Optical module connecting device, optical communication equipment and data center

Abstract

The utility model provides an optical module connecting device, optical communication equipment and a data center. The optical module connecting device comprises a first cage assembly which comprises a first cage body and a second cage body of which inner cavities are communicated, and the first cage body forms at least one optical module port along a first direction; the second cage body is arranged on the printed circuit board; the second cage assembly forms at least one optical module port in a direction parallel to the first direction, and the second cage assembly is arranged on the printed circuit board; a heat dissipation channel is formed between the first cage body and the second cage assembly. According to the technical scheme of the invention, the first cage assembly and the second cage assembly are in a split (2-pipe) laminated design, so that the heat dissipation performance of the optical module can be improved after the optical module is inserted into the optical module port.

Description

Technical Field

[0001] This application relates to the field of optical communication equipment technology, and in particular to an optical module connection device, optical communication equipment, and data center. Background Technology

[0002] Switches are crucial devices in data centers. With the continuous improvement of computing power and communication speeds in data centers, the power consumption of optical modules adapted to switches is constantly increasing, as is the heat generated by these modules. Inadequate heat dissipation design can affect the stability and performance of both the optical modules and the switch. Therefore, improving the heat dissipation performance of optical modules within the optical cage is of paramount importance. Utility Model Content

[0003] This application provides an optical module connection device, an optical communication device, and a data center to improve the heat dissipation performance of optical modules.

[0004] In a first aspect, embodiments of this application provide an optical module connection device, comprising: a printed circuit board; a first cage assembly including a first cage body and a second cage body with internal cavities connected, wherein the first cage body forms at least one optical module port along a first direction; the second cage body is disposed on the printed circuit board; a second cage assembly forming at least one of the optical module ports in a direction parallel to the first direction, the second cage assembly being disposed on the printed circuit board; wherein, in a second direction, a heat dissipation channel is formed between the first cage body and the second cage assembly, and the second direction is perpendicular to the plane where the printed circuit board is located.

[0005] In one embodiment, the optical module port is used for plugging and unplugging a QSFP optical module, the size of the optical module port in the first direction ranges from 18.6 mm to 18.9 mm, and the size of the optical module port in the second direction ranges from 8.8 mm to 9 mm.

[0006] In one embodiment, the optical module connection device further includes a first heat sink disposed on the side of the first cage assembly away from the printed circuit board.

[0007] In one embodiment, the optical module port is used to plug in and unplug a first OSFP optical module, the first OSFP optical module being encapsulated with a heat dissipation component, and in the second direction, the size of the heat dissipation channel is smaller than the size of the optical module port.

[0008] In one embodiment, the size of the optical module port in the first direction ranges from 22.7 mm to 23 mm, and the size of the optical module port in the second direction ranges from 13.2 mm to 13.4 mm.

[0009] In one embodiment, the optical module port is used for plugging in and unplugging a second OSFP optical module, the size of the optical module port in the first direction ranges from 22.7 mm to 23 mm, and the size of the optical module port in the second direction ranges from 9.7 mm to 9.9 mm.

[0010] In one embodiment, the optical module connection device further includes a first heat sink disposed on the side of the first cage assembly away from the printed circuit board.

[0011] In one embodiment, the heat dissipation channel is an air duct, and / or, a second heat sink is provided in the heat dissipation channel.

[0012] In one embodiment, at least one spring is provided at the bottom of the optical module port, the spring extending obliquely away from the printed circuit board in the direction toward the second cage.

[0013] Secondly, embodiments of this application provide an optical communication device, including the optical module connection device described in the first aspect.

[0014] In one embodiment, the optical communication device further includes a device chip, and a conductive layer is disposed in the printed circuit board for connecting the optical module port of the optical module connection device and the device chip.

[0015] In one embodiment, the optical communication device further includes a device chip and a flight cable, the flight cable being used to connect the optical module port of the optical module connection device and the device chip.

[0016] Thirdly, embodiments of this application provide a data center, including a computer room and at least one optical communication device as described in the second aspect, wherein the optical communication device is disposed in the computer room.

[0017] According to the technical solution of this application embodiment, a heat dissipation channel is formed between the first cage and the second cage assembly in the second direction. That is, the first cage assembly and the second cage assembly are a separate stacked design, and a heat dissipation channel is formed between the upper and lower optical module ports, thereby improving the heat dissipation performance of the optical module after the optical module is inserted into the optical module port.

