Gluing equipment for chip processing

Abstract

The utility model discloses gluing equipment for chip processing, which belongs to the technical field of chip processing and comprises a bottom plate, the upper surface of the bottom plate is fixedly connected with a first cylinder, the inner side surface of the first cylinder is fixedly provided with a damping sleeve, the inner side surface of the damping sleeve is rotatably connected with a round rod, and the bottom surface of a V-shaped plate is fixedly connected with a second cylinder. The top end of the round rod is fixedly installed in the second cylinder, a drying mechanism is arranged on the left side of the V-shaped plate, a dispensing mechanism is arranged on the right side of the V-shaped plate, and through the arrangement of the drying mechanism, specifically, a ventilation installation hole and a fan are arranged on the left side of the V-shaped plate, and a heating wire is installed in the ventilation installation hole, rapid drying after chip gluing is achieved; according to the design, the glue curing time is remarkably shortened, so that the production efficiency is improved, meanwhile, by arranging a V-shaped plate, a first handle and a second handle, an operator can conveniently adjust the positions of the drying mechanism and the glue dispensing mechanism, and the equipment is easy and convenient to operate and high in flexibility.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a coating equipment for chip processing. Background Technology

[0002] A chip, also known as a microcircuit, microchip, or integrated circuit, is a silicon wafer containing integrated circuits. Due to its small size, it is often used as a key component in computers or other electronic devices. In the semiconductor industry, chip processing is a crucial production process, and the application of adhesive (or dispensing) is an indispensable step.

[0003] In the prior art, such as the adhesive application equipment for chip processing described in application number 202220013082.3, adhesive application has been achieved to a certain extent in the chip processing process. This equipment includes multiple components such as a first frame, a second frame, an adhesive suction cylinder, and an adhesive dispensing cylinder. Through a series of mechanical and electrical controls, it achieves precise adhesive application to the chips to be processed. However, although this equipment improves the bonding strength while protecting the chips from damage, thereby enhancing the reliability of chip processing, some shortcomings still exist.

[0004] Specifically, the curing method used by the aforementioned equipment after applying adhesive to the chips requires a relatively long time, which significantly reduces production efficiency. In the fast-paced, high-efficiency modern production environment, such a deficiency is clearly unacceptable. Therefore, how to shorten the curing time after adhesive application and improve production efficiency has become an urgent problem to be solved. Utility Model Content

[0005] The purpose of this invention is to solve the problems of long curing time and low production efficiency after chip coating in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A chip processing adhesive application device includes a base plate. A first cylinder is fixedly connected to the upper surface of the base plate. A damping sleeve is fixedly installed on the inner side of the first cylinder. A round rod is rotatably connected to the inner side of the damping sleeve. A V-shaped plate is provided at the top end of the round rod. A second cylinder is fixedly connected to the bottom surface of the V-shaped plate. The top end of the round rod is fixedly installed inside the second cylinder. A drying mechanism is provided on the left side of the V-shaped plate, and an adhesive application mechanism is provided on the right side of the V-shaped plate.

[0008] Preferably, the drying mechanism includes a ventilation mounting hole and a fan. The fan is fixedly mounted on the upper left side surface of the V-shaped plate, and the ventilation mounting hole is opened inside the left side of the V-shaped plate. A heating wire is fixedly installed inside the ventilation mounting hole.

[0009] Preferably, the glue dispensing mechanism comprises a glue box and a support, the support is fixedly connected to the right bottom surface of the V-shaped plate, the glue box is fixedly connected to the right upper surface of the V-shaped plate, the upper surface of the glue box is fixedly communicated with a glue adding pipe, the top end of the glue adding pipe is covered with a cover, and the inner bottom wall of the glue box is fixedly installed with a glue pump.

[0010] Preferably, the output end of the glue pump is fixedly communicated with a connecting glue pipe, the connecting glue pipe is fixedly connected to the inside of the glue box, the bottom end of the connecting glue pipe is fixedly communicated with a spring glue pipe, the bottom end of the spring glue pipe is fixedly communicated with an electric glue gun, and the electric glue gun is placed on the support.

[0011] Preferably, the left surface of the V-shaped plate is fixedly connected with a first handle, and the right surface of the V-shaped plate is fixedly connected with a second handle.

