizing efficient coupling between the multi-core optical fiber 1100 and a plurality of single-mode optical fibers. The multi-core fan-in fan-out device 1000 can precisely couple optical signals from a single single-mode optical fiber to each core of the multi-core optical fiber 1100 (fan-in), or inversely disperse optical signals from the multi-core optical fiber 1100 to a plurality of single-mode optical fibers (fan-out), thereby realizing multiplexing and demultiplexing of space division channels. The multi-core fan-in fan-out device 1000 writes waveguides on a glass substrate by femtosecond laser to form an optical waveguide structure, thereby realizing the fan-in fan-out function.

[0061] In this embodiment, the multi-core fan-in fan-out device 1000 is arranged in the space division multiplexing silicon optical module, and the multi-core fan-in fan-out device 1000 is used to realize the coupling connection between the light emitting module, the light receiving module, and the multi-core optical fiber 1100. Moreover, the multi-core fan-in fan-out device 1000 can be directly coupled to the multi-core optical fiber 1100 for use. Compared with the existing MOP connector, the connection between the multi-core fan-in fan-out device 1000 and the multi-core optical fiber 1100 is simple, which reduces the complexity and cost of the connection between the space division multiplexing silicon optical module and the multi-core optical fiber 1100. This will effectively promote the application of silicon optical technology in optical modules, and is conducive to the promotion of the space division multiplexing transmission scheme in the field of optical communication, and plays a positive role in the development of the multi-core optical fiber 1100.

[0062] Specifically, the light emitting module is a core component in the silicon optical module for realizing the conversion of electrical signals to optical signals and completing optical emission.

[0063] Specifically, the light receiving module is a core component for converting optical signals into electrical signals in the silicon optical module.

[0064] Referring to Figure 2 In some embodiments, the light emitting module includes a digital signal processor 500, a light source unit, and a modulator of the silicon optical chip 300; the digital signal processor 500 is configured to receive and process a first electrical signal input by an external communication system, and then send the first electrical signal to the light source unit; the light source unit is configured to provide a laser beam to the modulator according to the first electrical signal; and the modulator is configured to modulate the laser beam into a first optical signal.

[0065] In this embodiment, the digital signal processor 500 (DSP) pre-processes the original electrical signal input by the external communication system, including encoding modulation, clock recovery, and pre-equalization operations, to optimize the signal quality and adapt to subsequent transmission requirements. Subsequently, the processed first electrical signal is sent to the light source unit to generate a laser beam with a specific wavelength and power. At the same time, the modulator integrated in the silicon optical chip 300 modulates the laser beam in intensity, phase, or frequency in real time through the electro-optic effect, loading the digital signal onto the laser beam. Finally, the modulated first optical signal is coupled to the multi-core optical fiber 1100 through the multi-core fan-in and fan-out device 1000.

[0066] Optionally, the light source unit includes a laser driving unit 600 and a laser emitting unit; the laser emitting unit is configured to emit a laser beam and shoot the laser beam into the light inlet port of the silicon optical chip 300; and the laser driving unit 600 is configured to drive the laser emitting unit to emit the laser beam according to the first electrical signal.

[0067] The laser driving unit 600 can convert the first electrical signal into a driving signal that precisely matches the characteristics of the light source, to drive the laser emitting unit to emit a laser beam with a specific wavelength and power.

[0068] Specifically, the laser driving unit 600 is a Driver driving chip. The Driver driving chip is an integrated circuit specially used to control and drive external loads in various electronic devices. Its core function is to convert the weak signal output by the microcontroller or digital circuit into a strong electrical signal sufficient to drive the load, through signal amplification, level conversion, and power regulation, to ensure stable operation of the device. In addition, the Driver driving chip also integrates protection functions such as overcurrent, overvoltage, and overheating, which can prevent the load or the chip itself from being damaged, simplify circuit design, and improve system reliability.

[0069] Optionally, the laser emitting unit includes a laser 900, an isolator 800, and a lens 700, which are arranged in sequence along the emission direction of the laser beam.

[0070] The laser 900 is used as a light source to output a laser beam, the isolator 800 uses the magneto-optical effect or the Faraday rotation principle to allow the light to pass in one direction while blocking the reflected light from returning, thereby avoiding the interference of the reflected signal with the laser 900, and the lens 700 shapes the divergent light beam emitted by the laser 900 into parallel light by precisely controlling the collimation, focusing or coupling angle of the light beam, and compensates for the aberration in the optical path, thereby realizing low-loss and high-efficiency optical signal transmission. The three work together to ensure that the laser emitting unit has stable light source characteristics, anti-reflection interference capability and precise optical alignment in high-speed communication.