[0018] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0019] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0020] Figure 1A and Figure 1D A perspective view of an optical module connection device 100 according to an embodiment of this application is shown;

[0021] Figure 1B This is a front view of the optical module connection device 100 according to an embodiment of this application;

[0022] Figure 1C A side view of an optical module connection device 100 according to an embodiment of this application is shown;

[0023] Figure 2A A perspective view of an optical module connection device 200 according to an embodiment of this application is shown;

[0024] Figure 2B This is a front view of an optical module connection device 200 according to an embodiment of this application;

[0025] Figure 2C A side view of an optical module connection device 200 according to an embodiment of this application is shown;

[0026] Figure 3A A perspective view of an optical module connection device 300 according to an embodiment of this application is shown;

[0027] Figure 3B This is a front view of an optical module connection device 300 according to an embodiment of this application;

[0028] Figure 3C A side view of an optical module connection device 300 according to an embodiment of this application is shown;

[0029] Figure 4 A side view of an optical module connection device 400 according to an embodiment of this application is shown;

[0030] Figure 5A This is a front view of an optical module connection device 500 according to an embodiment of this application;

[0031] Figure 5B A side view of an optical module connection device 500 according to an embodiment of this application is shown;

[0032] Figure 6 This is a side view of an optical module connection device 600 according to an embodiment of this application. Detailed Implementation

[0033] Many specific details are set forth in the following description to provide a full understanding of this application. However, this application can be implemented in many other forms than those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this application; therefore, this application is not limited to the specific embodiments disclosed below.

[0034] An optical module is a device used to convert electrical signals into optical signals or vice versa. It is primarily used in fiber optic communication systems to achieve high-speed data transmission. Optical modules mainly include quad small form-factor pluggable (QSFP) modules and eight-channel octagonal small form-factor pluggable (OSFP) modules. QSFP modules include: the QSFP28, which supports a data transmission rate of 100 gigabits per second (Gbps); the QSFP56, which supports a data transmission rate of 200 Gbps; and the quad small form-factor pluggable-double density (QSFP-DD), which supports a data transmission rate of 400 Gbps. OSFP modules can support a data transmission rate of 800 Gbps.

[0035] An optical cage is a structural component used to mount and secure optical modules. The optical cage has one or more optical module ports for inserting and removing optical modules. Based on the optical cage, optical modules can be correctly inserted into the optical module ports and electrically connected to the circuit boards or other components of optical communication equipment.

[0036] As data center computing power and the data transmission rates supported by optical modules continue to increase, the power consumption and heat generated by optical modules are also constantly increasing. This application aims to provide an optical module connection device (i.e., an optical cage) that, through a split-layer design, forms a heat dissipation channel between the upper and lower optical module ports, thereby improving the heat dissipation performance of the optical module.

[0037] Example 1

[0038] Figure 1A and Figure 1D A perspective view of an optical module connection device 100 according to an embodiment of this application is shown; Figure 1B This is a front view of the optical module connection device 100 according to an embodiment of this application; Figure 1C A side view of an optical module connection device 100 according to an embodiment of this application is shown. Figure 1A , Figure 1B , Figure 1C and Figure 1D As shown, the optical module connection device 100 includes a first cage assembly 110, a second cage assembly 120, and a printed circuit board (PCB) 130. Exemplarily, both the first cage assembly 110 and the second cage assembly 120 may have through holes to facilitate heat dissipation.

[0039] The first cage assembly 110 includes a first cage body 111 and a second cage body 112 with interconnected inner cavities. Exemplarily, the first cage body 111 and the second cage body 112 can be integrally formed.

[0040] The second cage 112 and the second cage assembly 120 are both disposed on the printed circuit board 130. Exemplarily, the second cage 112 and the second cage assembly 120 are fixed to the printed circuit board 130 by means of mechanical connection. The mechanical connection means include, but are not limited to, connection by fastener, connection by plug-in structure or welding, etc., and the embodiments of this application do not specifically limit this.

[0041] The first cage 111 forms one or more optical module ports 140 along the first direction L1, and the second cage assembly 120 forms one or more optical module ports 140 in a direction parallel to the first direction L1. The optical module port 140, also called an optical module connector, is used for inserting and removing optical modules (not shown in the figure). When an optical module is inserted into the optical module port 140, it can be electrically connected to the optical module port 140.

