Anti-condensation structure and test box

Abstract

The utility model relates to an anti-condensation structure and a test box. The anti-condensation structure provided by the utility model comprises a test box body which is provided with a terminal hole site; the wiring terminals penetrate through the terminal hole sites, the inner ends of the wiring terminals are located inside the test box body, and the outer ends of the wiring terminals are located outside the test box body; the anti-condensation assembly comprises a temperature adjusting piece, a temperature control piece and a controller, and the temperature adjusting piece and the temperature control piece are both connected with the controller; the temperature adjusting piece is arranged close to the outer end of the wiring terminal and is used for adjusting the temperature of the wiring terminal; the temperature control piece comprises a first temperature sensor and a second temperature sensor, and the first temperature sensor is arranged at the outer end of the wiring terminal; the second temperature sensor is arranged on the outer wall surface of the test box body. The anti-condensation structure provided by the utility model can effectively avoid condensation of partial terminals exposed out of the test box in a low-temperature test state, improves the operation stability of the test box, and prolongs the service life of equipment at the same time.

Description

Technical Field

[0001] This utility model relates to the field of testing equipment, and in particular to an anti-condensation structure and a test chamber. Background Technology

[0002] When conducting equipment performance tests or simulating special environmental conditions, it is often necessary to connect the test chamber through metal terminals to achieve electrical connection between the inside and outside of the chamber.

[0003] When the test chamber is set for low-temperature testing, the metal terminals, due to their excellent thermal conductivity, conduct the cold air inside the chamber to the outside. When the ambient temperature is relatively high, the air temperature in contact with the terminals can drop rapidly. Once the air temperature drops below the dew point, water vapor in the air will condense on the terminals and their surrounding surfaces, forming condensate. This condensation caused by low-temperature cooling can lead to electrical short circuits, preventing the equipment from operating normally and even damaging the delicate electronic components inside, resulting in inaccurate test results. Furthermore, long-term adhesion of condensate to the surface of the metal terminals accelerates the corrosion process, reduces their mechanical strength and electrical performance, and seriously affects the reliability and service life of the equipment.

[0004] Patent application number 202220526800.7 discloses an anti-condensation wiring structure for a lithium battery high and low temperature chamber terminal. One end of the terminal extends outside the high and low temperature chamber, and a protective box is installed on the outer side of that end. A PCT heater is fixed inside the protective box, replacing the original wound heating wire structure, to heat the air inside the protective box and prevent condensation. However, in this anti-condensation method, the inside of the protective box is a sealed space. The terminal generates heat during operation, and due to the inability to effectively dissipate heat in the sealed environment, the temperature inside the protective box may rise. This could affect the performance of the high and low temperature chamber and even adversely affect the test samples. Utility Model Content

[0005] Based on this, the purpose of this utility model is to provide an anti-condensation structure, which effectively regulates the temperature of the wiring terminals by setting anti-condensation components, effectively preventing external condensation caused by low-temperature conduction, and ensuring the stability of the wiring terminal connection.

[0006] Another objective of this invention is to provide a test chamber that can effectively prevent condensation from occurring on some terminals exposed outside the test chamber during low-temperature testing, thereby improving the operational stability of the test chamber and extending the service life of the equipment.

[0007] An anti-condensation structure, comprising:

[0008] The test chamber body has terminal holes on its outer shell;

[0009] The wiring terminal has its inner end passing through the terminal hole and located inside the test chamber body, and its outer end located outside the test chamber body;

[0010] The anti-condensation component includes a temperature regulating element, a temperature controlling element, and a controller. Both the temperature regulating element and the temperature controlling element are connected to the controller. The temperature regulating element is connected to the outer end of the terminal block and is used to adjust the temperature of the terminal block. The temperature controlling element includes a first temperature sensor and a second temperature sensor. The first temperature sensor is located at the outer end of the terminal block and is used to detect the temperature at the outer end of the terminal block. The second temperature sensor is located on the outer wall of the test chamber body and is used to detect the ambient temperature at the outer end of the terminal block.

