Core board structure and circuit board module
By setting multiple first and second solder points on the motherboard to form a combined solder pad, the problem of single expansion interface and poor versatility of the core board is solved, and the stability and versatility of the connection are improved.
Patent Information
- Application Number
- CN202423050913.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2034-12-10
AI Technical Summary
The existing core board has a single expansion interface, poor versatility, and poor connection stability.
Multiple first solder points and second solder points are set on the motherboard to form first solder pads and second solder pads, and then combined into a solder pad to provide a variety of expansion interfaces, improve connection stability and versatility.
By combining the pads, the types and number of expansion interfaces are increased, improving connection stability and versatility while reducing replacement costs.
Smart Images
Figure CN223730006U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic equipment technical field, concretely relates to a core board structure and circuit board module. BACKGROUND
[0002] Printed circuit board (PCB) is a kind of connection carrier of electronic device widely used in electronic information and related industries, plays an important function realization role in product, through the work of design personnel, circuit board not only assumes the task of electrical interconnection carrier of electronic component, simultaneously ensures the normal work of electronic equipment. It is widely used in various terminal product industries.
[0003] Core board is also called computer module, is the smallest computer system formed by processor and its necessary peripheral circuit, for the core board design produced to reduce product time to market in the embedded product design of high performance requirement, usually has certain expansion interface, to product developer designs the peripheral circuit satisfying product demand according to the relevant expansion interface of core board.
[0004] In prior art, the expansion interface of core board is single, poor in versatility, and poor in connection stability. UTILITY MODEL CONTENT
[0005] Therefore, the utility model provides a kind of core board structure and circuit board module to solve the problems of single expansion interface of core board in prior art, poor versatility, poor connection stability.
[0006] To solve the above technical problems, the technical scheme of the utility model is as follows:
[0007] Firstly, the utility model provides a kind of core board structure, comprising: mainboard, first solder joint and second solder joint;Multiple first solder joints are arranged along the edge of the mainboard evenly spaced to form a first solder pad, and multiple second solder joints are arranged along the edge of the mainboard evenly spaced to form a second solder pad;Multiple first solder joints and multiple second solder joints are arranged overlappingly to make the first solder pad and the second solder pad juxtaposed to form a combined solder pad.
[0008] It has the following advantages: multiple first solder joints and multiple second solder joints are arranged on the mainboard, the first solder joints are arranged along the edge of the mainboard evenly spaced to form a first solder pad, the second solder joints are arranged along the edge of the mainboard evenly spaced to form a second solder pad, the first solder joints and the second solder joints are arranged overlappingly to make the first solder pad and the second solder pad juxtaposed to form a combined solder pad. The arrangement of the combined solder pad makes the core board form multiple types of expansion interfaces, improves the versatility, and improves the stability and reliability of the connection.
[0009] According to the first aspect of the utility model, the first soldering point is a first preset shape, and the second soldering point is a second preset shape; the preset shape includes a stamp hole shape, a rectangle, a hole ring shape or a through hole shape.
[0010] According to the first aspect of the utility model, the first soldering pad is a stamp hole shape, the second soldering pad is a through hole shape, the width of the first soldering pad is equal to the diameter of the second soldering pad, and the diameter of the second soldering pad is 20-30 mils.
[0011] According to the first aspect of the utility model, the first edge of the first soldering pad coincides with the edge of the mainboard, the second soldering pad is located on the second edge of the first soldering pad, and the first edge of the first soldering pad is arranged opposite to the second edge of the second soldering pad.
[0012] According to the first aspect of the utility model, the mainboard is arranged in a rectangular, circular, oval or special shape.
[0013] According to the first aspect of the utility model, the first soldering pad and the second soldering pad are arranged in a single edge, double edges or multiple edges along the edge of the mainboard.
[0014] According to the first aspect of the utility model, the number of the first soldering points and the second soldering points is consistent, and 25-35 soldering points are arranged on a single edge of the mainboard.
[0015] In a second aspect, the utility model also provides a circuit board module, which comprises a bottom plate and a core plate structure. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the specific embodiments of the utility model or the technical solutions in the prior art, the drawings needed in the following specific embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.
[0017] Figure 1 It is a plane schematic view of the core plate structure of the first aspect of the utility model.
[0018] Figure 2 It is a distribution diagram of the first soldering point and the second soldering point on the mainboard provided in the first aspect of the utility model.
[0019] MARKING DESCRIPTION:
[0020] 1, mainboard; 2, first soldering point; 3, second soldering point. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0022] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0024] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.
[0025] Reference Figure 1 and Figure 2 As shown, in a first aspect of this utility model, a core board structure is provided, including: a main board 1, a first solder joint 2, and a second solder joint 3; the first solder joint 2 is provided in multiples and is evenly spaced along the edge of the main board 1 to form a first solder pad; the second solder joint 3 is provided in multiples and is evenly spaced along the edge of the main board 1 to form a second solder pad; the multiple first solder joints 2 and the multiple second solder joints 3 are overlapped so that the first solder pad and the second solder pad are placed side by side to form a combined solder pad.
[0026] Specifically, the plurality of first soldering points 2 and the plurality of second soldering points 3 are arranged along the edges of the main board 1 to form a first soldering pad and a second soldering pad, respectively, and the first soldering points 2 and the second soldering points 3 are arranged to overlap each other to form a combined soldering pad.
