Shell and electronic equipment

Abstract

A housing and an electronic device relate to the technical field of antennas, the housing comprises a protective layer and a support layer which are stacked, and also comprises an antenna structure located between the protective layer and the support layer, one side surface of the support layer is provided with an accommodating groove, the opening of the accommodating groove faces the protective layer, and the antenna structure is arranged in the accommodating groove. And at least part of the antenna structure is accommodated in the accommodating groove. The antenna structure coupled with the antenna radiator in the electronic equipment is arranged on the shell, so that the performance of the antenna radiator can be enhanced. And meanwhile, the antenna structure is invisible in appearance, so that the attractiveness of the shell is not influenced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of antennas, in particular to a shell and an electronic device. BACKGROUND

[0002] With the development of electronic devices and communication technology, the demand for antennas of electronic devices is increasing. Currently, an antenna radiator pattern can be formed on a formed plastic support by using laser direct structuring (LDS) technology to directly form the antenna radiator pattern on the support, or a metal frame of an electronic device can be used as an antenna radiator. However, the industrial design trend of electronic devices requires electronic devices to have high structural compactness and high metal ratio, and the antenna space is further compressed, and the height of the antenna is also limited. This leads to a decrease in the required clearance area of the antenna radiator, which in turn affects the performance of the antenna, making it difficult to further improve the performance of the antenna radiator. SUMMARY

[0003] The present application provides a shell and an electronic device. By arranging an antenna structure coupled with an antenna radiator in the shell between a protective layer and a supporting layer or on a side of the protective layer away from the supporting layer, the performance of the antenna radiator can be enhanced.

[0004] In a first aspect, the present application provides a shell, comprising a protective layer and a supporting layer arranged in layers, and further comprising an antenna structure between the protective layer and the supporting layer. One side surface of the supporting layer has a receiving groove, and the opening of the receiving groove faces the protective layer. At least part of the antenna structure is accommodated in the receiving groove.

[0005] The shell provided by the present application is provided with an antenna structure. The antenna structure can be coupled with an antenna radiator, and an antenna device can be formed between the antenna structure and the antenna radiator, thereby improving the bandwidth and radiation characteristics of the antenna radiator and enhancing the performance of the antenna radiator. The antenna structure is located between the protective layer and the supporting layer, and the distance between the antenna structure and the antenna radiator is further increased, thereby further enhancing the performance of the antenna radiator. At the same time, the antenna structure is located between the protective layer and the supporting layer and is not visible in appearance, and does not affect the aesthetics of the shell.

[0006] In a possible implementation manner, the antenna structure is in the form of a sheet with a thickness less than or equal to 0.04 mm. If the thickness of the antenna structure is too large, it will occupy more space. When the thickness of the antenna structure is less than or equal to 0.04 mm, the overall electronic device can remain thin and light while the performance of the antenna radiator is enhanced.

[0007] In a possible implementation manner, the depth of the accommodating groove is the same as the thickness of the antenna structure, and a surface of the antenna structure on a side facing the protective layer is coplanar with a plane where the opening of the accommodating groove is located. The surface of the antenna structure on the side facing the protective layer is coplanar with the plane where the opening of the accommodating groove is located, so that the antenna structure neither protrudes from the surface of the support layer on the side facing the protective layer nor is recessed relative to the surface of the support layer on the side facing the protective layer. When the protective layer is connected with the antenna structure, the protective layer does not have a protrusion or a recess due to the antenna structure, so that the protective layer is not uneven, and the overall appearance and the hand feeling of the back cover are affected. The surface of the antenna structure on the side facing the protective layer is coplanar with the plane where the opening of the accommodating groove is located, so that the surface on the side of the protective layer facing the support layer is connected with the surface of the antenna structure and the surface of the support layer at the same time. The coplanar relationship can enhance the adhesion between the support layer, the antenna structure and the protective layer, and effectively reduce the electromagnetic wave interference of the components on the antenna structure.

[0008] In a possible implementation manner, the protective layer is a gold silk layer, and the gold silk layer has a wiring layer therein, and the wiring layer is in a grid shape. The gold silk layer can make the shell have a three-dimensional texture and a sense of hierarchy, and can exhibit a changing luster under different light conditions, thereby improving the appearance of the shell. In addition, the gold silk material has strong toughness and light weight characteristics, and can significantly improve the impact resistance of the electronic device. In particular, when the electronic device is accidentally dropped or collided, the shell with the gold silk layer can better resist damage to the electronic device caused by external force. The wiring layer arranged in the gold silk layer can make the shell have a better texture, thereby improving the appearance of the shell.

[0009] In a possible implementation manner, the width of the grid line in the wiring layer is less than or equal to 0.15 mm. The lines can absorb electromagnetic waves, and a too wide width of the grid line can cause electromagnetic interference to the antenna structure and the antenna radiator, thereby affecting the efficiency of the antenna structure and the antenna radiator. When the width of the grid line is less than or equal to 0.15 mm, the appearance of the gold silk layer can be ensured, and the influence on the efficiency of the antenna structure and the antenna radiator can be reduced.

[0010] In a possible implementation manner, the grid in the wiring layer is in a square shape, and the length of a single grid is greater than or equal to 5 mm. The lines in the wiring layer can cause electromagnetic interference to the antenna structure and the antenna radiator, and the length of a single grid greater than or equal to 5 mm can make the grid in the wiring layer not too dense, thereby reducing the influence on the efficiency of the antenna structure and the antenna radiator.

[0011] In a possible implementation, the lines of the wiring layer are discontinuous. The discontinuous lines in the wiring layer can reduce electromagnetic interference of the wiring layer on the antenna structure and the antenna radiator, thereby reducing the influence on the efficiency of the antenna structure and the antenna radiator. In a possible implementation, the support layer is a glass fiber layer. The glass fiber layer can be made of glass fiber material or composed of glass fiber material and other materials. The dielectric constant of the glass fiber material is relatively low. The material with low dielectric constant does not significantly change the phase velocity or phase of the electromagnetic wave when the electromagnetic wave passes through, and has little influence on the radiation performance of the antenna. The glass fiber material is also a non-conductive material, which has little reflection or absorption of the electromagnetic wave, and can avoid attenuation or distortion of the electromagnetic wave signal. In addition, the glass fiber material has the characteristics of lightweight, and the use of the glass fiber material in the preparation of the support layer can make the shell thinner and lighter, while having high structural strength.

[0012] In a possible implementation, the shell is a protective shell, and the protective shell is used in detachable connection with the back cover of the electronic device. The antenna structure is located in the protective shell. When the protective shell is assembled and buckled on the outside of the back cover, the protective shell can not only provide protection for the electronic device, but also can produce coupling between the antenna structure and the antenna radiator inside the electronic device, thereby enhancing the performance of the antenna radiator inside the electronic device. The antenna radiator is located on the side of the back cover away from the protective shell, and the distance between the antenna structure and the antenna radiator is further increased, so that the performance of the antenna radiator can be further enhanced. When the protective shell is separated from the back cover, the antenna radiator inside the electronic device can still normally generate and emit electromagnetic waves.

[0013] In a possible implementation, the protective layer includes a cortex layer and a first plastic layer arranged in layers, and the support layer is a second plastic layer. The thickness of the first plastic layer is less than that of the second plastic layer. The cortex layer, the first plastic layer, and the second plastic layer are sequentially and adhesively connected. The antenna structure is located between the first plastic layer and the second plastic layer.