[0011] Furthermore, the temperature regulating element is a semiconductor refrigeration element, which has a heating part and a cooling part. The heating part is located at the end of the semiconductor refrigeration element that is close to the terminal block, and the cooling part is located at the end of the semiconductor refrigeration element that is away from the terminal block.

[0012] Furthermore, the anti-condensation component is also provided with a heat insulation element, which is attached to the inner wall of the terminal hole and extends to the outer wall of the test chamber body.

[0013] Furthermore, the anti-condensation structure also includes a junction box, which is detachably connected to the test chamber body and covers the outside of the wiring terminals and the anti-condensation component.

[0014] Furthermore, the junction box has a cutout opposite the position of the cooling unit, and the cooling unit passes through the cutout and protrudes outside the junction box.

[0015] Furthermore, the temperature regulating component also includes a heat-conducting component, which is sandwiched between the heating part and the wiring terminal.

[0016] Furthermore, the heat-conducting component is a heat-conducting pad, one end of which is bonded to the heating part, and the other end is covered with the outer wall surface of the wiring terminal.

[0017] Furthermore, the anti-condensation component also includes an insulating sheet disposed between the wiring terminal and the terminal hole.

[0018] A test chamber, comprising: the anti-condensation structure described in this utility model.

[0019] The beneficial effects of this utility model are as follows:

[0020] (1) By setting up anti-condensation components, the temperature of the wiring terminals can be effectively controlled, which can effectively prevent external condensation caused by low-temperature conduction when the test chamber is in low-temperature working state, and ensure the stability of the wiring terminal connection.

[0021] (2) By setting two sets of temperature sensors to monitor the external ambient temperature and the temperature of the wiring terminals in real time, the operation of the temperature control component can be precisely controlled to achieve precise control. At the same time, it can avoid the situation where the wiring terminals are overheated due to excessive temperature, which would affect the stable operation of the test chamber.

[0022] (3) When the test chamber is in low-temperature working condition, semiconductor cooling components are used to heat the terminals, which makes it easy to achieve precise temperature control;

[0023] (4) By installing heat insulation components at the terminal holes and the outer periphery of the test chamber, the cold energy generated by the cooling part of the semiconductor refrigeration component can be prevented from being transferred to the outer wall of the test chamber, thus preventing condensation.

[0024] To better understand and implement this invention, the following detailed description is provided in conjunction with the accompanying drawings. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the test chamber provided in the embodiments of this application;

[0026] Figure 2 This is one embodiment of the anti-condensation structure provided in this application.

[0027] Figure 3 This is a second embodiment of the anti-condensation structure provided in this application.

[0028] In the diagram: 10-Test chamber body; 20-Terminal block; 30-Anti-condensation component; 31-Temperature regulator; 32-Temperature controller; 321-First temperature sensor; 322-Second temperature sensor; 33-Insulation component; 34-Heat conduction component; 40-Gateway box. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] In the description of this utility model, it should be noted that the terms "vertical direction," "up," "down," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0031] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] Please see Figure 1 and Figure 2 This application provides an anti-condensation structure, including: a test chamber body 10, a terminal block 20, and an anti-condensation component 30. The terminal block 20 is inserted into the outer wall of the test chamber body 10, and the anti-condensation component 30 is disposed on the outer periphery of the terminal block 20. Specifically, the test chamber body 10 has terminal holes; the terminal block 20 passes through the terminal holes, with its inner end located inside the test chamber body 10 and its outer end located outside the test chamber body 10. The anti-condensation component 30 includes a temperature regulating element 31, a temperature controlling element 32, and a controller, with both the temperature regulating element 31 and the temperature controlling element 32 connected to the controller. Temperature regulating element 31 is disposed near the outer end of terminal 20 and is used to regulate the temperature of terminal 20, i.e., to heat terminal 20; temperature control element 32 includes a first temperature sensor 321 and a second temperature sensor 322. The first temperature sensor 321 is disposed at the outer end of terminal 20 and is used to detect the real-time temperature of the outer end of terminal 20 and feed the real-time temperature back to the controller; the second temperature sensor 322 is disposed on the outer wall of the test chamber body 10 and is used to detect the ambient temperature of the outer end of terminal 20 and feed the real-time temperature back to the controller.

