Rotary positioning mechanism and wafer cleaning equipment

Abstract

The utility model provides a rotary positioning mechanism and wafer cleaning equipment. The rotary positioning mechanism comprises a supporting seat, at least three positioning assemblies which are circumferentially arranged above the supporting seat and are connected with the supporting seat, and a driving piece for driving the supporting seat to rotate, the positioning assembly comprises a mounting base connected with the supporting base, a transverse blocking piece longitudinally arranged at the top of the mounting base and a pendulum piece connected to the side portion of the mounting base in a pivoted mode, a rotating shaft is embedded in the position, on the outer side of the transverse blocking piece, of the mounting base, the outer side of the rotating shaft is movably sleeved with the end of the pendulum piece, and the end of the pendulum piece axially extends outwards to form a longitudinal blocking piece; the weight of the longitudinal blocking piece is smaller than that of the end, away from the longitudinal blocking piece, of the pendulum piece. When the driving part drives the supporting seat to rotate, the pendulum part rotates around the axis where the rotating shaft is located, so that a wafer arranged on the mounting seat is limited by the longitudinal blocking part and the mounting seat together. According to the utility model, stable clamping of the wafer is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cleaning technical field especially relates to a rotary positioning mechanism and wafer cleaning equipment. BACKGROUND

[0002] In the semiconductor manufacturing process, wafer cleaning is an important process step, aiming at eliminating the pollutants generated by the contact of wafer with various organic matters, particles and metals in the processing, forming and polishing treatment process, including dust, metal ions, organic matter residues, etc. In the cleaning process, in order to ensure that the cleaning liquid can uniformly cover the entire wafer surface, the wafer needs to be clamped and driven to rotate by the clamping mechanism, which can also avoid insufficient cleaning or residue generation, thereby achieving the purpose of improving the wafer cleaning efficiency.

[0003] The clamping mechanism contained in the existing wafer cleaning equipment is usually composed of multiple clamping plates, which clamps the edge of the wafer at different orientations to exert a fixed force on the wafer, thereby ensuring the stability of the wafer during rotation. However, since the wafer will generate centrifugal force during rotation, the edge of the wafer will be subjected to a large centrifugal force, and the clamping plate will exert a fixed force on the edge of the wafer, which will cause stress concentration at the edge of the wafer, thereby causing the problem of wafer breakage.

[0004] Therefore, it is necessary to improve the clamping mechanism in the existing wafer cleaning equipment to solve the above problems.

[0005] It should be noted that the above introduction to the background technology is only for the convenience of clearly and completely describing the technical solutions of the present application, and for the convenience of understanding by those skilled in the art. The above technical solutions cannot be considered as known to those skilled in the art just because they are described in the background section of the present application. CONTENT OF THE UTILITY MODEL

[0006] The utility model aims at solving the problem of wafer breakage caused by stress concentration at the edge of the wafer due to the fixed force exerted on the wafer by the clamping mechanism contained in the existing wafer cleaning equipment, and the centrifugal force generated during wafer rotation.

[0007] To achieve the above purpose, the utility model provides a rotary positioning mechanism, which comprises:

[0008] A support seat, at least three positioning components circumferentially arranged above the support seat and connected with the support seat, and a driving member for driving the rotation of the support seat;

[0009] The positioning assembly comprises a mounting base connected with the support base, a transverse blocking piece longitudinally arranged on the top of the mounting base, and a pendulum piece pivotally connected to the side of the mounting base, the mounting base is inlaid with a rotating shaft outside the transverse blocking piece, the end of the pendulum piece is movably sleeved outside the rotating shaft, and the end of the pendulum piece extends axially outward to form a longitudinal blocking piece, the weight of the longitudinal blocking piece is less than the weight of the end of the pendulum piece away from the longitudinal blocking piece.

[0010] When the driving piece drives the support base to rotate, the pendulum piece rotates around the axis where the rotating shaft is located, so that the wafer placed on the mounting base is jointly limited by the longitudinal blocking piece and the mounting base.

[0011] As a further improvement of the utility model, the pendulum piece comprises a swing column and a connecting block arranged at the end of the swing column, the connecting block is movably sleeved outside the rotating shaft, and the longitudinal blocking piece is formed at the end of the connecting block away from the swing column, and the weight of the longitudinal blocking piece is less than the weight of the swing column.

[0012] As a further improvement of the utility model, the mounting base is provided with a top block for supporting the wafer on the inside of the transverse blocking piece.

[0013] As a further improvement of the utility model, the rotary positioning mechanism further comprises a telescopic rod connected between the support base and the single mounting base.

