Intelligent water cooking machine

Abstract

The embodiment of the utility model provides an intelligent water cooking machine which is communicated with a primary cooling device through a boiling water inlet pipeline, so that boiling water enters the primary cooling device to be primarily cooled, the boiling water is cooled to a first temperature, and water at the first temperature flows into a secondary cooling device through a first temperature water outlet pipeline; the water temperature is continuously reduced to the second temperature through the second-stage cooling device, then the water at the second temperature flows into the third-stage cooling device through the second-temperature water outlet pipeline, the water temperature is continuously reduced to the third temperature through the third-stage cooling device, and the third-stage cooling device is further provided with a third-temperature water outlet pipeline. By means of the three-stage cooling device, boiling water entering the water cooking machine is cooled step by step, the temperature of outlet water of the water cooking machine can be controlled more accurately, the requirements of users for water with various temperatures from warm water to normal-temperature water and then to cold water are met, cooling efficiency is improved, the users are prevented from drinking unboiled water and boiled water, the quality of the outlet water is improved, and the user experience is improved. And the user experience is improved.

Description

Technical Field

[0001] This invention relates to the field of hot water dispenser technology, and in particular to an intelligent hot water dispenser. Background Technology

[0002] Among current water purifier products, water purifiers, which provide boiled water at different temperatures, meet people's pursuit of healthy and safe drinking water and are favored by users. Most existing water purifier solutions cool water by mixing hot and cold water, but this water is called "yin-yang water," which may contain excessive bacteria and does not conform to Chinese drinking habits. Furthermore, current machines on the market can only lower the water temperature to near room temperature, and most existing technologies use water cooling, which is very slow in cooling boiling water. In summer, many people may prefer cooler boiled water, and water cooling alone is insufficient in terms of temperature and efficiency. Therefore, there is an urgent need for a water purifier that can meet users' needs for various water temperatures, from warm water to room temperature to cold water, while also meeting user requirements for cooling efficiency and water quality. Utility Model Content

[0003] To solve the above-mentioned technical problems, the technical solution provided in this application is as follows:

[0004] This utility model provides an intelligent boiling water machine, including a primary cooling device, a secondary cooling device, a tertiary cooling device, and a boiling water inlet pipe;

[0005] The boiling water inlet pipe is connected to the primary cooling device; the primary cooling device is connected to the secondary cooling device through a first temperature outlet pipe; the secondary cooling device is connected to the tertiary cooling device through a second temperature outlet pipe; and the tertiary cooling device is equipped with a third temperature outlet pipe.

[0006] The water temperature in the boiling water inlet pipe is greater than the water temperature in the first temperature outlet pipe, the water temperature in the first temperature outlet pipe is greater than the water temperature in the second temperature outlet pipe, and the water temperature in the second temperature outlet pipe is greater than the water temperature in the third temperature outlet pipe.

[0007] In some possible implementations, the intelligent water purifier further includes an intelligent control system; the intelligent control system is electrically connected to the primary cooling device, the secondary cooling device, and the tertiary cooling device, respectively.

[0008] The intelligent control unit includes an outlet water temperature setting unit, which is electrically connected to the primary cooling device, the secondary cooling device, and the tertiary cooling device.

[0009] In some possible implementations, the primary cooling device includes a primary heat dissipation device and a cooling tank;

[0010] The boiling water inlet pipe and the first temperature outlet pipe are connected to the cooling box, and the first temperature outlet pipe is located away from the boiling water inlet pipe.

[0011] The primary heat dissipation device is located on one side surface of the cooling box and is positioned close to the boiling water inlet pipe.

[0012] In some possible implementations, the primary heat dissipation device includes a first radiator and a first cooling fan;

[0013] The first radiator is disposed on one side surface of the cooling box, and the first cooling fan is disposed on the surface of the first radiator.

[0014] In some possible implementations, the secondary cooling device includes a radiator and a copper coil, the copper coil being embedded within the radiator;

[0015] One end of the copper coil is connected to the cooling box through the first temperature water outlet pipe, and the other end is connected to the three-stage cooling device.

[0016] In some possible implementations, the three-stage cooling system includes a cold tank, a three-stage heat dissipation device, and a cold tank inlet pipe;

[0017] The third temperature water outlet pipe is connected to the cold tank water tank;

[0018] The cold tank is connected to the cold tank inlet pipe and the second temperature outlet pipe, and the second temperature outlet pipe is connected to the copper coil.

[0019] The three-stage heat dissipation device is installed on one side surface of the cold tank.

[0020] In some possible implementations, the three-stage heat dissipation device includes a second heat sink, a second cooling fan, and a semiconductor cooling device;

[0021] The semiconductor refrigeration device includes a cooling surface and a heat dissipation surface, which are arranged opposite to each other. The semiconductor refrigeration device is disposed on one side surface of the cold tank, and the cooling surface is disposed on the side closer to the cold tank.

