Inspection equipment capable of automatically merging chips
By installing sensors and a microcontroller controller in the vacuum suction cup and placement slot, combined with detection and counting cameras, the problem of automated detection of wafer placement orientation and quantity was solved, improving the accuracy and safety of wafer inspection equipment.
Patent Information
- Application Number
- CN202422991740.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2034-12-04
AI Technical Summary
In existing technologies, the orientation of wafers placed in the tray is prone to errors, the suction cups are not stable and cause wafers to fall off, and there may be placement slots in the tray. The orientation and number of wafers placed need to be manually confirmed and adjusted.
By setting a vacuum sensor on the vacuum chuck and a pressure sensor in the placement slot, combined with a microcontroller, the automatic orientation and counting of wafers are achieved. The direction and quantity are automatically detected using a detection camera and a counting camera, and errors are indicated by an alarm light.
It enables automated orientation and counting of wafers, avoiding manual intervention, improving the accuracy and efficiency of wafer placement, and reducing the risk of wafers falling.
Smart Images
Figure CN223728728U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of chip production inspection, in particular to a kind of inspection equipment of automatic merging chip. BACKGROUND
[0002] After wafer is thinned to specified thickness by grinding, according to the demand of application end, after laser cutting and blade cutting, the whole wafer is scanned to distinguish good and bad product chips, and the good and bad product chips are sorted into good Tray and bad tray using picking machine, the prior art fills tray with suction cup, and good and bad products can be separated, but the above common inspection equipment still has the following problems:
[0003] The direction of the missing corner in the tray is prone to error, and the wafer may fall off due to unstable adsorption when the suction cup adsorbs and moves the wafer, and the tray may have unplaced slots, and the direction and quantity of wafer placement need to be confirmed and adjusted manually. UTILITY MODEL CONTENT
[0004] The utility model aims at providing a kind of inspection equipment of automatic merging chip to solve the problems of the direction of the missing corner in the tray being prone to error, the wafer may fall off due to unstable adsorption when the suction cup adsorbs and moves the wafer, and the tray may have unplaced slots, and the direction and quantity of wafer placement need to be confirmed and adjusted manually.
[0005] To achieve the above purpose, the utility model provides the following technical scheme: a kind of inspection equipment of automatic merging chip, including workbench, the one side of workbench top is fixedly installed with universal mechanical arm, one end of universal mechanical arm is fixedly connected with vacuum chuck, the side of vacuum chuck is provided with vacuum sensor, the lower of vacuum chuck is equipped with multiple tray assembly, and multiple tray assembly are all located on the surface of workbench, the inside of multiple tray assembly is equipped with multiple wafers, the other side of workbench top is fixedly installed with checking assembly, the junction of workbench and universal mechanical arm is fixedly installed with single-chip microcomputer controller, one end of the top of workbench is fixedly installed with counting assembly, the side of single-chip microcomputer controller is fixedly installed with control panel, the surface of workbench is fixedly installed with alarm lamp.
[0006] Preferably, the tray assembly includes a tray, the tray is internally provided with a plurality of placing grooves, the bottom of the inner wall of each of the plurality of placing grooves is provided with a pressure sensor, the top of each of the plurality of pressure sensors is fixedly connected with a placing plate, one side of the surface of the tray is provided with a power supply, one end of the tray is provided with a direction warning strip, the direction of the tray is prevented from being wrong through the direction warning strip, and the position not subjected to pressure is detected through the pressure sensor inside the placing groove, and the wafer is placed into the groove.
[0007] Preferably, the inspection assembly includes a mounting rod, the bottom of the mounting rod is provided with a rotating shaft sleeve, the top of the mounting rod is fixedly installed with a detection camera, one side of the surface of the mounting rod is fixedly connected with a first helical gear, one side of the mounting rod is provided with a speed reducer, the output end of the speed reducer is fixedly connected with a second helical gear, and whether the wafer is in the detection tray is detected.
[0008] Preferably, the counting assembly includes two rotating shaft seats, a transmission screw is rotatably connected between the two rotating shaft seats, a transmission screw thread block is threadedly connected to the surface of the transmission screw, a transmission motor is fixedly installed at one end of the transmission screw, and a counting camera is fixedly installed at the top of the transmission screw thread block.
[0009] Preferably, the pressure sensor and the single-chip microcomputer controller are electrically connected through the power supply, the surface of the placing plate is slidably connected with the inner wall of the placing groove, and the bottom of the wafer is in contact with the surface of the placing plate.
