Electroplating device for solar cell

Abstract

The utility model relates to the technical field of photovoltaics, in particular to an electroplating device for a solar cell. According to the electroplating device of the solar cell, the solar cell is arranged in the first electroplating space of the electroplating bath through the carrier assembly, and the first conductive plates are arranged on the two sides of the solar cell substrate in the first direction correspondingly; the electric field changing area is transferred from the two edges of the solar cell substrate in the first direction to the corresponding edge of the first conductive plate in the first direction, the electric fields on the two surfaces of the solar cell substrate are uniformly distributed, and meanwhile, the surface of the first conductive plate is insulated, so that a metal layer is not formed on the surface of the first conductive plate through electroplating; and the thickness uniformity of the electroplating grid line is improved, so that the quality of the solar cell is improved.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to an electroplating apparatus for solar cells. Background Technology

[0002] In the fabrication process of solar cells, a transparent conductive film is first deposited on the solar cell substrate, and then grid electrodes are fabricated on the transparent conductive film. When fabricating grid electrodes on the transparent conductive film using copper interconnect technology, a metal seed layer is first formed on the transparent conductive film using PVD (Physical Vapor Deposition) magnetron sputtering. Then, a photosensitive emulsion layer is coated on the metal seed layer, and the grid pattern is printed on the photosensitive emulsion layer and exposed. The portion of the photosensitive emulsion layer with the grid pattern printed on it is then removed by a developing solution to form grooves on the photosensitive emulsion layer. Finally, metal grid lines are electroplated in the grooves. When electroplating metal grid lines, in order to improve electroplating efficiency, both sides of the solar cell substrate are electroplated simultaneously. Since the amount of metal to be electroplated on the two sides of the solar cell substrate is different, the current density applied to the side with a larger amount of copper plating is greater than that applied to the side with a smaller amount of copper plating. The potential line on the side with a larger current density bypasses the side of the solar cell substrate and reaches the edge of the side with a smaller amount of copper plating. This results in a larger grid line thickness at the edge of the side with a smaller amount of copper plating, which is not conducive to improving the thickness uniformity of the electroplated grid lines and affects the quality of the solar cell. Utility Model Content

[0003] Based on this, this application provides an electroplating apparatus for solar cells to solve the technical problem in the prior art that is not conducive to improving the thickness uniformity of electroplated grid lines.

[0004] One embodiment of this application provides an electroplating apparatus for solar cells, comprising:

[0005] Electroplating tank, used to hold electroplating solution;

[0006] The first anode plate and the second anode plate are disposed in the electroplating tank, the first anode plate and the second anode plate are disposed opposite to each other, and a first electroplating space is formed between the first anode plate and the second anode plate;

[0007] A carrier assembly includes a conductive element, two first conductive plates spaced apart along a first direction, a first connector disposed on the conductive element, a second connector disposed on the conductive element, a third connector disposed on the conductive element, and a fourth connector disposed on the conductive element. The first conductive plates are parallel to the first anode plate and the second anode plate, respectively. A solar cell substrate is accommodated between the two first conductive plates. The first connector is electrically connected to a first surface of the solar cell substrate, and the second connector is electrically connected to a second surface of the solar cell substrate. The first conductive plate includes a first insulating surface and a second insulating surface disposed opposite to the first insulating surface. The third connector is electrically connected to the first insulating surface of the first conductive plate, and the fourth connector is electrically connected to the second insulating surface of the first conductive plate. During electroplating, the first conductive plate and the solar cell substrate are respectively located within the first electroplating space.

[0008] Optionally, the conductive element includes a first conductive element and a second conductive element, the first connector is disposed on the first conductive element, the second connector is disposed on the second conductive element, the third connector is disposed on the first conductive element, and the fourth connector is disposed on the second conductive element.

[0009] Optionally, the first conductive plate is indium tin oxide glass.

[0010] Optionally, the first conductive plate includes a first insulating layer, a copper metal layer, and a second insulating layer stacked sequentially.

[0011] Optionally, the length of the first conductive plate in the second direction is greater than the length of the solar cell substrate in the second direction, and a second conductive plate extending along the first direction is formed at one end of the first conductive plate in the second direction. The two second conductive plates are spaced apart in the second direction, and the solar cell substrate is accommodated between the two second conductive plates.