[0042] It should be noted that, Figure 1A , Figure 1B , Figure 1C and Figure 1D In the first cage 111, four optical module ports 140 are formed, and the second cage assembly 120 forms four optical module ports 140. It is understood that the number of optical module ports 140 is not specifically limited in this embodiment of the application, and can be adjusted accordingly according to actual application requirements.

[0043] In this embodiment, a heat dissipation channel 150 is formed between the first cage 111 and the second cage assembly 120 in the second direction L2, wherein the second direction L2 is perpendicular to the plane where the printed circuit board 130 is located. That is, the first cage assembly 110 and the second cage assembly 120 are a split (2-piece) stacked design, and a heat dissipation channel 150 is formed between the upper and lower (second direction L2) optical module ports 140, thereby improving the heat dissipation performance of the upper and lower optical modules (especially the lower optical module) after the optical module is inserted into the optical module port 140.

[0044] In one embodiment, the optical module connection device 100 can adopt a wind-cooled heat dissipation method, and the heat dissipation channel 150 is an air duct, that is, the heat dissipation channel 150 is arranged according to the airflow direction, so that the heat of the upper and lower optical modules is carried away by the cold air in the heat dissipation channel 150, thereby realizing the wind-cooled heat dissipation of the optical module.

[0045] In one embodiment, the optical module connection device 100 may employ air cooling, and the heat dissipation channel 150 is provided with a second heat sink (not shown in the figure), which is configured as an air-cooled heat sink. For example, the first heat sink may include multiple heat dissipation fins spaced apart, thereby forming multiple heat dissipation air channels between the fins to improve the heat dissipation performance of the upper and lower optical modules. The air-cooled heat sink may be mechanically connected to the second cage assembly 120.

[0046] In another embodiment, the optical module connection device 100 can employ liquid cooling, with a second heat sink (not shown) disposed in the heat dissipation channel 150. The second heat sink is configured as a liquid cooling plate. The liquid cooling plate stores a liquid cooling medium, which dissipates heat from the optical module. Exemplarily, in the second direction, the lower surface of the liquid cooling plate contacts the upper surface of the second cage assembly 120, thereby improving the heat dissipation performance of the lower optical module. Exemplarily, in the second direction, the upper surface of the liquid cooling plate contacts the lower surface of the first cage 111, thereby further improving the heat dissipation performance of the upper optical module. The liquid cooling plate can be mechanically connected to the second cage assembly 120.

[0047] In another embodiment, the optical module connection device 100 can adopt a combination of air cooling and liquid cooling, that is, the heat dissipation channel 150 is an air duct, and a second heat sink is provided in the heat dissipation channel 150.

[0048] In this embodiment, the optical module port 140 is used for plugging and unplugging a QSFP optical module. Exemplarily, the size of the optical module port 140 in the first direction L1 ranges from 18.6 mm to 18.9 mm, and the size of the optical module port 140 in the second direction L2 ranges from 8.8 mm to 9 mm. This allows for better adaptation to QSFP optical modules.

[0049] In one embodiment, the optical module connection device 100 may further include a first heat sink (not shown in the figure), which is disposed on the side of the first cage assembly 110 away from the printed circuit board 130, thereby improving the heat dissipation performance of the upper optical module. Exemplarily, the first heat sink may include multiple heat dissipation fins spaced apart to form multiple heat dissipation airflow channels between the fins. Alternatively, the first heat sink may be a liquid cooling plate.

[0050] For example, the sum of the dimensions of the second cage assembly 120 and the heat dissipation channel 150 in the second direction L2 is less than the dimension of the optical module port 140 in the first direction L1. Based on this, the space occupied by the optical module connection device 100 in the second direction L2 can be effectively reduced, improving space utilization to accommodate more QSFP optical modules.

[0051] like Figure 1D As shown, at least one spring tab 141 is provided at the bottom of the optical module port 140. The spring tab 141 extends obliquely away from the printed circuit board 130 in the direction towards the second cage 112 (third direction L3). When the optical module is inserted into the lower optical module port 140, it helps to keep the lower optical module in close contact with the cold air or the second heat sink in the heat dissipation channel 150, increasing the heat conduction efficiency. When the optical module is inserted into the upper optical module port 140, it helps to keep the upper optical module in close contact with the first heat sink or heat dissipation space on the first cage 111, increasing the heat conduction efficiency.

