Equipment for detecting thickness of flattened area of welding strip

Abstract

The utility model discloses a thickness detection device for a flattened area of a welding strip. Wherein a plurality of welding strip placing grooves are formed in the upper surface of the welding strip tray, the welding strip placing grooves are long-strip-shaped rectangular grooves, the welding strip placing grooves are arranged in a row in the width direction of the welding strip tray, the ends of the welding strip placing grooves are flush, and the welding strip placing grooves are used for placing welding strips; a supporting boss is arranged at the groove bottom of the middle area of each welding strip containing groove, all the supporting bosses are arranged in a row in the width direction of the welding strip containing grooves, and the supporting bosses are used for supporting a welding strip flattening area. The equipment body is provided with a hollow tray containing space, and the tray containing space forms an opening in the end face of one side of the equipment body. The device body further comprises a plurality of thickness detection parts, the thickness detection parts and the supporting bosses are arranged in a one-to-one correspondence mode, and the thickness detection parts are used for pressing the welding strips on the corresponding supporting bosses downwards and detecting the thickness of the welding strips above the supporting bosses. And the detection efficiency and precision are improved.

Description

Technical Field

[0001] This utility model relates to a device for detecting the thickness of the flattened area of ​​a welding strip. Background Technology

[0002] With the rapid development of the photovoltaic industry, large-size, small-pitch modules have become an indispensable main product series in the photovoltaic market. The increase in cell size and the full-scale production of rectangular cells have led to the mass production of small-pitch modules by various photovoltaic module manufacturers. The small-pitch design has not only gained recognition in terms of appearance, but also significantly improved the encapsulation power of photovoltaic modules under small-pitch and large-size conditions. Most new products utilize high-density technologies such as shingled bonding and small cell spacing. For example, modules produced with 182*183.75mm, 182*210mm, and 210*210mm cells are all designed with a small-pitch profile according to current standard designs, with a cell spacing of 0.8mm. Small-pitch will become the mainstream. Under small-pitch conditions, the requirements for the flattening thickness of the solder strip are more stringent. If the flattening thickness does not meet the standard, problems such as cell cracking and forked microcracks are prone to occur. Monitoring the flattening thickness has become a key management focus for single / double-glass module factories.

[0003] The solder strips used in existing photovoltaic modules are cylindrical when straightened, but become flat in the middle when flattened. Figure 1 The image shown is a top view of the solder strip after it has been flattened.

[0004] In existing technologies, the thickness of the flattened area of ​​the welding strip is measured manually using a micrometer, which is labor-intensive, time-consuming, and prone to errors caused by manual operation. Utility Model Content

[0005] This invention provides a device for detecting the thickness of the flattened area of ​​a weld strip, thereby improving the efficiency and accuracy of weld strip thickness detection.

[0006] The present invention achieves the above objectives through the following technical solutions.

[0007] This utility model provides a device for detecting the thickness of the flattened area of ​​a welding strip, including a welding strip tray and a device body;

[0008] The upper surface of the welding strip tray is provided with multiple welding strip placement slots. The welding strip placement slots are long rectangular slots. The multiple welding strip placement slots are arranged in a row along their width direction. The ends of the multiple welding strip placement slots are flush. The welding strip placement slots are used to place welding strips.

[0009] A support boss is provided on the bottom of the groove in the middle area of ​​each of the welding strip placement grooves. All the support bosses are arranged in a row along the width direction of the welding strip placement groove. The support bosses are used to support the flattened area of ​​the welding strip.

[0010] The main body of the equipment has a hollow tray receiving space, and the tray receiving space forms an opening on one side end face of the main body of the equipment, the opening being used for the welding strip tray to enter and exit the tray receiving space;

[0011] The main body of the equipment also includes multiple thickness detection components, which are arranged one-to-one with the multiple support bosses. The thickness detection components are used to press the welding strip on the corresponding support boss downward and detect the thickness of the welding strip above the support boss.

[0012] In some embodiments, the thickness detection component includes: a pressure sensor, a displacement sensor, an indenter, and a drive component;

[0013] The pressure sensor is used to detect the pressure between the pressure needle and the welding strip;

[0014] The driving component is used to drive the pressure needle to move up and down;

[0015] The free end of the pressure needle faces downwards;

[0016] The displacement sensor is used to detect the displacement value of the pressure needle.