[0012] Optionally, the third connector includes a first fixing part connected to the first conductive element and a first clamping claw connected to the first fixing part, and the fourth connector includes a second fixing part connected to the second conductive element and a second clamping claw connected to the second fixing part, wherein the first clamping claw and the second clamping claw move close to each other to clamp the first conductive plate.

[0013] Optionally, the electroplating apparatus for the solar cell further includes a conductive slide rail assembly, which includes a first conductive slide rail slidably connected to the first conductive element and a second conductive slide rail slidably connected to the second conductive element. The first conductive element and the second conductive element slide along the conductive slide rail assembly to drive the first conductive plate and the solar cell substrate to move along the first direction.

[0014] Optionally, the electroplating apparatus for the solar cell further includes an electroplating power supply assembly, which includes a first positive output terminal connected to the first anode plate, a second positive output terminal connected to the second anode plate, and a negative output terminal respectively connected to the first conductive slide rail and the second conductive slide rail.

[0015] Optionally, the electroplating power supply assembly includes an electroplating power supply and a rectifier connected to the electroplating power supply, wherein the first positive output terminal, the second positive output terminal and the negative output terminal are respectively disposed on the rectifier.

[0016] Optionally, the length of the first conductive plate in the first direction is greater than or equal to one-quarter of the length of the solar cell substrate in the first direction.

[0017] The solar cell electroplating apparatus of this application embodiment places the solar cell in the first electroplating space of the electroplating tank through a carrier assembly, and first conductive plates are respectively arranged on both sides of the solar cell substrate along the first direction. The area where the electric field changes is transferred from the two edges of the solar cell substrate in the first direction to the corresponding edges of the first conductive plates in the first direction. The electric field distribution on the two surfaces of the solar cell substrate is relatively uniform. At the same time, since the surface of the first conductive plate is insulated, no metal layer is electroplated on the surface of the first conductive plate, which is beneficial to improving the thickness uniformity of the electroplated grid lines and thus improving the quality of the solar cell. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the electric field distribution on a solar cell substrate during the electroplating process in the background art.

[0019] Figure 2 This is a schematic diagram of the structure of the electroplating apparatus for solar cells according to an embodiment of this application.

[0020] Figure 3 for Figure 2 A top view of the electroplating apparatus for the solar cell shown.

[0021] Figure 4 for Figure 3 The cross-sectional view along line AA is shown in the figure.

[0022] Figure 5 for Figure 3 The sectional view along line BB is shown in the figure.

[0023] Figure 6 This is a schematic diagram of the electric field distribution of the solar cell substrate during the electroplating process of the solar cell electroplating apparatus according to an embodiment of this application.

[0024] Figure 7 for Figure 2An exploded view of the carrier assembly in the electroplating apparatus for the solar cell shown.

[0025] Figure 8 for Figure 2 The diagram shows the assembly of the first conductive plate, the second conductive plate, and the solar cell substrate in the electroplating apparatus for the solar cell.

[0026] Figure 9 for Figure 2 The diagram shows a first structural schematic of the electroplating power supply assembly in the electroplating apparatus for the solar cell.

[0027] Figure 10 for Figure 2 The diagram shows a second structural schematic of the electroplating power supply assembly in the electroplating apparatus for the solar cell.

[0028] Figure 11 This is a schematic diagram of one embodiment of a solar cell substrate.

[0029] The meanings of the labels in the attached diagram are as follows:

[0030] 100 - Electroplating apparatus for solar cells; 10 - Electroplating tank; 10a - First electroplating space; 21 - First anode plate; 22 - Second anode plate; 30 - Carrier assembly; 30a - Conductive component; 31 - First conductive component; 32 - Second conductive component; 33 - First conductive plate; 301 - First insulating surface; 302 - Second insulating surface; 341 - First connector; 3411 - First support portion; 3412 - First connecting portion; 342 - Second connector; 3421 - Second support portion; 3422 - Second connecting portion; 343 - Third connector; 3431 - First fixing portion; 3432 - First gripper; 344 - Fourth connector; 3441 - Second fixing portion; 3442 - ... Two grippers; 34-Second conductive plate; 40-Conductive slide rail assembly; 41-First conductive slide rail; 42-Second conductive slide rail; 50-Electroplating power supply assembly; 501-First positive output terminal; 502-Second positive output terminal; 503-Negative output terminal; 511-Electroplating power supply; 512-Rectifier; 200-Solar cell substrate; 201-First surface; 202-Second surface; 110-Silicon wafer substrate; 121-First intrinsic amorphous silicon layer; 122-Second intrinsic amorphous silicon layer; 131-N-type doped amorphous silicon layer; 132-P-type doped amorphous silicon layer; 141-First conductive layer; 142-Second conductive layer; 151-First metal seed layer; 152-Second metal seed layer. Detailed Implementation