[0014] As a further improvement of the utility model, the telescopic rod is pivotally connected with the support base to adjust the angle formed by the telescopic rod and the support base.

[0015] As a further improvement of the utility model, the telescopic rod comprises a containing cylinder and a telescopic cylinder movably contained in the containing cylinder.

[0016] As a further improvement of the utility model, the side of the longitudinal blocking piece facing the wafer is configured as a V-shaped slope for guiding the liquid to flow to both sides.

[0017] As a further improvement of the utility model, the connecting block forms a liquid guide groove outside the longitudinal blocking piece for guiding the liquid to flow to both sides.

[0018] As a further improvement of the utility model, two transverse blocking pieces are arranged on the top of the mounting base, and the two transverse blocking pieces are arranged on the two sides of the longitudinal blocking piece respectively.

[0019] Based on the same design idea, the utility model further discloses a wafer cleaning equipment, which comprises:

[0020] The rotary positioning mechanism as claimed in any one of the preceding embodiments.

[0021] Compared with the prior art, the utility model discloses the beneficial effects are:

[0022] In the application, the rotating positioning mechanism includes: support seat, at least three positioning components are arranged circumferentially on the top of the support seat and connected with the support seat, and the driving part for driving the rotation of the support seat. The positioning component includes: the mounting seat connected with the support seat, the horizontal blocking piece longitudinally arranged on the top of the mounting seat, and the pendulum piece pivotally connected to the side of the mounting seat. The mounting seat is inlaid with a rotating shaft on the outside of the horizontal blocking piece, the end of the pendulum piece is movably sleeved on the outside of the rotating shaft, and the end of the pendulum piece extends axially outward to form a longitudinal blocking piece, and the weight of the longitudinal blocking piece is less than the weight of the end of the pendulum piece away from the longitudinal direction. When the driving part drives the rotation of the support seat, the pendulum piece rotates around the axis of the rotating shaft to restrict the wafer placed on the mounting seat by the longitudinal blocking piece and the mounting seat. In the process of clamping the wafer, the clamping force of the longitudinal blocking piece on the wafer is adjusted by the different centrifugal forces generated by the wafer 20 at different rotation rates, ensuring the controllability and adjustability of the clamping force, and ultimately achieving the purpose of considering the wafer clamping stability and safety. Therefore, the problem of wafer rupture caused by stress concentration at the edge of the wafer due to the centrifugal force generated by the wafer in the rotating process is solved. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 The rotating positioning mechanism and the wafer shown in the utility model are shown in a perspective view from one angle;

[0024] Figure 2 The rotating positioning mechanism and the wafer shown in the utility model are shown in a perspective view from another angle;

[0025] Figure 3 The rotating positioning mechanism shown in the utility model is shown in a perspective view from one angle;

[0026] Figure 4 The perspective view of the positioning component from one angle;

[0027] Figure 5 The perspective view of the positioning component from another angle;

[0028] Figure 6 The perspective view of the positioning component from one angle, omitting the pendulum piece;

[0029] Figure 7 The perspective view of the pendulum piece from one angle. DETAILED DESCRIPTION

[0030] The utility model will be explained in detail in combination with the embodiments shown in the drawings, but it should be explained that these embodiments are not the limitation of the utility model, the equivalent transformation or the substitution of function, method or structure made by the ordinary skill in the art according to these embodiments all belong to the protection scope of the utility model.

[0031] It should be understood that in the present application, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the technical solutions and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the technical solutions.

[0032] It should be noted that in the present application, "transverse" refers to the direction along the X-axis shown in the drawings, and "longitudinal" refers to the direction along the Y-axis shown in the drawings. Figure 1 Figure 1 It should be noted that in the present application, "transverse" refers to the direction along the X-axis shown in the drawings, and "longitudinal" refers to the direction along the Y-axis shown in the drawings.

[0033] Referring to FIG. Figures 1 to 7 The utility model shows a specific embodiment of a rotary positioning mechanism 10 for clamping and driving a wafer 20 to rotate in a wafer cleaning device (not shown), specifically adjusting the clamping force on the wafer 20 according to the centrifugal force generated by the driving member (not shown) driving the wafer 20 to rotate, so as to achieve the purpose of ensuring the stability and safety of wafer clamping.

