Drying device for wafer surface processing

Abstract

The utility model discloses a drying device for wafer surface processing, comprising a support, one side of the support is fixedly connected with a driving motor, the bottoms of the two sides of the support are rotatably connected with turntables, four groups of fixing rods are symmetrically arranged between the turntables in the circumferential direction, one group of fixing rods is slidably connected with the turntables, and the other fixing rods are fixedly connected with the turntables. A plurality of groups of elastic clamping pieces are fixedly connected to the fixing rod, a wafer body is clamped between the elastic clamping pieces, an air draft device is arranged below the fixing rod, the two ends of the air draft device are fixedly connected with the support, a main air supply pipeline is arranged above the fixing rod, and the main air supply pipeline is fixedly connected with the support. According to the wafer drying device, the two faces of a rotating wafer are comprehensively blown and dried from the upper portion through the air supply pipelines, meanwhile, the air draft device is arranged at the bottom of the wafer to accelerate air flow near the wafer, and therefore the drying efficiency of the wafer is improved.

Description

Technical Field

[0001] This utility model belongs to the field of wafer drying technology, and in particular relates to a drying device for wafer surface processing. Background Technology

[0002] Wafer drying technology is very important in semiconductor manufacturing. It involves removing residual moisture and solvents from the wafer surface during wafer processing to ensure the wafer surface is dry and clean. Wafer drying mainly occurs after the cleaning process, and its purpose is to remove residual moisture from the cleaning process to prevent water droplets from forming contamination on the wafer surface and affecting subsequent processes such as photolithography, evaporation, or chemical deposition.

[0003] However, existing technologies have some problems: current wafer drying devices use an air supply device to blow air onto both sides of the wafer for drying, which leads to air accumulation and poor circulation near the wafer, affecting the drying effect. Therefore, we propose a drying device for wafer surface processing. Utility Model Content

[0004] To address the problems existing in the prior art, the purpose of this utility model is to provide a drying device for wafer surface processing. The device uses an air supply pipe to blow air onto both sides of a rotating wafer from above for comprehensive drying, while an exhaust device is installed at the bottom of the wafer to accelerate the airflow around the wafer, thereby improving the drying efficiency of the wafer.

[0005] This invention is implemented as follows: a drying device for wafer surface processing includes a support frame. A drive motor is fixedly connected to one side of the support frame. Turntables are rotatably connected to the bottom of both sides of the support frame. The outer center of each turntable is fixedly connected to the output shaft of the drive motor. Four sets of fixing rods are symmetrically arranged circumferentially between the turntables. One set of fixing rods is slidably connected to the turntable at both ends, while the other set of fixing rods is fixedly connected to the turntable at both ends. Several sets of elastic clamping members are fixedly connected to the fixing rods. A wafer body is engaged in the middle of each elastic clamping member. An exhaust device is provided below the fixing rods, and both ends of the exhaust device are fixedly connected to the support frame. A main air supply pipe is provided above the fixing rods and is fixedly connected to the support frame. A branch air supply pipe is fixedly connected below the main air supply pipe.

[0006] Optionally, the turntable has a sliding groove, the fixed rod is slidably connected to the sliding groove, and a deceleration spring is provided above the sliding groove. One end of the deceleration spring is fixedly connected to the turntable, and the other end of the deceleration spring is fixedly connected to the fixed rod.

[0007] Optionally, a locking mechanism is provided on both sides of the slide groove. The locking mechanism includes a locking block, and a rotating push rod is slidably connected inside the locking block.

[0008] Optionally, the locking block has a transverse through hole and a longitudinal groove on its back side, and the rotating push rod is slidably connected to the locking block through the transverse through hole and the longitudinal groove.

[0009] Optionally, a connecting block is fixedly connected to the turntable, the rotating push rod passes through the connecting block, and the rotating push rod is slidably connected to the connecting block.

[0010] Optionally, a rotating ring is rotatably connected to the rotating push rod, and a locking spring is provided between the rotating ring and the connecting block. The rotating push rod and the connecting block are elastically connected by the locking spring.

[0011] Optionally, the exhaust device has an exhaust port on the side near the wafer body, and a vacuum pump is fixedly connected to the side of the exhaust device.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. The rotating wafer is dried by blowing air from above through the air supply pipes on both sides. At the same time, an exhaust device is set at the bottom of the wafer to accelerate the air flow near the wafer body, thereby improving the drying efficiency of the wafer.

[0014] 2. To prevent the wafer body from rolling off the elastic clamp due to inertia when the fixing rod falls rapidly, a slow-falling spring is installed between the fixing rod and the turntable to make the fixing rod fall slowly.

[0015] 3. When the fixing rod falls to the bottom of the slide, the elastic clamping element on the fixing rod can support and block the wafer body to prevent the wafer from slipping.