[0031] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0032] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0034] like Figure 1 As shown, the potentials of the upper and lower surfaces of the solar cell substrate are V0, and the potentials of the two anode plates are V1 and V2, respectively. The electroplating area of ​​the upper surface is approximately N times that of the lower surface, where N is greater than 1, for example, N can be 6.2. The current density on the upper surface is greater than that on the lower surface. During electroplating, the current on the upper surface is N times that on the lower surface. Therefore, V1 is N times that of V2. Consequently, at the edge of the solar cell substrate, there is a situation where the potential lines of the anode plates with higher potentials wrap around to the edge of the lower surface. This causes more metal ions to accumulate at the edge of the lower surface. The metal ions gain electrons and are reduced to elemental metals, forming metal grid lines. Ultimately, this results in an increase in the amount of electroplating on the lower surface and a decrease in the amount of electroplating on the upper surface. Furthermore, the grid line height at the edge of the lower surface is higher than the grid line height at the middle position of the lower surface, leading to an increase in the overall grid line height non-uniformity of the solar cell.

[0035] like Figures 2 to 7 The figure shows an electroplating apparatus for a solar cell according to an embodiment of this application. In each figure, arrows indicate the directions of up / down, front / back, left / right. Unless otherwise specified, the directions of up / down, front / back, and left / right are described according to the directions indicated by these arrows. Furthermore, in each figure, the front / back direction is the first direction, the up / down direction is the second direction, and the left / right direction is the third direction; the first, second, and third directions are perpendicular to each other. The first direction corresponds to the length extension direction of the electroplating tank in the solar cell electroplating apparatus.

[0036] like Figures 2 to 7 As shown, the electroplating apparatus 100 for the solar cell includes: an electroplating tank 10, a first anode plate 21, a second anode plate 22, and a carrier assembly 30.

[0037] The electroplating tank 10 is used to contain the electroplating solution. The first anode plate 21 and the second anode plate 22 are respectively disposed in the electroplating tank 10, and the first anode plate 21 and the second anode plate 22 are arranged opposite each other in a third direction, forming a first electroplating space 10a.

[0038] The carrier assembly 30 is used to support the solar cell substrate 200. During electroplating, the solar cell substrate 200 is suspended in the first electroplating space 11 by the support of the carrier assembly 30. The solar cell substrate 200 includes a first surface 201 and a second surface 202.

[0039] The carrier assembly 30 includes a conductive element 30a, two first conductive plates 33, a first connector 341, a second connector 342, a third connector 343, and a fourth connector 344. The two first guide plates 33 are parallel to the first anode plate 21 and the second anode plate 22, respectively. The two first conductive plates 33 are spaced apart along a first direction. The solar cell substrate 200 is accommodated between the two first conductive plates 33. The first connector 341, the second connector 342, the third connector 343, and the fourth connector 344 are respectively disposed on the conductive element 30a. The first connector 341 is electrically connected to the first surface 201 of the solar cell substrate 200, and the second connector 342 is electrically connected to the second surface 202 of the solar cell substrate 200. That is, the first surface 201 of the solar cell substrate 200 is electrically connected to the first conductive element 31, and the second surface 202 of the solar cell substrate 200 is electrically connected to the second conductive element 32.

[0040] The first conductive plate 33 includes a first insulating surface 301 and a second insulating surface 302, with the first insulating surface 301 and the second insulating surface 302 disposed opposite to each other.

[0041] The third connector 343 is electrically connected to the first insulating surface 301 of the first conductive plate 33, and the fourth connector 344 is electrically connected to the second insulating surface 302 of the first conductive plate 33. That is, the first insulating surface 301 of the first conductive plate 33 is electrically connected to the first conductive element 31, and the second insulating surface 302 of the first conductive plate 33 is electrically connected to the second conductive element 32.

