Auxiliary positioning and chip removing tool for negative pressure machining
By using a negative pressure machining-assisted positioning and chip removal fixture, precise workpiece positioning and automatic chip removal are achieved through positioning cylinders and vacuum chambers. This solves the problems of low positioning efficiency and untimely chip removal by robotic arms, thereby improving machining efficiency and accuracy.
Patent Information
- Application Number
- CN202520111426.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-01-17
AI Technical Summary
In existing technologies, robotic arms are inefficient in workpiece positioning and waste removal, which affects processing accuracy and efficiency.
A negative pressure machining-assisted positioning and chip removal fixture is adopted. The workpiece position is precisely controlled by the positioning cylinder, the workpiece is fixed by vacuum adsorption, and the airflow is automatically adjusted through the air inlet and chip removal hole to remove waste chips.
It achieves automated and precise workpiece positioning and efficient chip removal, improving processing accuracy and efficiency, and ensuring the stability and safety of the processing process.
Smart Images

Figure CN223734478U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of machining technology, and in particular to a negative pressure machining auxiliary positioning and chip removal tool. Background Technology
[0002] Machining is an indispensable part of modern manufacturing. It can transform raw materials into workpieces with specific shapes and sizes, improve dimensional accuracy and surface roughness, and meet product design requirements. It includes various methods such as milling, drilling, and grinding, and is generally achieved by using machine tools with different machining tools.
[0003] Before processing, the workpiece needs to be assembled onto the corresponding machine tool, and its positioning accuracy during processing needs to be ensured. Currently, most related technologies rely on robotic arms to grasp and transfer the workpiece to the processing station. However, this method has many drawbacks. On the one hand, each time the robotic arm grasps a workpiece, it needs to perform a tedious repositioning operation, which significantly reduces production efficiency and makes it difficult to meet the high-efficiency requirements of fully automated processing, thus hindering the improvement of production efficiency. On the other hand, the waste generated during processing cannot be automatically removed in a timely and effective manner. Waste residue left in the processing area or on the surface of the workpiece not only interferes with the accurate positioning of subsequent workpieces but may also cause processing equipment malfunctions, thereby affecting the processing quality of the workpiece.
[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background technology of this utility model, and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content
[0005] The technical problem to be solved by this utility model is to provide a negative pressure machining auxiliary positioning and chip removal tooling, which enables the robot arm to automatically pick up and place the workpiece with accurate positioning and automatically adsorb and remove the waste chips generated during machining.
[0006] To achieve the above objectives, the technical solution adopted by this utility model is: a negative pressure machining auxiliary positioning and chip removal tooling, comprising: an auxiliary plate, a sealing plate and a chip removal plate;
[0007] The auxiliary plate is provided with multiple positioning cylinders. The two sides of the auxiliary plate along the extension and retraction direction of the positioning cylinders form a working surface and an assembly surface, respectively. The auxiliary plate is recessed from the assembly surface to the working surface to form a vacuum cavity. The sealing plate is provided at the opening of the vacuum cavity and is fixedly connected to the auxiliary plate. The vacuum cavity has a number of adsorption holes that are connected to the working surface.
[0008] The chip removal plate is fixedly connected to the auxiliary plate, and its top surface forms a height difference with the working surface. The chip removal plate is provided with an air inlet and a number of chip removal holes. Each chip removal hole is arranged facing the side where the working surface is located, and the plane where the axis is located is arranged parallel to the working surface or inclined at a 45° angle. The air inlet is arranged through the length of the chip removal plate and is connected to each chip removal hole.
[0009] Furthermore, the auxiliary plate has a negative pressure hole on the side facing the chip removal plate, and the negative pressure hole is connected to the vacuum chamber.
[0010] Furthermore, two vacuum chambers are arranged side by side along the length of the auxiliary plate, and each vacuum chamber is connected to a negative pressure hole.