[0052] This application also provides an optical communication device, including one or more optical module connection devices 100. An optical communication device is a hardware system that uses optical signals (usually via optical fiber) for data transmission, and can be a switch, router, Peripheral Component Interconnect Express (PCIe) device, etc.

[0053] Optical communication equipment also includes device chips, such as processing chips or switch chips. In this embodiment, a conductive layer (not shown in the figure) is provided in the printed circuit board 130. The conductive layer is used to connect the optical module port 140 of the optical module connection device 100 and the device chip, thereby forming an electrical connection between the optical module and the device chip when the optical module is inserted into the optical module port 140.

[0054] This application also provides a data center, including a computer room and one or more of the aforementioned optical communication devices, wherein the optical communication devices are installed in the computer room. The data center can be a financial data center, an enterprise data center, or an internet cloud data center, etc.

[0055] Other components of the optical module connection device, optical communication equipment, and data center in the above embodiments can adopt various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.

[0056] Example 2

[0057] Figure 2A A perspective view of an optical module connection device 200 according to an embodiment of this application is shown; Figure 2BThis is a front view of an optical module connection device 200 according to an embodiment of this application; Figure 2C A side view of an optical module connection device 200 according to an embodiment of this application is shown. Figure 2A , Figure 2B and Figure 2C As shown, the optical module connection device 200 includes a first cage assembly 210, a second cage assembly 220, and a printed circuit board 230.

[0058] The first cage assembly 210 includes a first cage body 211 and a second cage body 212 with interconnected inner cavities. Exemplarily, the first cage body 211 and the second cage body 212 can be integrally formed. Both the second cage body 212 and the second cage assembly 220 are disposed on a printed circuit board 230.

[0059] The first cage 211 forms one or more optical module ports 140 along the first direction L1, and the second cage assembly 220 forms one or more optical module ports 140 in a direction parallel to the first direction L1. In this embodiment, a heat dissipation channel 150 is formed between the first cage 211 and the second cage assembly 220 in the second direction L2. That is, the first cage assembly 210 and the second cage assembly 220 are a separate stacked design, and a heat dissipation channel 150 is formed between the upper and lower optical module ports 140, thereby improving the heat dissipation performance of the upper and lower optical modules (especially the lower optical module) after the optical module is inserted into the optical module port 140.

[0060] like Figure 2C As shown, the second cage 212 includes a front panel 212A, a back panel 212B, and a base 212C. The front panel 212A is connected to the first cage 211, for example, as a single piece or integrally formed. The base 212C is disposed on the printed circuit board 230, for example, the base 212C is fixed to the printed circuit board 230 by a mechanical connection.

[0061] In one embodiment, the optical module connection device 200 may further include a first heat sink (not shown in the figure), which is disposed on the side of the first cage assembly 210 away from the printed circuit board 230, thereby improving the heat dissipation performance of the upper optical module.

[0062] For example, the sum of the dimensions of the second cage assembly 220 and the heat dissipation channel 150 in the second direction L2 is less than the dimension of the optical module port 140 in the first direction L1. Based on this, the space occupied by the optical module connection device 200 in the second direction L2 can be effectively reduced, improving space utilization and accommodating more QSFP optical modules.

[0063] Furthermore, the backplane 212B is provided with at least one cable port 270 for connecting the flight cable 70. The flight cable 70 is used to electrically connect the optical module port 140 and the device chip of the optical communication device, thereby forming an electrical connection between the QSFP optical module and the device chip when the QSFP optical module is inserted into the optical module port 140.

[0064] In this embodiment, chip-to-IO interconnection is achieved using a flyover cable. On the one hand, the flyover cable provides a shorter and more direct connection path, which can reduce signal delay and attenuation; on the other hand, it can reduce the number of traces on the printed circuit board, which helps to reduce heat accumulation and improve heat dissipation performance.

[0065] This application also provides an optical communication device, including one or more optical module connection devices 200. In one embodiment, the optical communication device further includes a device chip, and a flying cable 70 forms an electrical connection between the optical module port 140 and the device chip.

[0066] This application also provides a data center, including a computer room and one or more of the above-mentioned optical communication devices, wherein the optical communication devices are installed in the computer room.

[0067] Other components of the optical modules, optical communication equipment, and data centers in the above embodiments can be derived from various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.