[0071] Optionally, the laser beam and the light inlet port have a preset included angle.

[0072] If the laser beam is perpendicular to the light inlet port of the silicon optical chip 300, the light will be significantly reflected (Fresnel reflection) at the interface between the chip and the air (with a large difference in refractive index), which will cause part of the light energy to return to the laser 900, trigger mode competition or power fluctuation, and reduce the coupling efficiency. By tilting the incident, the reflected light deviates from the exit path of the laser 900, reducing the light energy returning to the laser 900, thereby improving the forward coupling efficiency, suppressing reflection interference, and improving the modulation performance.

[0073] Optionally, the included angle ranges from 11.3° to 11.9°.

[0074] By setting the included angle range, the reflection interference is effectively suppressed.

[0075] Referring to Figure 2 In some embodiments, the light receiving module includes a digital signal processor 500, a transimpedance amplifier 200, and a detector of a silicon optical chip 300; the detector is used to convert a second optical signal input by the multi-core fan-in fan-out device 1000 into a second electrical signal; the transimpedance amplifier 200 is used to amplify the second electrical signal and send the second electrical signal to the digital signal processor 500; and the digital signal processor 500 is used to process the second electrical signal and send the second electrical signal to an external communication system.

[0076] The detector integrated in the silicon optical chip 300 first converts the weak second optical signal transmitted by the multicore optical fiber 1100 into an electric current signal, and the high responsivity characteristic ensures effective capture of low optical power. The transimpedance amplifier 200 (TIA) then converts the weak current output by the detector into a high-amplitude voltage signal through impedance conversion and low-noise amplification, while suppressing background noise interference. At the same time, the digital signal processor 500 (DSP) performs clock data recovery, equalization compensation, decoding and demodulation, etc. on the amplified second electric signal, corrects the signal distortion in the transmission link and extracts the original data, optimizes the receiving performance under different optical power conditions through an adaptive algorithm, and realizes high-speed and low-error-rate optical-electric signal conversion and data restoration. Finally, the processed second electric signal is sent to an external communication system.

[0077] Referring to Figure 3 In some embodiments, the multicore fan-in fan-out device 1000 is stacked on the silicon optical chip 300; the fan-out interface is arranged at the bottom of the multicore fan-in fan-out device 1000, and the fan-in interface is arranged at one side of the multicore fan-in fan-out device 1000. The top of the silicon optical chip 300 is provided with a grating interface corresponding to the position of the fan-out interface.

[0078] In this embodiment, the problem of long space division device and large occupation of optical engine space in the existing space division multiplexing optical module is optimized. The multicore fan-in fan-out device 1000 and the silicon optical chip 300 are stacked and coupled, which saves the optical engine space and is more conducive to industrialization. Taking the light emission process as an example, the light emission of the emission end of the silicon optical chip 300 adopts a grating coupling mode, and the light is emitted vertically upward from the grating interface of the silicon optical chip 300. The fan-out interface of the multicore fan-in fan-out device 1000 receives light from the bottom and outputs light from the side fan-in interface, which is then coupled with the multicore optical fiber 1100 to output the optical module.

[0079] Referring to Figure 4 Optionally, the fan-in interface includes a plurality of annularly distributed fan-in ports 1001, and the fan-in ports 1001 are one-to-one coupled with the cores of the multicore optical fiber 1100.

[0080] The fan-in interface is a circular multicore structure to be coupled with the multicore optical fiber 1100.

[0081] Referring to Figure 5 Optionally, the grating interface includes a plurality of arrayed grating ports, and the fan-out interface includes a plurality of arrayed fan-out ports 1002; the grating ports and the fan-out ports 1002 are one-to-one coupled.

[0082] The coupling ports of the multicore fan-in fan-out device 1000 and the silicon optical chip 300 are two-dimensional array structures, which are used to realize optical signal transmission between the multicore fan-in fan-out device 1000 and the silicon optical chip 300.

[0083] In summary of the above embodiments, in some embodiments, the specific preparation process of the space division multiplexing silicon optical module includes the following steps:

[0084] Step 1, electronic component mounting by surface mounting technology (SMT), including main electrical chips such as DSP.

[0085] Step 2, laser eutectic, complete COC packaging.

[0086] Step 3, complete silicon optical chip, laser, driver chip, TIA chip and isolator mounting by high-precision die bonder, the tilt angle of the laser and the silicon optical chip is controlled at 11.6±0.3°.

[0087] Step 4, multi-core fan-in fan-out device coupling by coupling machine, the fan-out end is coupled with the silicon optical chip waveguide, and the fan-in end is coupled with the multi-core optical fiber, and the best coupling efficiency is obtained according to the MPD value feedback of the silicon optical chip.