[0042] Please see Figure 6As shown, during electroplating, the two first conductive plates 33 and the solar cell substrate 200 are located within the first electroplating space 10a. The first surface 201 of the solar cell substrate 200 and the first insulating surfaces 301 of the two first conductive plates 33 are electrically connected to the conductive element 30a, and the second surface 202 of the solar cell substrate 200 and the second insulating surfaces 302 of the two first conductive plates 33 are electrically connected to the conductive element 30a. The conductive element 30a is connected to the cathode terminal. The first surface 201 and the second surface 202 of the solar cell substrate 200 and the first insulating surfaces 301 and the second insulating surfaces 302 of the first conductive plates 33 have the same potential, for example, their potentials can be V0 respectively. The first anode plate 21 can be connected to the first anode, and the second anode plate 22 can be connected to the second anode. The potential of the first anode plate 21 is V1, and the potential of the second anode plate 22 is V2. Assuming that V1 is greater than V2, through the arrangement of two first conductive plates 33, one first conductive plate 33, the solar cell substrate 200, and the other first conductive plate 33 form a conductive structure. The corresponding edges of the two first conductive plates 33 are the edges of the conductive structure in the first direction. The edge of the solar cell substrate 200 in the first direction is not the edge of the conductive structure in the first direction. The electric field distribution of the first surface 201 and the second surface 202 of the solar cell substrate 200 is relatively uniform. Electric field lines are also distributed on the first insulating surface 301 and the second insulating surface 302 of the first conductive plate 33. Since the surface of the first conductive plate 33 is insulating, no metal layer will be electroplated on the first insulating surface 301 and the second insulating surface 302.

[0043] Meanwhile, since the potential of the first anode plate 21 is higher than that of the second anode plate 22, the potential lines of the first anode plate 21 will wrap around to the corresponding edges of the second insulating surfaces 302 of the two first conductive plates 33. Since the surfaces of the first conductive plates 33 are insulated, the potential lines of the first anode plate 21 will not affect the electroplating even though they wrap around the surface of the first conductive plates 33.

[0044] In this embodiment, the solar cell is placed in the first electroplating space of the electroplating tank by a carrier assembly, and first conductive plates are respectively arranged on both sides of the solar cell substrate along the first direction. The area where the electric field changes is transferred from the two edges of the solar cell substrate in the first direction to the corresponding edges of the first conductive plates in the first direction. The electric field distribution on the two surfaces of the solar cell substrate is relatively uniform. At the same time, since the surface of the first conductive plate is insulated, no metal layer will be electroplated on the surface of the first conductive plate, which is beneficial to improving the uniformity of the thickness of the electroplated grid lines and thus improving the quality of the solar cell.

[0045] In one embodiment, the conductive element 30a may include a first conductive element 31 and a second conductive element 32. The first conductive element 31 and the second conductive element 32 may extend along a first direction, and the first conductive element 31 and the second conductive element 32 are spaced apart in a third direction.

[0046] The first connector 341 and the third connector 343 are respectively disposed on the first conductive element 31, and the second connector 342 and the fourth connector 344 are respectively disposed on the second conductive element 32.

[0047] During electroplating, the first surface 201 of the solar cell substrate 200 and the first insulating surfaces 301 of the two first conductive plates 33 are electrically connected to the first conductive element 31, respectively. The second surface 202 of the solar cell substrate 200 and the second insulating surfaces 302 of the two first conductive plates 33 are electrically connected to the second conductive element 32, respectively. The first conductive element 31 and the second conductive element 32 are respectively connected to the same cathode terminal, and the first surface 201 and the second surface 202 of the solar cell substrate 200 and the first insulating surfaces 301 and the second insulating surfaces 302 of the first conductive plates 33 have the same potential.

[0048] In one embodiment, the thickness of the first conductive plate 33 is approximately the same as the thickness of the solar cell substrate 200. That is, the distance from the first insulating surface 301 of the first conductive plate 33 to the first anode plate 21 is approximately the same as the distance from the first surface 201 of the solar cell substrate 200 to the first anode plate 21, and the distance from the second insulating surface 302 of the first conductive plate 33 to the second anode plate 22 is approximately the same as the distance from the second surface 202 of the solar cell substrate 200 to the second anode plate 22.

