Vibration damping device for mounting MEMS (Micro Electro Mechanical System) device

Abstract

The utility model relates to a vibration damper for MEMS device installation. The device mainly comprises MEMS devices 1, a soft band PCB 2 and a damping structure 3, the damping structure 3 is provided with a plurality of mounting parts 301, and each mounting part 301 is used for mounting one MEMS device 1; one end of the soft band PCB 2 is connected with one end of the MEMS device 1; the other end of the soft belt PCB 2 is located on the outer side of the damping structure 3 and used for being connected with a circuit board of a device to be installed, and the damping structure 3 is fixed to the device to be installed. According to the utility model, the MEMS device and the circuit board of the device to be installed are connected through the soft band PCB, so that the vibration and impact of the circuit board are firstly relieved through the soft band PCB and then transmitted to the MEMS device, and the vibration and impact transmitted from the circuit board to the MEMS device are reduced; the MEMS device is arranged on the damping structure, and vibration impact borne by the MEMS device is further reduced through the damping structure.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical communication technical field, especially a kind of damping device for MEMS device installation. BACKGROUND

[0002] According to conventional mode, micro-electro-mechanical system (Micro-Electro-Mechanical System, for short: MEMS) device is generally fixed on the circuit board of device to be installed by electric pin welding, and the circuit board with MEMS device is fixed in the structural member of device to be installed using disc head screw, to realize the electrical connection and structure fixation of MEMS device.

[0003] When the device with MEMS device is placed in optical communication base station, other equipment is installed in base station, or when running, installation and running process can bring vibration and impact to the device with MEMS device, vibration and impact are transmitted to the circuit board in device through fixed screw on device structure, and the circuit board is transmitted to MEMS device through electric pin of MEMS device, after layer-by-layer transmission, MEMS device usually bears more vibration and impact, and then the performance fluctuation of MEMS device when working is easily caused, to cause the adverse consequences of unstable communication.

[0004] Therefore, how to overcome the defects of the prior art, how to reduce the vibration and impact borne by MEMS device, is a problem to be solved in the technical field. CONTENT OF UTILITY MODEL

[0005] In view of the defects or improvement needs of prior art: how to reduce the vibration and impact borne by MEMS device, the utility model provides a kind of damping device for MEMS device installation, by setting soft band PCB and shock-absorbing structure, to realize the purpose of reducing the vibration and impact borne by MEMS device.

[0006] The utility model adopts the following technical scheme:

[0007] First, the utility model provides a kind of damping device for MEMS device installation, including MEMS device 1, soft band PCB 2 and shock-absorbing structure 3, and a plurality of installation parts 301 are provided on the shock-absorbing structure 3, and each installation part 301 is used to install one MEMS device 1;

[0008] One end of the soft band PCB 2 is connected with one end of the MEMS device 1;The other end of the soft band PCB 2 is located on the outer side of the shock-absorbing structure 3, and is used to be connected with the circuit board of device to be installed, and the shock-absorbing structure 3 is fixed on device to be installed.

[0009] In some embodiments, the shock-absorbing structure 3 comprises shock-absorbing foam 302, and a plurality of the mounting portions 301 are arranged side by side on the shock-absorbing foam 302, and the mounting portions 301 are open upward, and at least a part of the MEMS device 1 is fixed in the mounting portions 301.

[0010] In some embodiments, the inner wall of the mounting portion 301 is provided with adhesive, and at least a part of the MEMS device 1 is fixed in the mounting portion 301 by the adhesive.

[0011] In some embodiments, the mounting portion 301 comprises a square slot open upward or an arc-shaped slot open upward.

[0012] In some embodiments, the MEMS device 1 comprises an OSW device, the pads at both ends of the soft-band PCB 2 each comprise five pins, the pads at one end of the soft-band PCB 2 are welded with the pins of the OSW device in correspondence, and the pads at the other end of the soft-band PCB 2 are welded with the pins of the circuit board of the device to be installed in correspondence.

[0013] In some embodiments, the shock-absorbing structure 3 comprises bottom shock-absorbing foam 303 and top shock-absorbing foam 304, a plurality of first mounting portions 305 are arranged side by side on the bottom shock-absorbing foam 303, the first mounting portions 305 are open upward, a plurality of second mounting portions 306 are arranged side by side on the top shock-absorbing foam 304, the second mounting portions 306 are open downward, the number of the first mounting portions 305 and the second mounting portions 306 is the same and one-to-one corresponding, the first mounting portion 305 and the second mounting portion 306 at each corresponding position are combined to form a complete mounting portion 301, and at least a part of the MEMS device 1 is fixed in the space surrounded by the first mounting portion 305 and the second mounting portion 306.