[0068] Example 3

[0069] Figure 3A A perspective view of an optical module connection device 300 according to an embodiment of this application is shown; Figure 3B This is a front view of an optical module connection device 300 according to an embodiment of this application; Figure 3C This is a side view of an optical module connection device 300 according to an embodiment of this application. Figure 3A , Figure 3B and Figure 3C As shown, the optical module connection device 300 includes a first cage assembly 310, a second cage assembly 320, and a printed circuit board 130.

[0070] The first cage assembly 310 includes a first cage body 311 and a second cage body 312 with interconnected inner cavities. Exemplarily, the first cage body 311 and the second cage body 312 can be integrally formed. Both the second cage body 312 and the second cage assembly 320 are disposed on the printed circuit board 130. Exemplarily, the second cage body 312 and the second cage assembly 320 are mechanically fixed to the printed circuit board 130, and both the first cage assembly 310 and the second cage assembly 320 may have through holes for heat dissipation.

[0071] The first cage 311 forms one or more optical module ports 340 along the first direction L1, and the second cage assembly 320 forms one or more optical module ports 340 in a direction parallel to the first direction L1. It should be noted that... Figure 3A , Figure 3B and Figure 3C In the first cage 311, four optical module ports 340 are formed, and the second cage assembly 320 forms four optical module ports 340. It is understood that the number of optical module ports 340 is not specifically limited in this embodiment of the application, and can be adjusted accordingly according to actual application requirements.

[0072] In this embodiment of the application, a heat dissipation channel 150 is formed between the first cage 311 and the second cage assembly 320 in the second direction L2. That is, the first cage assembly 310 and the second cage assembly 320 are a separate stacked design, and a heat dissipation channel 150 is formed between the upper and lower optical module ports 340, thereby improving the heat dissipation performance of the upper and lower optical modules (especially the lower optical module) after the optical module is inserted into the optical module port 340.

[0073] At least one spring tab 341 is provided at the bottom of the optical module port 340. The spring tab 341 extends obliquely away from the printed circuit board 130 in the direction towards the second cage 312 (third direction L3). When the optical module is inserted into the lower optical module port 340, it helps to keep the lower optical module in close contact with the cold air or the second heat sink in the heat dissipation channel 150, thereby increasing the heat conduction efficiency. When the optical module is inserted into the upper optical module port 340, it helps to keep the upper optical module in close contact with the first heat sink or heat dissipation space on the first cage 311, thereby increasing the heat conduction efficiency.

[0074] In this embodiment, the optical module port 340 is used for plugging and unplugging a first OSFP optical module, which is encapsulated with a heat dissipation component. That is, the first OSFP optical module is an optical module with its own heat dissipation component, such as an integrated heat sink (IHS) optical module. In the second direction L2, the size of the heat dissipation channel 150 is smaller than the size of the optical module port 340, thereby effectively reducing the space occupied by the optical module connection device 300 in the second direction L2 and improving space utilization.

[0075] For example, the size of the optical module port 340 in the first direction L1 ranges from 22.7 mm to 23 mm, and the size of the optical module port 340 in the second direction L2 ranges from 13.2 mm to 13.4 mm. This allows for better adaptation to the first QSFP optical module.

[0076] This application also provides an optical communication device, including one or more optical module connection devices 300. In one embodiment, the optical communication device further includes a device chip, and when a first OSFP optical module is inserted into the optical module port 340, a printed circuit board 130 forms an electrical connection between the first OSFP optical module and the device chip.

[0077] This application also provides a data center, including a computer room and one or more of the above-mentioned optical communication devices, wherein the optical communication devices are installed in the computer room.

[0078] Other components of the optical module connection device, optical communication equipment, and data center in the above embodiments can adopt various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.

[0079] Example 4

[0080] Figure 4 This is a side view of an optical module connection device 400 according to an embodiment of this application. Figure 4 As shown, the optical module connection device 400 includes a first cage assembly 310, a second cage assembly 320 and a printed circuit board 230. The second cage 312 includes a front panel 312A, a back panel 312B and a base 312C.

[0081] The front panel 312A is connected to the first cage 311, for example, by a single integral molding. The base 312C is disposed on the printed circuit board 230, for example, the base 312C is fixed to the printed circuit board 230 by a mechanical connection. Further, the back panel 312B is provided with at least one cable port 470 for connecting the flight cable 70. The flight cable 70 is used to connect the optical module port 340 and the device chip of the optical communication device, thereby forming an electrical connection between the first OSFP optical module and the device chip when the first OSFP optical module is inserted into the optical module port 340. That is to say, in this embodiment, chip-to-IO type interconnection is implemented based on the flight cable.

