Addition type pressure-sensitive adhesive curing device

Abstract

The utility model discloses an addition type pressure-sensitive adhesive curing device which comprises a bottom plate and four pressing structures, an original film base material is placed on the bottom plate, the four pressing structures are symmetrically arranged on the two sides of the bottom plate and used for pressing the original film base material, and the addition type pressure-sensitive adhesive curing device further comprises a preparation device. The preparation device comprises a handle and a scraping plate fixedly mounted at the lower end of the handle, a PSA glue solution is placed on the original film base material, and the scraping plate of the preparation device scrapes the PSA glue solution to be flat. The addition type pressure-sensitive adhesive curing device has the advantages of being convenient to take and use, capable of avoiding wrinkling and shrinking of the base material and easy to operate.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of addition type pressure sensitive adhesive curing technology, in particular to an addition type pressure sensitive adhesive curing device. BACKGROUND

[0002] Because the thin substrate is not flat enough when coating, it is easy to make the film surface uneven when coating by hand, resulting in uneven coating; at the same time, when placed in a vacuum oven for high-temperature baking and curing, the thin substrate is easy to shrink under high-temperature conditions, resulting in wrinkles, and the film surface is easy to stick together, resulting in unqualified test products, so a curing device needs to be designed to enable the thin substrate to be evenly spread on the device, and the film is evenly coated and tested, and the film can be stably placed in the oven for high-temperature curing. The baked film is easy to use and not prone to sticking and wrinkling. SUMMARY

[0003] In view of the above-mentioned deficiencies of the prior art, the technical problem to be solved by the present patent application is to provide an addition type pressure sensitive adhesive curing device which is easy to use, avoids substrate shrinkage and wrinkles, and is simple to operate.

[0004] To solve the above technical problems, the utility model adopts the following technical scheme:

[0005] An addition type pressure sensitive adhesive curing device, comprising a bottom plate and a pressing structure, the bottom plate is placed with a raw film substrate, the pressing structure is provided with four, four pressing structures are symmetrically arranged on both sides of the bottom plate and are used for pressing the raw film substrate, further comprising a preparation device, the preparation device comprises a handle and a scraper fixedly installed at the lower end of the handle, the raw film substrate is placed with PSA glue liquid, and the scraper of the preparation device is used for scraping the PSA glue liquid.

[0006] In this way, the raw film substrate is cut into a strip shape and placed on the bottom plate, the raw film substrate is pressed on the bottom plate by the four pressing structures, the preparation device is placed on the raw film substrate, the PSA glue liquid is poured on the raw film substrate, the preparation device is slowly pulled, the handle is held, the PSA glue liquid is evenly and smoothly coated on the raw film substrate by the scraper, the preparation device is taken out, the entire curing device is placed in an oven for baking and curing, and then taken out after the end. Then, open the four pressing structures to take out the film for mechanical property testing.

[0007] The pressing structure comprises two fixed seats fixedly installed on the bottom plate, the fixed seats are rotatably installed with shaft pins, the two shaft pins are rotatably installed with pressing frames, the pressing frames are installed with magnets, the bottom plate is made of ferromagnetic metal, and the magnets are attracted to the bottom plate to press the raw film substrate between the magnets and the bottom plate.

[0008] The containing groove is arranged on the pressing frame, and the magnet is arranged in the containing groove.

[0009] The magnet is a neodymium-iron-boron magnet strip.

[0010] The two ends of the magnet pressing cover are connected with the pressing frame through screws.

[0011] In summary, the addition type pressure sensitive adhesive curing device has the advantages of convenient access, avoiding substrate wrinkles and shrinkage, and simple operation. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 The addition type pressure sensitive adhesive curing device is shown in the structure diagram.

[0013] Figure 2 The addition type pressure sensitive adhesive curing device is shown in the structure diagram. Figure 1 The addition type pressure sensitive adhesive curing device is shown in the structure diagram. The addition type pressure sensitive adhesive curing device is shown in the structure diagram.

