Chip cushion packaging counting strip

Abstract

The utility model relates to the technical field of chip packaging equipment, and discloses a chip cushion packaging counting strip which comprises a strip body, an installation block is connected in the strip body in a sliding mode, a bubble cap is fixedly connected to the upper surface of the installation block, the lower surface of the bubble cap is attached to the upper surface of the strip body, and the upper surface of the strip body is fixedly connected with the installation block. A mounting groove is formed in the strip body, a chip body is arranged in the strip body, a connecting assembly for limiting and buffering the chip body is arranged in the mounting groove, and a buffering assembly for enhancing the buffering effect of the bubble cap is arranged in the bubble cap. According to the utility model, the buffer assembly adopts the combined design of the plastic layer, the foam outer layer and the rubber inner layer, and the effect of omnibearing buffer protection on the chip is realized by utilizing the energy absorption property of the foam outer layer, the high elasticity of the rubber inner layer and the supporting property of the plastic layer; and then additional buffer support is provided for the chip through a spring I and an elastic abutting plate in the connecting assembly.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging equipment technical field especially, relates to a chip buffer packaging counting strip. BACKGROUND

[0002] Chip usually refers to integrated circuit, is the micro -miniaturization electronic device or part of a large number of such as transistor, resistance, capacitance electronic component through semiconductor manufacturing process integration on the micro semiconductor wafer, can execute processing data, store information etc. Specific electronic function, according to function and application can be divided into microprocessor chip, memory chip, application specific integrated circuit etc. Multiple types. Because its structure is precise, in transportation, storage and handling are vulnerable to vibration, collision and impact, so need buffer packaging counting strip, the blister of the strip etc. Buffer structure can absorb and disperse external force, prevent chip pin or internal circuit damage, adapt to different logistics and storage environment;Its counting function is significant to chip production process control, supply chain management, facilitate real-time monitoring production progress, manage inventory.

[0003] The existing buffer packaging counting strip generally includes the blister of the buffer part and the identification of the counting part, the blister protects the chip to a certain extent, and the counting identification facilitates counting processing.

[0004] The existing blister is mostly plastic in the use process, although it protects the chip to a certain extent, but when facing high falling, strong impact and other extreme external force, it can not provide sufficient protection for the chip, resulting in damage to the chip, and further resulting in the problem of affecting the packaging effect of the chip. UTILITY MODEL CONTENTS

[0005] In order to make up for the above shortcomings, the utility model provides a chip buffer packaging counting strip, which aims at improving the problem that the existing blister is mostly plastic in the prior art, although it can protect the chip to a certain extent, but when facing high falling, strong impact and other extreme external force, it can not provide sufficient protection for the chip, resulting in damage to the chip, and further resulting in the problem of affecting the packaging effect.

[0006] To achieve the above object, the utility model provides the following technical scheme: a chip buffer packaging counting strip, including the strip body, the strip body interior is connected with the mounting block of sliding, the mounting block upper surface is connected with the blister of fixed connection, the blister lower surface and the strip body upper surface are pasted, the strip body interior is set up with the installation groove, the strip body interior is provided with the chip body, the installation groove interior is installed with the connecting assembly for limiting and buffering the chip body, the blister interior is provided with the buffer assembly of reinforcing blister buffer effect;

[0007] The connecting assembly comprises a spring one, the spring one is fixedly connected inside the strip body, one end of the spring one is fixedly connected with an elastic abutment plate, the upper surface of the elastic abutment plate is fixedly connected with a baffle one, the outer wall of the baffle one is slidably connected inside the strip body, and the outer wall of the baffle one is attached to the upper surface of the chip body.

[0008] Further, the buffer assembly comprises a plastic layer, the plastic layer is arranged inside the bubble cover, the outer wall of the plastic layer is fixedly connected with a foam outer layer, and the outer wall of the plastic layer is fixedly connected with a rubber inner layer.

[0009] Further, the strip body is internally provided with a counting scale, and the counting scale is used for facilitating counting.