[0012] Preferably, the upper surface of the bottom plate is fixedly connected with a placing seat, the bottom surface of the bottom plate is fixedly connected with a threaded cylinder, the inside of the threaded cylinder is threadedly connected with a threaded rod, the bottom surface of the threaded rod is fixedly connected with a supporting leg, and the bottom surface of the supporting leg is fixedly installed with a rubber pad.

[0013] Compared with the prior art, the chip processing glue applying equipment has the following beneficial effects.

[0014] 1、The drying mechanism is arranged, specifically, the air permeation mounting hole and the fan are arranged on the left side of the V-shaped plate, and the heating wire is arranged in the air permeation mounting hole, so that the rapid drying of the glued chip is realized, the glue curing time is significantly shortened, and the production efficiency is improved.

[0015] 2、The reasonable structure design is adopted, for example, the damping sleeve is connected with the round rod to realize the stable rotation, the V-shaped plate, the first handle and the second handle are arranged to facilitate the adjustment of the positions of the drying mechanism and the glue dispensing mechanism by the operating personnel, the equipment operation is simple and flexible, in addition, the supporting leg with adjustable height and the rubber pad with increased friction are arranged on the equipment, and the stability of the equipment on the workbench is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a perspective front view structural schematic diagram of the utility model.

[0017] Figure 2 It is a perspective rear side view structural schematic diagram of the utility model.

[0018] Figure 3 It is a perspective rear side view structural schematic diagram of the utility model. Figure 2 It is an enlarged schematic diagram of A in the utility model.

[0019] Figure 4The utility model discloses a V-shaped plate and its upper setting drying mechanism, point gum mechanism three-dimensional structure schematic view.

[0020] Figure 5 The utility model discloses Figure 4 The enlarged schematic view of B in the middle.

[0021] In the drawing,

[0022] 1, bottom plate, 2, first cylinder, 3, damping sleeve, 4, round rod, 5, second cylinder, 6, V-shaped plate, 7, drying mechanism, 701, air -permeable mounting hole, 702, heating wire, 703, fan, 8, point gum mechanism, 801, glue box, 802, glue pipe, 803, lid, 804, glue pump, 805, connecting glue pipe, 806, spring glue pipe, 807, electric glue gun, 808, support, 9, first handle, 10, second handle, 11, placing seat, 12, threaded cylinder, 13, threaded rod, 14, support foot, 15, rubber pad, 16, screw. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0024] Referring to Figures 1-5 A glue applying equipment for chip processing, including bottom plate 1, the upper surface of bottom plate 1 is fixedly connected with first cylinder 2, the inner side of first cylinder 2 is fixedly installed with damping sleeve 3, the inner side of damping sleeve 3 is rotatably connected with round rod 4, the top of round rod 4 is provided with V-shaped plate 6, the bottom of V-shaped plate 6 is fixedly connected with second cylinder 5, the top of round rod 4 is fixedly installed in the inside of second cylinder 5 by screw 16, the left side of V-shaped plate 6 is provided with drying mechanism 7, and the right side of V-shaped plate 6 is provided with point gum mechanism 8.

[0025] Drying mechanism 7 includes air -permeable mounting hole 701 and fan 703, and fan 703 is fixedly installed on the left upper surface of V-shaped plate 6, air -permeable mounting hole 701 is opened in the left inside of V-shaped plate 6, and heating wire 702 is fixedly installed in the inside of air -permeable mounting hole 701.

[0026] Point gum mechanism 8 includes glue box 801 and support 808, support 808 is fixedly connected to the right bottom of V-shaped plate 6, glue box 801 is fixedly connected to the right upper surface of V-shaped plate 6, and the upper surface of glue box 801 is fixedly connected with glue pipe 802, the top of glue pipe 802 is covered with lid 803, and glue pump 804 is fixedly installed on the inner bottom wall of glue box 801.

[0027] The output end of the glue pump 804 is fixedly connected with a connecting rubber tube 805, the connecting rubber tube 805 is fixedly connected with the inside of the glue box 801, the bottom end outer surface of the connecting rubber tube 805 is fixedly connected with a spring rubber tube 806, and the bottom end of the spring rubber tube 806 is fixedly connected with an electric glue gun 807, and the electric glue gun 807 is placed on a support 808.

