Tin immersion mechanism with dual functions

Abstract

The utility model discloses a dual-function tin immersion mechanism which comprises a rack, a collecting device and a tin liquid bin, a clamping device used for clamping a workpiece to be subjected to tin immersion is arranged on the rack in a sliding mode, a driving device is connected to the clamping device, and a flow guide structure is arranged between the tin liquid bin and the collecting device. And the flow guide structure is used for receiving the tin liquid falling from the tin immersion workpiece and guiding the tin liquid into the tin liquid bin. In order to prevent the tin liquid on the tin immersion element from dripping onto the rack, the flow guide structure is arranged between the collecting device and the tin liquid bin, in the moving process of the workpiece subjected to tin immersion, the falling tin liquid firstly drips into the flow guide structure, then the flow guide structure guides the tin liquid into the tin liquid bin, and therefore the tin liquid can be prevented from dripping onto the rack through the design; and the cleaning difficulty is reduced, and the device can be recycled and has the advantage of dual functions.

Description

Technical Field

[0001] This utility model particularly relates to a tin-dipping mechanism with dual functions. Background Technology

[0002] Existing tin-dipping mechanisms include a frame with a clamping device on the frame for holding components to be tinned. Below the frame is a molten solder tank for holding molten solder. A drive device is connected to the clamping device to move the clamping device to the molten solder tank for tinning, and then transfer it to a collection device. Since molten solder has a certain fluidity, during the process of transferring it to the collection device after tinning, some molten solder will fall onto the ground or the frame, causing waste of molten solder and making cleaning very troublesome. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a tin-dipping mechanism with dual functions.

[0004] To solve the aforementioned technical problems, this utility model adopts the following technical solution:

[0005] A dual-function tin-dipping mechanism includes a frame, a collection device, and a tin bath. A clamping device for holding a workpiece to be tinned is slidably mounted on the frame. A driving device is connected to the clamping device. A flow guiding structure is provided between the tin bath and the collection device. The flow guiding structure is used to receive the tin liquid that falls from the tin-dipping workpiece and guide the tin liquid into the tin bath.

[0006] Preferably, the flow guiding structure includes a flow guiding plate, one end of which is connected to the collecting device and the other end is connected to the molten tin tank. The flow guiding plate extends downward from the collecting device to the molten tin tank. Baffles are respectively provided on both sides of the flow guiding plate. The baffles and the flow guiding plate together form a channel for guiding the molten tin to the molten tin tank.

[0007] Preferably, the driving device includes a guide rod arranged in the horizontal direction of the frame, a mounting base slidably disposed on the guide rod, a horizontal conveying structure for driving the mounting base to move in the horizontal direction connected to the frame, a clamping device slidably disposed on the mounting base, and a vertical conveying structure for driving the clamping device to move up and down on the mounting base.

[0008] Preferably, the clamping device includes a base plate connected to the mounting base, and the base plate has a limiting groove for limiting the component to be immersed in tin.

[0009] Preferably, the collecting device includes a bracket, on which a fixing plate is provided, and the fixing plate has a groove along its length for placing tin-immersed components.

[0010] Preferably, the vertical conveying structure is a telescopic cylinder.

[0011] The beneficial effects of this utility model are:

[0012] To prevent molten solder from dripping onto the rack, this application incorporates a flow guiding structure between the collection device and the molten solder tank. When the workpiece is moving after tinning, any falling molten solder will first drip into the flow guiding structure, which then directs the molten solder into the molten solder tank. This design prevents molten solder from dripping onto the rack, reduces cleaning difficulty, and allows for recycling, offering the advantage of dual functionality. Attached Figure Description

[0013] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0014] Figure 1 This is a schematic diagram of a dual-function tin-dipping mechanism according to this application;

[0015] Figure 2 For the purposes of this application Figure 1 A magnified view of part A in the image. Detailed Implementation

[0016] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0017] The orientation shown in the accompanying drawings should not be construed as limiting the specific protection scope of this utility model, but is only for reference and understanding of preferred embodiments. The product components shown in the drawings can be changed in position, increased in number, or simplified in structure.