[0014] The cortex layer, the first plastic layer, and the second plastic layer are sequentially and adhesively connected. The cortex layer is located on the side of the first plastic layer away from the second plastic layer, and the cortex layer and the first plastic layer are adhesively connected. The cortex layer can improve the appearance and texture of the protective shell. The cortex layer has a relatively soft structure. If the cortex layer is directly and adhesively connected with the antenna structure, the cortex layer can easily form uneven structures at the adhesively connected part with the antenna structure. When the first plastic layer is added between the cortex layer and the antenna structure, the surface of the side of the first plastic layer away from the antenna structure is flat, and the cortex layer and the surface of the side of the first plastic layer away from the antenna structure are adhesively connected, and uneven structures such as protrusions or depressions are not easily formed.

[0015] In a second aspect, the application also provides a shell, which comprises a support layer and a protective layer stacked together, and further comprises an antenna structure located on a side of the protective layer away from the support layer, wherein a covering layer is arranged on a side of the antenna structure away from the support layer, the protective layer comprises a base layer and a wiring layer located in the base layer, the covering layer has a hollowed-out area, so that the shape of an exposed area of the antenna structure through the hollowed-out area coincides with the shape of the wiring layer in the protective layer, and the covering layer and the base layer have the same color.

[0016] The application provides a shell, in one aspect, the shell is provided with an antenna structure, the antenna structure can be coupled to an antenna radiator, and a coupled antenna device can be formed between the antenna structure and the antenna radiator, so that the bandwidth and radiation characteristics of the antenna radiator can be improved, and the performance of the antenna radiator can be enhanced. The antenna structure is located on a side of the protective layer away from the support layer, the distance between the antenna structure and the antenna radiator is further increased, and the coupling amount between the antenna structure and the antenna radiator is further increased, so that the performance of the antenna radiator is further enhanced. In another aspect, a covering layer is arranged on a side of the antenna structure away from the protective layer, the covering layer can cover most of the shape of the antenna structure, the structure of the antenna structure exposed through the hollowed-out area coincides with the shape of the wiring layer, and the covering layer and the base layer have the same color. Even if the shell is observed from the outside, the antenna structure will not look conspicuous, and the consistency and aesthetics of the appearance of the back cover are ensured.

[0017] In a possible implementation, the protective layer comprises a gold silk fiber layer, and the wiring layer in the gold silk fiber layer is in a grid shape. The gold silk fiber layer can make the shell have a three-dimensional texture and a sense of hierarchy, and can exhibit a changing luster under different light conditions, thereby improving the aesthetics of the shell. In addition, the gold silk fiber material has strong toughness and light weight characteristics, and can significantly improve the impact resistance of the electronic device. In particular, when the electronic device is accidentally dropped or collided, the shell with the gold silk fiber layer can better resist damage to the electronic device caused by external force. The arrangement of the wiring layer in the gold silk fiber layer can make the shell have a better texture, thereby increasing the aesthetics of the shell.

[0018] In a possible implementation, the width of the grid line in the wiring layer is less than or equal to 0.15 mm. If the width of the grid line is too wide, it will affect the antenna structure. When the width of the grid line is less than or equal to 0.15 mm, the aesthetics of the gold silk fiber layer can be ensured, and the influence on the antenna structure can be reduced.

[0019] In a possible implementation, the grid in the wiring layer is in a square shape, and the length of a single grid is greater than or equal to 5 mm.

[0020] In a possible implementation, the lines in the wiring layer are in a discontinuous shape. The discontinuous lines in the wiring layer can reduce the influence on the antenna structure.

[0021] Thirdly, this application also provides an electronic device, including the housing described in any of the above implementations, and further including an antenna radiator, the antenna radiator being located on the side of the support layer opposite to the antenna structure, and the antenna structure and the antenna radiator being coupled.

[0022] The electronic device provided in this application includes a housing, which can be a back cover or a protective shell. An antenna structure is disposed within the housing. The antenna structure can be coupled to an antenna radiator, forming a coupled antenna device. By placing the antenna structure between a protective layer and a support layer, or placing the antenna structure on the side of the protective layer away from the support layer, the distance between the antenna structure and the antenna radiator is further increased, and the coupling between them is further increased, thereby further improving the bandwidth and radiation characteristics of the antenna radiator and achieving further enhancement of its performance. Simultaneously, the antenna structure can be covered by a protective layer or a shielding layer, achieving both enhanced antenna radiator performance and aesthetic appeal of the electronic device.

[0023] In one possible implementation, the electronic device includes a bracket, with the antenna radiator fixed to the bracket. At least a portion of the antenna radiator is located between the bracket and the support layer, with a gap between the antenna radiator and the support layer. The bracket serves as a support carrier for supporting the antenna. The gap between the antenna radiator and the support layer satisfies the clearance requirements of the antenna radiator fixed to the bracket, ensuring that the antenna radiator can operate normally without interference from external factors.

[0024] In one possible implementation, the projections of the antenna radiator and the antenna structure along the thickness direction of the electronic device at least partially overlap. This partial overlap results in stronger electromagnetic coupling between the antenna radiator and the antenna structure, thereby enhancing the performance of the antenna radiator. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0026] Figure 2 This is an exploded view of the structure of the electronic device provided in the embodiments of this application;

[0027] Figure 3 This is a rear view of a portion of the structure of the electronic device provided in the embodiments of this application;

[0028] Figure 4 yes Figure 3 Cross-sectional view at point AA;

[0029] Figure 5 is a structural schematic diagram of a gold silk layer provided by an embodiment of the present application;

[0030] Figure 6 is a structural schematic diagram of an electronic device provided by another embodiment of the present application;

[0031] Figure 7 is an exploded structural schematic diagram of an electronic device provided by another embodiment of the present application;

[0032] Figure 8 is a rear view of a partial structure of an electronic device provided by another embodiment of the present application;

[0033] Figure 9 is a sectional view at B-B in FIG. 8; Figure 8

[0034] Figure 10 is a rear view of a partial structure of an electronic device provided by another embodiment of the present application;

[0035] Figure 11 is a sectional view at C-C in FIG. 9; Figure 10

[0036] is a structural schematic diagram of a wire layer and a cover layer in an embodiment of the present application; Figure 12

[0037] Figure 13 is an enlarged view at A in FIG. 10; Figure 12

[0038] Figure 14 is an effect diagram of performance enhancement of an antenna radiator in an embodiment of the present application;

[0039] Figure 15 is an effect diagram of performance enhancement of an antenna radiator in an embodiment of the present application;

[0040] Figure 16 is an effect diagram of performance enhancement of an antenna radiator in an embodiment of the present application;

[0041] Figure 17 is an effect diagram of performance enhancement of an antenna radiator in an embodiment of the present application. DETAILED DESCRIPTION

[0042] The embodiments of the present application will be described below with reference to the accompanying drawings.

[0043] For the convenience of understanding, the English abbreviations and related technical terms involved in the embodiments of the present application will be explained and described below.

[0044] ​​​It should be noted that the described embodiments are merely some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of the present application.

[0045] The terms used in the embodiments of the present application are merely for the purpose of describing particular embodiments, and are not intended to limit the present application. The singular forms "a", "an" and "the" used in the embodiments of the present application and the appended claims are intended to include plural forms, unless the context clearly indicates otherwise.

[0046] It should be understood that the term "and / or" used herein is merely a description of the same field of associated objects, indicating that there can be three relationships, for example, A and / or B, which can represent the following three cases: A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in the present application generally represents an "or" relationship between the front and rear associated objects.

[0047] It should be understood that "first", "second", etc. used in the present application are only used for the purpose of distinguishing description, and cannot be understood as indicating or implying relative importance, nor can it be understood as indicating or implying sequence.

[0048] In the description of the present application, the orientations or positional relationships indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0049] As used herein, "in the range of", unless otherwise indicated, includes both end values of the range by default, for example, in the range of 1 to 5, including both 1 and 5.