[0014] In some embodiments, one side of the bottom shock-absorbing foam 303 facing the top shock-absorbing foam 304 is provided with adhesive, and / or one side of the top shock-absorbing foam 304 facing the bottom shock-absorbing foam 303 is provided with adhesive; the bottom shock-absorbing foam 303 and the top shock-absorbing foam 304 are fixed by the adhesive.

[0015] In some embodiments, the inner wall of the first mounting portion 305 is provided with adhesive, and / or the inner wall of the second mounting portion 306 is provided with adhesive; at least a part of the MEMS device 1 is fixed in the space surrounded by the first mounting portion 305 and the second mounting portion 306 by the adhesive.

[0016] In some embodiments, the first mounting portion 305 comprises an upwardly open square slot or an upwardly open arcuate slot, and the second mounting portion 306 comprises a downwardly open square slot or a downwardly open arcuate slot.

[0017] In some embodiments, the MEMS device 1 comprises a VOA device, the pads at both ends of the soft-band PCB 2 each comprise two pins, the pad at one end of the soft-band PCB 2 is welded with the corresponding pin of the VOA device, and the pad at the other end of the soft-band PCB 2 is welded with the pin of the circuit board of the device to be installed.

[0018] Compared with the prior art, the beneficial effects of the utility model are that: a damping device for MEMS device installation is provided, which is provided with a soft-band PCB and a damping structure, the soft-band PCB is used to connect the MEMS device and the circuit board of the device to be installed, so that the vibration and impact of the circuit board are first alleviated by the soft-band PCB and then transmitted to the MEMS device, thereby reducing the vibration and impact transmitted from the circuit board to the MEMS device; meanwhile, the MEMS device is arranged on the damping structure, and the vibration and impact borne by the MEMS device can be further reduced by the damping structure. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the drawings needed to be used in the embodiments of the utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model, and other drawings can be obtained according to these drawings without creative labor for those skilled in the art.

[0020] Figure 1 is a structure schematic view of the damping device for MEMS device installation provided by the embodiments of the utility model;

[0021] Figure 2 is a structure schematic view of the first detailed embodiment provided by the embodiments of the utility model;

[0022] Figure 3 is a structure schematic view of the second detailed embodiment provided by the embodiments of the utility model;

[0023] Figure 4 is a structure schematic view of the third detailed embodiment provided by the embodiments of the utility model;

[0024] Figure 5 is an installation flowchart of the damping device for MEMS device installation provided by the embodiments of the utility model. DETAILED DESCRIPTION

[0025] In the description of the utility model, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "left", "right", "top", "bottom" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and do not require the utility model to be necessarily constructed and operated in a particular orientation, and therefore should not be understood as limiting the utility model.

[0026] The utility model will be described in detail below in combination with specific embodiments. The following embodiments will help the person skilled in the art to further understand the utility model, but do not limit the utility model in any form. It should be pointed out that, for those skilled in the art, without departing from the concept of the utility model, a number of modifications and improvements can be made. These all belong to the protection scope of the utility model.

[0027] It should be noted that, if there is no conflict, each feature in the embodiments of the utility model can be combined with each other, and all within the protection scope of the utility model. Unless otherwise defined, all technical and scientific terms used in the specification have the same meaning as understood by those skilled in the art of the technology to which the utility model belongs. The terms used in the specification of the utility model are only for the purpose of describing the specific embodiment and are not used to limit the utility model.

[0028] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as open and inclusive, i.e. as "including but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" are intended to mean that a particular feature, structure, material or characteristic included in at least one embodiment or example of the disclosure. The illustrative representation of the above terms does not necessarily mean the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any one or more embodiments or examples in any appropriate manner, i.e. although they are carried in the embodiment or example of the above terms due to the order of appearance and location, they are not limited to the combination of one embodiment or example.

[0029] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the following will be further described in detail in combination with the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not used to limit the utility model.