[0018] The “connection” described in the specification and the “connection” relationship between the components shown in the accompanying drawings can be understood as a fixed connection, a detachable connection, or a connection that forms an integral unit; it can be a direct connection or a connection through an intermediate medium. Those skilled in the art can understand the connection relationship according to the specific circumstances and can derive different implementation methods such as screwing, riveting, welding, snap-fitting, or embedding to suitably replace the connection.

[0019] The directional terms such as up, down, left, right, top, and bottom mentioned in the instruction manual and the directions shown in the attached drawings indicate that the components can directly contact each other or contact each other through other features; for example, "up" can mean directly above or diagonally above, or it simply means above other objects; other directions can be understood by analogy.

[0020] The materials used to manufacture solid-shaped parts as shown in the specification and drawings may be metallic, non-metallic, or other synthetic materials. The machining processes used for solid-shaped parts may include stamping, forging, casting, wire cutting, laser cutting, injection molding, CNC milling, 3D printing, machining, etc. Those skilled in the art may adapt or combine the above materials and manufacturing processes according to different processing conditions, costs, and precision requirements.

[0021] A dual-function tin-dipping mechanism, as described above. Figures 1-2 The device includes a frame 1, a collection device, and a molten tin tank 2. A clamping device for holding a workpiece 3 to be immersed in tin is slidably mounted on the frame 1. A driving device is connected to the clamping device. A flow guiding structure is provided between the molten tin tank 2 and the collection device. The flow guiding structure is used to receive the molten tin that falls from the workpiece 3 and guide the molten tin into the molten tin tank 2.

[0022] Furthermore, the flow guiding structure includes a flow guiding plate 41, one end of which is connected to the collecting device and the other end is connected to the molten tin tank 2. The flow guiding plate 41 extends downward from the collecting device to the molten tin tank 2. Baffles 42 are respectively provided on both sides of the flow guiding plate 41. The baffles 42 and the flow guiding plate 41 together form a channel for guiding the molten tin to the molten tin tank 2.

[0023] Furthermore, the driving device includes a guide rod 51 arranged in the horizontal direction of the frame 1, a mounting base 52 slidably arranged on the guide rod 51, a horizontal conveying structure 53 for driving the mounting base 52 to move in the horizontal direction connected to the frame 1, a clamping device slidably arranged on the mounting base 52, and a vertical conveying structure 54 for driving the clamping device to move up and down on the mounting base 52.

[0024] Furthermore, the clamping device includes a base plate 61 connected to the mounting base 52, and the base plate 61 has a limiting groove for limiting the component to be immersed in tin.

[0025] Furthermore, the collecting device includes a bracket 71, on which a fixing plate 72 is provided, and the fixing plate 72 has a groove 73 for placing tin-immersed components along its length.

[0026] Furthermore, the vertical conveying structure 54 is a telescopic cylinder.

[0027] The working principle of this utility model is as follows:

[0028] Before tinning, the workpiece to be tinned is clamped and positioned on the clamping device. The horizontal conveying structure 53 is activated, which moves the mounting base 52 horizontally. When the clamping device on the mounting base 52 is directly above the tin bath 2, the horizontal conveying structure 53 stops conveying the mounting base 52. At this time, the vertical conveying structure 54 is activated, which moves the mounting base 52 downward, thereby moving the clamping device on the mounting base 52 downward so that the workpiece to be tinned on the clamping device is immersed in the tin bath 2 for tinning. After the tinning is completed, the vertical conveying structure 54 is activated, which moves the mounting base 52 upward, thereby removing the tinned workpiece from the tin bath 2. Then, the vertical conveying structure 54 stops moving, and the horizontal conveying structure 53 is activated, which moves the mounting base 52 horizontally. When the clamping device is above the collecting device, the tinned workpiece is placed on the collecting device. The horizontal conveying structure 53 described above can be driven by a telescopic cylinder or belt conveyor to move the mounting base 52 horizontally. To enable the mounting base 52 to move to a designated position, this application provides a guide rod 51 on the frame 1 that slides with the mounting base 52. That is, under the drive of the horizontal conveying structure 53, the mounting base 52 moves along the guide rod 51, and the guide rod 51 limits the movement trajectory of the mounting base 52. This application provides a flow guiding structure between the collecting device and the molten solder tank 2. The flow guiding structure can be configured as a combination of a flow guide plate 41 and a baffle 42. One end of the flow guide plate 41 is connected to the collecting device, and the other end is connected to the molten solder tank 2. The flow guide plate 41 extends downward from the collecting device to the molten solder tank 2. Baffles 42 are provided on both sides of the flow guide plate 41. The baffles 42 and the flow guide plate 41 together form a channel. When the workpiece after tinning is moving, the falling molten solder will first drip into the channel, and the channel will then guide the molten solder into the molten solder tank 2. In the above technical solution, the vertical conveying structure 54 can be implemented by a telescopic cylinder, and the horizontal conveying structure 53 can be implemented by a telescopic cylinder or belt conveyor, etc.