[0010] Further, the elastic abutment plate is made of silicone rubber.

[0011] Further, the upper surface of the strip body is fixedly connected with a mounting plate, the upper surface of the strip body is rotatably connected with a baffle two, and the baffle two is internally provided with a clamping hole.

[0012] Further, the mounting plate is slidably connected with a pull rod, and the outer wall of the pull rod is fixedly connected with a limiting plate.

[0013] Further, the outer wall of the limiting plate is fixedly connected with a spring two, one end of the spring two is fixedly connected inside the mounting plate, and one end of the limiting plate is slidably connected inside the clamping hole.

[0014] Further, the baffle two is internally threadedly connected with a bolt, and one end of the bolt is threadedly connected inside the strip body.

[0015] The utility model has the advantages of the following:

[0016] 1、The buffer assembly of the utility model adopts the combined design of a plastic layer, a foam outer layer and a rubber inner layer, utilizes the energy absorption of the foam outer layer, the high elasticity of the rubber inner layer and the supporting property of the plastic layer, realizes the effect of all-round buffer protection of the chip, and then provides additional buffer support for the chip through the spring one and the elastic abutment plate in the connecting assembly, so that the problem that the existing bubble cover is mostly made of plastic material in the prior art, can protect the chip to a certain extent, but cannot provide sufficient protection for the chip in the face of some extreme external force, resulting in damage to the chip and affecting the packaging effect is solved, and the practicality of the device is improved.

[0017] 2. The utility model discloses a bubble cap is slidably installed in the strip body through the mounting block, and the bubble cap is limited through the limiting of baffle no. 2 to the mounting block, so that the installation of the bubble cap is realized, and through the pull rod and the spring in the mounting plate, the effect that the installation is quickly removed can be realized while being limited stably, so that the chip can be taken down easily, the chip damage risk is reduced, the chip taking rate can be improved, and the practicality of the device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A three-dimensional structure schematic diagram of a chip buffer packaging counting strip is provided for the utility model;

[0019] Figure 2 A bubble cap part structure schematic diagram of a chip buffer packaging counting strip is provided for the utility model;

[0020] Figure 3 A chip body part structure schematic diagram of a chip buffer packaging counting strip is provided for the utility model;

[0021] Figure 4 A foam outer layer part structure schematic diagram of a chip buffer packaging counting strip is provided for the utility model;

[0022] Figure 5 A mounting plate part structure schematic diagram of a chip buffer packaging counting strip is provided for the utility model.

[0023] Legend:

[0024] 1, strip body, 2, bubble cap, 3, counting scale, 4, mounting block, 5, chip body, 6, baffle no. 1, 7, elastic abutment plate, 8, spring no. 1, 9, mounting groove, 10, foam outer layer, 11, plastic layer, 12, rubber inner layer, 13, mounting plate, 14, baffle no. 2, 15, bolt, 16, pull rod, 17, limiting plate, 18, spring no. 2, 19, clamping hole. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0026] Reference Figure 1 - Figure 4The utility model provides a kind of embodiment: a chip buffer packaging counting strip, including strip body 1, installation block 4 is slidably connected in strip body 1 inside, realize the sliding connection of blister 2 and strip body 1, installation block 4 upper surface is fixedly connected with blister 2, directly covers in chip body 5 top, protects chip, blister 2 lower surface and strip body 1 upper surface are conformed, installation groove 9 is set in strip body 1 inside, chip body 5 is provided in strip body 1 inside, its precision structure determines that it needs to be properly protected in transport, storage etc. Link, to ensure that its normal function is not affected, installation groove 9 inside is installed with the connecting assembly for limiting and buffering chip body 5, blister 2 inside is provided with the buffer assembly of reinforcing blister 2 buffering effect, connecting assembly includes spring one 8, by elastic deformation absorption impact force, when chip is vibrated or slightly collides, the expansion of spring one 8 can effectively buffer external force, protect chip from damage, spring one 8 is fixedly connected in strip body 1 inside, spring one 8 one end is fixedly connected with elastic abutment plate 7, adopt silicon rubber material, with good elasticity and flexibility, and chip body 5 upper surface is closely conformed, on the one hand further buffer impact force from above, on the other hand prevent chip from shaking and displacement in packaging, ensure that chip is in stable state, elastic abutment plate 7 upper surface is fixedly connected with baffle one 6, baffle one 6 outer wall one side is slidably connected in strip body 1 inside, baffle one 6 outer wall one side and chip body 5 upper surface are conformed, buffer assembly includes plastic layer 11, plastic layer 11 is set in blister 2 inside, foam outer layer 10 is fixedly connected with plastic layer 11 outer wall one side, with excellent energy absorption characteristics, can effectively absorb a large amount of impact energy by its deformation, rubber inner layer 12 is fixedly connected with plastic layer 11 outer wall other side, with high elasticity, under the action of daily vibration or smaller impact force, vibration and impact force are buffered.