[0010] Preferably, the detection camera and the control panel are electrically connected through an external power supply, one side of the first helical gear is meshedly connected with one side of the second helical gear, and the counting camera, the alarm lamp and the single-chip microcomputer controller are electrically connected.
[0011] Compared with the prior art, the beneficial effects of the utility model are as follows: the direction of the tray is prevented from being wrong through the direction warning strip, the suction value of the suction disc is ensured to be qualified through the vacuum sensor, the position not subjected to pressure is detected through the pressure sensor inside the placing groove, the wafer is placed into the groove through the single-chip microcomputer controller, and the counting and detection of whether the wafer is in the detection tray are realized through the detection camera and the counting camera. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 It is a structure diagram of the utility model test equipment;
[0013] Figure 2 It is a structure diagram of the utility model test equipment tray assembly;
[0014] Figure 3 It is a structure diagram of the utility model test equipment inspection assembly;
[0015] Figure 4 The utility model discloses a structure diagram of the counting component of the inspection equipment.
[0016] In the drawing: 1, workbench, 2, universal mechanical arm, 3, vacuum chuck, 4, vacuum sensor, 5, tray assembly, 51, tray, 52, placing groove, 53, pressure sensor, 54, placing plate, 6, wafer, 7, inspection assembly, 71, detection camera, 72, mounting rod, 73, first helical gear, 74, speed reducer, 75, second helical gear, 8, single-chip microcomputer controller, 9, counting component, 91, rotating shaft seat, 92, transmission screw, 93, transmission screw block, 94, transmission motor, 95, counting camera, 10, control panel, 11, alarm lamp. DETAILED DESCRIPTION
[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model.
[0018] Please refer to Figures 1-4 The utility model provides a kind of inspection equipment of automatic merging chip, including workbench 1, the top of workbench 1 one side is fixedly installed with universal mechanical arm 2, one end of universal mechanical arm 2 is fixedly connected with vacuum chuck 3, the side of vacuum chuck 3 is provided with vacuum sensor 4, the below of vacuum chuck 3 is equipped with multiple tray assemblies 5, and multiple tray assemblies 5 are all located on the surface of workbench 1, the inside of multiple tray assemblies 5 is equipped with multiple wafers 6, the other side of the top of workbench 1 is fixedly installed with inspection assembly 7, the junction of workbench 1 and universal mechanical arm 2 is fixedly installed with single-chip microcomputer controller 8, one end of the top of workbench 1 is fixedly installed with counting component 9, the side of single-chip microcomputer controller 8 is fixedly installed with control panel 10, the surface of workbench 1 is fixedly installed with alarm lamp 11.
[0019] Please refer to Figures 2-4 Further, tray assembly 5 includes tray 51, the inside of tray 51 is equipped with multiple placing grooves 52, the bottom of the inner wall of multiple placing grooves 52 is provided with pressure sensor 53, the top of multiple pressure sensors 53 is fixedly connected with placing plate 54, the surface of tray 51 one side is provided with power, one end of tray 51 is provided with direction warning strip, inspection assembly 7 includes mounting rod 72, the bottom of mounting rod 72 is equipped with rotating shaft sleeve, the top of mounting rod 72 is fixedly installed with detection camera 71, the surface of mounting rod 72 one side is fixedly connected with first helical gear 73, one side of mounting rod 72 is provided with speed reducer 74, the output end of speed reducer 74 is fixedly connected with second helical gear 75 ，The counting assembly 9 comprises two rotating shaft seats 91, a transmission screw 92 is rotatably connected between the two rotating shaft seats 91, a transmission threaded block 93 is threadedly connected to the surface of the transmission screw 92, a transmission motor 94 is fixedly installed at one end of the transmission screw 92, and a counting camera 95 is fixedly installed at the top of the transmission threaded block 93.