[0033] Specifically, the controller determines whether the temperature regulating element 31 is working by comparing the real-time temperatures detected by the first temperature sensor 321 and the second temperature sensor 322, and adjusts the heat supply of the temperature regulating element 31 accordingly. Preferably, the real-time temperature of the outer end of the terminal 20 is higher than the ambient temperature of the outer end of the terminal 20, and the temperature difference is maintained at 5-10°C. Under this temperature difference condition, condensation can be effectively prevented from forming on the outer wall of the terminal 20, and the terminal 20 will not overheat, thus affecting the stability of the test.

[0034] Please see Figure 1-3 Furthermore, as a specific implementation, the temperature regulating element 31 is a semiconductor cooling element. This semiconductor cooling element can switch between heating and cooling by adjusting the magnitude and direction of the current, simultaneously regulating both heating and cooling capacity. Simultaneously, precise calculations are performed based on the size of the terminal 20 and the expected heat load to ensure sufficient heat is provided to offset the coldness generated by the conduction of heat. In this embodiment, the semiconductor cooling element has a heating section and a cooling section. The heating section is located at the end of the semiconductor cooling element close to the terminal 20, used to heat the terminal 20 when the test chamber is operating at low temperatures. The cooling section is located at the end of the semiconductor cooling element away from the terminal 20, and can radiate a certain amount of cold energy to cool the air around the terminal 20, thereby reducing the temperature difference between the cold-conducting terminal and the surrounding hot air, and further preventing condensation. Simultaneously, due to the decrease in ambient temperature, the input current of the semiconductor cooling element can be appropriately reduced, decreasing the heating capacity and saving energy.

[0035] Furthermore, in some embodiments, the anti-condensation component 30 is also provided with a heat insulation element 33 to prevent the cold air generated by the refrigeration unit from being conducted to the outer wall of the test chamber, which would cause condensation on the outer wall due to low temperature. This condensation flowing onto the wiring terminals 20 or the wiring connections could also damage or short-circuit the metal wiring terminals 20. Furthermore, the heat insulation element 33 is attached to the inner wall of the terminal hole and extends towards the outer wall of the test chamber body 10. It is understood that the coverage size of the heat insulation element 33 can be determined according to the arrangement of the semiconductor refrigeration unit, which will not be elaborated here.

[0036] Furthermore, in some embodiments, the anti-condensation structure also includes a junction box 40, which is detachably connected to the test chamber body 10 and covers the outside of the terminal block 20 and the anti-condensation component 30. The junction box 40 and the test chamber body 10 form a heat-insulating chamber to reduce the impact of external airflow on the heating effect of the terminal block 20, effectively reduce the heat loss of the terminal block 20, and help to form a stable wiring space.

[0037] Furthermore, in some embodiments, the junction box 40 has a cutout directly opposite the cooling unit. The cooling unit passes through the cutout and is partially or completely exposed outside the junction box 40. This allows the cooling energy generated by the cooling unit to be directly discharged to the outside of the insulation chamber, preventing excessive cooling of the air inside the insulation chamber and thus avoiding adverse effects on other parts of the equipment. It is understood that the mounting gap between the cutout and the semiconductor cooling component is sealed with sealant to prevent external air or condensate from entering the insulation chamber through this mounting gap.

[0038] In another embodiment, a heat sink is provided in the cooling section, which is exposed outside the junction box 40 through the cutout, to conduct cold energy to the outside of the insulation chamber, and this is not the only embodiment.

[0039] Furthermore, in some embodiments, the anti-condensation assembly 30 further includes a heat-conducting element 34, which is sandwiched between the heating element and the terminal 20 to ensure close contact with the terminal 20, thereby reducing thermal resistance and improving heat transfer efficiency. It is understood that the heat-conducting element 34 can be thermally conductive silicone grease or a soft thermally conductive pad to overcome the problem of low thermal conductivity caused by uneven contact surfaces. Preferably, in this embodiment, the heat-conducting element 34 is a thermally conductive pad, with one end bonded to the heating element and the other end covering the outer wall surface of the terminal 20. The size of this thermally conductive pad can be larger than the size of the heating surface of the semiconductor cooling element, covering the entire outer periphery of the terminal 20, which can improve the heating uniformity of the terminal 20.

