Package structure

Abstract

The utility model provides a packaging structure, comprising a mold packaging substrate, the side surface of the mold packaging substrate is divided into an upper part and a lower part, and the upper part and the lower part of the side surface of the mold packaging substrate form an obtuse angle; the shielding layer covers the mold sealing substrate, the side surface of the shielding layer is divided into an upper part and a lower part, and the upper part and the lower part of the shielding layer are both gradually shrunk from bottom to top. Thus, due to the oblique angle arrangement of the side surface of the mold sealing substrate, when the shielding layer is bent from the horizontal direction to the vertical direction, the corner is changed into two obtuse angles from one right angle, the extension amount of each corner can be reduced, the shielding layer film layer can be prevented from being discontinuous, and the electromagnetic shielding effect is further ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor packaging technical field, concretely relates to a packaging structure. BACKGROUND

[0002] When electromagnetic interference is received, the performance of the mold encapsulation substrate will be affected. Therefore, the original mold encapsulation substrate can be coated with an electromagnetic shielding layer to achieve electromagnetic shielding. In the specific implementation process, referring to Figure 1 The upper part, the mold encapsulation substrate 01 is placed on the insulating layer 05 and the plastic layer 04, and then the shielding layer 02 (including a release film 021 and a conductive contact agent 022) above the mold encapsulation substrate 01 and the plastic layer 04 are laminated on the mold encapsulation substrate 01.

[0003] However, since the mold encapsulation substrate 01 has a relatively sharp right angle above it, the shielding layer 02 above the sharp right angle needs to be bent during the lamination process, which will cause stress concentration problems, a large extension, and thus lead to the phenomenon of incomplete continuity of the shielding layer 02 at this point (see Figure 1 the discontinuous area 03 in the middle lower part and Figure 2 ), which will lead to electromagnetic shielding failure. SUMMARY

[0004] The utility model provides a packaging structure, which comprises:

[0005] a mold encapsulation substrate, the side surface of the mold encapsulation substrate is divided into an upper part and a lower part, and the upper part and the lower part of the side surface of the mold encapsulation substrate form an obtuse angle;

[0006] a shielding layer, the shielding layer covers the mold encapsulation substrate, and the side surface of the shielding layer is divided into an upper part and a lower part, and both the upper part and the lower part of the side surface of the shielding layer taper from bottom to top.

[0007] As a possible implementation, the shielding layer is an electromagnetic shielding layer.

[0008] As a possible implementation, there is a first gap between the upper part of the side surface of the mold encapsulation substrate and the upper part of the side surface of the shielding layer.

[0009] As a possible implementation, the first gap is close to the upper surface of the mold encapsulation substrate.

[0010] As a possible implementation, there is a second gap between the lower part of the side surface of the mold encapsulation substrate and the lower part of the side surface of the shielding layer.

[0011] As a possible implementation, the second gap is close to the upper part of the side surface of the mold encapsulation substrate.

[0012] As a possible implementation, the obtuse angle is 135°.

[0013] As a possible implementation, the extending direction of the lower part of the side surface of the mold sealing substrate forms a right angle with the extending direction of the upper surface of the mold sealing substrate.

[0014] As a possible implementation, the mold sealing substrate comprises an electronic element.

[0015] As a possible implementation, the distance between the side surface of the electronic element and the projection of the first inflection point in the horizontal direction is greater than a first preset threshold, and the first inflection point is the intersection of the upper surface of the mold sealing substrate and the side surface.

[0016] As a possible implementation, the distance between the upper surface of the electronic element and the projection of the second inflection point in the vertical direction is greater than a second preset threshold, and the second inflection point is the intersection of the upper part and the lower part of the side surface of the mold sealing substrate.

[0017] As a possible implementation, the first preset threshold or the second preset threshold is not less than 30 μm.

[0018] As a possible implementation, the intersection of the upper surface and the side surface of the shielding layer is a hollow structure.

[0019] As a possible implementation, the intersection of the upper part and the lower part of the side surface of the shielding layer is a hollow structure.

[0020] As a possible implementation, the hollow structure comprises a plurality of gaps tapering from top to bottom.

[0021] As a possible implementation, the hollow structure is continuous.

