Electronic device cooling system

Abstract

The utility model discloses an electronic device cooling system which comprises a temperature control system and an electrode device arranged at the output end of the temperature control system, the temperature control system comprises a substrate and at least two heating rods used for heating the substrate, and at least two thermocouple sets arranged in a crossed mode are arranged on the upper end face of the substrate. The electrode device comprises a bottom plate and a plurality of first grooves which are formed in the upper end face of the bottom plate and are used for constructing an electric field gradient, a dielectric layer and a hydrophobic layer which can be used for transporting liquid drops to do reciprocating motion are sequentially arranged above the bottom plate, and a controllable temperature field is provided in the liquid drop transportation process through a temperature control system; according to the utility model, the electrode device is electrified to form an electric field gradient, so that directional driving of the liquid drops is induced, the heat dissipation effect can be ensured, and the local heat dissipation accuracy can be improved, and the heat dissipation device belongs to the technical field of heat dissipation of electronic devices.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of electronic device heat dissipation technology, more specifically relates to a kind of electronic device cooling system. BACKGROUND

[0002] The heat dissipation of current increasingly miniaturized microelectronic devices is a serious challenge. In the actual electronic device running process, the essence of calculation is electron transition, so the heat dissipation is not uniform, and the accuracy of the directed heat dissipation is poor, and the overall heat is uneven to form local hot spots. Subsequent poor local heat dissipation may cause large thermal stress on the chip, thereby affecting the service life. Therefore, an electronic device cooling system capable of improving the accuracy of local heat dissipation and ensuring the heat dissipation effect is urgently needed. SUMMARY

[0003] The main purpose of the utility model is to provide an electronic device cooling system to improve the accuracy of local heat dissipation and ensure the heat dissipation effect.

[0004] To achieve the above purpose, the technical scheme of the utility model is as follows:

[0005] An electronic device cooling system includes a temperature control system and an electrode device arranged at the output end of the temperature control system. The temperature control system includes a substrate and at least two heating rods for heating the substrate. The upper end surface of the substrate is provided with at least two cross-arranged thermocouple groups. The electrode device includes a bottom plate and a plurality of first grooves arranged on the upper end surface of the bottom plate for constructing an electric field gradient. A dielectric layer and a hydrophobic layer for transporting liquid droplets reciprocating motion are arranged above the bottom plate.

[0006] According to the first aspect of the utility model, the substrate is provided with an embedded part for adjusting the temperature measured by the thermocouple group and a plurality of second grooves for accommodating the thermocouple group.

[0007] According to the first aspect of the utility model, the size of the embedded part is less than or equal to the size of the substrate.

[0008] According to the first aspect of the utility model, the upper end surface of the substrate is further provided with a third groove for assembling the embedded part, and the depth of the third groove is greater than the thickness of the embedded part.

[0009] According to the first aspect of the utility model, the substrate is a copper material member.

[0010] According to the first aspect of the utility model, the two thermocouple groups are arranged perpendicular to each other, and each thermocouple group includes at least two parallel arranged thermocouple parts.

[0011] According to the first aspect of the utility model, the thermocouple components in the same thermocouple group are arranged at equal intervals.

[0012] According to the first aspect of the utility model, the temperature control system further comprises a power supply temperature controller, and one end of the two heating rods is connected to the output end of the power supply temperature controller.

[0013] According to the first aspect of the utility model, the two heating rods are arranged through the side of the substrate, and the two heating rods are arranged in parallel.

[0014] According to the first aspect of the utility model, the bottom plate is a glass material component.

[0015] The above technical solution of the utility model has at least one of the following advantages or beneficial effects:

[0016] The utility model provides a controllable temperature field in the liquid drop transportation process by using the temperature control system, solves the problem of local hot spots in the liquid drop transportation process, and further forms an electric field gradient by electrifying the electrode device, so as to induce directional driving of the liquid drop, so that not only the heat dissipation effect can be ensured, but also the local heat dissipation accuracy can be further improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] The utility model will be further described below in combination with the drawings and examples.