[0022] The second heat sink is disposed on the surface of the semiconductor cooling device, and the second cooling fan is disposed on the surface of the second heat sink.

[0023] In some possible implementations, the cooling tank is equipped with a baffle plate, a water level probe, and a first temperature sensor; the cold tank is equipped with a second temperature sensor.

[0024] The baffle plate is disposed inside the cooling box and between the boiling water inlet pipe and the first temperature outlet pipe, and the height of the baffle plate is less than the height of the cooling box.

[0025] The water level probe is suspended on the upper surface of the cooling tank; the water level probe includes a first water level probe and a second water level probe, wherein the length of the first water level probe is less than the length of the second water level probe.

[0026] The first temperature sensor is positioned close to the first temperature outlet water pipe; the second temperature sensor is positioned close to the third temperature outlet water pipe.

[0027] In some possible implementations, the first temperature water outlet pipe is equipped with a first temperature water outlet valve and a water pump; the second temperature water outlet pipe is equipped with a second temperature water outlet valve; the cold tank inlet pipe is equipped with a cold tank inlet valve; the third temperature water outlet pipe is equipped with a third temperature water outlet valve; and the boiling water inlet pipe is equipped with a boiling water inlet valve.

[0028] In some possible implementations, the intelligent control system further includes an outlet water temperature control unit and a water replenishment control unit;

[0029] The water replenishment control unit is electrically connected to the first water level probe, the second water level probe, the boiling water inlet valve, the first temperature outlet valve, the second temperature outlet valve, the water pump, the third temperature outlet valve, and the outlet temperature control unit, respectively.

[0030] The outlet water temperature control unit is electrically connected to the outlet water temperature setting unit, the first temperature sensor, the first cooling fan, the water pump, the second cooling fan, the semiconductor refrigeration device, and the second temperature sensor, respectively.

[0031] The above-mentioned technical solution provided in this application has the following beneficial effects:

[0032] This utility model provides an intelligent hot water dispenser. A boiling water inlet pipe connects to a primary cooling device, allowing boiling water to undergo initial cooling to a first temperature. The water then flows through a first-temperature outlet pipe into a secondary cooling device, where the temperature is further reduced to a second temperature. This second-temperature outlet pipe then flows into a tertiary cooling device, where the temperature is further reduced to a third temperature. The tertiary cooling device also has a third-temperature outlet pipe. This three-stage cooling system progressively cools the boiling water entering the dispenser, allowing for more precise control of the water's output temperature. This meets users' needs for various water temperatures, from warm to room temperature to cold, while also improving cooling efficiency, preventing users from drinking mixed hot and cold water, enhancing water quality, and improving the user experience. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a structural schematic diagram of an intelligent hot water machine provided in an embodiment of this utility model.

[0035] Figure 2 This is a schematic diagram of the circuit connection provided in an embodiment of the present invention.

[0036] Figure 3 This is a schematic diagram of the intelligent control logic of the intelligent boiled water machine provided in this embodiment of the utility model.

[0037] Figure 4 This is a schematic diagram of the water replenishment control logic of the cooling box provided in this embodiment of the utility model.

[0038] The following is supplementary explanation of the attached figures:

[0039] 1-First-stage cooling device; 11-First temperature outlet water pipe; 111-First temperature outlet water valve; 12-First-stage heat dissipation device; 121-First radiator; 122-First cooling fan; 13-Cooling tank; 131-Baffle plate; 132-Water level probe; 1321-First water level probe; 1322-Second water level probe; 133-First temperature sensor;

[0040] 2-Secondary cooling unit; 21-Second temperature water outlet pipe; 211-Second temperature water outlet valve; 22-Radiator; 23-Copper coil; 24-Water pump;

[0041] 3-Three-stage cooling device; 31-Third temperature outlet water pipe; 311-Third temperature outlet water valve; 32-Cold tank water tank; 321-Second temperature sensor; 33-Three-stage heat dissipation device; 331-Second radiator; 332-Second cooling fan; 333-Semiconductor refrigeration device; 34-Cold tank water inlet pipe; 341-Cold tank water inlet valve;

[0042] 4- Boiling water inlet pipe; 41- Boiling water inlet valve;

[0043] 5-Intelligent control system; 51-Outlet water temperature setting unit; 52-Outlet water temperature control unit; 53-Water replenishment control unit. Detailed Implementation

[0044] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0045] The term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of this application. In the description of this application, it should be understood that the terms "upper," "lower," "top," "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.

[0046] When a numerical range is disclosed herein, the range is considered continuous and includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to an integer, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe a feature or characteristic, the ranges may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are included. For example, a specified range from “1 to 10” should be considered to include any and all subranges between the minimum value 1 and the maximum value 10. Exemplary subranges of the range 1 to 10 include, but are not limited to, 1 to 6.1, 3.5 to 7.8, 5.5 to 10, etc.