[0034] Referring to FIG. Figure 1 , Figure 4 and Figure 6 ​As shown, the rotary positioning mechanism 10 comprises a support base 11, at least three positioning assemblies 12 circumferentially arranged above and connected with the support base 11, and a driving member (not shown) for driving the support base 11 to rotate. Since the positioning assemblies 12 are similar in structure, only the specific structure of one positioning assembly 12 will be exemplarily described in the following description. The positioning assembly 12 comprises a mounting base 121 connected with the support base 11, a transverse blocking member 122 longitudinally arranged on the top of the mounting base 121, and a pendulum member 123 pivotally connected to the side of the mounting base 121. The mounting base 121 is inlaid with a rotating shaft 124 outside the transverse blocking member 122, the end of the pendulum member 123 is movably sleeved outside the rotating shaft 124, and the end of the pendulum member 123 axially extends outward to form a longitudinal blocking member 125, the weight of the longitudinal blocking member 125 is less than the weight of the end of the pendulum member 123 away from the longitudinal blocking member 125. When the driving member drives the support base 11 to rotate (i.e., rotates around the axis 31 where the support base 11 is located), the pendulum member 123 rotates around the axis 32 where the rotating shaft 124 is located, so as to be restricted by the longitudinal blocking member 125 and the mounting base 121 together to place the wafer 20 on the mounting base 121.

[0035] It is to be noted that, since the weight of the longitudinal blocking member 125 is less than the weight of the end of the pendulum member 123 away from the longitudinal blocking member 125, when the driving member drives the support base 11 to rotate, the pendulum member 123 is caused to rotate the longitudinal blocking member 125 around the axis 32 of the rotation shaft 124 in the direction 41 under the action of centrifugal force; when the driving member does not drive the support base 11 to rotate, the pendulum member 123 is caused to rotate the longitudinal blocking member 125 around the axis 32 of the rotation shaft 124 in the direction 42 under the action of gravity, thereby making the longitudinal blocking member 125 always located at the top of the pendulum member 123. When the wafer 20 is cleaned, the wafer 20 is placed on the mounting seat 121 included in each of the at least three positioning assemblies 12, and the edge of the wafer 20 is in contact with the lateral blocking member 122, so that the wafer 20 is laterally limited by the at least three lateral blocking members 122, and then the driving member drives the support base 11 to rotate (i.e., to rotate around the axis 31 of the support base 11), the positioning assembly 12 rotates around the axis 31 of the support base 11 with the support base 11, and the pendulum member 123 is caused to rotate around the axis 32 of the rotation shaft 124 in the direction 41 under the action of centrifugal force, so that the edge of the wafer 20 is in contact with the longitudinal blocking member 125, thereby the wafer 20 is longitudinally limited by the longitudinal blocking member 125 and the mounting seat 121, so that the wafer 20 is stably clamped. When the cleaning of the wafer 20 is completed, the driving member stops driving the support base 11 to rotate around the axis 31 of the support base, and the positioning assembly 12 correspondingly stops rotating, and the pendulum member 123 is caused to rotate around the axis 32 of the rotation shaft 124 in the direction 42 under the action of gravity, so that the edge of the wafer 20 is away from the longitudinal blocking member 125, thereby achieving the purpose of releasing the wafer 20, so as to facilitate the wafer 20 to be taken out. In the process of clamping the wafer 20, the clamping force of the longitudinal blocking member 125 on the wafer 20 is adjusted by the different centrifugal forces generated by the wafer 20 at different rotation speeds, so as to ensure the controllability and adjustability of the clamping force, and finally to ensure the clamping stability and safety of the wafer 20, thereby solving the problem that the existing wafer cleaning equipment includes a clamping mechanism which applies a fixed force to the wafer, and the wafer edge generates stress concentration due to the centrifugal force generated in the rotation process of the wafer, thereby causing the wafer to break.

[0036] In order to further ensure the lateral limiting effect of the lateral blocking member 122 on the wafer 20, two lateral blocking members 122 are arranged on the top of the mounting seat 121 included in each positioning assembly 12, and the two lateral blocking members 122 are arranged on the two sides of the longitudinal blocking member 125, thereby further ensuring the stability of the wafer 20 clamped by the positioning assembly 12.