[0027] It can be understood that the first soldering points 2 and the second soldering points 3 are arranged to overlap each other, so that the first soldering pad and the second soldering pad are connected, and when one of the pads is damaged, the other pad can still work, thereby ensuring the stability and reliability of the connection. In addition, the first soldering pad and the second soldering pad are juxtaposed to form a combined soldering pad, increasing the types of expansion interfaces to adapt to the connection of various lines, improving the versatility and applicability, and reducing the replacement cost.
[0028] In the first aspect of the utility model, the first soldering points 2 are of a first preset shape, and the second soldering points 3 are of a second preset shape. The preset shapes include a stamp hole shape, a rectangular shape, a hole ring shape, or a through hole shape.
[0029] Specifically, the preset shapes of the soldering points include a stamp hole shape, a rectangular shape, a hole ring shape, and a through hole shape. The first soldering points 2 are of a first preset shape, and the second soldering points 3 are of a second preset shape. The first preset shape and the second preset shape are different to ensure the connection between the first soldering pad and the second soldering pad and increase the diversity of the expansion interface to improve the versatility.
[0030] In the first aspect of the utility model, the first soldering pad is a stamp hole, and the second soldering pad is a through hole. The width of the first soldering pad is equal to the diameter of the second soldering pad. The diameter of the second soldering pad is 40-60 mils.
[0031] In the first aspect of the utility model, the first edge of the first soldering pad coincides with the edge of the main board 1, the second soldering pad is located on the second edge of the first soldering pad, and the first edge of the first soldering pad is arranged opposite to the second edge of the second soldering pad.
[0032] Specifically, the first soldering pad is a stamp hole, and the second soldering pad is a through hole. The width of the first soldering pad is equal to the diameter of the second soldering pad, so that the first soldering pad and the second soldering pad are arranged to overlap each other. Specifically, the diameter of the second soldering pad is 40 mils.
[0033] It can be understood that the first edge of the first soldering pad coincides with the edge of the main board 1, the center of the second soldering pad is located on the second edge of the first soldering pad, and the first edge is arranged opposite to the second edge.
[0034] In the first aspect embodiment of the utility model, the mainboard 1 is rectangular, circular, oval or irregularly shaped.
[0035] Specifically, the mainboard 1 is rectangular with a size of 42mm*42mm.
[0036] In the first aspect embodiment of the utility model, the first and second soldering pads are arranged on a single side, two sides or multiple sides along the edge of the mainboard 1.
[0037] Specifically, the first and second soldering pads are arranged on three sides of the mainboard 1, and the specific arrangement can be set according to requirements.
[0038] In the first aspect embodiment of the utility model, the number of the first and second soldering points 2 and 3 is consistent, and the first and second soldering pads are provided with 25-35 soldering points on a single side of the mainboard 1.
[0039] Specifically, the number of the soldering points protected by the first and second soldering pads is consistent, and in the first embodiment of the utility model, the number of the first and second soldering points 2 and 3 is 30.
[0040] Secondly, the utility model also provides a circuit board module, which comprises a bottom plate and a core plate structure.
[0041] Specifically, the bottom plate and the core plate structure are fixed by plugging or welding, and at the same time, electrical connection is realized.
[0042] Although the embodiments of the utility model are described in combination with the drawings, various modifications and variations can be made by those skilled in the art without departing from the spirit and scope of the utility model, and such modifications and variations all fall within the scope defined by the appended claims.
Claims
1. A core plate structure, characterized by, The application relates to a core board structure, which comprises: a main board (1); a plurality of first soldering points (2) are arranged uniformly along the edge of the main board (1) to form first soldering pads; a plurality of second soldering points (3) are arranged uniformly along the edge of the main board (1) to form second soldering pads; the first soldering points (2) and the second soldering points (3) are arranged in an overlapping mode so that the first soldering pads and the second soldering pads are juxtaposed to form combined soldering pads.
2. The coreboard structure according to claim 1, wherein, The first soldering points (2) have a first preset shape, and the second soldering points (3) have a second preset shape; the preset shapes include a stamp hole shape, a rectangular shape, a hole ring shape or a through hole shape.
3. The coreboard structure of claim 2, wherein, The first soldering pads are in the shape of stamp holes, and the second soldering pads are in the shape of through holes; the width of the first soldering pads is equal to the diameter of the second soldering pads; and the diameter of the second soldering pads is 20-30 mils.
4. The coreboard structure of claim 3, wherein, The first edge of the first soldering pads coincides with the edge of the main board (1), and the second soldering pads are arranged on the second edge of the first soldering pads; the first edge of the first soldering pads is arranged oppositely to the second edge of the second soldering pads.
5. The coreboard structure of claim 1, wherein, The main board (1) is in the shape of a rectangle, a circle, an ellipse or a special shape.
6. The coreboard structure of claim 5, wherein, The first soldering pads and the second soldering pads are arranged on a single side, two sides or multiple sides of the edge of the main board (1).
7. The coreboard structure of claim 6, wherein, The number of the first soldering points (2) is equal to that of the second soldering points (3); and 25-35 soldering points are arranged on a single side of the main board (1).
8. A circuit board module characterized by comprising: The application further relates to a bottom board structure comprising the core board structure and a bottom board; the core board structure is fixed to the bottom board through insertion or welding.