[0082] This application also provides an optical communication device, including one or more optical module connection devices 400. In one embodiment, the optical communication device further includes a device chip, and a flying cable 70 forms an electrical connection between the optical module port 340 and the device chip.

[0083] This application also provides a data center, including a computer room and one or more of the above-mentioned optical communication devices, wherein the optical communication devices are installed in the computer room.

[0084] Other components of the optical modules, optical communication equipment, and data centers in the above embodiments can be derived from various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.

[0085] Example 5

[0086] Figure 5A This is a front view of an optical module connection device 500 according to an embodiment of this application; Figure 5B A side view of an optical module connection device 500 according to an embodiment of this application is shown. Figure 5A and Figure 5B As shown, the optical module connection device 500 includes a first cage assembly 510, a second cage assembly 520, and a printed circuit board 130.

[0087] The first cage assembly 510 includes a first cage body 511 and a second cage body 512 with interconnected inner cavities. Exemplarily, the first cage body 511 and the second cage body 512 can be integrally formed. Both the second cage body 512 and the second cage assembly 520 are disposed on the printed circuit board 130. Exemplarily, the second cage body 512 and the second cage assembly 520 are mechanically fixed to the printed circuit board 130, and both the first cage assembly 510 and the second cage assembly 520 may have through holes to facilitate heat dissipation.

[0088] The first cage 511 forms one or more optical module ports 540 along the first direction L1, and the second cage assembly 520 forms one or more optical module ports 540 in a direction parallel to the first direction L1. It should be noted that... Figure 5A and Figure 5B In the first cage 511, four optical module ports 540 are formed, and the second cage assembly 520 forms four optical module ports 540. It is understood that the number of optical module ports 540 is not specifically limited in this embodiment of the application, and can be adjusted accordingly according to actual application requirements.

[0089] In this embodiment of the application, a heat dissipation channel 150 is formed between the first cage 511 and the second cage assembly 520 in the second direction L2. That is, the first cage assembly 510 and the second cage assembly 520 are a separate stacked design, and a heat dissipation channel 150 is formed between the upper and lower optical module ports 540, thereby improving the heat dissipation performance of the upper and lower optical modules (especially the lower optical module) after the optical module is inserted into the optical module port 540.

[0090] At least one spring is provided at the bottom of the optical module port 540. The spring extends obliquely away from the printed circuit board 130 in the direction toward the second cage 512 (third direction L3). When the optical module is inserted into the optical module port 540, it helps to maintain close contact between the optical module and the first heat sink or heat dissipation channel, thereby increasing the heat conduction efficiency.

[0091] In this embodiment, the optical module port 540 is used for plugging and unplugging the second OSFP optical module. Exemplarily, the size of the optical module port 540 in the first direction L1 ranges from 22.7 mm to 23 mm, and the size of the optical module port 140 in the second direction L2 ranges from 8.8 mm to 9 mm. This allows for better adaptation to the second OSFP optical module.

[0092] In one embodiment, the second OSFP optical module itself does not have a heat dissipation component encapsulated, such as a riding heat sink (RHS) optical module. That is, the optical module connection device 500 may also include a first heat sink (not shown in the figure), which is disposed on the side of the first cage assembly 510 away from the printed circuit board 130, thereby improving the heat dissipation performance of the upper optical module.

[0093] For example, the sum of the dimensions of the second cage assembly 520 and the heat dissipation channel 150 in the second direction L2 is less than the dimension of the optical module port 540 in the first direction L1. Based on this, the space occupied by the optical module connection device 500 in the second direction L2 can be effectively reduced, improving space utilization to accommodate more second OSFP optical modules.

[0094] This application also provides an optical communication device, including one or more optical module connection devices 500. In one embodiment, the optical communication device further includes a device chip, and when a second OSFP optical module is inserted into the optical module port 540, a printed circuit board 130 forms an electrical connection between the second OSFP optical module and the device chip.

[0095] This application also provides a data center, including a computer room and one or more of the above-mentioned optical communication devices, wherein the optical communication devices are installed in the computer room.

[0096] Other components of the optical module connection device, optical communication equipment, and data center in the above embodiments can adopt various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.

