Smart wearable chip

Abstract

The utility model discloses an intelligent wearable chip, which relates to the field of chips, and comprises a substrate, a power supply management unit, an application processing unit, a storage unit and a wireless communication unit, the wireless communication unit comprises an RF (Radio Frequency) processing unit, the power management unit, the application processing unit, the storage unit, the wireless communication unit and the RF processing unit are integrated on the same wafer, and the wafer and the wireless communication unit are installed on the substrate. The technical problem that in the prior art, a wearable chip adopts a simple integration mode to meet the multifunctional requirement, and consequently the size is large is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of wisdom wear chip, belong to chip technical field. BACKGROUND

[0002] Wisdom wear chip, it can be used as the multi-interface scheme chip of main control and communication integration, it can also be used as communication chip alone, various chips in industry are integrated scheme, that is, multiple discrete devices are integrated into a module to work cooperatively, and such integrated mode has the technical problem of larger size.

[0003] For example, the technical points of the wearable device with built-in NFC chip disclosed in Chinese patent CN204425340U are: configuring NFC chip for wearable device to realize intelligent multifunctional application in combination with other functional units integrated on circuit board.

[0004] The above scheme solves the problem of multifunctional application of wearable device, but still uses multiple discrete devices integrated into a module to solve existing problems, which is a "1+1" problem solving scheme and cannot solve the technical problem of larger size.

[0005] Therefore, a new scheme is needed to solve this problem. INVENTION CONTENTS

[0006] The technical problem to be solved by the utility model is to provide a wisdom wear chip, which solves the technical problem of larger size caused by the simple integrated mode of existing wearable chip to realize multifunctional demand.

[0007] The technical problem to be solved by the utility model is solved by the following technical scheme: a wisdom wear chip, comprising a substrate; a power management unit, an application processing unit, a storage unit and a wireless communication unit, the wireless communication unit comprising an RF processing unit; wherein the power management unit, the application processing unit, the storage unit and the RF processing unit are integrated on the same wafer, and the wafer and the wireless communication unit are installed on the substrate.

[0008] By adopting the above technical scheme, the utility model is further provided: discrete device, the discrete device is installed on the substrate.

[0009] By adopting the above technical scheme, the wireless communication unit further comprises: a radio frequency switch, and the radio frequency switch is on the substrate.

[0010] By adopting the above technical scheme, the wireless communication unit further comprises: a power amplifier, and the power amplifier is installed on the substrate.

[0011] By adopting the technical scheme, the wireless communication unit further comprises a duplexer installed on the substrate.

[0012] By adopting the technical scheme, the wireless communication unit further comprises an antenna connected with the substrate through a wire.

[0013] By adopting the technical scheme, the smart wearable chip is packaged by using resin.

[0014] By adopting the technical scheme, the beneficial effects of the utility model are as follows: a smart wearable chip is provided, which comprises a substrate, a power management unit, an application processing unit, a storage unit and a wireless communication unit, the wireless communication unit comprising an RF processing unit; wherein the power management unit, the application processing unit, the storage unit and the wireless communication unit comprising the RF processing unit are integrated on the same wafer, and the wafer and the wireless communication unit are installed on the substrate. The wafer-level design of multiple functional units is integrated on the same wafer, and compared with the modular integration of the prior art, the volume is smaller, and multi-functional requirements can be achieved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 The utility model discloses a structural schematic diagram.

[0016] Mark explanation:

[0017] The substrate 100, the power management unit 200, the application processing unit 300, the storage unit 400, the wireless communication unit 500, the RF processing unit 510, the radio frequency switch 520, the power amplifier 530, the duplexer 540 and the antenna 550. DETAILED DESCRIPTION

[0018] In order to make the technical means, creative characteristics, purposes and effects of the utility model easy to understand, the utility model is further described below in combination with specific drawings.

[0019] As Figure 1 shown, the utility model embodiment provides a kind of smart wearable chip, including substrate 100;Power management unit 200, application processing unit 300, storage unit 400 and wireless communication unit 500, the wireless communication unit 500 includes RF processing unit 510;Wherein, the power management unit 200, the application processing unit 300, the storage unit 400, the RF processing unit 510 are integrated on the same wafer, and the wafer and the wireless communication unit 510 are installed on the substrate.