[0049] In one embodiment, the first conductive plate 33 can be indium tin oxide (ITO) glass. The surface of ITO glass is typically treated as an insulating layer. For example, ITO glass can be a mixture of 90% In2O3 and 10% SnO2 by mass percentage.

[0050] In one embodiment, the first conductive plate 33 can be a metal conductive plate, comprising a first insulating layer, a copper metal layer, and a second insulating layer stacked sequentially. The first insulating layer and the second insulating layer can each be an organic thin film. For example, the first insulating layer and the second insulating layer can each be made of a degradable polymeric organic thin film material.

[0051] As one implementation method, please refer to Figure 8As shown, the length of the first conductive plate 33 in the second direction is greater than the length of the solar cell substrate 200 in the second direction. A second conductive plate 34 extending along the first direction is formed at one end of the first conductive plate 33 in the second direction. The two second conductive plates 34 are spaced apart in the second direction, and the solar cell substrate 200 is accommodated between the two second conductive plates 34.

[0052] The first guide plate 33 and the second conductive plate 34 are integrally formed. The two surfaces of the second conductive plate 34 are insulated and are electrically connected to the first guide plate 33 through the third connector 343, the fourth connector 344 and the third connector 344. One of the insulated surfaces of the second conductive plate 34 is electrically connected to the first conductive element 31, and the other insulated surface of the second conductive plate 34 is electrically connected to the second conductive element 32.

[0053] Similar to the function of the first conductive plate 33, one second conductive plate 34, the solar cell substrate 200, and the other second conductive plate 34 form a conductive structure. The corresponding edges of the two second conductive plates 34 are the edges of the conductive structure in the second direction. The edge of the solar cell substrate 200 in the second direction is not the edge of the conductive structure in the second direction. The electric field distribution of the first surface 201 and the second surface 202 of the solar cell substrate 200 is relatively uniform. Electric field lines are also distributed on one and the other insulating surfaces of the second conductive plate 34. Since the surface of the second conductive plate 34 is insulating, no metal layer will be electroplated on either of the two insulating surfaces of the second conductive plate 34.

[0054] Therefore, by setting second conductive plates on both sides of the solar cell substrate along the second direction, the area where the electric field changes is transferred from the two edges of the solar cell substrate in the second direction to the corresponding edges of the second conductive plates in the second direction. The electric field distribution on the two surfaces of the solar cell substrate is more uniform. At the same time, since the surface of the second conductive plate is insulated, no metal layer will be electroplated on the surface of the second conductive plate, which is beneficial to improving the uniformity of the thickness of the electroplated grid lines and thus improving the quality of the solar cell.

[0055] In one embodiment, the third connector 343 includes a first fixing part 3431 connected to the first conductive member 31 and a first gripper 3432 connected to the first fixing part 3431. The fourth connector 344 includes a second fixing part 3441 connected to the second conductive member 32 and a second gripper 3442 connected to the second fixing part 3441. The first gripper 3432 and the second gripper 3442 move close to each other to clamp the first conductive plate 33.

[0056] In one embodiment, the first connector 341 includes a first support portion 3411 connected to the first conductive member 31 and a first connecting portion 3412 connected to the first support portion 3411. The second connector 342 includes a second support portion 3421 connected to the first conductive member 31 and a second connecting portion 3422 connected to the second support portion 3421. The first connecting portion 3412 and the second connecting portion 3422 are respectively connected to the first surface 201 and the second surface 202 of the solar cell substrate 200.

[0057] In some embodiments, the first connecting portion 3412 and the second connecting portion 3422 may each be a conductive tape. For example, the conductive tape may be a copper foil conductive tape.

[0058] As one implementation method, please refer to Figure 7 As shown, the solar cell electroplating apparatus 100 of this embodiment further includes a conductive slide rail assembly 40. The conductive slide rail assembly 40 includes a first conductive slide rail 41 slidably connected to a first conductive member 31 and a second conductive slide rail 42 slidably connected to a second conductive member 32. During electroplating, the first conductive member 31 slides along the first conductive slide rail 41 and the second conductive member 32 slides along the second conductive slide rail 42 to drive the first conductive plate 33 and the solar cell substrate 200 to move in a first direction. During the movement, metal grid lines are electroplated on the first surface 201 and the second surface 202 of the solar cell substrate 200, respectively.