[0037] In an embodiment, the pendulum member 123 is arranged on the top of the support base 11, and the longitudinal blocking member 125 is arranged on the top of the pendulum member 123. Figures 4 to 7As shown, the pendulum 123 comprises a swing column 126 and a connecting block 127 arranged at the end of the swing column 126, the connecting block 127 movably sleeved outside the rotating shaft 124, and a longitudinal blocking piece 125 formed at the end of the connecting block 127 away from the swing column 126, the weight of the longitudinal blocking piece 125 being less than the weight of the swing column 126. In short, the rotating shaft 124 transversely penetrates the connecting block 127 and is embedded outside the mounting seat 121 at the lateral blocking piece 122, the connecting block 127 can rotate around the axis 32 where the rotating shaft 124 is located, and the swing column 126 and the longitudinal blocking piece 125 are arranged at opposite sides of the connecting block 127, respectively. Thus, when the driving member drives the support seat 11 to rotate around the axis 31 where the support seat 11 is located, the pendulum 123 is subjected to centrifugal force, the connecting block 127 rotates around the axis 32 where the rotating shaft 124 is located in the direction 41, so that the longitudinal blocking piece 125 and the mounting seat 121 together realize the longitudinal restriction of the wafer 20; when the driving member stops driving the support seat 11 to rotate around the axis 31 where the support seat 11 is located, the pendulum 123 is subjected to gravity, the connecting block 127 rotates around the axis 32 where the rotating shaft 124 is located in the direction 42, and maintains balance under the action of gravity, so that the longitudinal blocking piece 125 releases the wafer 20. Preferably, the weight of the longitudinal blocking piece 125 is much less than the weight of the swing column 126, in other words, the weight of the swing column 126 is much greater than the weight of the longitudinal blocking piece 125.

[0038] In one embodiment, the method comprises Figure 1 With Figure 4 As shown, the mounting seat 121 at the inner side of the lateral blocking piece 122 is provided with a top block 128 supporting the wafer 20. The top block 128 is arranged at the top of the mounting seat 121, and the upper surface (not labeled) of the top block 128 is smaller than the upper surface (not labeled) of the mounting seat 121, so that when the wafer 20 is cleaned, the wafer 20 is placed on the top block 128 arranged by the mounting seat 121 included in at least three positioning assemblies 12, so as to reduce the contact area between the positioning assembly 12 and the wafer 20, and prevent the wafer 20 from being contaminated. At the same time, since the top block 128 and the lateral blocking piece 122 are both arranged at the top of the mounting seat 121, the upper surface of the top block 128 and the bottom of the lateral blocking piece 122 form a height difference, so that when the cleaning liquid on the surface of the wafer 20 is thrown outward under the action of centrifugal force, it can flow downward along the lateral blocking piece 122 and flow out from the bottom of the top block 128 on both sides, thereby preventing the cleaning liquid from spreading from the mounting seat 121 to the lower surface of the wafer 20, and further preventing the wafer 20 from being contaminated.

[0039] As to the connection between the mounting seat 121 and the support seat 11, the mounting seat 121 can be connected to the support seat 11 by a plurality of mounting seats 121 through one assembly, or by a single mounting seat 121 through a single assembly, or the mounting seat 121 and the support seat 11 can be regarded as a whole. As long as the mounting seat 121 can be connected to the support seat 11, the connection mode is not limited in the embodiment, and only one connection mode is exemplarily illustrated in the following description.

[0040] In one embodiment, referring to Figure 1 As shown, the rotary positioning mechanism 10 further comprises a telescopic rod 13 connected between the support seat 11 and the single mounting seat 121. If three mounting seats 121 are provided, three telescopic rods 13 are correspondingly provided to independently support the three positioning assemblies 12 by the three telescopic rods 13. Further, the telescopic rod 13 is pivotally connected to the support seat 11 to adjust the angle formed by the telescopic rod 13 and the support seat 11. Since the size of the wafer 20 is different, in order to ensure that the limiting area (not labeled) formed by the transverse blocking pieces 122 contained in the plurality of positioning assemblies 12 matches the size of the wafer 20, the angle formed by the telescopic rod 13 and the support seat 11 can be adjusted to adjust the size of the limiting area formed by the transverse blocking pieces 122, and finally ensure the stability of the wafer 20 limited by the transverse blocking pieces 122. The position of the pivotal connection between the telescopic rod 13 and the support seat 11 is not limited in the embodiment, and the telescopic rod 13 can be pivotally connected to the side of the support seat 11, or to the top of the support seat 11, etc. Further, referring to Figure 2 With Figure 3 As shown, the telescopic rod 13 comprises a containing cylinder 131 and a telescopic cylinder 132 movably contained in the containing cylinder 131. The telescopic cylinder 132 can radially extend out of or into the containing cylinder 131 to adjust the overall length of the telescopic rod 13, thereby adjusting the size of the limiting area formed by the transverse blocking pieces 122, and finally ensuring the stability of the wafer 20 limited by the transverse blocking pieces 122.