[0017] After the equipment is properly debugged, the initial position of the pressure pin and the position of the supporting boss are known. The drive unit drives the pressure pin to move downwards gradually. When the pressure pin contacts and presses against the flattened area of ​​the solder strip, the pressure sensor detects a significant increase in pressure. At this point, the drive unit stops driving the pressure pin downwards, and the displacement sensor detects the distance the pressure pin has moved downwards from the initial state to the current state. By subtracting the downward distance of the pressure pin from the initial distance between the pressure pin and the supporting boss, the thickness of the flattened area of ​​the solder strip can be determined.

[0018] Data from pressure and displacement sensors can be transmitted to the device's controller (not shown), which can control the start / stop and movement direction of the drive components.

[0019] In some embodiments, the drive component includes a cylinder.

[0020] In some other embodiments, the driving component includes a motor. For example, refer to Chinese Utility Model Patent CN211121140U for a coal caking layer thickness detection device.

[0021] It should be noted that this utility model does not limit the structure and working principle of a single thickness detection component, and it can be designed according to existing related technologies.

[0022] In some embodiments, the top surface of the support boss is rectangular.

[0023] In some embodiments, the top surface of the support boss is rectangular, and the length direction of the top surface of the support boss is the length direction of the welding strip placement groove.

[0024] This design makes full use of the space in the solder strip placement slot.

[0025] In some embodiments, during the detection state, the normal direction of the end face where the opening of the main body of the device is located is perpendicular to the length direction of the strip placement groove of the strip tray.

[0026] When inserting the welding strip tray into the main body of the equipment, the extension direction of the welding strip placement groove is parallel to the end face where the opening of the main body of the equipment is located.

[0027] In some embodiments, during the detection state, the normal direction of the end face where the opening of the main body of the device is located is parallel to the length direction of the solder strip placement groove of the solder strip tray.

[0028] When inserting the welding strip tray into the main body of the equipment, the extension direction of the welding strip placement groove is perpendicular to the end face where the opening of the main body of the equipment is located.

[0029] In some embodiments, the top surface of the support boss is flush with the top opening of the strip placement groove.

[0030] This setup ensures that the bottom height of the flattened area of ​​each weld strip to be measured is equal, improving the consistency of the inspection.

[0031] In some other embodiments, the top surface of the support boss is slightly lower than the top opening of the solder strip placement groove.

[0032] In some embodiments, the diameter of the welding strip before flattening is 0.26 mm, and the width of the welding strip placement groove is less than or equal to 0.5 mm.

[0033] That is, the diameter of the unflattened portion of the solder strip is 0.26mm, which is a common specification.

[0034] The width of the solder strip placement groove is slightly wider, which is beneficial for placing the solder strip into it.

[0035] In some embodiments, the length of the support boss is in the range of 9mm to 11mm, and the spacing between adjacent solder strip placement slots is 3mm to 5mm.

[0036] This design maximizes the density of the solder strip placement slots and avoids structural interference between the flattened areas of the solder strip.

[0037] The beneficial effects of this utility model are as follows:

[0038] On the one hand, it enables simultaneous detection of the thickness of the flattened areas of multiple weld strips, thereby improving detection efficiency.

[0039] On the other hand, it avoids measurement errors caused by manual inspection. Attached Figure Description

[0040] Figure 1 This is a top view of the solder strip after it has been flattened.

[0041] Figure 2 This is a top view of the welding strip tray in the welding strip flattening area thickness detection device of this utility model.

[0042] Figure 3 This is a schematic diagram of the combined operation of the welding strip tray and the main body of the welding strip flattening area thickness detection device of this utility model.

[0043] Figure 4 This is a schematic diagram of the main body of the welding strip flattening area thickness detection device of this utility model.

[0044] The attached figures are labeled as follows:

[0045] 1. Welding strip tray;

[0046] 11. Welding strip placement groove; 12. Support boss;

[0047] 2. Main body of the equipment;

[0048] 21. Bottom support platform;

[0049] 22. Pressure sensor;

[0050] 23. Displacement sensor;

[0051] 24. Pressing needle;

[0052] 25. Cylinder;

[0053] 26. Pallet capacity. Detailed Implementation

[0054] The present invention will be further described below with reference to specific embodiments, but the scope of protection of the present invention is not limited thereto.

[0055] Note: The vertical relationship defined in this utility model refers to the relative positional relationship of the welding strip flattening area thickness detection device when it is in use.