[0020] In use, the tailing tray and the empty tray are placed by the direction warning strip arranged at the position of the missing corner, the universal mechanical arm 2 can be moved and placed in each direction, the vacuum chuck 3 is provided with a vacuum sensor 4, so that the value set by the single-chip microcomputer controller 8 to the vacuum sensor 4, when the vacuum chuck 3 is adsorbed on the wafer 6, the adsorption condition needs to reach the value set by the vacuum sensor 4 to be able to transfer the wafer 6 to the combined tray 51, the pressure sensor 53 is arranged in the placing groove 52 in the tray 51, when the wafer 6 is placed on the placing plate 54, the pressure sensor 53 detects the pressure and sends a signal to the single-chip microcomputer controller 8, and when the single-chip microcomputer controller 8 does not receive the signal of the pressure sensor 53, the wafer 6 is placed at these positions, the Bluetooth module is installed in each tray 51 and can be signal-connected with the single-chip microcomputer controller 8, the detection camera 71 is arranged to rotate through the speed reducer 74, drive the second bevel gear 75 to rotate, the second bevel gear 75 and the first bevel gear 73 are meshingly connected, so that the first bevel gear 73 rotates, the rotating shaft sleeve is installed on the workbench 1, and the mounting rod 72 is installed in the rotating shaft sleeve, so that a certain angle of rotation can be realized, the counting assembly 9 is arranged on one side of the combined tray area, the transmission threaded block 93 moves in the horizontal direction, and the counting camera 95 installed on the transmission threaded block 93 moves.
[0021] In use, the counting camera 95 can count through the photographing function of the camera, can further identify the front and back of the wafer 6 through comparison of the photos, can display the comparison and counting display through the control panel 10, and can display the alarm lamp 11 when an error occurs, so as to prompt the staff to make mistakes, and the moving counting camera 95 can shoot the situation in the tray more clearly.
[0022] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. within the spirit and principle of the utility model should be included in the protection scope of the utility model.
Claims
1. An inspection apparatus for automatically merging chips, comprising a table (1), characterized in that: The side of the top of the workbench (1) is fixedly installed with a universal mechanical arm (2), one end of the universal mechanical arm (2) is fixedly connected with a vacuum chuck (3), one side of the vacuum chuck (3) is provided with a vacuum sensor (4), the lower side of the vacuum chuck (3) is provided with a plurality of tray assemblies (5), and the plurality of tray assemblies (5) are arranged on the surface of the workbench (1), the inside of the plurality of tray assemblies (5) is provided with a plurality of wafers (6), the other side of the top of the workbench (1) is fixedly installed with an inspection assembly (7), the connection between the workbench (1) and the universal mechanical arm (2) is fixedly installed with a single-chip microcomputer controller (8), one end of the top of the workbench (1) is fixedly installed with a counting assembly (9), one side of the single-chip microcomputer controller (8) is fixedly installed with a control panel (10), and the surface of the workbench (1) is fixedly installed with an alarm lamp (11).
2. The automatic die merge inspection apparatus of claim 1, wherein: The tray assembly (5) comprises a tray (51), a plurality of placing grooves (52) are arranged in the tray (51), a pressure sensor (53) is arranged at the bottom of the inner wall of each of the placing grooves (52), a placing plate (54) is fixedly connected to the top of each of the pressure sensors (53), a power supply is arranged on one side of the surface of the tray (51), and a direction warning strip is arranged at one end of the tray (51).
3. The automatic die merge chip inspection apparatus of claim 2, wherein: The inspection assembly (7) comprises a mounting rod (72), a rotating shaft sleeve is arranged at the bottom of the mounting rod (72), a detection camera (71) is fixedly installed at the top of the mounting rod (72), a first bevel gear (73) is fixedly connected to one side of the surface of the mounting rod (72), a speed reducer (74) is arranged on one side of the mounting rod (72), and the output end of the speed reducer (74) is fixedly connected with a second bevel gear (75).
4. The automatic die merge chip inspection apparatus of claim 3, wherein: The counting assembly (9) comprises two rotating shaft seats (91), a transmission screw rod (92) is rotatably connected between the two rotating shaft seats (91), a transmission threaded block (93) is threadedly connected to the surface of the transmission screw rod (92), a transmission motor (94) is fixedly installed at one end of the transmission screw rod (92), and a counting camera (95) is fixedly installed at the top of the transmission threaded block (93).
5. The automatic die merge chip inspection apparatus of claim 2, wherein: The pressure sensor (53) and the single-chip microcomputer controller (8) are electrically connected through the power supply, the surface of the placing plate (54) is slidably connected with the inner wall of the placing groove (52), and the bottom of the wafer (6) is in contact with the surface of the placing plate (54).
6. The automatic die merge chip inspection apparatus of claim 4, wherein: The detection camera (71) and the control panel (10) are electrically connected through an external power supply, one side of the first bevel gear (73) is meshingly connected with one side of the second bevel gear (75), and the counting camera (95), the alarm lamp (11) and the single-chip microcomputer controller (8) are electrically connected.