[0022] In order to ensure the electromagnetic shielding effect, the utility model provides a packaging structure, which comprises: a mold sealing substrate, the side surface of the mold sealing substrate is divided into an upper part and a lower part, and the upper part and the lower part of the side surface of the mold sealing substrate form an obtuse angle; a shielding layer, the shielding layer covers the mold sealing substrate, the side surface of the shielding layer is divided into an upper part and a lower part, and the upper part and the lower part of the shielding layer taper from bottom to top.

[0023] In this way, due to the oblique angle setting of the side surface of the mold sealing substrate, when the shielding layer is bent from horizontal to vertical, the corner changes from a right angle to two obtuse angles, and the extension at each corner is reduced, which can prevent the shielding layer film from being discontinuous, thereby ensuring the electromagnetic shielding effect. BRIEF DESCRIPTION OF DRAWINGS

[0024] Other features, objects and advantages of the utility model will become more apparent from the following detailed description of non-limiting embodiments made with reference to the accompanying drawings.

[0025] Figure 1 is a manufacturing and structural schematic diagram of an existing packaging structure;

[0026] Figure 2 is a structural schematic diagram of another existing packaging structure;

[0027] Figure 3 is a structural schematic diagram of a packaging structure 100 according to an embodiment of the present application;

[0028] Figure 4 is a partial enlarged view of the packaging structure 100 according to an embodiment of the present application;

[0029] Figure 5 is another partial enlarged view of the packaging structure 100 according to an embodiment of the present application;

[0030] Figure 6 is a dimension marking diagram of the packaging structure 100 according to an embodiment of the present application;

[0031] Figure 7 is a structural schematic diagram of a packaging structure 200 according to an embodiment of the present application;

[0032] Figure 8 is a partial enlarged view of the packaging structure 200 according to an embodiment of the present application;

[0033] Figure 9 is another partial enlarged view of the packaging structure 200 according to an embodiment of the present application;

[0034] Figure 10 is a comparative structural diagram of a packaging structure 300 according to an embodiment of the present application;

[0035] Figure 11 is a physical effect comparative diagram of the packaging structure 300 according to an embodiment of the present application;

[0036] Figure 12 is a physical overhead effect diagram of the packaging structure 300 according to an embodiment of the present application;

[0037] Figure 13 is a manufacturing flow diagram of the packaging structure 100 according to an embodiment of the present application;

[0038] Figure 14 is another manufacturing flow diagram of the packaging structure 100 according to an embodiment of the present application.

[0039] Explanation of reference signs / symbols:

[0040] 01 - mold seal substrate; 02 - shielding layer; 021 - release film; 022 - conductive contact agent; 03 - discontinuous region; 04 - plastic layer; 05 - insulating layer; 101 - mold seal substrate; 1011 - upper portion of mold seal substrate side surface; 1012 - lower portion of mold seal substrate side surface; 1013 - electronic component; 1014 - substrate; 1015 - first inflection point; 1016 - second inflection point; 1017 - mold seal material; 102 - shielding layer; 1021 - upper portion of shielding layer side surface; 10211 - first gap; 1022 - lower portion of shielding layer side surface; 10221 - second gap; 1023 - hollow structure. DETAILED DESCRIPTION

[0041] The specific embodiments of the present application will be described below in conjunction with the drawings and examples, and those skilled in the art can easily understand the technical problems solved by the present application and the technical effects produced by the present application through the contents described in the specification. It can be understood that the specific embodiments described herein are only used to explain the related application, and not to limit the application. In addition, in order to facilitate description, only the parts related to the application are shown in the drawings.

[0042] It should be readily understood that the meanings of "on", "above", and "on top of" in the present application should be interpreted in the broadest manner, such that "on" not only means "directly on" but also means "on with intervening components or layers therebetween".

[0043] In addition, in order to facilitate description, spatial relative terms such as "below", "under", "lower", "above", "upper" and the like can be used herein for describing the relationship between one element or component and another element or component shown in the drawings. In addition to the orientation described in the drawings, the spatial relative terms are also intended to cover different orientations of the device in use or operation. The device can be oriented in other ways (rotated 90° or in other orientations), and the spatial relative descriptions used herein can be interpreted accordingly.