[0059] The first conductive slide rail 41 and the second conductive slide rail 42 extend along the first direction, and the first conductive slide rail 41 and the second conductive slide rail 42 can be arranged opposite each other in the third direction. The first conductive slide rail 41 and the second conductive slide rail 42 can be connected to the cathode end respectively, so that the first conductive element 31 and the second conductive element 32 are connected to the cathode end respectively during the sliding along the first direction.

[0060] In this process, multiple carrier assemblies 30 are provided, and multiple carrier assemblies 30 loaded with solar cell substrates 200 slide sequentially along the conductive slide rail assembly 40, so that each solar cell substrate 200 moves sequentially along the first direction in the first electroplating space 20a for metal wire electroplating.

[0061] As one implementation method, please refer to Figure 9 As shown, the electroplating apparatus 100 for solar cells in this embodiment further includes an electroplating power supply assembly 50, which includes a first positive output terminal 501 connected to the first anode plate 21, a second positive output terminal 502 connected to the second anode plate 22, and a negative output terminal 503 connected to the first conductive slide rail 41 and the second conductive slide rail 42 respectively.

[0062] In this embodiment, the first surface 201 of the solar cell substrate 200 and the first insulating surface 301 of the first conductive plate 33 are respectively connected to the negative output terminal 503 via the first conductive element 31 and the first conductive slide rail 41. The second surface 202 of the solar cell substrate 200 and the second insulating surface 302 of the first conductive plate 33 are respectively connected to the negative output terminal 503 via the second conductive element 32 and the second conductive slide rail 42. The potential of the negative output terminal 503 can be V0. The potentials V1 of the first positive output terminal 501 and V2 of the second positive output terminal 502 are not equal. During electroplating, the electroplating voltage applied to the first surface 201 of the solar cell substrate 200 and the first insulating surface 301 of the first conductive plate 33 is V1-V0, and the electroplating voltage applied to the second surface 202 of the solar cell substrate 200 and the second insulating surface 302 of the first conductive plate 33 is V2-V0.

[0063] In some implementations, please refer to [the relevant documentation]. Figure 10 As shown, the electroplating power supply assembly 50 includes an electroplating power supply 511 and a rectifier 512 connected to the electroplating power supply 511. The first positive output terminal 501, the second positive output terminal 502 and the negative output terminal 503 are respectively disposed on the rectifier 512.

[0064] In this embodiment, the electroplating power supply 511 can output alternating current, which is rectified by the rectifier 512 and outputs two direct currents. One direct current acts on the first surface 201 of the solar cell substrate 200 and the first insulating surface 301 of the first conductive plate 33, and the other direct current acts on the second surface 202 of the solar cell substrate 200 and the second insulating surface 302 of the first conductive plate 33.

[0065] In some embodiments, the length of the first conductive plate 33 in the first direction is greater than or equal to one-quarter of the length of the solar cell substrate 200 in the first direction.

[0066] In some embodiments, the electroplating solution can be a copper sulfate electroplating solution to electroplat copper grid lines on the solar cell substrate 200.

[0067] The solar cell electroplating apparatus 100 of this application embodiment is particularly suitable for electroplating metal grid lines on heterojunction with Intrinsic Thin Layer (HJT) substrates. Please refer to [link to relevant documentation]. Figure 11As shown, the solar cell substrate 200 includes a silicon substrate 110, a first intrinsic amorphous silicon layer 121 and a second intrinsic amorphous silicon layer 122 respectively stacked on the upper and lower surfaces of the silicon substrate 110, an N-type doped amorphous silicon layer 131 stacked on the side of the first intrinsic amorphous silicon layer 121 away from the silicon substrate 110, a P-type doped amorphous silicon layer 132 stacked on the side of the second intrinsic amorphous silicon layer 122 away from the silicon substrate 110, a first conductive layer 141 stacked on the side of the N-type doped amorphous silicon layer 131 away from the silicon substrate 110, a second conductive layer 142 stacked on the side of the P-type doped amorphous silicon layer 132 away from the silicon substrate 110, a first metal seed layer 151 stacked on the side of the first conductive layer 141 away from the silicon substrate 110, and a second metal seed layer 152 stacked on the side of the second conductive layer 142 away from the silicon substrate 110. The silicon substrate 110 is a silicon wafer with textured upper and lower surfaces. On the heterojunction solar cell substrate, the plating amount on the side containing the P-type doped amorphous silicon layer 132 is greater than the plating amount on the side containing the N-type doped amorphous silicon layer 131.