[0040] Furthermore, in some embodiments, the anti-condensation component 30 also includes an insulating sheet disposed between the terminal block 20 and the terminal hole to prevent the terminal block 20 from contacting the test chamber body 10 and causing a short circuit.

[0041] This application also provides a test chamber with an anti-condensation structure, which can effectively prevent condensation from occurring on some terminals exposed outside the test chamber during low-temperature testing, thereby improving the operational stability of the test chamber and extending the service life of the equipment.

[0042] Compared with the prior art, the beneficial effects of the embodiments of this application are as follows:

[0043] (1) By setting up anti-condensation components, the temperature of the wiring terminals can be effectively controlled, which can effectively prevent external condensation caused by low-temperature conduction when the test chamber is in low-temperature working state, and ensure the stability of the wiring terminal connection.

[0044] (2) By setting two sets of temperature sensors to monitor the external ambient temperature and the temperature of the wiring terminals in real time, the operation of the temperature control component can be precisely controlled to achieve precise control. At the same time, it can avoid the situation where the wiring terminals are overheated due to excessive temperature, which would affect the stable operation of the test chamber.

[0045] (3) When the test chamber is in low-temperature working condition, semiconductor cooling components are used to heat the terminals, which makes it easy to achieve precise temperature control;

[0046] (4) By installing heat insulation components at the terminal holes and the outer periphery of the test chamber, the cold energy generated by the cooling part of the semiconductor refrigeration component can be prevented from being transferred to the outer wall of the test chamber, thus preventing condensation.

[0047] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and this utility model also intends to include these modifications and variations.

Claims

1. An anti-condensation structure, characterized by, The application relates to a condensation-preventing structure of a terminal of a test box. The test box body is provided with a terminal hole position in the shell; The terminal is arranged inside the test box body through the terminal hole position, and the outer end of the terminal is arranged outside the test box body; The condensation-preventing assembly comprises a temperature adjusting part, a temperature controlling part and a controller, the temperature adjusting part and the temperature controlling part are connected with the controller; the temperature adjusting part is connected with the outer end of the terminal, and is used for adjusting the temperature of the terminal; the temperature controlling part comprises a first temperature sensor and a second temperature sensor, the first temperature sensor is arranged at the outer end of the terminal, and is used for detecting the temperature of the outer end of the terminal; the second temperature sensor is arranged on the outer wall surface of the test box body, and is used for detecting the ambient temperature of the outer end of the terminal.

2. The condensation-preventing structure according to claim 1, wherein: The temperature adjusting part is a semiconductor refrigeration part, the semiconductor refrigeration part is provided with a heating part and a refrigerating part, the heating part is arranged at one end of the semiconductor refrigeration part close to the terminal; and the refrigerating part is arranged at the other end of the semiconductor refrigeration part away from the terminal.

3. The condensation-preventing structure according to claim 2, wherein: The condensation-preventing assembly is further provided with a heat insulation part, the heat insulation part is attached to the inner wall of the terminal hole position, and is arranged on the outer wall surface of the test box body.

4. The anti-condensation structure according to claim 3, wherein Further comprising: The terminal box is detachably connected to the test box body, and covers the terminal and the condensation-preventing assembly outside.

5. The condensation-preventing structure according to claim 4, wherein: The terminal box is provided with a cutout opposite to the position of the refrigerating part, and the refrigerating part is exposed outside the terminal box through the cutout.

6. The condensation-preventing structure according to claim 2, wherein: The condensation-preventing assembly further comprises a heat conducting part, the heat conducting part is clamped between the heating part and the terminal.

7. The condensation-preventing structure according to claim 6, wherein: The heat conducting part is a heat conducting adhesive pad, one end surface of the heat conducting adhesive pad is bonded to the heating part, and the other end surface of the heat conducting adhesive pad is wrapped on the outer wall surface of the terminal.

8. The condensation-preventing structure according to claim 1, wherein: The condensation-preventing assembly further comprises an insulating sheet, the insulating sheet is arranged between the terminal and the terminal hole position.

9. A test chamber, characterized by The condensation-preventing structure according to any one of claims 1-8. ​

Images