[0027] Referring to Figure 1 , Figure 2 and Figure 5The inside of the strip body 1 is provided with a counting scale 3, which provides an intuitive and convenient counting method for the operator. The counting scale 3 is used for convenient counting. The elastic abutting plate 7 is made of silicone rubber, which has excellent elasticity, flexibility and chemical stability. When the chip is impacted by external force, the elastic abutting plate 7 can deform, effectively buffer the impact force, and protect the chip from damage. The upper surface of the strip body 1 is fixedly connected with a mounting plate 13. The upper surface of the strip body 1 is rotatably connected with a baffle two 14. By means of the bolt 15, the strip body 1 is rotated, and the bubble cap 2 is limited. The inside of the baffle two 14 is provided with a clamping hole 19. When the limiting plate 17 is inserted into the clamping hole 19 under the action of the spring two 18, the baffle two 14 can be positioned and fixed. The inside of the mounting plate 13 is slidably connected with a pull rod 16. By pulling the pull rod 16, the elastic force of the spring two 18 can be overcome, so that the limiting plate 17 is separated from the clamping hole 19, thereby releasing the limiting of the baffle two 14. The outer wall of the pull rod 16 is fixedly connected with the limiting plate 17. The outer wall of the limiting plate 17 is fixedly connected with the spring two 18. When the pull rod 16 is pulled, the spring two 18 is compressed to store elastic potential energy. After the pull rod 16 is released, the spring two 18 rebounds to push the limiting plate 17 to return to the original position. One end of the spring two 18 is fixedly connected in the mounting plate 13. One end of the limiting plate 17 is slidably connected in the clamping hole 19. The inside of the baffle two 14 is threadedly connected with the bolt 15. One end of the bolt 15 is threadedly connected in the inside of the strip body 1.