[0028] A circular hole is formed in the right side of the V-shaped plate 6, and the size of the circular hole is larger than that of the connecting rubber tube 805, so that the connecting rubber tube 805 can pass out of the outside of the circular hole.

[0029] The left side of the V-shaped plate 6 is fixedly connected with a first handle 9, and the right side of the V-shaped plate 6 is fixedly connected with a second handle 10.

[0030] The upper surface of the bottom plate 1 is fixedly connected with a placing seat 11, the bottom surface of the bottom plate 1 is fixedly connected with a threaded cylinder 12, the inside of the threaded cylinder 12 is screwedly connected with a threaded rod 13, the bottom surface of the threaded rod 13 is fixedly connected with a supporting leg 14, and the bottom surface of the supporting leg 14 is fixedly installed with a rubber pad 15.

[0031] The threaded cylinder 12, the threaded rod 13, the supporting leg 14 and the rubber pad 15 are all provided with four, and are all arranged at the four corners of the bottom surface of the bottom plate 1.

[0032] Referring to Figure 1 and Figure 4 In some actual applications, in order to realize rapid drying of the chip, a drying mechanism 7 is arranged on the left side of the V-shaped plate 6, the drying mechanism 7 comprises a ventilation mounting hole 701 formed in the inside of the left side of the V-shaped plate 6, and a heating wire 702 is mounted in the inside of the ventilation mounting hole 701 and used for generating heat. Meanwhile, a fan 703 is fixedly installed on the upper surface of the left side of the V-shaped plate 6 and used for blowing the heated air to the chip uniformly, so that rapid drying is realized.

[0033] Referring to Figure 1 , Figure 4 , Figure 5 In some actual applications, in order to realize precise glue dispensing, a glue dispensing mechanism 8 is arranged on the right side of the V-shaped plate 6, the glue dispensing mechanism 8 comprises a glue box 801 fixedly installed on the upper surface of the right side of the V-shaped plate 6, and glue is contained in the inside of the glue box 801. A glue adding tube 802 is arranged on the upper surface of the glue box 801 and used for adding glue into the glue box 801, a cover 803 is arranged on the top end of the glue adding tube 802 and used for preventing the glue from volatilizing. A glue pump 804 is mounted on the inner bottom wall of the glue box 801 and used for pumping the glue out of the glue box 801. The output end of the glue pump 804 is connected with a connecting rubber tube 805, the bottom end outer surface of the connecting rubber tube 805 is connected with a spring rubber tube 806, and the bottom end of the spring rubber tube 806 is connected with an electric glue gun 807 and used for dispensing glue on the chip.

[0034] Referring toFigure 1 In some practical applications, the left side and the right side of the V-shaped plate 6 are respectively fixedly connected with a first handle 9 and a second handle 10, and an operator can conveniently rotate the V-shaped plate 6 by holding the two handles, so as to adjust the positions of the glue dispensing mechanism 8 and the drying mechanism 7.

[0035] With reference to Figure 1 In some practical applications, the upper surface of the bottom plate 1 is further fixedly connected with a placing seat 11 for stably placing the chip to be processed. Meanwhile, the bottom surface of the bottom plate 1 is fixedly connected with a threaded cylinder 12 at each corner, the threaded cylinder 12 is internally threadedly connected with a threaded rod 13, the bottom surface of the threaded rod 13 is fixedly connected with a supporting leg 14, and the bottom surface of the supporting leg 14 is fixedly installed with a rubber pad 15. By rotating the threaded rod 13, the height of the supporting leg 14 can be adjusted, so that the device is stably placed on the workbench surface. The rubber pad 15 can increase the friction force with the workbench surface to prevent the device from sliding.