[0050] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or abutting connection or integral connection; for those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0051] The electronic device 10 can include, but is not limited to, a mobile or fixed terminal with an antenna, such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a point-of-sale (POS) machine, a personal digital assistant (PDA), a wearable device, a virtual reality device, a wireless U disk, a Bluetooth speaker, a Bluetooth headset, a driving recorder, a security device, and the like. The electronic device is taken as a mobile phone for example in the present application.

[0052] Referring to Figure 1 and Figure 2 The electronic device 10 can include a housing 100, a middle frame 200, and a display screen 300. The housing 100 and the display screen 300 are respectively located on both sides of the middle frame 200. The middle frame 200 can carry and fix devices such as a battery 400, an antenna radiator 210, or a circuit board of the electronic device 10. The antenna radiator 210 in the electronic device 10 can include, but is not limited to, a Bluetooth antenna, a WI FI antenna, and a GPS antenna. The antenna radiator 210 can realize the function of wireless communication of the electronic device 10.

[0053] The commonly used antenna design in the electronic device at present can form an antenna radiator pattern (a bracket antenna) on a formed plastic bracket by using a laser direct structuring (LDS) technology directly on the bracket, or can use the metal frame of the electronic device as an antenna radiator. The optional types of the antenna radiator include, but are not limited to, an induced field antenna (IFA), a monopole antenna, or a loop antenna. However, the industrial design trend of the electronic device requires that the electronic device has a very high structural compactness and a metal ratio, such as a higher screen ratio, more multimedia devices, and a larger battery capacity. The antenna space is further compressed, and the height of the antenna is limited. The clearance area required by the antenna radiator when radiating is also reduced, and thus the efficiency and bandwidth of the antenna radiator are affected, so that the performance of the antenna radiator is difficult to further improve.

[0054] To solve the above problems, the present application provides a housing 100, referring to Figures 1 to 4 The housing 100 can be a back cover 101 of the electronic device 10. The back cover 101 can be a glass back cover, a ceramic back cover, or a plastic back cover. Figure 2The back cover 101 shown in FIG. 1 is a 2.5D (Dimension) three-dimensional back cover. The central region of the back cover 101 can be regarded as a planar shell with a thickness. Only the edges of the back cover 101 are provided with chamfered or curved corners. In an embodiment, the back cover 101 can also be a planar back cover. The entire structure of the planar back cover is a planar shell with a thickness. In an embodiment, the back cover 101 can also be a 3D three-dimensional back cover. The 3D three-dimensional back cover not only has a curvature at the edges of the back cover, but also has a significant curvature from the central region to the edges of the entire surface of the back cover, forming a complete three-dimensional curved surface.

[0055] Referring back to FIGS. 1-3, Figure 2 、 Figure 3 and Figure 4 The shell 100 has a multi-layer structure including a protective layer 110 and a support layer 120 stacked together. The protective layer 110 and the support layer 120 are stacked along the Y direction. The protective layer 110 is located on the side of the support layer 120 away from the middle frame 200. The protective layer 110 can protect other structures inside the shell 100 or other structures of the electronic device 10. On the other hand, it can be understood that when the side of the protective layer 110 away from the support layer 120 is not provided with other film layer structures, or when the side of the protective layer 110 away from the support layer 120 is provided with a transparent film layer structure, the protective layer 110 can also act as a decorative layer of the shell 100. The shape and appearance of the surface of the protective layer 110 away from the support layer 120 can be directly observed by the user. Personalized design of the shape and appearance of the protective layer 110 can meet the aesthetic requirements of the electronic device. The material for preparing the support layer 120 includes at least one or a combination of glass fiber composite material, polyimide (PI) material, aramid fiber material, and polyethylene material. The support layer 120 provides support for other structures (such as heat dissipation structures, sensors, decorative parts, and antenna structures) inside the shell 100.

[0056] The shell 100 further includes an antenna structure 130 between the protective layer 110 and the support layer 120. One side surface of the support layer 120 has a receiving groove. The opening of the receiving groove faces the protective layer 110. At least part of the antenna structure 130 is accommodated in the receiving groove. The antenna structure 130 can be completely accommodated in the receiving groove, or partially accommodated in the receiving groove. Figure 4The antenna structure 130 is shown as being completely accommodated in the accommodating groove. If the accommodating groove is not provided on the support layer 120, the part of the surface of the support layer 120 facing the protective layer 110 will be directly connected with the antenna structure 130, and the antenna structure 130 will form a protrusion on the support layer 120. When the protective layer 110 is connected with the antenna structure 130, the protective layer 110 will be uneven due to the protrusion of the antenna structure 130, which will affect the overall appearance and feel of the back cover. By partially or completely embedding the antenna structure 130 in the accommodating groove of the support layer 120, it can be ensured that the antenna structure will not protrude beyond the surface of the support layer 120, thereby avoiding the protrusion of the protective layer 110 at the position of the antenna structure 130. In addition, accommodating the antenna structure 130 in the accommodating groove can reduce the thickness of the shell 100 in the Y direction, thereby reducing the thickness of the entire electronic device and making the electronic device more lightweight.

[0057] The antenna structure 130 can be a copper foil, and the designed shape of the antenna structure 130 can be formed on the copper foil by chemical etching or laser cutting. Then the antenna structure 130 is placed in the accommodating groove, and the surface and edge of the antenna structure 130 can be connected with the inner wall of the accommodating groove to fix the antenna structure 130 in the accommodating groove. The antenna structure 130 can be connected with the support layer 120 by adhesion.

[0058] In some other possible embodiments, the antenna structure 130 can also be a printed silver paste antenna, and the conductive silver paste can be printed on the inner wall of the accommodating groove of the support layer 120 by screen printing technology, thereby forming the antenna structure 130 in the accommodating groove.

[0059] The connection between the protective layer 110 and the antenna structure 130 can be the same as the connection between the antenna structure 130 and the support layer 120. The protective layer 110 and the antenna structure 130 are also connected by adhesion. For example, a layer of glue (not shown in the figure) can be designed between the antenna structure 130 and the protective layer 110, and the glue layer is adhered to the protective layer 110 and the antenna structure 130 by heating and pressing, thereby adhering the protective layer 110 and the antenna structure 130 together. The glue layer can be a hot melt glue layer or an optical glue layer, and the material for preparing the glue layer can be selected from one or more combinations of acrylic glue, unsaturated polyester, polyurethane or epoxy glue.

[0060] The electronic device 10 further comprises an antenna radiator 210, the antenna radiator 210 has a feeding structure to be electrically connected with the circuit board, and the antenna structure 130 is coupled with the antenna radiator 210. The antenna radiator 210 can be coupled with the antenna structure 130 to form a coupled antenna device, and the antenna radiator 210 can be coupled with the antenna structure 130 through electromagnetic coupling. When the circuit (such as a radio frequency module) in the electronic device provides power to the antenna radiator 210, the antenna radiator 210 will excite to generate an electromagnetic field, and the antenna radiator 210 radiates electromagnetic waves to the surrounding space, and the antenna structure 130 receives the electromagnetic waves from the antenna radiator to generate an induced current and a voltage. The antenna radiator 210 and the antenna structure 130 can transmit and receive signals through electromagnetic induction interaction, the antenna radiator 210 and the antenna structure 130 form a coupled antenna device, and the antenna structure 130 couples the electromagnetic waves of the antenna radiator 210 to form secondary radiation, so that the coupled antenna device can improve the bandwidth and radiation characteristics of the antenna radiator 210, and enhance the performance of the antenna radiator 210.