[0018] ATTACHMENT Figure 1 It is the overall structure diagram of an embodiment of the utility model;

[0019] ATTACHMENT Figure 2 It is the substrate structure diagram of an embodiment of the utility model;

[0020] ATTACHMENT Figure 3 It is the electrode device structure diagram of an embodiment of the utility model;

[0021] ATTACHMENT Figure 4 It is the electrode device sectional view of an embodiment of the utility model;

[0022] ATTACHMENT Figure 5 It is the electrode device structure diagram of an embodiment of the utility model;

[0023] ATTACHMENT Figure 6 It is the electrode device structure diagram of an embodiment of the utility model;

[0024] ATTACHMENT Figure 7 It is the substrate PID temperature control principle diagram of an embodiment of the utility model;

[0025] ATTACHMENT Figure 8The force diagram of a liquid drop on the electrode device of one embodiment of the utility model is shown in the figure;

[0026] The force diagram of a liquid drop on the electrode device of one embodiment of the utility model is shown in the figure; Figure 9 The force diagram of a liquid drop on the electrode device of one embodiment of the utility model is shown in the figure;

[0027] The force diagram of a liquid drop on the electrode device of one embodiment of the utility model is shown in the figure; Figure 10 The force diagram of a liquid drop on the electrode device of one embodiment of the utility model is shown in the figure; DETAILED DESCRIPTION

[0028] The embodiments of the utility model will be described below in detail, and the examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as a limitation on the utility model.

[0029] In the description of the utility model, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right and the like, is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as a limitation on the utility model.

[0030] In the description of the utility model, the meaning of several is one or more, and the meaning of multiple is more than two, greater than, less than, more than and the like are not included in the number, and above, below and the like are included in the number. If it is described as first, second, it is only used to distinguish the technical features for the purpose, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the sequence of the indicated technical features.

[0031] In addition, the terms "first" and "second" are only used for the purpose of description, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include one or more features.

[0032] In the description of the utility model, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be understood broadly, for example, it can be fixed connection or movable connection, or detachable connection or non-detachable connection, or integrally connected; it can be mechanical connection, or electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through intermediate medium, or the internal communication of two elements, indirect communication or the interaction relationship between two elements.

[0033] The following disclosure provides many different implementations or examples to implement different aspects of the present application.

[0034] Referring to the drawings Figure 1 to the drawings Figure 10 As shown in the drawings, an electronic device cooling system comprises a temperature control system 1 and an electrode device 2 arranged at the output end of the temperature control system 1, wherein the temperature control system 1 comprises a base 11 of a copper material member, two heating rods 12 for heating the base 11, and a power temperature controller 13, the output end of the power temperature controller 13 is connected with one end of the two heating rods 12 respectively, and the two heating rods 12 are arranged in parallel and pass through the side surface of the base 11.

[0035] In an embodiment of the present application, the base 11 is provided with an embedded part 3 for adjusting the temperature measurement of the thermocouple group and a plurality of second grooves 31 for accommodating the thermocouple group, the embedded part 3 and the second grooves 31 are used to adjust the assembled thermocouple to measure the temperature, so as to ensure accurate measurement of the temperature value of each hot spot.

[0036] In an embodiment of the present application, the size of the embedded part 3 is less than or equal to the size of the base 11, and a third groove 4 for assembling the embedded part 3 is arranged on the upper end surface of the base 11, so as to ensure that the depth of the third groove 4 is greater than the thickness of the embedded part 3 and facilitate installation.

[0037] In an embodiment of the present application, the base 11 is provided with two cross-arranged thermocouple groups, and the two thermocouple groups are arranged perpendicularly, each thermocouple group comprises at least two parallel arranged thermocouple elements, each thermocouple element can be installed in the corresponding second groove 31, and the thermocouple elements in the same thermocouple group are arranged at equal intervals, so as to ensure uniform heating.

[0038] In an embodiment of the present application, the design steps of the temperature-controllable base 11 comprise:

[0039] Firstly, a third groove 4 is processed on the base 11 of the copper material member, and a plurality of second grooves 31 are processed on the embedded part 3, which are used for assembling the thermocouple group;

[0040] Secondly, the side surface of the base 11 is processed to satisfy the assembly of the heating rod 12;

[0041] Thirdly, the temperature measurement point of the thermocouple element is taken as the input of the temperature control system 1;

[0042] Fourthly, the output end of the temperature control system 1 is connected with the heating rod 12 to form a loop, so as to realize PID operation temperature control.

[0043] In one embodiment of the utility model, electrode device 2 includes bottom plate 21 and the upper end surface of bottom plate 21 is provided with a plurality of first grooves 22 for constructing electric field gradient, and specifically can refer to the drawings Figure 3 、the drawings Figure 4 、the drawings Figure 5 、the drawings Figure 6 The first groove 22 is one of rectangle, trapezoid and other polygons, and the bottom plate 21 can be a glass material member.