[0068] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0069] The above embodiments merely illustrate preferred implementations of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the scope of protection of this patent application should be determined by the appended claims.

Claims

1. An electroplating apparatus for solar cells, characterized in that, The application relates to a solar cell plating device. The device comprises a plating tank for containing plating solution; a first anode plate and a second anode plate arranged in the plating tank, the first anode plate and the second anode plate being oppositely arranged, and a first plating space being formed between the first anode plate and the second anode plate; a carrier assembly comprising a conductive member, two first conductive plates arranged in a first direction, a first connecting member arranged on the conductive member, a second connecting member arranged on the conductive member, a third connecting member arranged on the conductive member, and a fourth connecting member arranged on the conductive member; the first conductive plates are parallel to the first anode plate and the second anode plate respectively, a solar cell substrate is arranged between the two first conductive plates, the first connecting member is electrically connected to a first surface of the solar cell substrate, and the second connecting member is electrically connected to a second surface of the solar cell substrate; the first conductive plate comprises a first insulating surface and a second insulating surface arranged oppositely to the first insulating surface, the third connecting member is electrically connected to the first insulating surface of the first conductive plate, and the fourth connecting member is electrically connected to the second insulating surface of the first conductive plate; the first conductive plate and the solar cell substrate are arranged in the first plating space during plating. The conductive member comprises a first conductive member and a second conductive member, the first connecting member is arranged on the first conductive member, the second connecting member is arranged on the second conductive member, the third connecting member is arranged on the first conductive member, and the fourth connecting member is arranged on the second conductive member. The first conductive plate is an indium tin oxide glass.

2. The electroplating apparatus for a solar cell according to claim 1, wherein The first conductive plate comprises a first insulating layer, a copper metal layer, and a second insulating layer which are sequentially stacked.

3. The electroplating apparatus for a solar cell according to claim 1 or 2, wherein The length of the first conductive plate in a second direction is greater than the length of the solar cell substrate in the second direction, one end of the first conductive plate in the second direction is formed with a second conductive plate extending in the first direction, two second conductive plates are arranged in the second direction, and the solar cell substrate is arranged between the two second conductive plates.

4. The electroplating apparatus for a solar cell according to claim 1 or 2, wherein The third connecting member comprises a first fixing part connected to the first conductive member and a first clamping jaw connected to the first fixing part, the fourth connecting member comprises a second fixing part connected to the second conductive member and a second clamping jaw connected to the second fixing part, and the first clamping jaw and the second clamping jaw are close to each other to clamp the first conductive plate.

5. The electroplating apparatus for a solar cell according to claim 1 or 2, wherein The solar cell plating device further comprises a conductive slide rail assembly, the conductive slide rail assembly comprises a first conductive slide rail connected to the first conductive member in a sliding mode and a second conductive slide rail connected to the second conductive member in a sliding mode, and the first conductive member and the second conductive member slide along the conductive slide rail assembly to drive the first conductive plate and the solar cell substrate to move in the first direction.

6. The apparatus for electroplating a solar cell of claim 2, wherein, The solar cell plating device further comprises a plating power supply assembly, the plating power supply assembly comprises a first positive output end connected to the first anode plate, a second positive output end connected to the second anode plate, and a negative output end connected to the first conductive slide rail and the second conductive slide rail respectively.

7. The apparatus for electroplating a solar cell of claim 2, wherein, ​ 8. The apparatus for electroplating a solar cell of claim 6, wherein, ​ 9. The apparatus for electroplating a solar cell of claim 8, wherein, The electroplating power supply assembly comprises an electroplating power supply and a rectifier connected with the electroplating power supply, and the first positive output end, the second positive output end and the negative output end are respectively arranged on the rectifier.

10. The apparatus for electroplating a solar cell according to claim 1 or 2, wherein The length of the first conductive plate in the first direction is greater than or equal to one fourth of the length of the solar cell substrate in the first direction.

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