[0014] The addition type pressure sensitive adhesive curing device is shown in the structure diagram. Figure 3 The addition type pressure sensitive adhesive curing device is shown in the structure diagram. Figure 1 The addition type pressure sensitive adhesive curing device is shown in the structure diagram. DETAILED DESCRIPTION

[0015] The addition type pressure sensitive adhesive curing device is shown in the structure diagram.

[0016] As shown in the drawings, an addition type pressure sensitive adhesive curing device comprises a bottom plate 1 and a pressing structure, the original film substrate 2 is arranged on the bottom plate, the pressing structure is provided with four, the four pressing structures are symmetrically arranged on both sides of the bottom plate and used for pressing the original film substrate, further comprising a preparation device 3, the preparation device comprises a handle 4 and a scraper 5 fixedly installed at the lower end of the handle, the PSA glue liquid 6 is arranged on the original film substrate, and the scraper of the preparation device is used for scraping the PSA glue liquid. Figures 1-3

[0017] In this way, the original film substrate is cut into a strip and placed on the base plate, the original film substrate is pressed on the base plate by the four pressing structures, the preparation device is placed on the original film substrate, the PSA glue liquid is poured on the original film substrate, the preparation device is slowly pulled, the handle is held, the PSA glue liquid is evenly and smoothly coated on the original film substrate by the scraper, the preparation device is taken out, the entire curing device is placed in the oven for baking and curing, and then taken out. After that, the four pressing structures are opened, the film is taken out, and the mechanical property test is carried out.

[0018] In the implementation, the pressing structure comprises two fixed seats 7 fixedly installed on the base plate, shaft pins are rotatably installed on the fixed seats, two shaft pins are rotatably installed with pressing frames 8, magnets are installed on the pressing frames, the base plate is made of ferromagnetic metal, and the magnets are attracted to the base plate to press the original film substrate between the magnets and the base plate. By arranging the fixed seat and the pin shaft, the pressing frame can rotate, and when the original film substrate is pressed, the pressing frame is rotated above the original film substrate, the magnet is attracted to the base plate, and the pressing of the original film substrate is realized.

[0019] Specifically, the base is made of an iron plate.

[0020] In the implementation, the pressing frame is provided with a containing groove, the magnet is placed in the containing groove, and a magnet pressing cover 9 is fixedly installed on the pressing frame opposite to the containing groove. The magnet is convenient to install and avoids being separated from the pressing frame.

[0021] In the implementation, the magnet is a neodymium iron boron magnet strip. It is convenient to use.

[0022] In the implementation, the two ends of the magnet pressing cover are connected with the pressing frame by screws 10. It is convenient to install.

[0023] Finally, it should be noted that those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and the statistical number thereof, the present application also intends to include these modifications and variations.

Claims

1. An addition type pressure sensitive adhesive curing device characterized by comprising: The application relates to a device for preparing a film base material, which comprises a bottom plate (1) and four pressing structures, the film base material (2) is placed on the bottom plate, the four pressing structures are symmetrically arranged on the two sides of the bottom plate and used for pressing the film base material, and a preparer (3) is arranged on the bottom plate, the preparer comprises a handle (4) and a scraper (5) fixedly arranged at the lower end of the handle, PSA glue (6) is placed on the film base material, and the scraper of the preparer is used for scraping the PSA glue.

2. The addition type pressure sensitive adhesive curing device according to claim 1, wherein The pressing structure comprises two fixed seats (7) fixedly arranged on the bottom plate, shaft pins rotatably arranged on the fixed seats, and pressing frames (8) rotatably arranged on the shaft pins, magnets are arranged on the pressing frames, the bottom plate is made of ferromagnetic metal, the magnets are attracted to the bottom plate so as to press the film base material between the magnets and the bottom plate.

3. The addition-type pressure-sensitive adhesive curing apparatus according to claim 2, wherein The pressing frame is provided with a containing groove, the magnet is arranged in the containing groove, and a magnet pressing cover (9) is fixedly arranged on the pressing frame and opposite to the containing groove.

4. The addition-type pressure-sensitive adhesive curing apparatus according to claim 3, wherein The magnet is a neodymium iron boron magnet strip.

5. The addition-type pressure-sensitive adhesive curing apparatus according to claim 4, wherein The two ends of the magnet pressing cover are connected with the pressing frame through screws (10).

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