[0061] The shell 100 provided in the present application is provided with the antenna structure 130, the antenna structure 130 can be coupled with the antenna radiator 210, the antenna structure 130 can form a coupled antenna device with the antenna radiator 210, so as to improve the bandwidth and radiation characteristics of the antenna radiator 210, and enhance the performance of the antenna radiator 210. The antenna structure 130 is located between the protective layer 110 and the support layer 120, the antenna structure 130 and the antenna radiator 210 are spaced apart by the support layer 120, the support layer 120 further increases the spacing between the antenna structure 130 and the antenna radiator 210, and the coupling amount between the antenna structure 130 and the antenna radiator 210 is further increased, so that the performance of the antenna radiator 210 is further enhanced. At the same time, the antenna structure 130 is located between the protective layer 110 and the support layer 120, and the antenna structure 130 is not visible in appearance, which does not affect the aesthetics of the shell 100.

[0062] In some possible embodiments, the antenna structure 130 is in a sheet shape, and the antenna structure 130 can be in a regular sheet structure or an irregular sheet structure. The shape of the antenna structure 130 can be adaptively designed according to the design of other structures on the shell 100, which is not limited in the present application.

[0063] The thickness of the antenna structure 130 in the Y direction is less than or equal to 0.04 mm. The thickness of the antenna structure 130 in the Y direction can be 0.01 mm, 0.02 mm, 0.03 mm, or 0.04 mm. If the thickness of the antenna structure 130 is too large, more space will be occupied. The thickness of the antenna structure 130 in the Y direction is less than or equal to 0.04 mm, which can satisfy the performance of the antenna radiator 210 while keeping the electronic device 10 thin and light as a whole.

[0064] In some possible embodiments, referring to Figure 4 As shown, the antenna structure 130 is completely accommodated in the accommodating groove, the depth of the accommodating groove is the same as the thickness of the antenna structure 130, and the antenna structure 130 can be completely accommodated in the accommodating groove. The surface of the antenna structure 130 on the side facing the protective layer 110 is coplanar with the plane on which the opening of the accommodating groove is located, which can make the surface of the protective layer 110 on the side facing the support layer 120 simultaneously fit and connect with the surface of the antenna structure 130 and the surface of the support layer 120. The antenna structure 130 will neither protrude from the surface of the support layer 120 on the side facing the protective layer 110 nor be recessed relative to the surface of the support layer 120 on the side facing the protective layer 110. When the protective layer 110 is connected with the antenna structure 130, the protective layer 110 will not be raised or recessed due to the antenna structure 130, so that the protective layer 110 is not uneven, which affects the overall appearance and feel of the back cover.

[0065] In some possible embodiments, referring to Figure 5 As shown, the protective layer 110 is a gold silk fiber layer 111, which can make the shell 100 have a three-dimensional texture and a sense of hierarchy, and can exhibit a changing luster under different light conditions, thereby improving the aesthetics of the shell 100. In addition, the gold silk fiber material is more durable than traditional glass or plastic materials, has strong toughness and light weight characteristics, and can significantly improve the impact resistance of the electronic device. In particular, when the electronic device is accidentally dropped or collided, the shell 100 with the gold silk fiber layer 111 can better resist damage to the electronic device caused by external forces.

[0066] The gold silk fiber layer 111 has a wiring layer 114 therein. The wiring layer 114 includes at least one line 114a. All the lines are arranged in parallel and intersected to form the wiring layer 114 and make the wiring layer 114 have a grid shape. After all the lines are arranged in parallel and intersected, a grid is formed. The lines 114a forming the grid are referred to as grid lines. The grids on the wiring layer 114 can have the same size or different sizes. The shapes of the grids formed between the lines can include but are not limited to positive directions, rectangles, and diamonds. The shape of the grid is not limited in the present application. The arrangement of the wiring layer 114 in the gold silk fiber layer 111 can make the shell 100 have a better texture, thereby increasing the aesthetics of the shell 100.

[0067] In the present application, the gold-plated layer 111 can further comprise a base layer 113, and the base layer 113 and the wiring layer 114 are stacked, the wiring layer 114 can be located on the side of the base layer 113 away from the support layer 120, the lines 114a on the wiring layer 114 can be non-parallel to the edge of the base layer 113 in the X direction, and the spacing between each parallel line 114a on the wiring layer 114 can be equal, thereby forming a grid of the same size. In some other possible embodiments, the lines 114a on the wiring layer 114 can be parallel to the edge of the base layer 113 in the X direction, and the spacing between each parallel line 114a on the wiring layer 114 can be equal. The density of the lines 114a in the wiring layer 114 can remain uniform.

[0068] In some possible implementations, the width of the grid lines in the wiring layer 114 is less than or equal to 0.15 mm. Here, the width refers to the line width of the grid lines themselves. Referring to FIG. 1, Figure 5 As shown, the wiring layer 114 comprises at least one line 114a, all the lines are arranged in parallel and intersected to make the wiring layer 114 grid-shaped, the lines 114a in the wiring layer 114 are grid lines, and the width of the lines 114a is less than or equal to 0.15 mm. The width of the lines 114a is between 0 mm and 0.15 mm, and the width of the lines 114a does not include the endpoint value of 0 mm but includes the endpoint value of 0.15 mm. The width of the lines 114a can be 0.05 mm, 0.1 mm, or 0.15 mm. The lines 114a can absorb electromagnetic waves, and a too wide width of the grid lines can cause electromagnetic interference to the antenna structure 130 and the antenna radiator 210, which can affect the efficiency of the antenna structure 130 and the antenna radiator 210. When the width of the grid lines is less than or equal to 0.15 mm, the appearance of the gold-plated layer 111 can be ensured, and the influence on the efficiency of the antenna structure 130 and the antenna radiator 210 can be reduced.

[0069] In some possible implementations, referring to FIG. 1, Figure 5 As shown, the lines 114a in the wiring layer 114 are arranged in parallel and intersected to make the wiring layer 114 grid-shaped, and the grid in the wiring layer 114 is square-shaped, the wiring layer 114 has a plurality of grids, and the length L of a single grid is greater than or equal to 5 mm. The lines 114a in the wiring layer 114 can cause electromagnetic interference to the antenna structure 130 and the antenna radiator 210, and the length of a single grid greater than or equal to 5 mm can make the grid in the wiring layer 114 not too dense, thereby reducing the influence on the efficiency of the antenna structure 130 and the antenna radiator 210.

[0070] In some possible implementations, referring to FIG. 1, Figure 5As shown, the trace layer 114 includes at least one trace 114a, and each trace 114a in the trace layer 114 can be discontinuous, or some traces in the trace layer 114 can be discontinuous. The discontinuous traces 114a in the trace layer 114 can reduce the electromagnetic interference of the trace layer 114 on the antenna structure 130 and the antenna radiator 210, thereby reducing the impact on the efficiency of the antenna structure 130 and the antenna radiator 210.

[0071] In some possible embodiments, the support layer 120 is a glass fiber layer 121. The glass fiber layer 121 can be made of glass fiber material or composed of glass fiber material and other materials. The glass fiber material has high structural strength and can provide good support for other structures provided on the shell 100. The glass fiber material has good corrosion resistance and is not easy to be corroded, and has good stability. The glass fiber material has a relatively low dielectric constant. The material with low dielectric constant does not significantly change the phase velocity or phase of electromagnetic waves when the electromagnetic waves pass through, and has little impact on the radiation performance of the antenna. The glass fiber material is also a non-conductive material, which has little reflection or absorption of electromagnetic waves, and can avoid attenuation or distortion of electromagnetic wave signals. In addition, the glass fiber material has the characteristics of lightweight, and the use of the glass fiber material in the preparation of the support layer 120 can make the shell 100 thinner and lighter, while having high structural strength.