[0044] As used herein, the term "layer" refers to a portion of material that includes a region having a thickness. A layer can extend over an entire underlying or overlying structure, or can have an extent that is less than the underlying or overlying structure. Further, a layer can be a region of a homogenous or inhomogenous continuous structure that has a thickness that is less than the thickness of the continuous structure. For example, a layer can be between, or between any pair of horizontal planes of, a top surface and a bottom surface of a continuous structure. A layer can extend horizontally, vertically, and / or along a tapered surface. A substrate can be a layer, can include one or more layers therein, and / or can have one or more layers thereon, above, and / or below. A layer can include multiple layers. For example, a semiconductor layer can include one or more doped or undoped semiconductor layers, and can have the same or different materials.

[0045] As used herein, the term "substrate" refers to a material on which a subsequent layer of material is added. The substrate itself can be patterned. The material added on top of the substrate can be patterned or can remain unpatterned. Further, the substrate can include a wide variety of semiconductor materials such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate can be made of a non-conductive material such as glass, plastic, or sapphire wafer, etc. Further alternatively, the substrate can have semiconductor devices or circuits formed therein.

[0046] It should be noted that the structure, proportion, size and the like shown in the drawings of the specification are only used to cooperate with the content described in the specification for understanding and reading by those skilled in the art, and do not have technical substantive significance to limit the implementation of the utility model, any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effect and the purpose that the utility model can produce, should still fall within the scope of the technical content disclosed by the utility model. At the same time, the terms such as "upper", "first", "second" and "one" in the specification are only for the convenience of clear description, and not to limit the scope of the utility model that can be implemented, the change or adjustment of the relative relationship, without substantially changing the technical content, is also regarded as the scope of the utility model that can be implemented.

[0047] It should also be noted that the embodiments of the utility model correspond to the longitudinal section in the corresponding front view direction, the transverse section in the corresponding right view direction, and the horizontal section in the corresponding upper view direction.

[0048] In addition, the embodiments in the utility model and the features in the embodiments can be combined with each other without conflict. The utility model will be described in detail below with reference to the drawings and in combination with the embodiments.

[0049] In combination withFigure 3 、 Figure 4 , Figure 3 is a structure diagram of a packaging structure 100 according to an embodiment of the present application, Figure 4 is a partial enlarged view of the packaging structure 100 according to an embodiment of the present application. The packaging structure 100 comprises:

[0050] The side surface of the mold sealing substrate 101 is divided into an upper part 1011 and a lower part 1012. It should be noted that the upper part 1011 of the side surface of the mold sealing substrate and the lower part 1012 of the side surface of the mold sealing substrate form an obtuse angle θ1 (as shown in Figure 4 ), and the size of the obtuse angle θ1 is not limited here;

[0051] The shielding layer 102 covers the mold sealing substrate 101, and the side surface thereof is also divided into an upper part 1021 and a lower part 1022. It should be noted that the upper part 1021 of the side surface of the shielding layer is tapered from bottom to top (as shown in Figure 4 D2>D1, where D1 and D2 are the thicknesses of the upper part 1021 of the side surface of the shielding layer at different positions), and the lower part 1022 of the side surface of the shielding layer is also tapered from bottom to top (as shown in Figure 4 D4>D3, where D3 and D4 are the thicknesses of the lower part 1022 of the side surface of the shielding layer at different positions). Optionally, the shielding layer 102 can be an electromagnetic shielding layer.

[0052] In this way, there is no sharp right angle on the mold sealing substrate 101, and stress accumulation is not easy to occur at the obtuse angle when the shielding layer 102 is laminated on the mold sealing substrate 101, the extension amount of the shielding layer 102 is small, the film layer of the shielding layer 102 can be prevented from being discontinuous, and the electromagnetic shielding effect is ensured.

[0053] Continuing to refer to Figure 4 , the upper part 1011 of the side surface of the mold sealing substrate and the upper surface of the mold sealing substrate 101 form an obtuse angle θ2, and the size of the obtuse angle θ2 is not limited here. The extension direction of the lower part 1012 of the side surface of the mold sealing substrate forms a right angle with the extension direction of the upper surface of the mold sealing substrate 101. As an example, when θ1=θ2=135 degrees, the included angle α (as shown in Figure 5 ) of the upper part 1011 of the side surface of the mold sealing substrate with the vertical direction = the included angle β (as shown in Figure 5 ) of the upper part 1011 of the side surface of the mold sealing substrate with the horizontal direction = 45°. Experiments show that in this example case, the stress reduction at the corner is better than in other cases.