[0044] In the prior art, only temperature field is used for droplet driving, which has the disadvantages of slow response and low speed; the electronic device cooling system drives droplets under the coupling of temperature field and electric field, and the response time and driving speed can be greatly accelerated by using electric field to drive droplets, and active control can be performed.

[0045] In one embodiment of the utility model, a dielectric layer 23 and a hydrophobic layer 24 for reciprocating motion of transported droplets are sequentially arranged above the bottom plate 21, and the drawings are referred to Figure 10 After applying voltage, the leakage current value of the electrode device 2 can complete transportation without breakdown damage. The preparation process of the electrode device 2 includes: cleaning the substrate, magnetron sputtering patterning electrode, spin coating photoresist, etching, spin coating fluoropolymer and heat treatment.

[0046] In one embodiment of the utility model, the manufacturing steps of the electrode device 2 with a pattern include:

[0047] First step, a plurality of first grooves 22 are machined on the bottom plate 21, that is, a patterned electrode is plated, and the purpose is to form an electric field gradient after power-on;

[0048] Second step, clean the bottom plate 21 plated with ITO, spin coat the hydrophobic layer 24 and the dielectric layer 23, modify the surface of the dielectric layer 23, and spin coat the hydrophobic layer 24;

[0049] Third step, transport droplets on the hydrophobic layer 24, connect the upper surface of the droplets to the positive electrode, and connect the electrode of the electrode device 2 to the negative electrode;

[0050] Fourth step, use a picoammeter and a LIBVIEW program to apply a step voltage, control the coupling of the electric field gradient and the temperature field, and realize droplet transportation.

[0051] The main design idea of the electronic device cooling system is: the substrate 11 made of copper material is designed as a temperature PID control system; further, the local point temperature is measured by using a thermocouple; further, feedback is given to the power temperature controller 13, and then the power temperature controller 13 controls the heating circuit to heat; further, a plurality of first grooves 22 are arranged on the electrode device 2 to construct an electrode pattern, so as to construct an electric field gradient (the drawings are referred to Figure 4); further utilize spin coating, photolithography technology to manufacture the hydrophobic layer 24 of the electrode device 2, utilize the dielectric wetting principle and the coupling effect of the temperature field to actively control the liquid drops to realize directional transportation.

[0052] Although the embodiments of the utility model have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the utility model, and the scope of the utility model is defined by the claims and their equivalents.

Claims

1. An electronic device cooling system, characterized by, The temperature control system (1) comprises a substrate (11) and at least two heating rods (12) for heating the substrate (11), and the upper end surface of the substrate (11) is provided with at least two cross-arranged thermocouple groups; the electrode device (2) comprises a bottom plate (21) and a plurality of first grooves (22) arranged on the upper end surface of the bottom plate (21) for constructing an electric field gradient, and the bottom plate (21) is sequentially provided with a dielectric layer (23) and a hydrophobic layer (24) for transporting liquid droplets reciprocating motion.

2. The electronic device cooling system of claim 1, wherein: The substrate (11) is provided with an embedded part (3) for adjusting the measured temperature of the thermocouple group and a plurality of second grooves (31) for accommodating the thermocouple group.

3. The electronic device cooling system of claim 2, wherein: The size of the embedded part (3) is less than or equal to the size of the substrate (11).

4. The electronic device cooling system of claim 2, wherein: The upper end surface of the substrate (11) is further provided with a third groove (4) for assembling the embedded part (3), and the depth of the third groove (4) is greater than the thickness of the embedded part (3).

5. The electronic device cooling system of claim 4, wherein: The substrate (11) is a copper material member.

6. The electronic device cooling system of claim 1, wherein: The two thermocouple groups are arranged perpendicular to each other, and each of the thermocouple groups comprises at least two parallel arranged thermocouple elements.

7. The electronic device cooling system of claim 6, wherein: The thermocouple elements in the same thermocouple group are arranged at equal intervals.

8. The electronic device cooling system of claim 1, wherein: The temperature control system (1) further comprises a power supply temperature controller (13), and one end of the power supply temperature controller (13) is connected with one end of the two heating rods (12) respectively.

9. The electronic device cooling system of claim 8, wherein: The two heating rods (12) are arranged through the side surface of the substrate (11), and the two heating rods (12) are arranged parallel to each other.

10. The electronic device cooling system of claim 1, wherein: The bottom plate (21) is a glass material member.

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