[0097] Example 6

[0098] Figure 6 A side view of an optical module connection device 600 according to an embodiment of this application is shown. Figure 6 As shown, the optical module connection device 600 includes a first cage assembly 510, a second cage assembly 520, and a printed circuit board 230. The second cage 312 includes a front panel 512A, a back panel 512B, and a base 512C. The front panel 512A is connected to the first cage 511, for example, by means of a single integral molding. The base 512C is disposed on the printed circuit board 230, for example, the base 512C is mechanically fixed to the printed circuit board 230.

[0099] Furthermore, at least one cable port 670 is provided on the backplane 512B for connecting the flight cable 70. The flight cable 70 is used to connect the optical module port 540 and the device chip of the optical communication device, thereby forming an electrical connection between the second OSFP optical module and the device chip when the second OSFP optical module is inserted into the optical module port 540. That is, in this embodiment of the application, a chip-to-IO type interconnect is implemented based on the flight cable.

[0100] This application also provides an optical communication device, including one or more optical module connection devices 600. In one embodiment, the optical communication device further includes a device chip, and a flying cable 70 forms an electrical connection between the optical module port 540 and the device chip.

[0101] This application also provides a data center, including a computer room and one or more of the above-mentioned optical communication devices, wherein the optical communication devices are installed in the computer room.

[0102] Other components of the optical modules, optical communication equipment, and data centers in the above embodiments can be derived from various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.

[0103] In the description of this specification, it should be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0104] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0105] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0106] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or indirect contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0107] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0108] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An optical module connecting device, characterized by comprising: Comprising: a printed circuit board; a first cage assembly comprising a first cage and a second cage in communication with an inner cavity, wherein the first cage forms at least one optical module port in a first direction; and the second cage is disposed on the printed circuit board; a second cage assembly forming at least one optical module port in a direction parallel to the first direction, the second cage assembly is disposed on the printed circuit board; wherein a heat dissipation channel is formed between the first cage and the second cage assembly in a second direction, the second direction is perpendicular to the plane in which the printed circuit board is located.

2. The optical module connection device according to claim 1, characterized by The optical module port is used for plugging and unplugging a QSFP optical module, the size of the optical module port in the first direction ranges from 18.6mm to 18.9mm, and the size of the optical module port in the second direction ranges from 8.8mm to 9mm.

3. The optical module connection device according to claim 2, characterized by The optical module connecting device further comprises a first heat sink, and the first heat sink is disposed on a side of the first cage assembly away from the printed circuit board.

4. The optical module connection apparatus according to claim 1, wherein The optical module port is used for plugging and unplugging a first OSFP optical module, and the first OSFP optical module is packaged with a heat dissipation assembly, and in the second direction, the size of the heat dissipation channel is smaller than the size of the optical module port.

5. The optical module connection device according to claim 4, wherein The size of the optical module port in the first direction ranges from 22.7mm to 23mm, and the size of the optical module port in the second direction ranges from 13.2mm to 13.4mm.

6. The optical module connection apparatus according to claim 1, wherein The optical module port is used for plugging and unplugging a second OSFP optical module, and the size of the optical module port in the first direction ranges from 22.7mm to 23mm, and the size of the optical module port in the second direction ranges from 9.7mm to 9.9mm.

7. The optical module connection device according to claim 6, wherein The optical module connecting device further comprises a first heat sink, and the first heat sink is disposed on a side of the first cage assembly away from the printed circuit board.

8. The optical module connection device according to any one of claims 1 to 7, characterized by, The heat dissipation channel is an air duct, and / or a second heat sink is disposed in the heat dissipation channel.

9. The optical module connection device according to any one of claims 1 to 7, characterized by, The bottom of the optical module port is provided with at least one spring, and the spring extends in a direction away from the printed circuit board in a direction towards the second cage.

10. An optical communication device, comprising: Comprising: The optical module connecting device according to any one of claims 1 to 9.

11. The optical communication device of claim 10, wherein, Further comprising a device chip, and a conductive layer is disposed in the printed circuit board, and the conductive layer is used for connecting the optical module port of the optical module connecting device and the device chip.

12. The optical communication device of claim 10, wherein, Further comprising a device chip and a flight cable, and the flight cable is used for connecting the optical module port of the optical module connecting device and the device chip.

13. A data center, characterized by, Comprising a machine room and at least one optical communication device according to any one of claims 10 to 12, and the optical communication device is disposed in the machine room.

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