[0016] Other features and advantages of the present invention will become clear from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure provided by this utility model;

[0018] Figure 2 This is a schematic diagram of the exhaust device provided by this utility model;

[0019] Figure 3 This is a schematic diagram of the elastic clamping component provided by this utility model;

[0020] Figure 4 This is a schematic diagram of the slide groove provided by this utility model;

[0021] Figure 5 This is a schematic diagram of the fixing rod provided by this utility model;

[0022] Figure 6 This is a schematic diagram of the turntable provided by this utility model;

[0023] Figure 7 This is a schematic diagram of the locking mechanism provided by this utility model.

[0024] Figure 8 This is a schematic diagram of the transverse through hole provided by this utility model;

[0025] Figure 9 This is a schematic diagram of the longitudinal groove provided by this utility model;

[0026] Figure 10 This is a schematic diagram of the rotary push rod provided by this utility model.

[0027] In the diagram: 1. Support; 2. Turntable; 201. Slide; 202. Connecting block; 3. Drive motor; 4. Main air supply pipe; 401. Branch air supply pipe; 5. Fixing rod; 6. Elastic clamping component; 7. Wafer body; 8. Exhaust device; 801. Exhaust port; 802. Vacuum pump; 9. Locking mechanism; 901. Locking block; 902. Locking spring; 903. Rotating push rod; 904. Rotating ring; 905. Horizontal through hole; 906. Longitudinal groove; 10. Descending spring. Detailed Implementation

[0028] To further understand the utility model content, features and effects of this utility model, the following embodiments are provided, and detailed descriptions are given in conjunction with the accompanying drawings.

[0029] like Figures 1 to 10 As shown in the figure, the present invention provides a drying device for wafer surface processing, including a support 1, a drive motor 3 fixedly connected to one side of the support 1, turntables 2 rotatably connected to the bottom of both sides of the support 1, the outer center of the turntables 2 being fixedly connected to the output shaft of the drive motor 3, four sets of fixing rods 5 symmetrically arranged circumferentially between the turntables 2, one set of fixing rods 5 being slidably connected to the two ends of the turntables 2, and the other fixing rods 5 being fixedly connected to the two ends of the turntables 2, several sets of elastic clamping parts 6 being fixedly connected to the fixing rods 5, a wafer body 7 being clamped in the middle of the elastic clamping parts 6, an exhaust device 8 being provided below the fixing rods 5, the exhaust device 8 being fixedly connected to the two ends of the support 1, a main air supply pipe 4 being provided above the fixing rods 5, the main air supply pipe 4 being fixedly connected to the support 1, and a branch air supply pipe 401 being fixedly connected below the main air supply pipe 4;

[0030] It should be noted that the drive motor 3 drives the turntable 2 to rotate, thereby causing the wafer body 7 to rotate. The air supply pipe 401 blows air from above the rotating wafer body 7 to both sides for drying. The exhaust device 8 below draws air from below the wafer body 7 to accelerate the airflow around the wafer body 7, thus improving the drying efficiency.

[0031] In a preferred embodiment of this application, a groove 201 is provided on the turntable 2, the fixing rod 5 is slidably connected to the groove 201, and a deceleration spring 10 is provided above the groove 201. One end of the deceleration spring 10 is fixedly connected to the turntable 2, and the other end of the deceleration spring 10 is fixedly connected to the fixing rod 5.

[0032] It should be noted that one end of the main gas supply pipe 4 is connected to a gas supply device for gas supply. The side of the sliding fixed rod 5 is curved. When the fixed rod 5 slides in the slide groove 201, the curved surface is always in contact with the inner wall of the slide groove 201 to prevent the fixed rod 5 from rotating during the sliding process. The initial state of the sliding fixed rod 5 is located below the slide groove 201. The elastic clamping member 6 on the fixed rod 5 can support and block the wafer body 7 to prevent the wafer body 7 from slipping. After the wafer body 7 is placed in the middle of the elastic clamping member 6, the fixed rod 5 is manually pulled up and fixed by the locking mechanism 9 to prevent the sliding fixed rod 5 from loosening during the turntable 2 process, which would cause the wafer body 7 to slip. When the wafer body 7 is removed, the pulling force of the deceleration spring 10 on the fixed rod 5 makes the fixed rod 5 fall slowly to prevent the fixed rod 5 from falling quickly and causing the wafer body 7 to roll off the middle of the elastic clamping member 6 due to inertia.

[0033] It is worth noting that the elastic clamping member 6 can be made of a softer material such as rubber to avoid damaging the wafer body 7 when clamping it.

[0034] In a preferred embodiment of this application, a locking mechanism 9 is provided on both sides of the slide groove 201. The locking mechanism 9 includes a locking block 901, and a rotating push rod 903 is slidably connected inside the locking block 901.

[0035] It should be noted that by rotating the push rod 903 laterally through the locking block 901, and then rotating it 90 degrees and pulling it back, the push rod 903 is engaged in the locking block 901, thereby fixing the sliding fixed rod 5 in the slide groove 201, ensuring that the elastic clamping member 6 stably clamps the wafer body 7 when the turntable 2 rotates.