[0072] In some possible embodiments, the shell 100 is a protective shell 102, which is detachably connected with the back cover 101 of the electronic device 10. Referring to Figure 6 and Figure 7 As shown, the shell 100 is a protective shell 102 of the electronic device 10, the electronic device 10 includes a display screen 300, a middle frame 200 and a back cover 101, the protective shell 102 has a cavity for accommodating the electronic device 10, the electronic device 10 is accommodated in the cavity of the protective shell 102, and can be detachably connected with the back cover 101 of the electronic device 10. The protective shell 102 can absorb and disperse the impact force generated by the electronic device 10 due to falling, scratching or collision, and protect the back cover 101 and other structures of the electronic device 10 from being damaged. It should be noted that the protective shell 102 provided in the present embodiment can be detachably connected with the back cover 101. When the protective shell 102 is separated from the back cover 101, the antenna radiator 210 inside the electronic device 10 can still normally generate and emit electromagnetic waves. When the protective shell 102 is assembled and buckled on the outside of the back cover 101, the antenna structure 130 in the protective shell 102 can be coupled with the antenna radiator 210 inside the electronic device 10, and the performance of the antenna radiator 210 inside the electronic device 10 can be enhanced. In the present application, the shell 100 has a multilayer structure, and the protective shell 102 will be described in detail below with reference to Figure 8 and Figure 9As shown, the protective shell 102 can include a protective layer 110 and a support layer 120 arranged in a stack, the protective layer 110 and the support layer 120 are arranged in a stack along the Y direction, and the protective layer 110 is located on the side of the support layer 120 away from the middle frame 200. On the one hand, the protective layer 110 can protect other structures arranged inside the shell 100 or other structures of the electronic device 10. On the other hand, it can be understood that when the side of the protective layer 110 away from the support layer 120 is not provided with other film layer structures, or when the side of the protective layer 110 away from the support layer 120 is provided with a transparent film layer structure, the protective layer 110 can also act as a decorative layer of the shell 100, the shape and appearance of the surface of the protective layer 110 away from the support layer 120 can be directly observed by the user, and the personalized design of the shape and appearance of the protective layer 110 can meet the aesthetic demand of the electronic device. The material for preparing the support layer 120 at least includes one or more combinations of glass fiber composite material, polyimide (PI) material, aramid fiber material, polyethylene material, etc. The support layer 120 is used to provide support for other structures (such as heat dissipation structures, sensors, decorative parts, and antenna structures, etc.) arranged inside the shell 100.

[0073] The shell 100 further includes an antenna structure 130 between the protective layer 110 and the support layer 120, one side surface of the support layer 120 has a receiving groove, an opening of the receiving groove faces the protective layer 110, and at least part of the antenna structure 130 is accommodated in the receiving groove. The antenna structure 130 can be completely accommodated in the receiving groove, or can be partially accommodated in the receiving groove. Figure 9 The antenna structure 130 shown in the figure is completely accommodated in the receiving groove only for illustration. Accommodating the antenna structure 130 in the receiving groove can reduce the thickness of the shell 100 in the Y direction, thereby reducing the thickness of the entire electronic device, making the electronic device more lightweight.

[0074] The electronic device 10 further comprises an antenna radiator 210, the antenna radiator 210 has a feeding structure to be electrically connected with the circuit board, and the antenna structure 130 is coupled with the antenna radiator 210. The antenna radiator 210 can be coupled with the antenna structure 130 to form a coupled antenna device, and the antenna radiator 210 can be coupled with the antenna structure 130 through electromagnetic coupling. When the circuit (such as a radio frequency module) in the electronic device provides power to the antenna radiator 210, the antenna radiator 210 will excite to generate an electromagnetic field, and the antenna radiator 210 radiates electromagnetic waves to the surrounding space, and the antenna structure 130 receives the electromagnetic waves from the antenna radiator to generate an induced current and a voltage. The antenna radiator 210 can transmit and receive signals through electromagnetic induction interaction with the antenna structure 130, and the antenna radiator 210 and the antenna structure 130 form a coupled antenna device, which can improve the bandwidth and radiation characteristics of the antenna radiator 210, and enhance the performance of the antenna radiator 210. The antenna structure 130 is located in the protective shell 102, and when the protective shell 102 is assembled and buckled on the outside of the back cover 101, the protective shell 102 can not only provide protection for the electronic device, but also the antenna structure 130 can be coupled with the antenna radiator 210 inside the electronic device 10 to enhance the performance of the antenna radiator 210 inside the electronic device 10. The antenna radiator 210 is located on the side of the back cover 101 away from the protective shell 102, and the distance between the antenna structure 130 and the antenna radiator 210 is further increased, so that the performance of the antenna radiator 210 can be further enhanced.

[0075] In some possible embodiments, referring to Figure 9 As shown, the protective layer 110 comprises the cortex layer 140 and the first plastic layer 112 which are arranged in layers, and the support layer 120 is the second plastic layer 122. The first plastic layer 112 and the second plastic layer 122 can be made of plastic materials, including but not limited to polycarbonate, acrylonitrile-butadiene-styrene copolymer, and polyvinyl chloride, etc. The material for making the first plastic layer 112 and the material for making the second plastic layer 122 can be the same or different. In the embodiments of the present application, the material for making the first plastic layer 112 and the material for making the second plastic layer 122 can both be polycarbonate. The protective layer 110 and the support layer 120 made of polycarbonate materials can make the protective shell 102 have the characteristics of light weight and good impact resistance.

[0076] The thickness of the first plastic layer 112 in the Y direction is less than the thickness of the second plastic layer 122 in the Z direction. The second plastic layer 122 is used as the support layer 120, and the thickness is greater. On the one hand, the support capacity of the second plastic layer 122 can be improved. On the other hand, the distance between the antenna structure 130 and the antenna radiator 210 can be increased, and the performance of the antenna radiator 210 can be further improved. The first plastic layer 112 is used as the protection layer 110. When the protection capacity is ensured, the thickness of the first plastic layer 112 is less than the thickness of the second plastic layer 122. The overall thickness of the protective shell 102 can be reduced, and the protective shell 102 can be more lightweight.

[0077] The cortical layer 140 is located on the side of the first plastic layer 112 away from the second plastic layer 122. The cortical layer 140, the first plastic layer 112, and the second plastic layer 122 are sequentially attached in the Y direction. The cortical layer 140 and the first plastic layer 112 are attached. The cortical layer 140 can be attached to the first plastic layer 112 through a glue layer. The cortical layer 140 can improve the appearance and texture of the protective shell 102. The cortical layer 140 is relatively soft. If the cortical layer 140 is directly attached to the antenna structure 130, the cortical layer 140 can form an uneven structure at the attachment position of the antenna structure. When a first plastic layer 112 is added between the cortical layer 140 and the antenna structure 130, the surface of the side of the first plastic layer 112 away from the antenna structure 130 is flat. After the surface of the side of the cortical layer 140 away from the antenna structure 130 is attached to the surface of the side of the first plastic layer 112 away from the antenna structure 130, an uneven structure such as a protrusion or a depression is not easily formed.

[0078] The second plastic layer 122 can be provided with a receiving groove. The second plastic layer 122 has a receiving groove on one side surface. The opening of the receiving groove faces the protection layer 110. At least part of the antenna structure 130 is accommodated in the receiving groove. The antenna structure 130 can be completely accommodated in the receiving groove, or part of the antenna structure 130 can be accommodated in the receiving groove. Figure 9 The antenna structure 130 is completely accommodated in the receiving groove only for illustration. The antenna structure 130 accommodated in the receiving groove can reduce the thickness of the protective shell 102 in the Y direction, thereby reducing the thickness of the entire electronic device and making the electronic device more lightweight.