[0047] A water purifier boils water first, then rapidly cools it to the desired temperature using a built-in cooling system. Most current water purifiers cool water by mixing hot and cold water, resulting in "yin-yang water" (a mixture of hot and cold water), which may contain excessive bacteria and doesn't suit Chinese drinking habits. Many people prefer cooled boiled water, which is neither too hot nor too cold and has fewer bacteria. Heating water to boiling and then storing it for cooling only lowers the temperature to near room temperature, which is insufficient for most people, especially in summer. Furthermore, current technology cools boiling water very slowly, requiring users to wait considerable time for cooled water to reach a suitable temperature, lacking innovative solutions.

[0048] Based on this, please see Figure 1 This utility model provides an intelligent hot water dispenser, including a primary cooling device 1, a secondary cooling device 2, a tertiary cooling device 3, and a boiling water inlet pipe 4; the boiling water inlet pipe 4 is connected to the primary cooling device 1; the primary cooling device 1 is connected to the secondary cooling device 2 via a first temperature outlet pipe 11; the secondary cooling device 2 is connected to the tertiary cooling device 3 via a second temperature outlet pipe 21; the tertiary cooling device 3 is provided with a third temperature outlet pipe 31; wherein, the temperature of the water in the boiling water inlet pipe 4 is greater than the temperature of the water in the first temperature outlet pipe 11, the temperature of the water in the first temperature outlet pipe 11 is greater than the temperature of the water in the second temperature outlet pipe 21, and the temperature of the water in the second temperature outlet pipe 21 is greater than the temperature of the water in the third temperature outlet pipe 31.

[0049] For example, the intelligent boiled water dispenser includes a three-stage cooling system: a primary cooling system 1, a secondary cooling system 2, and a tertiary cooling system 3. Specifically, the boiling water inlet pipe is connected to the primary cooling system 1; the primary cooling system 1 is connected to the secondary cooling system 2 via a first-temperature outlet pipe; the secondary cooling system 2 is connected to the tertiary cooling system 3 via a second-temperature outlet pipe; and the tertiary cooling system 3 is equipped with a third-temperature outlet pipe. The first and second temperature outlet pipes are T-junctions. Specifically, the first end of the first temperature outlet pipe is connected to the primary cooling system 1, the second end is connected to the secondary system, and the third end is the outlet for water at the first temperature, used by the user to obtain water at the first temperature. The first section of the second temperature outlet pipe 21 is connected to the secondary cooling system 2, the second end is connected to the tertiary cooling system 3, and the third end is the outlet for water at the second temperature, used by the user to obtain water at the second temperature. The third temperature outlet pipe 31 is the outlet for water at the third temperature, used by the user to obtain water at the third temperature.

[0050] The principle of the above device is as follows: Boiling water enters the primary cooling device 1 of the water purifier through the boiling water inlet pipe. After being cooled by the primary cooling device 1, the water temperature drops to a first temperature. Water at the first temperature is then taken by the user through the first temperature outlet pipe 11 or flows into the secondary cooling device 2. After being cooled by the secondary cooling device, the water temperature drops to a second temperature. Subsequently, it is taken by the user through the second temperature outlet pipe 21 or flows into the tertiary cooling device 3. After being cooled by the tertiary cooling device 3, the temperature drops to a third temperature, which the user can then take through the third temperature outlet pipe 31. Therefore, the temperature of the water in the boiling water inlet pipe 4 is greater than the temperature of the water in the first temperature outlet pipe 11, the temperature of the water in the first temperature outlet pipe 11 is greater than the temperature of the water in the second temperature outlet pipe 21, and the temperature of the water in the second temperature outlet pipe 21 is greater than the temperature of the water in the third temperature outlet pipe 31. That is, boiling water temperature > first temperature > second temperature > third temperature.

[0051] Optionally, the arrangement of the above three cooling devices can be as follows: Figure 1 The vertical arrangement shown can also be arranged sequentially from left to right or from right to left.

[0052] This utility model provides an intelligent hot water dispenser. A boiling water inlet pipe connects to a primary cooling device, allowing boiling water to undergo initial cooling to a first temperature. The water then flows through a first-temperature outlet pipe into a secondary cooling device, where the temperature is further reduced to a second temperature. This second-temperature outlet pipe then flows into a tertiary cooling device, where the temperature is further reduced to a third temperature. The tertiary cooling device also has a third-temperature outlet pipe. This three-stage cooling system progressively cools the boiling water entering the dispenser, allowing for more precise control of the water's output temperature. This meets users' needs for various water temperatures, from warm to room temperature to cold, while also improving cooling efficiency, preventing users from drinking mixed hot and cold water, enhancing water quality, and improving the user experience.

[0053] In some embodiments, the intelligent water purifier further includes an intelligent control system 5; the intelligent control system 5 is electrically connected to the primary cooling device 1, the secondary cooling device 2 and the tertiary cooling device 3 respectively;

[0054] The intelligent control unit includes an outlet water temperature setting unit 51, which is electrically connected to the primary cooling device 1, the secondary cooling device 2, and the tertiary cooling device 3.