[0011] Furthermore, there are 6 positioning cylinders arranged in a T-shape, wherein two positioning cylinders are located between the two vacuum chambers, and two positioning cylinders are located on the side of each vacuum chamber facing the chip removal plate.
[0012] Furthermore, the auxiliary plate is provided with vacuum pipeline channels, which are located on the side of the assembly surface and distributed among the multiple positioning cylinders.
[0013] Furthermore, the auxiliary plate is provided with a plurality of first mounting holes, which are distributed on the four sides of the auxiliary plate and between the two vacuum chambers.
[0014] Furthermore, the working surface is provided with a number of continuous protrusions evenly distributed, and the adsorption holes are arranged at equal intervals between the protrusions.
[0015] Furthermore, the chip removal plate includes a chip removal section and three mounting sections. The chip removal section is arranged along the length direction of the auxiliary plate. The air inlet is located at both ends of the chip removal section. The chip removal holes are arranged sequentially along the length direction of the chip removal section. The three mounting sections are located at both ends and the middle section of the chip removal section, respectively, and are fixedly connected to the side of the negative pressure hole on the auxiliary plate.
[0016] Furthermore, the mounting section is provided with a second mounting hole, and the mounting section is fixedly connected to the auxiliary plate through the second mounting hole.
[0017] Furthermore, a stepped surface is formed between the assembly surface and the vacuum cavity, and the sealing plate is fixedly disposed on the stepped surface. A sealing strip is sandwiched between the side of the sealing plate facing the inside of the vacuum cavity and the stepped surface, and the other side is located on the same plane as the assembly surface.
[0018] The beneficial effects of this utility model are as follows: By setting a positioning cylinder on the auxiliary plate, the position of the workpiece can be automatically and accurately controlled to ensure processing accuracy. By setting a vacuum chamber and fixing it with a sealing plate, the airtightness of the vacuum chamber is ensured. The vacuum chamber adsorbs the workpiece set on the working surface through the adsorption hole, ensuring the stability of workpiece positioning and fixing during processing, realizing automated production processing and improving processing efficiency. By setting an air inlet and a chip removal hole, the airflow can be automatically adjusted according to different working conditions to remove waste chips on the working surface during production, which greatly improves processing efficiency. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of the structure of the negative pressure machining auxiliary positioning and chip removal tool in the embodiment of this utility model;
[0021] Figure 2 This is a structural schematic diagram of the side of the auxiliary plate where the mounting surface is located in an embodiment of this utility model;
[0022] Figure 3 This is a schematic diagram of the structure of the side of the auxiliary plate where the working surface is located in an embodiment of this utility model;
[0023] Figure 4 This is a schematic diagram of the chip removal plate in an embodiment of the present invention.
[0024] Reference numerals: 1. Auxiliary plate; 1a. Working surface; 1b. Assembly surface; 1c. Step surface; 11. Vacuum chamber; 12. Adsorption hole; 13. Negative pressure hole; 14. Vacuum pipeline channel; 15. First mounting hole; 16. Protrusion; 2. Sealing plate; 3. Chip removal plate; 3a. Air inlet; 3b. Chip removal hole; 31. Chip removal section; 32. Mounting section; 32a. Second mounting hole; 4. Positioning cylinder. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0028] like Figures 1 to 4 The negative pressure machining auxiliary positioning chip removal fixture shown includes: auxiliary plate 1, sealing plate 2 and chip removal plate 3;
[0029] Multiple positioning cylinders 4 are provided on the auxiliary plate 1. The two sides of the auxiliary plate 1 along the extension and retraction direction of the positioning cylinders 4 form a working surface 1a and an assembly surface 1b respectively. The auxiliary plate 1 is recessed from the assembly surface 1b side toward the working surface 1a side to form a vacuum chamber 11. The sealing plate 2 is provided at the opening of the vacuum chamber 11 and is fixedly connected to the auxiliary plate 1. The vacuum chamber 11 has a number of adsorption holes 12 that are connected to the working surface 1a.