[0079] The antenna structure 130 is located on the side of the second plastic layer 122 away from the back cover 101. There can be a height difference between the antenna structure 130 and the second plastic layer 122 due to process errors. The first plastic layer 112 is arranged on the side of the antenna structure 130 away from the second plastic layer 122. The outer surface of the protective shell 102 can be a more flat surface. The relatively soft cortical layer 140 is prevented from directly attaching to the antenna structure 130 to form an uneven surface. The protective shell 102 is arranged on the outside of the back cover 101. The antenna structure 130 is located in the protective shell 102, and the performance of the antenna radiator 210 inside the electronic device 10 can be improved.

[0080] In an embodiment, the protective layer 110 includes the leather layer 140 and the first plastic layer 112 arranged in a stack, the support layer 120 is the second plastic layer 122, the antenna structure 130 is a copper foil, the antenna structure 130 is located between the first plastic layer 112 and the second plastic layer 122, and the antenna radiator 210 can be a bracket antenna, as shown in Figure 14 Compared with the protective shell 102 without the antenna structure 130, the protective shell 102 with the antenna structure 130 can enhance the performance of the N78 / N79 frequency band antenna of the bracket antenna by 1dB-1.5dB.

[0081] In an embodiment, the protective layer 110 includes the leather layer 140 and the first plastic layer 112 arranged in a stack, the support layer 120 is the second plastic layer 122, the antenna structure 130 is a copper foil, the antenna structure 130 is located between the first plastic layer 112 and the second plastic layer 122, and the antenna radiator 210 can be a bracket antenna, as shown in Figure 15 Compared with the protective shell 102 without the antenna structure 130, the protective shell 102 with the antenna structure 130 can enhance the performance of the N78 frequency band antenna of the bracket antenna by 1.5dB-2dB.

[0082] The present application also provides a shell 100, as shown in Figure 1 , Figure 2 and Figure 10 The electronic device 10 can include the shell 100, the middle frame 200 and the display screen 300, the shell 100 and the display screen 300 are located on both sides of the middle frame 200 respectively, and the middle frame 200 can carry and fix the devices such as the battery 400, the antenna radiator 210 or the circuit board of the electronic device 10. The shell 100 in the embodiment of the present application can be the back cover 101 of the electronic device 10.

[0083] Continuing to refer to Figure 10 and Figure 11As shown, the shell 100 has a multi-layer structure, including a protective layer 110 and a support layer 120 arranged in a stack, the protective layer 110 and the support layer 120 are arranged in a stack along the Y direction, and the protective layer 110 is located on the side of the support layer 120 away from the middle frame 200. The protective layer 110 can protect other structures arranged inside the shell 100 or other structures of the electronic device 10. On the other hand, it can be understood that when the side of the protective layer 110 away from the support layer 120 is not provided with other film layer structures, or when the side of the protective layer 110 away from the support layer 120 is provided with a transparent film layer structure, the protective layer 110 can also act as a decorative layer of the shell 100, the shape and appearance of the surface of the protective layer 110 away from the support layer 120 can be directly observed by the user, and the personalized design of the shape and appearance of the protective layer 110 can meet the aesthetic requirements of the electronic device. The material for preparing the support layer 120 at least includes one or more combinations of glass fiber composite material, polyimide (PI) material, aramid fiber material, polyethylene material, etc. The support layer 120 is used to provide support for other structures (such as heat dissipation structures, sensors, decorative parts, and antenna structures, etc.) arranged inside the shell 100.

[0084] The shell 100 further includes an antenna structure 130 located on the side of the protective layer 110 away from the support layer 120, and the side of the antenna structure 130 away from the support layer 120 is provided with a covering layer 150. In an embodiment, the covering layer 150, the antenna structure 130, the protective layer 110, and the support layer 120 can be arranged in a stack in the Y direction in the order shown. Figure 11

[0085] The protective layer 110 includes a base layer 113 and a wiring layer 114 located in the base layer 113. The base layer 113 and the wiring layer 114 are arranged in a stack, and the wiring layer 114 can be located on the side of the base layer 113 away from the support layer 120. The wiring layer 114 includes at least one line 114a, and all the lines are arranged in parallel and intersected to form the wiring layer 114, and make the wiring layer 114 have a grid shape. After all the lines are arranged in parallel and intersected, a grid is formed, and the lines 114a forming the grid are called grid lines. The wiring layer 114 can make the shell 100 have a better texture, and increase the aesthetics of the shell 100. The base layer 113 can have different colors, and by designing the base layer 113 with different colors, the back cover 101 of the electronic device 10 can have different color appearances.

[0086] ​A shielding layer 150 is disposed on the side of the antenna structure 130 opposite to the protective layer 110. The shielding layer 150 needs to completely cover the antenna structure 130. The shape and size of the shielding layer 150 can be exactly the same as the shape and size of the antenna structure 130, or the shape and size of the shielding layer 150 can be different from the shape and size of the antenna structure 130. The size of the shielding layer 150 can be larger than the size of the antenna structure 130 so that the shielding layer 150 can completely cover the antenna structure 130. See reference. Figure 11 , Figure 12 and Figure 13 As shown, to facilitate understanding of the structure of the cover layer 150, Figure 12 Only the structure of the wiring layer 114 and the cover layer 150 of the protective layer 110 is shown. Figure 13 It shows Figure 12 The structure of the covering layer 150 at point A. Figure 12 In the middle, the masking layer 150 covers the wiring layer 114. The masking layer 150 has a cutout area 151. The shape of the cutout area 151 is the same as the shape of the lines in the wiring layer 114 covered by the masking layer 150. The shape of the cutout area 151 is as follows: Figure 13 As shown in the image.

[0087] The cover layer 150 can cover the surface of the antenna structure 130. When the cover layer 150 covers the surface of the antenna structure 130, the cutout area 151 on the cover layer 150 allows the shape of the exposed area of ​​the antenna structure 130 through the cutout area 151 to coincide with the shape of the wiring layer 114 in the protective layer 110. Most of the antenna structure 130 is covered by the cover layer 150, and the structure exposed through the cutout area 151 coincides with the shape of the wiring layer 114. The color of the cover layer 150 is the same as the color of the base layer 113, so even when the housing 100 is viewed from the outside, the antenna structure 130 will not appear obtrusive, and the presence of the antenna structure 130 is greatly reduced, ensuring the consistency and aesthetics of the appearance of the back cover 101. It is understood that in some other possible embodiments, the consistency and aesthetics of the appearance of the back cover 101 can be further ensured by increasing the thickness of the cover layer 150.

[0088] In one embodiment, the masking layer 150 may be an ink layer, which may be prepared from an ink material. The ink layer can be formed by applying ink to the surface of the antenna structure 130 away from the protective layer 110. The methods of applying the ink include, but are not limited to, printing, spraying, screen printing, or dipping. This application embodiment does not limit the material and thickness of the ink layer. The ink used to prepare the ink layer can be mixed from various different colors to obtain an ink of the same color as the base layer 113.