[0036] In a preferred embodiment of this application, the locking block 901 has a transverse through hole 905 and a longitudinal groove 906 on its back side. The rotating push rod 903 is slidably connected to the locking block 901 through the transverse through hole 905 and the longitudinal groove 906.

[0037] It should be noted that when locking, after the rotating push rod 903 passes through the transverse through hole 905 and through the locking block 901, the rotating push rod 903 is rotated 90 degrees and then pulled back to engage it in the longitudinal groove 906, thus locking the rotating push rod 903. To unlock, simply push the rotating push rod 903 and rotate it 90 degrees and pull it back to unlock it. Then, lower the fixing rod 5 and remove the wafer body 7. The operation is simple and quick.

[0038] In a preferred embodiment of this application, a connecting block 202 is fixedly connected to the turntable 2, a rotating push rod 903 passes through the connecting block 202, and the rotating push rod 903 is slidably connected to the connecting block 202; a rotating ring 904 is rotatably connected to the rotating push rod 903, a locking spring 902 is provided between the rotating ring 904 and the connecting block 202, and the rotating push rod 903 and the connecting block 202 are elastically connected by the locking spring 902;

[0039] It should be noted that the locking spring 902 is stretched when the rotating push rod 903 is engaged in the longitudinal groove 906, ensuring that the rotating push rod 903 will not slip out of the longitudinal groove 906 when the turntable 2 rotates, thus ensuring the reliability of the locking.

[0040] In a preferred embodiment of this application, the exhaust device 8 has an exhaust port 801 corresponding to the side of the wafer body 7, and a vacuum pump 802 is fixedly connected to the side of the exhaust device 8.

[0041] It should be noted that the exhaust device 8 is placed below the wafer body 7 to extract air from the vicinity of the wafer body 7. At the same time, the air supply pipe 401 above the wafer body 7 blows air to both sides of the wafer body 7, forming an air duct from top to bottom, which accelerates the air flow around the wafer body 7 and improves the drying efficiency.

[0042] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A drying device for wafer surface processing, comprising a support (1), characterized in that: The support (1) is fixedly connected with a driving motor (3) on one side, rotatably connected with a rotating disc (2) on the bottom of both sides, and the rotating disc (2) is fixedly connected with the output shaft of the driving motor (3) on the outside center, four groups of fixed rods (5) are arranged in the circumferential symmetry between the rotating discs (2), the both ends of a group of the fixed rods (5) are slidably connected with the rotating disc (2), the both ends of the remaining fixed rods (5) are fixedly connected with the rotating disc (2), the fixed rods (5) are fixedly connected with elastic clamping pieces (6), the middle of the elastic clamping pieces (6) is clamped with a wafer body (7), the fixed rods (5) are provided below with an air extraction device (8), the both ends of the air extraction device (8) are fixedly connected with the support (1), the fixed rods (5) are provided above with a gas supply main pipeline (4), the gas supply main pipeline (4) is fixedly connected with the support (1), and the gas supply main pipeline (4) is fixedly connected below with a gas supply branch pipeline (401).

2. The drying apparatus for wafer surface processing according to claim 1, wherein: A sliding groove (201) is arranged on the rotating disc (2), the fixed rod (5) is slidably connected with the sliding groove (201), a slow descent spring (10) is arranged above the sliding groove (201), one end of the slow descent spring (10) is fixedly connected with the rotating disc (2), and the other end of the slow descent spring (10) is fixedly connected with the fixed rod (5).

3. The drying apparatus for wafer surface processing according to claim 2, wherein: Locking mechanisms (9) are arranged on both sides of the sliding groove (201), the locking mechanism (9) comprises a locking block (901), and a rotating push rod (903) is slidably connected in the locking block (901).

4. The drying apparatus for wafer surface processing according to claim 3, wherein: A transverse through hole (905) is arranged on the locking block (901), a longitudinal groove (906) is arranged on the back of the locking block (901), and the rotating push rod (903) is slidably connected with the locking block (901) through the transverse through hole (905) and the longitudinal groove (906).

5. The drying apparatus for wafer surface processing according to claim 4, wherein: A connecting block (202) is fixedly connected with the rotating disc (2), the rotating push rod (903) penetrates through the connecting block (202), and the rotating push rod (903) is slidably connected with the connecting block (202).

6. The drying apparatus for wafer surface processing according to claim 5, wherein: A rotating ring (904) is rotatably connected with the rotating push rod (903), a locking spring (902) is arranged between the rotating ring (904) and the connecting block (202), and the rotating push rod (903) is elastically connected with the connecting block (202) through the locking spring (902).

7. The drying apparatus for wafer surface processing according to claim 1, wherein: An air extraction port (801) is arranged on the side of the air extraction device (8) close to the wafer body (7), and a vacuum pump (802) is fixedly connected with the air extraction device (8).

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