[0020] Specifically, the smart wearable chip provided by the embodiment of the utility model at least includes substrate 100, power management unit 200, application processing unit 300, storage unit 400 and wireless communication unit 500.

[0021] Substrate 100 can be a circuit board for mounting discrete devices; power management unit 200 is used to provide energy for the chip; application processing unit 300 is used to execute preset computing power tasks; storage unit 400 is used to store demand data; wireless communication unit 500 is used to interact with the outside world; RF processing unit 510 is used to convert and modulate radio frequency signals and digital signals.

[0022] Further, the power management unit 200, the application processing unit 300, the storage unit 400 and the RF processing unit 510 are integrated in the same wafer. In the conventional technology, the power management unit 200, the application processing unit 300, the storage unit 400 and the RF processing unit 510 are linearly connected on the circuit board to realize functional integration. The embodiment of the utility model adopts wafer-level design to realize smaller hardware integration.

[0023] Preferably, it further comprises: discrete devices, which are mounted on the substrate 100.

[0024] Specifically, the discrete device refers to the component that needs to be integrated on the substrate 100 except the power management unit 200, the application processing unit 300, the storage unit 400 and the RF processing unit 510. Since the others are all small devices such as interfaces, they occupy less volume and do not need wafer-level integration. Selective integration can reduce process cost.

[0025] Preferably, the wireless communication unit 500 further comprises: a radio frequency switch 520 mounted on the substrate 100.

[0026] Specifically, the radio frequency switch 520 refers to the functional component of the wireless communication unit 500 for transmitting signals to realize the transmission of radio frequency signals.

[0027] Preferably, the wireless communication unit further comprises: a power amplifier 530 mounted on the substrate 100.

[0028] Preferably, the wireless communication unit further comprises: a duplexer 540 mounted on the substrate 100.

[0029] Preferably, the wireless communication unit further comprises: an antenna 550 connected to the substrate 100 through a wire.

[0030] Preferably, the smart wearable chip adopts resin packaging.

[0031] The smart wearable chip provided by the embodiment of the utility model has at least the following technical effects:

[0032] By providing a kind of smart wearable chip, including substrate;Power management unit, application processing unit, storage unit and wireless communication unit, the wireless communication unit includes RF processing unit;Wherein, the power management unit, the application processing unit, the storage unit, the wireless communication unit including RF processing unit is integrated in same wafer, the wafer and the wireless communication unit are installed on the substrate. Multiple functional units are designed using wafer level, integrated in same wafer, compared with the modular integration of prior art, smaller volume, and multiple functional requirements can be realized.

[0033] The basic principle, main features and advantages of the utility model are shown and described above. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and various changes and improvements can be made without departing from the spirit and scope of the utility model. These changes and improvements are within the scope of the utility model claimed. The scope of protection of the utility model is defined by the appended claims and their equivalents.

Claims

1. A smart wearable chip, characterized in that, include substrate; The system includes a power management unit, an application processing unit, a storage unit, and a wireless communication unit, wherein the wireless communication unit includes an RF processing unit. The power management unit, the application processing unit, the storage unit, and the RF processing unit are integrated on the same wafer, and the wafer and the wireless communication unit are mounted on the substrate.

2. The smart wearable chip as described in claim 1, characterized in that, Also includes: Discrete components are mounted on the substrate.

3. The smart wearable chip as described in claim 2, characterized in that, The wireless communication unit further includes a radio frequency switch, which is mounted on the substrate.

4. The smart wearable chip as described in claim 3, characterized in that, The wireless communication unit further includes a power amplifier, which is mounted on the substrate.

5. The smart wearable chip as described in claim 4, characterized in that, The wireless communication unit further includes a duplexer, which is mounted on the substrate.

6. The smart wearable chip as described in claim 5, characterized in that, The wireless communication unit further includes an antenna, which is connected to the substrate via a line.

7. The smart wearable chip as described in claim 1, characterized in that, The smart wearable chip is encapsulated in resin.

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