[0089] The antenna structure 130 can be a copper foil, and can also be a printed silver paste printed on the protective layer 110. The antenna structure 130 is located on the side of the protective layer 110 away from the support layer 120. It can be understood that when no other film layer structure is arranged on the side of the antenna structure 130 away from the protective layer 110, or when a transparent film layer structure is arranged on the side of the antenna structure 130 away from the protective layer 110, the shape and appearance design of the antenna structure 130 and the protective layer 110 can be directly observed by the user, and the shape and appearance design of the antenna structure 130 and the protective layer 110 are different, which easily affects the aesthetics of the back cover 101. When the covering layer 150 with the same color as the base layer 113 of the protective layer 110 is arranged on the side of the antenna structure 130 away from the protective layer 110, the covering layer 150 has a hollow area 151, the shape of the hollow area 151 is consistent with part of the shape of the wiring layer 114 in the protective layer 110, and the exposed part of the antenna structure 130 through the hollow area 151 has a shape coinciding with the shape of the wiring layer 114. Under the action of the covering layer 150, most of the shape of the antenna structure 130 can be covered by the covering layer 150, and the structure exposed by the antenna structure 130 through the hollow area 151 coincides with the shape of the wiring layer 114. The color of the covering layer 150 is the same as the color of the base layer 113, and even when the shell 100 is observed from the outside, the antenna structure 130 does not look conspicuous, the presence of the antenna structure 130 is greatly reduced, and the consistency and aesthetics of the appearance of the back cover 101 are ensured.

[0090] The shell 100 provided in the present application has the antenna structure 130 arranged therein. On one hand, the antenna structure 130 can be coupled to the antenna radiator 210, and a coupled antenna device can be formed between the antenna structure 130 and the antenna radiator 210, so that the bandwidth and radiation characteristics of the antenna radiator 210 can be improved, and the performance of the antenna radiator 210 can be enhanced. The antenna structure 130 is located on the side of the protective layer 110 away from the support layer 120, the distance between the antenna structure 130 and the antenna radiator 210 is further increased, and the coupling amount between the antenna structure 130 and the antenna radiator 210 is further increased, so that the performance of the antenna radiator 210 is further enhanced. On the other hand, the covering layer 150 is arranged on the side of the antenna structure 130 away from the protective layer 110. The covering layer 150 can cover most of the shape of the antenna structure 130, and the structure exposed by the antenna structure 130 through the hollow area 151 coincides with the shape of the wiring layer 114. The color of the covering layer 150 is the same as the color of the base layer 113, and even when the shell 100 is observed from the outside, the antenna structure 130 does not look conspicuous, and the consistency and aesthetics of the appearance of the back cover 101 are ensured.

[0091] In some possible implementation manners, reference can be made to Figure 5As shown, the protective layer 110 is a gold wire layer 111, which can make the shell 100 have a three-dimensional texture and a sense of hierarchy, and can exhibit varying gloss under different light conditions, thereby improving the aesthetics of the shell 100. In addition, the gold wire material is more durable than traditional glass or plastic materials, has strong toughness and lightweight properties, and can significantly improve the impact resistance of the electronic device. In particular, when the electronic device is accidentally dropped or collided, the shell 100 with the gold wire layer 111 can better resist damage to the electronic device caused by external forces.

[0092] The gold wire layer 111 has a wiring layer 114 therein, which includes at least one line 114a. All lines are collectively formed by parallel and intersecting arrangements to form the wiring layer 114, and the wiring layer 114 has a grid shape. The grids on the wiring layer 114 can be of the same size or different sizes. The arrangement of the wiring layer 114 in the gold wire layer 111 can make the shell 100 have a better texture, thereby increasing the aesthetics of the shell 100.

[0093] In this application, the gold wire layer 111 can also have a base layer 113 therein. The base layer 113 and the wiring layer 114 are arranged in layers. The wiring layer 114 can be located on the side of the base layer 113 away from the support layer 120. The lines 114a on the wiring layer 114 can be non-parallel to the edges of the base layer 113 in the X direction. The spacing between each pair of parallel lines 114a on the wiring layer 114 can be equal, thereby forming grids of the same size. In some other possible embodiments, the lines 114a on the wiring layer 114 can be parallel to the edges of the base layer 113 in the X direction. The spacing between each pair of parallel lines 114a on the wiring layer 114 can be equal. The density of the lines 114a in the wiring layer 114 can be uniform.

[0094] In one embodiment, the protective layer 110 is a gold wire layer 111, the support layer 120 is a glass fiber layer 121, and the antenna structure 130 is a copper foil. The antenna structure 130 is located between the gold wire layer 111 and the glass fiber layer 121. The antenna radiator 210 can be a bracket antenna. Referring to Figure 16 As shown, compared with the rear cover 101 without the antenna structure 130, the rear cover 101 with the antenna structure 130 can enhance the performance of the N78 / N79 frequency band antenna of the bracket antenna by 0.5-1 dB.

[0095] In one embodiment, the protective layer 110 is a gold wire layer 111, the support layer 120 is a glass fiber layer 121, and the antenna structure 130 is a copper foil. The antenna structure 130 is located between the gold wire layer 111 and the glass fiber layer 121. The antenna radiator 210 can be an antenna radiator 210 arranged on the middle frame 200. Referring to Figure 17As shown, compared with the back cover 101 without the antenna structure 130, the back cover 101 with the antenna structure 130 can enhance the performance of the WI FI antenna on the middle frame 200 by more than 1 dB.

[0096] In some possible implementation manners, the width of the grid line in the wiring layer 114 is less than or equal to 0.15 mm. For details, refer to Figure 5 As shown, the wiring layer 114 includes at least one line 114a, all the lines are arranged in parallel and intersected to form a grid shape of the wiring layer 114, the line 114a in the wiring layer 114 is a grid line, and the width of the line 114a is less than or equal to 0.15 mm. The width of the line 114a is between 0 mm and 0.15 mm, and the width of the line 114a is not limited to the endpoint value of 0 mm but includes the endpoint value of 0.15 mm. The width of the line 114a can be 0.05 mm, 0.1 mm or 0.15 mm. The line 114a can absorb electromagnetic waves, and a too wide width of the grid line can cause electromagnetic interference to the antenna structure 130 and the antenna radiator 210, and affect the efficiency of the antenna structure 130 and the antenna radiator 210. The width of the grid line less than or equal to 0.15 mm can ensure the aesthetic appearance of the gold-plated wire layer 111 and reduce the influence on the efficiency of the antenna structure 130 and the antenna radiator 210.

[0097] In some possible implementation manners, refer to Figure 5 As shown, the lines 114a in the wiring layer are arranged in parallel and intersected to form a grid shape of the wiring layer 114, and the grid in the wiring layer 114 is a square, and the length of a single grid is greater than or equal to 5 mm. The lines 114a in the wiring layer 114 can cause electromagnetic interference to the antenna structure 130 and the antenna radiator 210, and the length of a single grid greater than or equal to 5 mm can prevent the grid in the wiring layer 114 from being too dense, thereby reducing the influence on the efficiency of the antenna structure 130 and the antenna radiator 210.

[0098] In some possible implementation manners, refer to Figure 5 As shown, the wiring layer 114 includes at least one line 114a, and the lines 114a in the wiring layer 114 are discontinuous. Each line 114a in the wiring layer 114 can be discontinuous, or part of the lines in the wiring layer 114 are discontinuous. The discontinuous lines 114a in the wiring layer 114 can reduce the electromagnetic interference of the wiring layer 114 to the antenna structure 130 and the antenna radiator 210, thereby reducing the influence on the efficiency of the antenna structure 130 and the antenna radiator 210.

[0099] The application also provides an electronic device 10 comprising the shell of any of the above embodiments. It can be understood that when the shell 100 is a protective shell 102, the electronic device 10 comprises an electronic device body and the protective shell 102, and the protective shell 102 also falls within the protection scope of the electronic device 10 of the application. The electronic device 10 further comprises an antenna radiator 210, which is located on the side of the support layer 120 away from the antenna structure 130, and the antenna structure 130 and the antenna radiator 210 are coupled. The antenna radiator 210 can be an antenna radiator pattern formed on a shaped bracket by LDS technology (bracket antenna), or can use the metal frame of the electronic device as the antenna radiator. In an embodiment, the electronic device 10 can comprise a display screen 300, a middle frame 200, and a shell 100, the shell 100 and the display screen 300 are respectively located on both sides of the middle frame 200, and the middle frame 200 can carry and fix devices such as a battery 400, an antenna radiator 210, or a circuit board of the electronic device 10.