[0036] The working principle of the glue applying device for chip processing is as follows:

[0037] In use of the glue applying device for chip processing, first, the height of the supporting leg 14 is adjusted by rotating the threaded rod 13, so that the device is stably placed on the workbench surface. The rubber pad 15 can increase the friction force with the workbench surface to prevent the device from sliding. Then, the chip to be glued is placed on the placing seat 11. By operating the first handle 9 and the second handle 10, the V-shaped plate 6 can be conveniently rotated, so as to adjust the positions of the glue dispensing mechanism 8 and the drying mechanism 7. In the glue dispensing operation, first, an appropriate amount of glue is added into the glue box 801 through the glue adding pipe 802, and the lid 803 is covered to prevent the glue from volatilizing. The glue pump 804 is started, and the glue is delivered to the electric glue gun 807 through the connecting glue pipe 805 and the spring glue pipe 806. An operator can hold the electric glue gun 807 or place it on the support 808 to accurately glue the chip. After the glue dispensing is completed, the position of the drying mechanism 7 is adjusted by holding the first handle 9 and rotating it to the right, so that the drying mechanism 7 is located above the chip. The fan 703 is started, and the heating wire 702 starts heating. Hot air is uniformly blown out through the air-permeable mounting hole 701 to quickly dry the glue on the chip, thereby greatly shortening the curing time. Through the above steps, the glue applying device for chip processing can realize efficient and accurate glue applying of the chip and complete the curing of the glue in a short time, thereby significantly improving the production efficiency. In addition, the structure of the glue applying device for chip processing is reasonable and easy to operate, which is not only suitable for large-scale production lines but also suitable for small laboratories or research and development environments, and has wide practicability and market prospect. In summary, the glue applying device for chip processing optimizes the glue dispensing and drying processes, solves the problems of long curing time and low production efficiency of the chip after glue applying in the prior art, and provides an efficient and reliable glue applying device solution for the chip processing industry.

[0038] The above merely describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An adhesive applying apparatus for chip processing, comprising a base plate (1), characterized in that, The upper surface of the bottom plate (1) is fixedly connected with a first cylinder (2), the inner side of the first cylinder (2) is fixedly installed with a damping sleeve (3), the inner side of the damping sleeve (3) is rotatably connected with a round rod (4), the top end of the round rod (4) is provided with a V-shaped plate (6), the bottom surface of the V-shaped plate (6) is fixedly connected with a second cylinder (5), the top end of the round rod (4) is fixedly installed in the second cylinder (5), the left side of the V-shaped plate (6) is provided with a drying mechanism (7), and the right side of the V-shaped plate (6) is provided with a point gluing mechanism (8).

2. The gumming apparatus for chip processing according to claim 1, wherein The drying mechanism (7) comprises a ventilation mounting hole (701) and a fan (703), the fan (703) is fixedly installed on the left upper surface of the V-shaped plate (6), the ventilation mounting hole (701) is opened in the left inner side of the V-shaped plate (6), and the inside of the ventilation mounting hole (701) is fixedly installed with a heating wire (702).

3. The device for applying adhesive to a chip for processing according to claim 1, wherein The point gluing mechanism (8) comprises a glue box (801) and a support (808), the support (808) is fixedly connected to the right bottom surface of the V-shaped plate (6), the glue box (801) is fixedly connected to the right upper surface of the V-shaped plate (6), the upper surface of the glue box (801) is fixedly communicated with a glue adding pipe (802), the top end of the glue adding pipe (802) is covered with a cover (803), and the inner bottom wall of the glue box (801) is fixedly installed with a glue pump (804).

4. The device for applying adhesive to a chip for processing according to claim 3, wherein The output end of the glue pump (804) is fixedly communicated with a connecting glue pipe (805), the connecting glue pipe (805) is fixedly connected with the inside of the glue box (801), the bottom end outer surface of the connecting glue pipe (805) is fixedly communicated with a spring glue pipe (806), the bottom end of the spring glue pipe (806) is fixedly communicated with an electric glue gun (807), and the electric glue gun (807) is placed on the support (808).

5. The device for applying adhesive to a chip as recited in claim 1, wherein The left side surface of the V-shaped plate (6) is fixedly connected with a first handle (9), and the right side surface of the V-shaped plate (6) is fixedly connected with a second handle (10).

6. The device for applying adhesive to a chip for processing according to claim 1, wherein The upper surface of the bottom plate (1) is fixedly connected with a placing seat (11), the bottom surface of the bottom plate (1) is fixedly connected with a threaded cylinder (12), the inside of the threaded cylinder (12) is threadedly connected with a threaded rod (13), the bottom surface of the threaded rod (13) is fixedly connected with a supporting leg (14), and the bottom surface of the supporting leg (14) is fixedly installed with a rubber pad (15).

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