[0041] In one embodiment, referring to Figure 4 With Figure 7 As shown, the longitudinal blocking piece 125 is configured as a V-shaped slope 129 facing the side surface of the wafer 20 to guide the liquid to flow to both sides. Specifically, the part of the V-shaped slope 129 abutting the edge of the wafer 20 is adapted to the profile of the wafer 20. Thus, when the wafer 20 is cleaned, the V-shaped slope 129 formed by the longitudinal blocking piece 125 abuts the edge of the wafer 20 to guide the cleaning liquid splashed out of the wafer 20 to flow to both sides through the V-shaped slope 129, thereby preventing the cleaning liquid from spreading from the longitudinal blocking piece 125 to the lower surface of the wafer 20, and further preventing the wafer 20 from being contaminated.

[0042] In one implementation, the reference Figure 4 and Figure 7 As shown, the connecting block 127 forms a liquid guiding groove 130 on the outside of the longitudinal barrier 125 to guide the liquid to flow to both sides. Specifically, the liquid guiding groove 130 is in the shape of an "eight". Thus, when cleaning the wafer 20, the V-shaped slope 129 formed by the longitudinal barrier 125 is in contact with the edge of the wafer 20. When cleaning liquid splashes off the surface of the wafer 20, the liquid guiding groove 130 guides the cleaning liquid to flow to both sides, thereby preventing the cleaning liquid from flowing from the mounting base 121 to the longitudinal barrier 125 and spreading from the longitudinal barrier 125 to the lower surface of the wafer 20, so as to further prevent contamination of the wafer 20.

[0043] Based on the technical solution of the rotary positioning mechanism 10 disclosed in the foregoing embodiments, this embodiment also discloses a wafer cleaning device. The wafer cleaning device (not shown) includes: the rotary positioning mechanism 10 as disclosed in the above embodiments, used to clamp the wafer 20 and rotate it stably, and during the rotation, a cleaning fluid is delivered to the surface of the wafer 20 through a liquid delivery mechanism (not shown) to clean the wafer 20.

[0044] The detailed descriptions listed above are merely specific descriptions of feasible implementations of this utility model, and are not intended to limit the scope of protection of this utility model. All equivalent implementations or modifications made without departing from the spirit of this utility model should be included within the scope of protection of this utility model.

[0045] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A rotational positioning mechanism, characterized by, The rotary positioning mechanism comprises: a support base, at least three positioning assemblies circumferentially arranged above the support base and connected with the support base, and a driving member for driving the support base to rotate; the positioning assembly comprises: a mounting base connected with the support base, a transverse blocking member longitudinally arranged on the top of the mounting base, and a pendulum member pivotally connected to the side of the mounting base, the mounting base is inlaid with a rotating shaft outside the transverse blocking member, the end of the pendulum member is movably sleeved outside the rotating shaft, and the end of the pendulum member extends axially outward to form a longitudinal blocking member, the weight of the longitudinal blocking member is less than the weight of the end of the pendulum member away from the longitudinal blocking member; when the driving member drives the support base to rotate, the pendulum member rotates around the axis where the rotating shaft is located, so that the wafer placed on the mounting base is jointly limited by the longitudinal blocking member and the mounting base.

2. The rotational positioning mechanism of claim 1, wherein, The pendulum member comprises: a swing column and a connecting block arranged at the end of the swing column, the connecting block is movably sleeved outside the rotating shaft, and the longitudinal blocking member is formed at the end of the connecting block away from the swing column, and the weight of the longitudinal blocking member is less than the weight of the swing column.

3. The rotational positioning mechanism of claim 2, wherein, The mounting base is provided with a top block for supporting the wafer on the inside of the transverse blocking member.

4. The rotational positioning mechanism of claim 1, wherein, The rotary positioning mechanism further comprises: a telescopic rod connected between the support base and a single mounting base.

5. The rotational positioning mechanism of claim 4, wherein, The telescopic rod is pivotally connected with the support base to adjust the angle formed by the telescopic rod and the support base.

6. The rotational positioning mechanism of claim 4, wherein, The telescopic rod comprises: a containing cylinder and a telescopic cylinder movably contained in the containing cylinder.

7. The rotational positioning mechanism of claim 1, wherein, The side of the longitudinal blocking member facing the wafer is configured as a V-shaped slope for guiding the liquid to flow to both sides.

8. The rotational positioning mechanism of claim 2, wherein, The connecting block forms a liquid guide groove outside the longitudinal blocking member for guiding the liquid to flow to both sides.

9. The rotational positioning mechanism of claim 1, wherein, The mounting base is provided with two transverse blocking members on the top, and the two transverse blocking members are arranged on both sides of the longitudinal blocking member respectively.

10. A wafer cleaning apparatus characterized by comprising: The rotary positioning mechanism comprises: The rotary positioning mechanism according to any one of claims 1 to 9.

Images