[0054] Continuing to refer to Figure 4When the shielding layer 102 is laminated on the mold sealing substrate 101, a first gap 10211 can be generated between the upper part 1011 of the mold sealing substrate side surface and the upper part 1021 of the shielding layer side surface at a position close to the upper surface of the mold sealing substrate 101; a second gap 10221 can be generated between the lower part 1012 of the mold sealing substrate side surface and the lower part 1022 of the shielding layer side surface at a position close to the upper part 1011 of the mold sealing substrate side surface.

[0055] Continuing to refer to Figure 6 The mold sealing substrate 101 can include electronic elements 1013 for implementing various functions. If the intersection of the upper surface and the side surface of the mold sealing substrate 101 is defined as a first inflection point 1015, and the intersection of the upper part and the lower part of the mold sealing substrate 101 side surface is defined as a second inflection point 1016. In the process of forming the obtuse angles ∠θ1, ∠θ2 of the surface of the mold sealing substrate 101, in order to prevent damage to the electronic elements 1013 during the manufacturing process, the electronic elements 1013 and the placement range of the bevel area can be kept at a distance as much as possible, and the electronic elements 1013 are ensured to be within the placement range of the horizontal distance L3 corresponding to the upper surface of the mold sealing substrate 101, avoiding the placement range of the horizontal distance L4 between the first inflection point 1015 and the second inflection point 1016 and the placement range of the vertical distance L5 between the first inflection point 1015 and the second inflection point 1016.

[0056] Specifically, the distance L1 between the side surface of the electronic element 1013 and the projection of the first inflection point 1015 in the horizontal direction can be greater than a first preset threshold, and the distance L2 between the upper surface of the electronic element 1013 and the projection of the second inflection point 1016 in the vertical direction can be greater than a second preset threshold. As an example, the first preset threshold and the second preset threshold can each be no less than 30 μm.

[0057] Continuing to refer to Figure 7 , Figure 7 is a structural schematic diagram of a packaging structure 200 according to an embodiment of the present application. The packaging structure 200 is similar to the packaging structure 100, and the difference lies in that the intersection of the upper surface and the side surface of the shielding layer 102 of the packaging structure 200 and the intersection of the upper part and the lower part of the shielding layer 102 side surface can be a hollow structure 1023, and the packaging structure 100 does not include the hollow structure. In combination with Figure 8 、 Figure 9 The hollow structure 1023 of the packaging structure 200 can include a plurality of gaps that taper from top to bottom. In this way, the shielding layer 102 located at the intersection forms a structure that is easier to bend, and the gaps reduce the stress concentration problem during bending, so that the hollow structure 1023 is continuous and will not be disconnected.

[0058] Referring to Figure 10, the packaging structure 300 designs the left side surface of the mold sealing substrate 101 as a vertical surface similar to the prior art, designs the right side surface as a surface divided into upper and lower parts similar to the packaging structure 100, and laminates the shielding layer 102 on the mold sealing substrate 101. In combination with Figure 11 , Figure 11 The left side is an enlarged physical diagram of the left side part of the packaging structure 300, reflecting the problem of stress concentration in the design similar to the prior art; Figure 11 The right side is an enlarged physical diagram of the right side part of the packaging structure 300, reflecting that the design similar to the packaging structure 100 can effectively maintain the continuity of the shielding layer 102. Continue to refer to Figure 12 , Figure 12 The top view of the two physical structures that the packaging structure 300 may correspond to is shown, and it can be known from the figure that the design similar to the packaging structure 100 can effectively maintain the continuity of the shielding layer 102.

[0059] Next, refer to Figure 13 , the manufacturing steps of the packaging structure 100 of an embodiment of the utility model are introduced:

[0060] Step 1, refer to (a), the electronic element 1013 is formed on the substrate 1014;

[0061] Step 2, refer to (b), the mold sealing material 1017 is used to mold seal the overall structure including multiple structures that need to be wrapped by the shielding layer, that is, the mold sealing substrate 101;

[0062] Step 3, refer to (c), the inclined surface is formed on the mold sealing substrate 101 by using laser polishing;

[0063] Step 4, refer to (d), the mold sealing substrate 101 is cut to form a single structure that needs to be wrapped by the shielding layer;

[0064] Step 5, refer to (e), the shielding layer 102 is laminated on the single structure to obtain the packaging structure 100.