[0100] The antenna radiator 210 is fed, and the antenna radiator 210 can be directly electrically connected with the feed source, or the antenna radiator 210 has a feeding point electrically connected with the feed source, and the feed source can be a radio frequency circuit in the electronic device 10. The antenna structure 130 can not be fed, and the antenna radiator 210 can be coupled with the antenna structure 130 to form a coupled antenna device, and the antenna radiator 210 can be coupled with the antenna structure 130 in a way of electromagnetic coupling. When the circuit (such as a radio frequency module) in the electronic device provides power to the antenna radiator 210, the antenna radiator 210 will excite to generate an electromagnetic field, and the antenna radiator 210 radiates electromagnetic waves to the surrounding space, and the antenna structure 130 receives the electromagnetic waves from the antenna radiator to generate an induced current and voltage. The antenna radiator 210 and the antenna structure 130 can transmit and receive signals through electromagnetic induction interaction, and the antenna radiator 210 and the antenna structure 130 form a coupled antenna device, which can improve the bandwidth and radiation characteristics of the antenna radiator 210, and enhance the performance of the antenna radiator 210.

[0101] The electronic device provided in the application comprises a shell 100, which can be a rear cover 101 of the electronic device 10 or a protective shell 102. The shell 100 is internally provided with an antenna structure 130, which can be coupled with an antenna radiator 210. The antenna structure 130 and the antenna radiator 210 form a coupled antenna device. By arranging the antenna structure 130 between the protective layer 110 and the support layer 120 or arranging the antenna structure 130 on the side of the protective layer 110 away from the support layer 120, the distance between the antenna structure 130 and the antenna radiator 210 is further increased, and the coupling between the antenna structure 130 and the antenna radiator 210 is further increased, thereby further improving the bandwidth and radiation characteristics of the antenna radiator 210, and further enhancing the performance of the antenna radiator 210. At the same time, the antenna structure 130 can be covered by the protective layer 110 or the cover layer 150, thereby ensuring the appearance of the electronic device 10 while enhancing the performance of the antenna radiator 210.

[0102] In some possible embodiments, the electronic device 10 comprises a bracket 220 and an antenna radiator 210 arranged on the bracket 220. The antenna radiator 210 fixed on the bracket 220 can be a bracket antenna. The bracket 220 can be fixed on a circuit board of the electronic device 10, and the bracket 220 serves as a support carrier for supporting the bracket antenna. It should be understood that the bracket 220 as a carrier should be insulating to avoid affecting the feeding of the bracket antenna. For example, the bracket 220 can be made of polycarbonate or acrylonitrile-butadiene-styrene copolymer material. The antenna radiator 210 is fixed on the bracket 220, and at least part of the antenna radiator 210 is located between the bracket 220 and the support layer 120. The antenna radiator 210 and the support layer 120 have a gap therebetween, which can meet the clearance requirement of the antenna radiator 210 fixed on the bracket 220, and ensure that the antenna radiator 210 can work normally without being disturbed by external factors.

[0103] In some possible embodiments, referring to Figure 4 、 Figure 9 and Figure 11As shown, the antenna radiator 210 and the antenna structure 130 are arranged in parallel along the Y direction, and the thickness direction of the electronic device 10 is the Y direction. The projection of the antenna radiator 210 and the antenna structure 130 along the thickness direction of the electronic device 10 at least partially overlaps. In some possible embodiments, the shape and size of the antenna radiator 210 can be completely the same as the shape and size of the antenna structure 130, and the projection of the antenna radiator 210 and the antenna structure 130 along the Y direction completely overlaps. Alternatively, the shape and size of the antenna radiator 210 can be completely the same as the shape and size of the antenna structure 130, and the projection of the antenna radiator 210 and the antenna structure 130 along the Y direction partially overlaps. Alternatively, the shape and size of the antenna radiator 210 can be different from the shape and size of the antenna structure 130, and the projection of the antenna radiator 210 and the antenna structure 130 along the Y direction partially overlaps. Those skilled in the art can adapt the positional relationship between the antenna radiator 210 and the antenna structure 130 according to the actual needs of the structural layout in the electronic device 10. The projection of the antenna radiator 210 and the antenna structure 130 along the thickness direction of the electronic device 10 at least partially overlaps, and a stronger electromagnetic coupling is formed between the antenna radiator 210 and the antenna structure 130, thereby enhancing the performance of the antenna radiator 210.

[0104] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit the technical solutions of the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A housing characterized by, The antenna structure is accommodated in the accommodating groove.

2. The housing of claim 1, wherein The antenna structure is in a sheet shape, and the thickness is less than or equal to 0.04 mm.

3. The housing of claim 2, wherein, The depth of the accommodating groove is the same as the thickness of the antenna structure, and the surface of the antenna structure on the side facing the protective layer is coplanar with the plane where the opening of the accommodating groove is located.

4. The housing according to any one of claims 1-3, characterized in that The protective layer is a gold wire layer, and the gold wire layer has a wiring layer.

5. The housing of claim 4, wherein, The width of the grid line in the wiring layer is less than or equal to 0.15 mm.

6. The case according to claim 4, characterized in that, The grid in the wiring layer is in a square shape, and the length of a single grid is greater than or equal to 5 mm.

7. The case according to claim 4, characterized by The lines of the wiring layer are in a discontinuous shape.

8. The housing according to any one of claims 1-3, wherein, The support layer is a glass fiber layer.

9. The housing according to any one of claims 1-3, wherein, The shell is a protective shell, and the protective shell is detachably connected with the back cover of the electronic device.

10. The case of claim 9, wherein, The protective layer includes a skin layer and a first plastic layer arranged in layers, and the support layer is a second plastic layer. The thickness of the first plastic layer is less than that of the second plastic layer. The skin layer, the first plastic layer, and the second plastic layer are sequentially and adhesively connected. The antenna structure is located between the first plastic layer and the second plastic layer.

11. A housing characterized by, The shell includes a support layer and a protective layer arranged in layers. The antenna structure is located on the side of the protective layer away from the support layer. The antenna structure is provided with a covering layer on the side away from the support layer. The protective layer includes a base layer and a wiring layer located in the base layer. The covering layer has a hollow area, so that the exposed area shape of the antenna structure through the hollow area coincides with the shape of the wiring layer in the protective layer. The covering layer and the base layer have the same color.

12. The case of claim 11, wherein, The protective layer includes a gold wire layer, and the wiring layer in the gold wire layer is in a grid shape.

13. The case of claim 12, wherein, The width of the grid line in the wiring layer is less than or equal to 0.15 mm.

14. The housing according to claim 12 or 13, characterized in that The grid in the wiring layer is in a square shape, and the length of a single grid is greater than or equal to 5 mm.

15. The housing according to claim 12 or 13, characterized in that The lines of the wiring layer are in a discontinuous shape.

16. An electronic device, comprising: The shell includes the shell of any one of claims 1-15, and further includes an antenna radiator. The antenna radiator is located on the side of the support layer away from the antenna structure. The antenna structure and the antenna radiator are coupled.

17. The electronic device of claim 16, wherein, The electronic device includes a bracket, and the antenna radiator is fixed on the bracket. At least part of the antenna radiator is located between the bracket and the support layer. There is a gap between the antenna radiator and the support layer.

18. The electronic device of claim 16 or 17, wherein, The projection of the antenna radiator and the antenna structure along the thickness direction of the electronic device at least partially overlaps.

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