[0055] For example, the intelligent water purifier includes an intelligent control unit, the function of which is to intelligently control the cooling devices at each stage of the water purifier, such as... Figure 2 As shown, the intelligent control system 5 is electrically connected to the primary cooling device 1, the secondary cooling device 2, and the tertiary cooling device 3, respectively.

[0056] The intelligent control system 5 includes an outlet water temperature setting unit 51, which is electrically connected to the primary cooling device 1, the secondary cooling device 2, and the tertiary cooling device 3. The outlet water temperature setting unit 51 can set the heat dissipation and cooling effect of the primary cooling device 1, the secondary cooling device 2, and the tertiary cooling device 3. Specifically, the user can set the water temperature of the first temperature outlet pipe 11, the second temperature outlet pipe 21, and the third temperature outlet pipe 31 according to their own needs.

[0057] The aforementioned intelligent control system 5 controls the primary cooling device 1 to activate its heat dissipation or cooling function when the water temperature in the primary cooling device 1 is higher than the first temperature, and to deactivate its heat dissipation or cooling function when the water temperature in the primary cooling device 1 is lower than the first temperature, thus achieving precise control over the outlet water temperature of the primary cooling device 1. The control principles for the secondary cooling device 2 and the tertiary cooling device 3 are similar and will not be elaborated here.

[0058] Optionally, before the user makes personal settings, the water purifier system defaults to the following: the first-stage cooling device 1 cools boiling water to warm water, with the outlet water temperature of the first temperature outlet pipe 11 being 60°C; the second-stage cooling device 2 cools warm water to room temperature water, with the outlet water temperature of the second temperature outlet pipe 21 being 40°C; and the third-stage cooling device 3 cools room temperature water to cold water, with the outlet water temperature of the second temperature outlet pipe 21 being 10°C.

[0059] Alternatively, the intelligent control system 5 can be a microcontroller or other types of control systems.

[0060] Optionally, the specific location of the intelligent control system 5 is not limited. The intelligent control system 5 is equipped with a human-machine interaction module, which is used to enable users to control the outlet water temperature setting unit 51, thereby setting the outlet water temperature of three cooling temperature according to individual needs.

[0061] Optionally, the specific implementation methods of the above-mentioned human-computer interaction module include, but are not limited to, voice interaction, touch screen or non-touch screen interaction.

[0062] This utility model embodiment controls the intelligent hot water machine by setting an intelligent control system 5. This not only allows users to set the outlet water temperature of each cooling device according to their own needs, but also uses the intelligent control system 5 to precisely control the outlet water temperature of each cooling device, meeting users' various temperature water needs from warm water to room temperature water to cold water, thus improving the user experience.

[0063] In some embodiments, the primary cooling device 1 includes a primary heat dissipation device 12 and a cooling box 13;

[0064] The boiling water inlet pipe 4 and the first temperature outlet pipe 11 are connected to the cooling box 13, and the first temperature outlet pipe 11 is located away from the boiling water inlet pipe 4.

[0065] The primary heat dissipation device 12 is disposed on one side surface of the cooling box 13 and is located near the boiling water inlet pipe 4.

[0066] In some embodiments, the primary heat dissipation device 12 includes a first heat sink 121 and a first cooling fan 122;

[0067] The first radiator 121 is disposed on one side surface of the cooling box 13, and the first cooling fan 122 is disposed on the surface of the first radiator 121.

[0068] For example, such as Figure 1As shown, the primary cooling device 1 includes a primary heat dissipation device 12 and a cooling tank 13. The cooling tank 13 is used to contain boiling water entering from the boiling water inlet pipe 4. The boiling water inlet pipe 4 is provided on one side surface of the cooling tank 13. The primary heat dissipation device 12 is also provided on the other side outer surface of the cooling tank 13, and the primary heat dissipation device 12 is located near the boiling water inlet pipe 4 to quickly dissipate heat from the boiling water entering the cooling tank 13.

[0069] The positional relationships of the various structures can be as follows: Figure 1 As shown, the boiling water inlet pipe 4 is located on the upper left side of the upper surface of the cooling tank 13, and the primary cooling device 1 is located on the left side surface of the cooling tank 13. Of course, it can also be located in other positions, as long as the positional relationship can satisfy the requirement that the boiling water inlet pipe 4 is connected to the cooling tank 13, and the primary cooling device 1 is located near the boiling water pipe.

[0070] Specifically, the primary cooling device 12 includes a first radiator 121 and a first cooling fan 122, used to rapidly dissipate heat from the incoming boiling water. The first temperature water outlet pipe 11 is positioned on the cooling tank 13 at a distance as far as possible from the boiling water inlet pipe to ensure the cooling effect of the water from the primary cooling device 1. For example, when the boiling water inlet pipe 4 is located on the left side of the upper surface of the cooling tank 13, the first temperature water outlet pipe 11 is located on the right side of the lower surface of the cooling tank 13.