[0028] Working principle: first, the chip body 5 is placed in the mounting groove 9 inside the strip body 1, at this time the connecting assembly plays a role, the spring 8 is in a natural state, the baffle 6 on the upper surface of the elastic abutting plate 7 is attached to the upper surface of the chip body 5, and the chip is preliminarily limited, preventing the chip from being separated from the strip body 1, the elastic effect of the spring 8 can absorb the slight impact force that the chip may receive during placement to a certain extent, ensuring that the chip is placed stably in the mounting groove 9 and reducing the possibility of damage; during transportation or storage, when slight vibration is encountered, the plastic layer 11 keeps the overall structure of the blister 2 stable, the rubber inner layer 12 buffers the impact force generated by the vibration due to its high elasticity, reducing the transmission of vibration to the chip body 5, at the same time, the elastic abutting plate 7 in the connecting assembly will also deform slightly due to the vibration, and the spring 8 will be further compressed, together with the rubber inner layer 12, to absorb the vibration energy and protect the chip from being affected; if a larger external force impact is encountered, the foam outer layer 10 first plays an energy absorption role, the foam outer layer 10 can absorb a large amount of impact energy through its deformation, effectively reducing the direct impact of the impact force on the chip, at the same time, the rubber inner layer 12 and the plastic layer 11 further provide buffering and support on the basis of the foam outer layer 10, preventing the chip from being damaged due to excessive external force, thereby better achieving the buffering protection of the chip; then through the counting scale 3 opened inside the strip body 1, the operator can directly count the number of chips, in the production, packaging, quality inspection and other links of the chip, only by observing the counting scale 3, the number of chips on the strip can be known; finally, the blister 2 is slidably connected with the strip body 1 through the mounting block 4, during installation, the mounting block 4 at the bottom of the blister 2 is slid into the strip body 1, the lower surface of the blister 2 is tightly attached to the upper surface of the strip body 1, then the baffle 14 is rotated above the mounting block 4 by rotating the bolt 15, one end of the pull rod 16 is clamped in the clamping hole 19, the fixation of the baffle 14 is realized, and the limiting installation of the blister 2 is realized, with the downward compression of the bolt 15, the baffle 14 is further compressed and fixed; when the blister 2 needs to be removed, the pull rod 16 is pulled upward, the pull rod 16 is separated from the clamping hole 19 by overcoming the elastic force of the spring 18, and then the baffle 14 is moved away from the mounting plate 13 by reversing the rotation of the bolt 15.

[0029] Finally, it should be noted that: the above only describes the preferred embodiments of the present application and is not intended to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement for part of the technical features, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A chip buffer package count tape strip comprising a tape body (1), characterized in that: The strip body (1) is internally connected with the mounting block (4), the upper surface of the mounting block (4) is fixedly connected with the bubble cap (2), the lower surface of the bubble cap (2) is attached to the upper surface of the strip body (1), the strip body (1) is internally provided with the mounting groove (9), the strip body (1) is internally provided with the chip body (5), the mounting groove (9) is internally provided with the connecting assembly for limiting and buffering the chip body (5), and the bubble cap (2) is internally provided with the buffering assembly for buffering the bubble cap (2). The connecting assembly comprises a spring (8), the spring (8) is fixedly connected in the strip body (1), one end of the spring (8) is fixedly connected with the elastic abutting plate (7), the upper surface of the elastic abutting plate (7) is fixedly connected with the baffle (6), one side of the outer wall of the baffle (6) is slidably connected in the strip body (1), and one side of the outer wall of the baffle (6) is attached to the upper surface of the chip body (5).

2. A chip buffer package count strip according to claim 1, wherein: The buffering assembly comprises a plastic layer (11), the plastic layer (11) is arranged in the bubble cap (2), one side of the outer wall of the plastic layer (11) is fixedly connected with the foam outer layer (10), and the other side of the outer wall of the plastic layer (11) is fixedly connected with the rubber inner layer (12).

3. A chip buffer package count strip according to claim 1, wherein: The strip body (1) is internally provided with the counting scale (3), and the counting scale (3) is used for facilitating counting.

4. The chip buffer package count strip of claim 1, wherein: The material of the elastic abutting plate (7) is silicone rubber.

5. A chip buffer package count strip according to claim 3, wherein: The upper surface of the strip body (1) is fixedly connected with the mounting plate (13), the upper surface of the strip body (1) is rotatably connected with the baffle (14), and the baffle (14) is internally provided with the clamping hole (19).

6. A chip buffer package count strip according to claim 5, wherein: The mounting plate (13) is internally slidably connected with the pull rod (16), one side of the outer wall of the pull rod (16) is fixedly connected with the limiting plate (17).

7. A chip buffer package count strip according to claim 6, wherein: One side of the outer wall of the limiting plate (17) is fixedly connected with the spring (18), one end of the spring (18) is fixedly connected in the mounting plate (13), and one end of the limiting plate (17) is slidably connected in the clamping hole (19).

8. A chip buffer package count strip according to claim 5, wherein: The baffle (14) is internally threadedly connected with the bolt (15), and one end of the bolt (15) is threadedly connected in the strip body (1).

Images