[0030] The chip removal plate 3 is fixedly connected to the auxiliary plate 1, and its top surface forms a height difference with the working surface 1a. The chip removal plate 3 is provided with an air inlet 3a and several chip removal holes 3b. Each chip removal hole 3b is set facing the side where the working surface 1a is located, and the plane where the axis is located is parallel to the working surface 1a or inclined at a 45° angle. The air inlet 3a is set through along the length direction of the chip removal plate 3 and is connected to each chip removal hole 3b. Specifically, the chip removal holes 3b whose axes are parallel to the working surface can remove chips from the surface of the working surface 1a, and the chip removal holes 3b whose axes are inclined at a 45° angle to the working surface can remove flying chips from the surface of the workpiece and the tool. The chip removal process is carried out synchronously with the working process. A regulating valve can be set to adjust the air flow in the air inlet 3a. During the working process, the airflow is reduced to prevent waste chips from interfering with the normal processing of the tool. After the processing is completed, the airflow is increased to prevent waste chips from accumulating on the working surface 1a and to ensure the cleanliness of the working surface 1a before the next processing process.
[0031] This invention enables precise control of the workpiece position and ensures machining accuracy by setting a positioning cylinder 4 on the auxiliary plate 1. The vacuum chamber 11 is fixed by a sealing plate 2 to ensure its airtightness. The vacuum chamber 11 adsorbs the workpiece placed on the working surface 1a through the adsorption hole 12, ensuring the stability of workpiece positioning and fixation during machining. By setting an air inlet 3a and a chip removal hole 3b, the airflow can be automatically adjusted according to different working conditions to remove waste chips on the working surface 1a during production, greatly improving machining efficiency.
[0032] Based on the above embodiment, the auxiliary plate 1 has a negative pressure hole 13 on the side facing the chip removal plate 3, and the negative pressure hole 13 is connected to the vacuum chamber 11. The negative pressure hole 13 allows the vacuum chamber 11 to be connected to an external negative pressure system, thereby maintaining a negative pressure state during the processing to ensure that the workpiece is firmly adsorbed on the working surface 1a. After the processing is completed, the negative pressure in the vacuum chamber 11 can be released by adjusting the negative pressure state, so that the workpiece is separated from the working surface 1a and it is convenient to remove the processed workpiece.
[0033] Based on the above embodiment, two vacuum chambers 11 are arranged side by side along the length of the auxiliary plate 1. Each vacuum chamber 11 is connected to a negative pressure hole 13. A pressure gauge is installed in the vacuum pipeline corresponding to the vacuum chamber 11 and is connected to the vacuum chamber through the negative pressure hole 13. The two independent vacuum chambers 11 allow for individual control of the adsorption force in different areas on the working surface 1a to adapt to workpieces of different sizes and shapes, thereby improving processing flexibility. Two workpieces can also be processed simultaneously, which greatly improves processing efficiency.
[0034] Based on the above embodiment, six positioning cylinders 4 are provided and arranged in a T-shape. Two positioning cylinders 4 are located between two vacuum chambers 11, and two positioning cylinders 4 are provided on the side of each vacuum chamber 11 facing the chip removal plate 3. The T-shaped arrangement allows the positioning cylinders 4 to make more efficient use of space. The two positioning cylinders 4 are located between two vacuum chambers 11 as common positioning points for the workpieces on the corresponding working surfaces 1a of the two vacuum chambers 11 in the width direction. The layout design is optimized, the installation space of the positioning cylinders 4 is reduced, and a larger vacuum chamber 11 is formed on the auxiliary plate 1 to ensure the positioning and fixing effect.
[0035] It should be noted that during assembly and positioning, the positioning cylinder 4 extends and protrudes from the working surface 1a to facilitate the determination of the limit positions in the length and width directions, enabling rapid and accurate positioning. After positioning, the workpiece is fixed on the working surface 1a through the vacuum chamber 11 and the adsorption hole 12. The positioning cylinder 4 retracts, and the output end is not higher than the plane where the working surface 1a is located, thereby effectively preventing collision with the tool feed during processing and ensuring work safety.