[0071] Optionally, the cooling tank 13 can be made of stainless steel. The reason for choosing stainless steel here is to enhance heat conduction, so that the hot water cooling tank 13 can be cooled by heat conduction through the air. The cooling tank 13 is the first stage of cooling.

[0072] In this embodiment, the primary heat dissipation device 12 in the primary cooling device 1 is positioned near the boiling water inlet pipe 4. By positioning the boiling water inlet pipe 4 and the first temperature outlet pipe 11, better cooling or heat dissipation effects can be ensured, so that the effect of the primary cooling device 1 meets the requirements and satisfies people's demand for warm water.

[0073] In some embodiments, the secondary cooling device 2 includes a radiator 22 and a copper coil 23, the copper coil 23 being embedded in the radiator 22; one end of the copper coil 23 is connected to the cooling box 13 through the first temperature water outlet pipe 11, and the other end is connected to the tertiary cooling device 3.

[0074] For example, such as Figure 1 As shown, the secondary cooling device 2 consists of a copper coil 23 embedded in the radiator 22. As the water at the first temperature (warm water) passes through the slender copper coil 23, the water temperature can quickly drop to the second temperature (room temperature, i.e., normal temperature water).

[0075] In this embodiment, the secondary cooling device 2 uses a copper coil 23 to further cool the water flowing out from the first temperature outlet pipe. The slender copper coil 23 can meet the cooling requirements from warm water to room temperature water, while saving energy and improving the user experience.

[0076] In some embodiments, the three-stage cooling device 3 includes a cold tank water tank 32, a three-stage heat dissipation device 33, and a cold tank water inlet pipe 34;

[0077] The third temperature water outlet pipe 31 is connected to the cold tank 32;

[0078] The cold tank 32 is connected to the second temperature water outlet pipe 21 through the cold tank inlet pipe 34, and the second temperature water outlet pipe 21 is connected to the copper coil 23.

[0079] The three-stage heat dissipation device 33 is disposed on one side surface of the cold tank 32.

[0080] In some embodiments, the three-stage heat dissipation device 33 includes a second heat sink 331, a second cooling fan, and a semiconductor cooling device 333;

[0081] The semiconductor cooling device 333 includes a cooling surface and a heat dissipation surface, which are arranged opposite to each other. The semiconductor cooling device 333 is disposed on one side surface of the cold tank 32, and the cooling surface is disposed on the side close to the cold tank 32.

[0082] The second heat sink 331 is disposed on the surface of the semiconductor cooling device 333, and the second cooling fan is disposed on the surface of the second heat sink 331.

[0083] For example, such as Figure 1 As shown, the three-stage cooling device 3 includes a cold water tank 32, a three-stage heat dissipation device 33, and a cold water inlet pipe 34. The function of the cold water tank 32 is to store the water at the second temperature from the second-stage cooling device 2, and then the third-stage heat dissipation device 33 cools it down to the third temperature. One end of the cold water inlet pipe 34 is connected to the second-temperature water outlet pipe 21, and the other end is connected to the cold water tank 32, used to allow the water flowing out of the second-stage cooling device 2 to flow into the third-stage cooling device 3.

[0084] The three-stage heat dissipation device 33 is located on one outer surface of the cold tank 32, near the cold tank inlet pipe 34. Specifically, the three-stage heat dissipation device 33 includes a second radiator 331, a second cooling fan, and a semiconductor cooling device 333. The three-stage heat dissipation device 33 mainly relies on the cooling function of the semiconductor cooling device 333 to cool the water at the second temperature to the third temperature. Normally, the third temperature water refers to cold water. The second radiator 331 and the second cooling fan are used for auxiliary heat dissipation and auxiliary cooling.

[0085] The semiconductor cooling device 333 is divided into a cooling surface and a heat dissipation surface, namely a cold surface and a hot surface. The cold surface is attached to the cold tank 32, and the hot surface is attached to the second radiator 331. The second cooling fan is set on the surface of the second radiator 331, and the temperature of the hot surface is blown away by the second radiator 331 and the second cooling fan.

[0086] The third temperature outlet water pipe 31 is located on one side of the cold tank water tank 32 and is located away from the cold tank inlet water pipe 34. This is to better ensure the water temperature of the third temperature outlet water pipe 31.

[0087] This embodiment of the utility model, by setting the three-stage heat dissipation device 33 in the three-stage cooling device 3 near the cold tank inlet pipe 34, and by setting it in the positions of the cold tank inlet pipe 34 and the third temperature outlet water pipe 31, and by using a semiconductor device for cooling and heat dissipation, can ensure better cooling and heat dissipation effects, and can make the effect of the three-stage cooling device 3 meet the requirements and meet people's needs for warm water.