[0029] Based on the above technical solution, the clamping device of this application has a base plate 61 connected to the mounting base 52, and a limiting groove for limiting the component to be immersed in tin is provided on the base plate 61.

[0030] Based on the above technical solution, this application configures the collecting device with a support 71, a fixing plate 72 on the support 71, and a groove 73 on the fixing plate 72 for placing the workpiece after tinning. When the clamping device moves the tinned workpiece above the collecting device, the workpiece can be manually placed into the groove 73.

[0031] To prevent molten solder from dripping onto the rack, this application provides a flow guiding structure between the collection device and the molten solder tank 2. When the workpiece is moving after being immersed in tin, the molten solder that falls will first drip into the flow guiding structure, which will then guide the molten solder into the molten solder tank 2. This design can prevent molten solder from dripping onto the rack, reduce cleaning difficulty, and also recycle it, thus having the advantage of dual functions.

[0032] Although the present invention has been described in detail with reference to the above embodiments, it will be apparent to those skilled in the art that various changes or modifications can be made to the present invention without departing from the principles and spirit of the present invention as defined by the claims. Therefore, the detailed description of the embodiments in this disclosure is for explanation only and not for limiting the present invention, but rather the scope of protection is defined by the content of the claims.

Claims

1. A dual function tin dipping mechanism comprising: The application relates to a tin immersion device, which comprises a rack (1), a collecting device and a tin liquid bin (2), the rack (1) is provided with clamping devices for clamping workpieces (3) to be immersed in tin and is connected with driving devices, a flow guide structure is arranged between the tin liquid bin (2) and the collecting device, the flow guide structure is used for receiving tin liquid dropped from the workpieces (3) to be immersed in tin and guiding the tin liquid into the tin liquid bin (2).

2. The dual function tin dipping mechanism of claim 1, wherein, The flow guide structure comprises a flow guide plate (41), one end of the flow guide plate (41) is connected with the collecting device, the other end is connected in the tin liquid bin (2), the flow guide plate (41) extends downward from the collecting device to the tin liquid bin (2), and baffles (42) are arranged on the two sides of the flow guide plate (41) respectively, the baffles (42) and the flow guide plate (41) jointly form a channel for guiding the tin liquid to the tin liquid bin (2).

3. The dual function tin dipping mechanism of claim 1 wherein, The driving device comprises a guide rod (51) arranged in the horizontal direction of the rack (1), a mounting base (52) is slidably arranged on the guide rod (51), the rack (1) is connected with horizontal conveying structures (53) for driving the mounting base (52) to move in the horizontal direction, the mounting base (52) is slidably arranged with the clamping devices, and the mounting base (52) is provided with vertical conveying structures (54) for driving the clamping devices to move up and down.

4. The dual function tin dipping mechanism of claim 3, wherein, The clamping devices comprise a bottom plate (61) connected with the mounting base (52), and the bottom plate (61) is provided with limiting grooves for limiting the workpieces to be immersed in tin.

5. The dual function tin dipping mechanism of claim 1 wherein, The collecting device comprises a support (71), the support (71) is provided with a fixed plate (72), and the fixed plate (72) is provided with grooves (73) along the length direction for placing the workpieces to be immersed in tin.

6. The dual function tin dipping mechanism of claim 3 wherein, The vertical conveying structure (54) is a telescopic air cylinder.

Images