[0056] Example

[0057] Figure 2 This is a top view of the welding strip tray in the welding strip flattening area thickness detection device of this utility model. Figure 3 This is a schematic diagram of the combined operation of the welding strip tray and the main body of the welding strip flattening area thickness detection device of this utility model. Figure 4This is a schematic diagram of the main body of the welding strip flattening area thickness detection device of this utility model.

[0058] refer to Figures 2 to 4 An embodiment of this utility model provides a device for detecting the thickness of the flattened area of ​​a welding strip.

[0059] The equipment for detecting the thickness of the flattened area of ​​the welding strip includes a welding strip tray 1 and the main body of the equipment 2.

[0060] Multiple solder strip placement slots 11 are provided on the upper surface of the solder strip tray 1. Each solder strip placement slot 11 is a long rectangular slot. The multiple solder strip placement slots 11 are arranged in a row along their width direction. The ends of the multiple solder strip placement slots 11 are flush. The solder strip placement slots 11 are used to place solder strips.

[0061] A support boss 12 is provided on the bottom of the groove in the middle area of ​​each strip placement groove 11. All the support bosses 12 are arranged in a row along the width direction of the strip placement groove 11. The support bosses 12 are used to support the flattened area of ​​the strip.

[0062] The main body of the equipment 2 has a hollow pallet holding space 26. The pallet holding space 26 has an opening on one side end face of the main body of the equipment 2. The opening is used for the welding strip pallet 1 to enter and exit the pallet holding space 26.

[0063] The bottom of the tray-accommodating space 26 is defined by the bottom support platform 21.

[0064] When in use, the welding strip tray is placed on the bottom support platform 21.

[0065] The main body 2 of the equipment also includes multiple thickness detection components, which are arranged one-to-one with multiple support bosses 12. The thickness detection components are used to press the welding strip on the corresponding support boss 12 downward and detect the thickness of the welding strip above the support boss 12.

[0066] With the welding strip tray 1 placed inside the main body 2 of the equipment, the thickness detection component is positioned above the welding strip tray 1.

[0067] The thickness detection component includes: a pressure sensor 22, a displacement sensor 23, an indenter 24, and a drive component;

[0068] Pressure sensor 22 is used to detect the pressure between pressure needle 24 and solder strip;

[0069] The drive unit is used to drive the pressure needle 24 to move up and down;

[0070] The free end of the pressure needle 24 faces downwards;

[0071] Displacement sensor 23 is used to detect the displacement value of pressure needle 24.

[0072] After the equipment is properly debugged, the initial position of the pressure pin 24 and the position of the supporting boss 12 are known. The drive unit drives the pressure pin 24 to move downwards gradually. When the pressure pin 24 contacts and presses the flattened area of ​​the solder strip, the pressure value detected by the pressure sensor 22 will increase significantly. At this time, the drive unit stops driving the pressure pin 24 to move downwards, and the displacement sensor 23 detects the distance the pressure pin 24 has moved downwards from the initial state to the current state. By subtracting the downward movement distance of the pressure pin 24 from the initial distance between the pressure pin 24 and the supporting boss 12, the thickness value of the flattened area of ​​the solder strip can be determined.

[0073] Data from pressure sensor 22 and displacement sensor 23 can be transmitted to the device controller (not shown), which can control the start / stop and movement direction of the drive components.

[0074] In this embodiment, the driving component includes a cylinder 25.

[0075] In this embodiment, the welding strip tray 1 is rectangular in shape, and the tray accommodating space 26 protrudes upward in the middle to provide accommodating space for the thickness detection component.

[0076] The controller controls the delivery of gas into cylinder 25 or controls the discharge of gas from cylinder 25. The output end of cylinder 25 is connected to pressure needle 24.

[0077] The top surface of the supporting boss 12 is rectangular.

[0078] The support boss 12 extends along the width direction of the welding strip placement groove 11 to both sides of the welding strip placement groove 11.

[0079] That is, the welding strip placement groove 11 is divided into two sections by the supporting boss 12.

[0080] Specifically, the top surface of the support boss 12 is rectangular, and the length direction of the top surface of the support boss 12 is the length direction of the welding strip placement groove 11.

[0081] This design makes full use of the space in the solder strip placement groove 11.

[0082] In the testing state, the normal direction of the end face where the opening of the main body 2 is located is perpendicular to the length direction of the welding strip placement groove 11 of the welding strip tray 1.