[0088] In some embodiments, the cooling tank 13 is provided with a baffle plate 131, a water level probe 132 and a first temperature sensor 133; the cold tank 32 is provided with a second temperature sensor 321.

[0089] The baffle plate 131 is disposed inside the cooling box 13 and between the boiling water inlet pipe 4 and the first temperature outlet pipe 11. The height of the baffle plate 131 is less than the height of the cooling box 13.

[0090] The water level probe 132 is suspended on the upper surface of the cooling tank 13; the water level probe 132 includes a first water level probe 1321 and a second water level probe 1322, wherein the length of the first water level probe 1321 is less than the length of the second water level probe 1322.

[0091] The first temperature sensor 133 is positioned close to the first temperature water outlet pipe 11; the second temperature sensor 321 is positioned close to the third temperature water outlet pipe 31.

[0092] For example, such as Figure 1As shown, the primary cooling tank 13 is equipped with a baffle plate 131, a water level probe 132, and a first temperature sensor 133. The baffle plate is located between the boiling water inlet pipe 4 and the first temperature outlet pipe 11. Its function is to buffer the boiling water when the water in the cooling tank 13 is used up to the middle water level, preventing the boiling water from directly passing through and rapidly heating the water on the right side of the cooling tank 13. The water level probe 132 is mainly used to control the water level in the cooling tank 13. The first water level probe 1321 is the middle water level probe 132, and the second water level probe 1322 is the high water level probe 132. When the water level in the cooling tank 13 exceeds the high water level, water replenishment stops, and when it is below the middle water level, water is replenished. This ensures that the water in the cooling tank 13 is always at or above the middle water level, thereby guaranteeing the water output.

[0093] The first temperature sensor 133 is positioned near the first temperature outlet water pipe 11. Its functions are twofold: first, to monitor the outlet water temperature; and second, to activate the first cooling fan 122 for air cooling when the detected water temperature exceeds the user-set first temperature, thereby accelerating the temperature drop of the water inside the cooling tank 13. The second temperature sensor 321 controls the cooling temperature of the cold tank 32. When the user-set third temperature is reached, it shuts off the semiconductor cooling function to save energy.

[0094] Optionally, the lengths of the first water level probe 1321 and the second water level probe 1322 can be determined according to actual needs or the height of the water tank.

[0095] This embodiment of the invention adds a baffle plate 131 to the left side of the cooling tank 13, which can effectively extend the time that hot water affects the water temperature on the right side of the cooling tank 13 after it enters. A water level probe 132 is included to control water replenishment, ensuring that the water in the hot water cooling tank 13 remains at a medium level. Furthermore, temperature sensors are installed in both the primary cooling device 1 and the tertiary cooling device 3 to accurately measure the outlet water temperature and control the on / off state of the heat dissipation devices, contributing to energy conservation and consumption reduction.

[0096] In some embodiments, the first temperature water outlet pipe 11 is provided with a first temperature water outlet valve 111 and a water pump 24; the second temperature water outlet pipe 21 is provided with a second temperature water outlet valve 211; the cold tank inlet pipe 34 is provided with a cold tank inlet valve 341; the third temperature water outlet pipe 31 is provided with a third temperature water outlet valve 311; and the boiling water inlet pipe 4 is provided with a boiling water inlet valve 41.

[0097] For example, such as Figure 1As shown, a first temperature water outlet valve 111 is installed on the first temperature water outlet pipe 11, specifically at the third end of the first temperature water outlet pipe 11, for the user to access water at the first temperature; a second temperature water outlet valve 211 is installed on the second temperature water outlet pipe 21, specifically at the third end of the second temperature water outlet pipe 21, for the user to access water at the second temperature; a cold tank inlet valve 341 is installed on the cold tank inlet pipe 34, for controlling whether water from the secondary cooling device 2 enters the tertiary cooling device 3; a third temperature water outlet valve 311 is installed on the third temperature water outlet pipe 31, for the user to access water at the third temperature; and a boiling water inlet valve 41 is installed on the boiling water inlet pipe 4, for controlling whether boiling water enters the primary cooling device 1.

[0098] Optionally, the first temperature outlet valve 111, the second temperature outlet valve 211, the cold tank inlet valve 341, the third temperature outlet valve 311, and the boiling water inlet valve 41 mentioned above can be solenoid valves for automated control.

[0099] This utility model is equipped with water outlet valves on each water outlet pipe, which makes it convenient for users to take the water from each level of cooling device and meet the user's needs for various temperature water from warm water to room temperature water to cold water.

[0100] In some embodiments, the intelligent control system 5 further includes an outlet water temperature control unit 52 and a water replenishment control unit;

[0101] The water replenishment control unit is electrically connected to the first water level probe 1321, the second water level probe 1322, the boiling water inlet valve 41, the first temperature outlet valve 111, the second temperature outlet valve 211, the water pump 24, the third temperature outlet valve 311, and the outlet temperature control unit 52, respectively.