[0088] Step 5, laser coupling, the best light output power can be obtained by single lens coupling or double lens coupling.

[0089] In this embodiment, the space division multiplexing silicon optical module design is realized by combining the multi-core fan-in fan-out planar waveguide optical device and the silicon optical chip technology, and the multi-core optical fiber is directly connected to the silicon optical module through the connector for use, which solves the complex problem of the application of the multi-core optical fiber in the silicon optical module.

[0090] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0091] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0092] In this application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixed", and the like, should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be direct connection, can also be indirect connection through an intermediate medium, can be internal communication of two elements or interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0093] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0094] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments. The technical features of the above embodiments can be combined in any way. In order to make the description brief, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combination of these technical features does not exist contradiction, it should be considered as the scope of the present application.

[0095] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the embodiments disclosed herein. The application is intended to cover any variations, uses or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice in the art to which the application pertains or the like. The specification and examples are to be considered exemplary only, with the true scope and spirit of the application indicated by the appended claims.

[0096] It should be understood that the present application is not limited to the precise construction that has been described and shown in the accompanying drawings, and that various modifications and changes can be affected therein by those skilled in the art without departing from the scope of the application. The scope of the application should be limited only by the appended claims.

Claims

1. A space division multiplexed silicon light module, characterized by, The application relates to a circuit board, and a light emitting module, a light receiving module and a multi-core fan-in fan-out device arranged on the circuit board, wherein a fan-out interface of the multi-core fan-in fan-out device is coupled with the light emitting module and the light receiving module respectively, and a fan-in interface of the multi-core fan-in fan-out device is coupled with a multi-core optical fiber. The light emitting module is used for converting an input first electrical signal into a first optical signal and outputting the first optical signal to the multi-core optical fiber through the multi-core fan-in fan-out device. The light receiving module is used for receiving a second optical signal input by the multi-core optical fiber through the multi-core fan-in fan-out device and converting the second optical signal into a second electrical signal.

2. The space division multiplexed silicon light module of claim 1, wherein, The light emitting module comprises a digital signal processor, a light source unit and a modulator of a silicon optical chip. The digital signal processor is used for receiving a first electrical signal input by an external communication system and processing the first electrical signal, and then sending the first electrical signal to the light source unit. The light source unit is used for providing a laser beam to the modulator according to the first electrical signal. The modulator is used for modulating the laser beam into a first optical signal.

3. The spatial division multiplexed silicon light module of claim 2, wherein, The light source unit comprises a laser driving unit and a laser emitting unit. The laser emitting unit is used for emitting a laser beam and shooting the laser beam into an optical input port of the silicon optical chip. The laser driving unit is used for driving the laser emitting unit to emit a laser beam according to the first electrical signal.

4. The spatial division multiplexed silicon light module of claim 3, wherein, The laser emitting unit comprises a laser, an isolator and a lens, which are sequentially and spacedly arranged along an emitting direction of the laser beam.

5. The spatial division multiplexed silicon light module of claim 3, wherein, The laser beam and the optical input port have a preset included angle.

6. The spatial division multiplexed silicon light module of claim 5, wherein, The included angle ranges from 11.3 degrees to 11.9 degrees.

7. The space division multiplexed silicon light module of claim 1, wherein, The light receiving module comprises a digital signal processor, a transimpedance amplifier and a detector of a silicon optical chip. The detector is used for converting a second optical signal input by the multi-core fan-in fan-out device into a second electrical signal. The transimpedance amplifier is used for amplifying the second electrical signal and sending the second electrical signal to the digital signal processor. The digital signal processor is used for processing the second electrical signal and sending the second electrical signal to an external communication system.

8. The space division multiplexed silicon light module of any of claims 2-7, wherein, The multi-core fan-in fan-out device is arranged on the silicon optical chip in a stacking mode. The fan-out interface is arranged at the bottom of the multi-core fan-in fan-out device, the fan-in interface is arranged at one side of the multi-core fan-in fan-out device, and the top of the silicon optical chip is provided with a grating interface corresponding to the position of the fan-out interface.

9. The spatial division multiplexed silicon light module of claim 8, wherein, The fan-in interface comprises a plurality of annularly distributed fan-in ports which are one-to-one coupled with the cores of the multi-core optical fiber.

10. The spatial division multiplexed silicon light module of claim 8, wherein, The grating interface comprises a plurality of arrayed grating ports, and the fan-out interface comprises a plurality of arrayed fan-out ports. The grating ports and the fan-out ports are one-to-one coupled.

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