[0036] Based on the above embodiments, a vacuum pipeline channel 14 is provided on the auxiliary plate 1. The vacuum pipeline channel 14 is located on the side of the assembly surface 1b and is distributed among multiple positioning cylinders 4. By providing installation space for the negative pressure hole through the vacuum pipeline channel 14, the auxiliary plate 1 can be stably fixed on the machining station of the machine tool, and the negative pressure state in the vacuum chamber 11 can be quickly controlled through the vacuum pipeline channel 14 to ensure the stable progress of the machining process.
[0037] Based on the above embodiments, a plurality of first mounting holes 15 are provided through the auxiliary plate 1. The plurality of first mounting holes 15 are distributed on the four sides of the auxiliary plate 1 and between the two vacuum chambers 11. By providing the first mounting holes 15, the auxiliary plate 1 can be connected to the machine tool as a whole by bolts, screws or other fasteners, which enhances stability and structural strength. The distribution of the first mounting holes 15 helps to optimize the space utilization on the auxiliary plate 1, making the structure of the auxiliary plate 1 more compact while ensuring connection stability, and at the same time not affecting the normal operation of other components on the auxiliary plate 1.
[0038] Based on the above embodiment, a plurality of continuous protrusions 16 are evenly distributed on the working surface 1a, and adsorption holes 12 are arranged at equal intervals between the protrusions 16. The continuous protrusions 16 can provide additional support points, reduce the area of the workpiece in direct contact with the working surface 1a, reduce workpiece surface damage caused by excessive adsorption force, improve adsorption stability and product processing accuracy, facilitate rapid adjustment of workpiece position during assembly, and the gap between the protrusions 16 provides a channel for the chip removal process, facilitating the rapid discharge of waste chips. The equally spaced adsorption holes 12 can ensure uniform distribution of negative pressure, provide more uniform adsorption force, avoid workpiece deformation or displacement caused by uneven adsorption force, and ensure workpiece processing accuracy and surface quality.
[0039] Based on the above embodiment, the chip removal plate 3 includes a chip removal section 31 and three mounting sections 32. The chip removal section 31 is arranged along the length direction of the auxiliary plate 1. Air inlets 3a are located at both ends of the chip removal section 31, and chip removal holes 3b are arranged sequentially along the length direction of the chip removal section 31. The three mounting sections 32 are located at both ends and the middle section of the chip removal section 31, respectively, and are fixedly connected to the side where the negative pressure hole 13 is located on the auxiliary plate 1. The chip removal section 31 is arranged along the length direction of the auxiliary plate 1. Airflow is introduced into the chip removal section 31 through the air inlet. The airflow is discharged when it passes through the tiny chip removal holes 3b, and blows away the waste chips collected on the working surface 1a along the width direction of the auxiliary plate 1. This can effectively collect and discharge the waste chips generated during the processing, keeping the entire working surface 1a clean. The three mounting sections 32 are located at both ends and the middle section of the chip removal section 31, respectively, which helps to evenly distribute the fixing force and enhance the stability of the connection of the chip removal plate 3 during operation.
[0040] Based on the above embodiments, the mounting section 32 is provided with a second mounting hole 32a. The mounting section 32 is fixedly connected to the auxiliary plate 1 through the second mounting hole 32a. Through the second mounting hole 32a, bolts, screws or other fasteners can be used to fix the mounting section 32 to the auxiliary plate 1, thereby enhancing the connection strength and stability between the chip removal plate 3 and the auxiliary plate 1.