[0102] The outlet water temperature control unit 52 is electrically connected to the outlet water temperature setting unit 51, the first temperature sensor 133, the first cooling fan 122, the water pump 24, the second cooling fan, the semiconductor cooling device 333, and the second temperature sensor 321, respectively.

[0103] For example, such as Figure 2 As shown, the intelligent hot water dispenser operates under the control of the intelligent control system 5, which enables the system to operate more intelligently. The outlet water temperature control unit 52 is electrically connected to the outlet water temperature setting unit 51, the first temperature sensor 133, the first cooling fan 122, the water pump 24, the second cooling fan, the semiconductor cooling device 333, and the second temperature sensor 321. Figure 3 As shown, the specific control method is as follows:

[0104] Cooling process of primary cooling device 1: When the intelligent control system 5 is turned on, boiling water generated by heating enters the cooling tank 13. At this time, the outlet water temperature control unit 52 determines whether the temperature obtained by the first temperature sensor 133 is greater than the user-set temperature value. The user-set temperature value is obtained by the outlet water temperature setting unit 51 and transmitted to the outlet water temperature control unit 52. If so, the first cooling fan 122 is turned on to start heat dissipation. Then, it is determined whether the temperature of the first temperature sensor 133 is equal to or less than the user-set temperature. If so, the first cooling fan 122 is turned off to complete the first stage of cooling.

[0105] Cooling process of secondary cooling device 2: When the intelligent control system 5 is turned on, if the user takes cold water or room temperature water, that is, if the user takes water at the second temperature or the third temperature, the small water pump 24 is turned on to flow the water in the cooling tank 13 through the copper coil 23. After the user stops taking water, the small water pump 24 is turned off to complete the second stage of cooling.

[0106] The cooling process of the three-stage cooling device 3: When the intelligent control system 5 is turned on, the user takes cold water, i.e., water at the third temperature. At this time, based on the outlet water temperature control unit 52, it judges whether the temperature obtained by the second temperature sensor 321 is greater than the user-set temperature value. If so, the semiconductor cooling is turned on. Then, it judges whether the temperature obtained by the second temperature sensor 321 is lower than the user-set temperature value. If so, the cooling is turned off. The third stage of cooling is completed.

[0107] The intelligent control system 5 also includes a water replenishment control unit, which is electrically connected to the first water level probe 1321, the second water level probe 1322, the boiling water inlet valve 41, the first temperature outlet valve 111, the second temperature outlet valve 211, the water pump 24, the third temperature outlet valve 311, and the outlet water temperature control unit 52. The specific water replenishment control logic is as follows:

[0108] Regarding the water replenishment logic for the cooling tank 13 of the primary cooling device 1 after the user takes water, since warm water, room temperature water, and cold water all use water from the cooling tank 13, taking warm water, room temperature water, or cold water will trigger the water replenishment logic. The control logic is as follows: Figure 4 As shown: When the user starts drawing room temperature or cold water, it checks whether the water level in the cooling tank 13 is below the middle water level. If it is below the middle water level, heating is activated to replenish boiling water into the hot water cooling tank 13. Simultaneously with water replenishment, the self-cooling logic is executed. When the water level reaches the high water level, water replenishment is complete and stops. The self-cooling logic refers to the cooling control logic of the three-stage cooling device 3 executed by the aforementioned outlet water temperature control unit 52.

[0109] It should be noted that, in this utility model specification, the hot water refers to the outlet water of the first-stage cooling device 1, that is, water at the first temperature; the room temperature water or warm water refers to the outlet water of the second-stage cooling device 2, that is, water at the second temperature; and the cold water refers to the outlet water of the third-stage cooling device 3, that is, water at the third temperature.

[0110] This utility model embodiment establishes the working control logic of each level of cooling device through the outlet water temperature control unit of the intelligent control system, and establishes the cooling tank water replenishment logic of the first-level cooling device through the water replenishment control unit, so that the intelligent boiled water machine realizes intelligent operation, can more accurately control the outlet water temperature of each level of cooling device of the boiled water machine, and improves the user experience.

[0111] The above description is only an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An intelligent cooked water machine, characterized by, The device comprises a first cooling device (1), a second cooling device (2), a third cooling device (3) and a boiling water inlet pipeline (4); The boiling water inlet pipeline (4) is communicated with the first cooling device (1); the first cooling device (1) is communicated with the second cooling device (2) through a first temperature water outlet pipeline (11); the second cooling device (2) is communicated with the third cooling device (3) through a second temperature water outlet pipeline (21); the third cooling device (3) is provided with a third temperature water outlet pipeline (31). The temperature of water in the boiling water inlet pipeline (4) is higher than that of water in the first temperature water outlet pipeline (11), the temperature of water in the first temperature water outlet pipeline (11) is higher than that of water in the second temperature water outlet pipeline (21), and the temperature of water in the second temperature water outlet pipeline (21) is higher than that of water in the third temperature water outlet pipeline (31).