[0083] When the welding strip tray 1 is inserted into the main body 2 of the equipment, the extension direction of the welding strip placement groove 11 is parallel to the end face where the opening of the main body 2 of the equipment is located.

[0084] The top surface of the support boss 12 is flush with the top opening of the welding strip placement groove 11.

[0085] This setup ensures that the bottom height of the flattened area of ​​each weld strip to be measured is equal, improving the consistency of the inspection.

[0086] The diameter of the welding strip before flattening is 0.26 mm, and the width of the welding strip placement groove 11 is less than or equal to 0.5 mm.

[0087] That is, the diameter of the unflattened portion of the solder strip is 0.26mm, which is a common specification.

[0088] The welding strip placement groove 11 is slightly wider, which is beneficial for placing the welding strip into it.

[0089] The length of the support boss 12 is in the range of 9mm to 11mm, and the spacing between adjacent solder strip placement grooves 11 is 3mm to 5mm.

[0090] This design maximizes the density of the solder strip placement grooves 11 and avoids structural interference between the flattened areas of the solder strip.

[0091] In this embodiment, the welding strip flattening area inspection device also includes a human-machine interface element (e.g., a touch screen). The human-machine interface element is connected to the controller and can control the start and stop of the displacement sensor 23 and its moving direction, and can display the thickness value of the flattened area of ​​each welding strip.

[0092] This utility model is not limited to the above-described embodiments. Any modifications, improvements, or substitutions that can be conceived by those skilled in the art without departing from the essential content of this utility model shall fall within the scope of this utility model.

Claims

1. A weld strip crush area thickness detection apparatus, characterized by, The solder strip tray and the device body are included. A plurality of solder strip placement grooves are arranged on the upper surface of the solder strip tray, the solder strip placement grooves are long rectangular grooves, the plurality of solder strip placement grooves are arranged in a row along the width direction thereof, the end portions of the plurality of solder strip placement grooves are flush, and the solder strip placement grooves are used for placing solder strips. A support boss is arranged on the groove bottom at the middle region of each solder strip placement groove, all the support bosses are arranged in a row along the width direction of the solder strip placement groove, and the support boss is used for supporting the flattened region of the solder strip. The device body has a hollow tray containing space, the tray containing space forms an opening on one side end surface of the device body, and the opening is used for the solder strip tray to enter and exit the tray containing space. The device body further includes a plurality of thickness detection components, the plurality of thickness detection components are arranged one-to-one with the plurality of support bosses, and the thickness detection component is used for pressing the solder strip on the corresponding support boss downward and detecting the thickness of the solder strip above the support boss.

2. The weld band crush area thickness detection apparatus of claim 1, wherein, The thickness detection component includes a pressure sensor, a displacement sensor, a pressing needle, and a driving component. The pressure sensor is used for detecting the pressure between the pressing needle and the solder strip. The driving component is used for driving the pressing needle to move up and down. The free end of the pressing needle faces downward. The displacement sensor is used for detecting the displacement value of the pressing needle.

3. The weld band crush area thickness detection apparatus of claim 2, wherein, The driving component includes a pneumatic cylinder.

4. The weld band crush area thickness detection apparatus of claim 1, wherein, The top surface of the support boss is rectangular.

5. The weld band crush area thickness detection apparatus of claim 1, wherein, The top surface of the support boss is rectangular, and the length direction of the top surface of the support boss is the length direction of the solder strip placement groove.

6. The weld band crush area thickness detection apparatus of claim 1, wherein, In the detection state, the normal direction of the end surface of the opening of the device body is perpendicular to the length direction of the solder strip placement groove of the solder strip tray.

7. The weld band crush area thickness detection apparatus of claim 1, wherein, In the detection state, the normal direction of the end surface of the opening of the device body is parallel to the length direction of the solder strip placement groove of the solder strip tray.

8. The weld band crush area thickness detection apparatus of claim 1, wherein, The top surface of the support boss is flush with the top opening of the solder strip placement groove.

9. The weld band crush area thickness detection apparatus of claim 8, wherein, The diameter of the solder strip before flattening is 0.26 mm, and the width of the solder strip placement groove is less than or equal to 0.5 mm.

10. The weld band crush area thickness detection apparatus of claim 9, wherein, The length of the support boss is in the range of 9 mm to 11 mm, and the pitch between adjacent solder strip placement grooves is 3 mm to 5 mm.

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