[0065] Next, refer to Figure 13 , the manufacturing steps of the packaging structure 100 of another embodiment of the utility model are introduced:

[0066] Step 1, refer to (a), the electronic element 1013 is formed on the substrate 1014;

[0067] Step 2, refer to (b), the mold sealing material 1017 is used to mold seal the overall structure including multiple structures that need to be wrapped by the shielding layer, that is, the mold sealing substrate 101;

[0068] Step 3, refer to (c), the inclined surface is formed on the mold sealing substrate 101 by using the bevel saw;

[0069] Step 4, see (d), cutting the mold seal substrate 101 to form a single structure that needs to be wrapped by the shielding layer;

[0070] Step 5, see (e), laminating the shielding layer 102 on the single structure to obtain the package structure 100.

[0071] As used herein, the terms "substantially," "substantial," "about," and "approximately" are used to indicate and describe differences and / or variations that can exist in the values, dimensions, spatial relationships, and / or other characteristics of materials, components, and / or parameters of the disclosed embodiments. For example, as used herein, the terms "substantially," "substantial," "about," and "approximately" can indicate and describe values that are within 10% of a stated value, such as within 5%, within 4%, within 3%, within 2%, within 1%, within 0.5%, within 0.1%, or within 0.05% of the stated value. As another example, a film or layer can be "substantially uniform" if the average thickness of the film or layer is within ±10% of the standard deviation, such as within ±5%, within ±4%, within ±3%, within ±2%, within ±1%, within ±0.5%, within ±0.1%, or within ±0.05% of the standard deviation. The term "substantially coplanar" can refer to two surfaces that are within 50 μιη of the same plane, such as within 40 μιη, within 30 μιη, within 20 μιη, within 10 μιη, or within 1 μιη of the same plane. Two components can be considered "substantially aligned" if they overlap or overlap within 200 μιη, 150 μιη, 100 μιη, 50 μιη, 40 μιη, 30 μιη, 20 μιη, 10 μιη, or 1 μιη, for example. Two surfaces or components can be considered "substantially perpendicular" if the angle between them is 90° ± 10° (such as ± 5°, ± 4°, ± 3°, ± 2°, ± 1°, ± 0.5°, ± 0.1°, or ± 0.05°), for example. When used in conjunction with events or circumstances, the terms "substantially," "substantial," "about," and "approximately" can refer to instances where the event or circumstance is occurring exactly, as well as instances where the event or circumstance is occurring approximately or nearly.

Claims

1. A package structure, characterized by, The application relates to a module package, comprising: a module package substrate, a side surface of the module package substrate being divided into an upper part and a lower part, the upper part and the lower part of the side surface of the module package substrate forming an obtuse angle; a shielding layer covering the module package substrate, a side surface of the shielding layer being divided into an upper part and a lower part, the upper part and the lower part of the side surface of the shielding layer both tapering from bottom to top.

2. The package structure of claim 1, wherein, a first gap is formed between the upper part of the side surface of the module package substrate and the upper part of the side surface of the shielding layer.

3. The package structure of claim 2, wherein, The first gap is close to an upper surface of the module package substrate.

4. The package structure of claim 1, wherein, a second gap is formed between the lower part of the side surface of the module package substrate and the lower part of the side surface of the shielding layer.

5. The package structure of claim 4, wherein, The second gap is close to the upper part of the side surface of the module package substrate.

6. The package structure of claim 1, wherein, The obtuse angle is 135 degrees.

7. The package structure of claim 1, wherein, The module package substrate comprises an electronic element.

8. The package structure of claim 7, wherein, A distance between a side surface of the electronic element and a projection of a first inflection point in a horizontal direction is greater than a first preset threshold value, the first inflection point being an intersection of an upper surface and the side surface of the module package substrate.

9. The package structure of claim 8, wherein, A distance between an upper surface of the electronic element and a projection of a second inflection point in a vertical direction is greater than a second preset threshold value, the second inflection point being an intersection of the upper part and the lower part of the side surface of the module package substrate.

10. The package structure of claim 9, wherein, The first preset threshold value or the second preset threshold value is not less than 30 micrometers.

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