2. The intelligent cooked water machine of claim 1, wherein, The intelligent hot water machine further comprises an intelligent control system (5); the intelligent control system (5) is electrically connected with the first cooling device (1), the second cooling device (2) and the third cooling device (3) respectively. The intelligent control system (5) comprises a water temperature setting unit (51); the water temperature setting unit (51) is electrically connected with the first cooling device (1), the second cooling device (2) and the third cooling device (3) respectively.

3. The intelligent retort of claim 2, wherein, The first cooling device (1) comprises a first heat dissipation device (12) and a cooling box (13). The boiling water inlet pipeline (4) and the first temperature water outlet pipeline (11) are communicated with the cooling box (13), and the first temperature water outlet pipeline (11) is arranged at a position away from the boiling water inlet pipeline (4). The first heat dissipation device (12) is arranged on a side surface of the cooling box (13) and close to the boiling water inlet pipeline (4).

4. The intelligent retort of claim 3, wherein, The first heat dissipation device (12) comprises a first radiator (121) and a first heat dissipation fan (122). The first radiator (121) is arranged on a side surface of the cooling box (13), and the first heat dissipation fan (122) is arranged on a surface of the first radiator (121).

5. The intelligent retort of claim 4, wherein, The second cooling device (2) comprises a radiator (22) and a copper coil pipe (23); the copper coil pipe (23) is embedded in the radiator (22); One end of the copper coil pipe (23) is communicated with the cooling box (13) through the first temperature water outlet pipeline (11), and the other end is communicated with the third cooling device (3).

6. The intelligent retort of claim 5, wherein, The third cooling device (3) comprises a cold water tank (32), a third heat dissipation device (33) and a cold water inlet pipeline (34). The third temperature water outlet pipeline (31) is communicated with the cold water tank (32). The cold water tank (32) is communicated with the second temperature water outlet pipeline (21) through the cold water inlet pipeline (34), and the second temperature water outlet pipeline (21) is communicated with the copper coil pipe (23); The third heat dissipation device (33) is arranged on a side surface of the cold water tank (32).

7. The intelligent retort of claim 6, wherein, The third heat dissipation device (33) comprises a second heat sink (331), a second heat dissipation fan (332) and a semiconductor refrigeration device (333); The semiconductor refrigeration device (333) comprises a refrigeration surface and a heat dissipation surface, the refrigeration surface and the heat dissipation surface are oppositely arranged, the semiconductor refrigeration device (333) is arranged on one side surface of the cold tank water tank (32), and the refrigeration surface is arranged close to one side of the cold tank water tank (32); The second heat sink (331) is arranged on the surface of the semiconductor refrigeration device (333), and the second heat dissipation fan (332) is arranged on the surface of the second heat sink (331).

8. The intelligent boiler as claimed in claim 7, wherein, The cooling box (13) is provided with a water baffle (131), a water level probe (132) and a first temperature sensor (133); and the cold tank water tank (32) is provided with a second temperature sensor (321); The water baffle (131) is arranged in the cooling box (13) and between the boiling water inlet pipeline (4) and the first temperature outlet pipeline (11), and the height of the water baffle (131) is less than the height of the cooling box (13); The water level probe (132) is hung on the upper surface of the cooling box (13); the water level probe (132) comprises a first water level probe (1321) and a second water level probe (1322), and the length of the first water level probe (1321) is less than the length of the second water level probe (1322); The first temperature sensor (133) is arranged close to the first temperature outlet pipeline (11); and the second temperature sensor (321) is arranged close to the third temperature outlet pipeline (31).

9. The intelligent boiler of claim 8, wherein, The first temperature outlet pipeline (11) is provided with a first temperature outlet valve (111) and a water pump (24); the second temperature outlet pipeline (21) is provided with a second temperature outlet valve (211); the cold tank water inlet pipeline (34) is provided with a cold tank water inlet valve (341); the third temperature outlet pipeline (31) is provided with a third temperature outlet valve (311); and the boiling water inlet pipeline (4) is provided with a boiling water inlet valve (41).

10. The intelligent retort of claim 9, wherein, The intelligent control system (5) further comprises a water outlet temperature control unit (52) and a water replenishment control unit (53); The water replenishment control unit (53) is electrically connected with the first water level probe (1321), the second water level probe (1322), the boiling water inlet valve (41), the first temperature outlet valve (111), the second temperature outlet valve (211), the water pump (24), the third temperature outlet valve (311), the water outlet temperature control unit (52) and the second temperature sensor (321) respectively; The water outlet temperature control unit (52) is electrically connected with the water outlet temperature setting unit (51), the first temperature sensor (133), the first heat dissipation fan (122), the water pump (24), the second heat dissipation fan (332), the semiconductor refrigeration device (333), the second temperature sensor (321) and the third temperature outlet valve (311) respectively.

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