[0041] Based on the above embodiment, a stepped surface 1c is formed between the assembly surface 1b and the vacuum chamber 11. The sealing plate 2 is fixedly disposed on the stepped surface 1c. A sealing strip is sandwiched between the side of the sealing plate 2 facing the inside of the vacuum chamber 11 and the stepped surface 1c, and the other side is located on the same plane as the assembly surface 1b. The stepped surface 1c provides additional support for the sealing plate 2, increases the contact area between the sealing plate 2 and the auxiliary plate 1, enhances the stability of the entire structure, and ensures the sealing effect between the two by setting the sealing strip for vacuum sealing, preventing air leakage, ensuring the negative pressure state of the vacuum chamber 11, and thus ensuring the stability of the workpiece after positioning and assembly.
[0042] Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A negative pressure machining aid positioning chip removal tooling characterized by, The utility model relates to a vacuum adsorption device for glass sheet, comprising: auxiliary plate, sealing plate and scrap removing plate; A plurality of positioning cylinders are arranged on the auxiliary plate, two sides of the auxiliary plate along the extension direction of the positioning cylinders are respectively formed with a working surface and an assembly surface, the auxiliary plate is recessed from one side of the assembly surface to the other side of the working surface to form a vacuum cavity, the sealing plate is arranged at the opening of the vacuum cavity and is fixedly connected with the auxiliary plate, and a plurality of adsorption holes penetrating through the working surface are arranged in the vacuum cavity; The scrap removing plate is fixedly connected with the auxiliary plate, and the top surface of the scrap removing plate has a height difference with the working surface, the scrap removing plate is provided with an air inlet hole and a plurality of scrap removing holes, each of the scrap removing holes is arranged on the side of the working surface and has an axis plane parallel to the working surface or inclined at an angle of 45 degrees, and the air inlet hole penetrates through the length direction of the scrap removing plate and is in communication with each of the scrap removing holes.
2. The negative pressure process-aided positioning and chip removal tooling according to claim 1, characterized in that, A negative pressure hole is formed in the side of the auxiliary plate facing the scrap removing plate, and the negative pressure hole is in communication with the vacuum cavity.
3. The negative pressure machining aid positioning and debris removal tool of claim 2, wherein, Two vacuum cavities are arranged in parallel along the length direction of the auxiliary plate, and each of the vacuum cavities is in communication with one negative pressure hole.
4. The negative pressure machining aid positioning and debris removal tool of claim 3, wherein, The positioning cylinders are arranged in a T shape, and six positioning cylinders are arranged between the two vacuum cavities.
5. The negative pressure machining aid positioning and debris removal tool of claim 4, wherein, A vacuum pipeline channel is formed in the auxiliary plate, and the vacuum pipeline channel is arranged on the side of the assembly surface and between the plurality of positioning cylinders.
6. The negative pressure machining aid positioning and debris removal tool of claim 5, wherein, A plurality of first mounting holes are arranged through the auxiliary plate, and the first mounting holes are arranged between the four sides of the auxiliary plate and the two vacuum cavities.
7. The negative pressure machining aid positioning and debris removal tool of claim 6, wherein, A plurality of continuous protrusions are uniformly arranged on the working surface, and the adsorption holes are arranged at equal intervals between the protrusions.
8. The negative pressure machining aid positioning and debris removal tool of claim 2, wherein, The scrap removing plate comprises a scrap removing section and three mounting sections, the scrap removing section is arranged along the length direction of the auxiliary plate, the air inlet hole is arranged at both ends of the scrap removing section, the scrap removing holes are arranged in sequence along the length direction of the scrap removing section, and the three mounting sections are arranged at both ends and the middle of the scrap removing section and are fixedly connected with the side of the auxiliary plate where the negative pressure hole is arranged.
9. The negative pressure machining aid positioning and debris removal tool of claim 8, wherein, Second mounting holes are arranged on the mounting sections, and the mounting sections are fixedly connected with the auxiliary plate through the second mounting holes.
10. The negative pressure machining aid positioning and debris removal tool of claim 1, wherein, A stepped surface is formed between the assembly surface and the vacuum cavity, the sealing plate is fixedly arranged on the stepped surface, a sealing strip is arranged between the side of the sealing plate facing the interior of the vacuum cavity and the stepped surface, and the other side is arranged on the same plane as the assembly surface.