[0030] Embodiment 1

[0031] As Figure 1As shown in the utility model embodiment, the utility model provides a kind of damping device for MEMS device installation, including MEMS device 1, soft band PCB 2 and shock-absorbing structure 3, it is provided with several mounting parts 301 on the shock-absorbing structure 3, and each mounting part 301 is used to install one MEMS device 1;The one end of the soft band PCB 2 is connected with the one end of the MEMS device 1;The other end of the soft band PCB 2 is located at the outside of the shock-absorbing structure 3, and it is used to be connected with the circuit board of device to be installed, and the shock-absorbing structure 3 is used to be fixed on device to be installed.

[0032] Through the above setting, the vibration and impact of the circuit board can be first alleviated by the soft band PCB, and then transmitted to the MEMS device, so as to reduce the vibration and impact transmitted from the circuit board to the MEMS device; at the same time, the MEMS device is arranged on the shock-absorbing structure, so that the vibration and impact borne by the MEMS device can be further reduced through the shock-absorbing structure.

[0033] In some embodiments, the material of the shock-absorbing structure 3 includes one or more of rubber, foam and artificial cartilage foam (abbreviated as ACF). For the convenience of description, the shock-absorbing structure 3 is described by taking the foam material as an example in the subsequent embodiments.

[0034] Embodiment 2

[0035] The above embodiment 1 is the overall technical scheme of the utility model embodiment, and the utility model embodiment will be described in more detail by more specific examples.

[0036] Reference Figure 2 As shown in the utility model embodiment, in some embodiments, the shock-absorbing structure 3 includes shock-absorbing foam 302, and the shock-absorbing foam 302 is provided with a plurality of mounting parts 301 side by side, the mounting part 301 is upwardly open, and at least a part of the MEMS device 1 is fixed in the mounting part 301. Specifically, an adhesive can be provided on the inner wall of the mounting part 301, and at least a part of the MEMS device 1 is fixed in the mounting part 301 by the adhesive.

[0037] It should be noted that, in some embodiments, the shock-absorbing foam 302 can be designed flexibly according to the shape and number of the MEMS device 1, to form a sufficient damping area between the MEMS device 1 and the device to be installed. Specifically, the shock-absorbing foam 302 can be designed with a slot according to the shape of the MEMS device 1, and the shock-absorbing foam 302 has an adhesive on the inside and outside, so that the MEMS device 1 can be fixed in the shock-absorbing foam 302, and the shock-absorbing foam 302 can be fixed on the structural member of the device to be installed. At the same time, the adhesive can be supplemented flexibly to increase the adhesion, and an effective damping area can be formed between the MEMS device 1 and the device to be installed.

[0038] In some embodiments, the mounting portion 301 comprises an open-up square slot or an open-up arc slot, regardless of whether it is a square slot or an arc slot, the size needs to match the size of the MEMS device 1 to be installed; for example, if the main body part of the MEMS device 1 is cylindrical, when the mounting portion 301 is a square slot, the length of the square slot can be consistent with the length of the main body part of the MEMS device 1, and the width of the square slot can be set to the diameter of the main body part of the MEMS device 1. When the mounting portion 301 is an arc slot, the curvature of the arc slot needs to match the curvature of the main body part of the MEMS device 1, and the arc slot can be set to a semicircular arc slot to enclose the lower half of the main body part of the MEMS device 1.

[0039] In some embodiments, the MEMS device 1 comprises an optical switch (OSW) device, and the pads at both ends of the soft-band PCB 2 each comprise five pins, the pads at one end of the soft-band PCB 2 are welded in correspondence with the pins of the OSW device, and the pads at the other end of the soft-band PCB 2 are welded in correspondence with the pins of the circuit board of the device to be installed.

[0040] It should be noted that, in some embodiments, the soft-band PCB 2 comprises three parts: namely, a pad at one end for connecting with the pins of the MEMS device 1, a pad at the other end for connecting to the circuit board of the device to be installed, and a middle part suitable for the length and shape of the structure of the device to be installed. The pad at one end for connecting with the pins of the MEMS device 1 is used for welding the MEMS device 1, and is an electrical pin lead-out part of the MEMS device 1. Specifically, after the electrical pins of the MEMS device 1 are cut to an appropriate length, they are welded to the pad at one end of the soft-band PCB 2, which is used to lead out the electrical pins of the MEMS device 1. The pad at the other end for connecting to the circuit board of the device to be installed is welded to the circuit board of the device to be installed, and is used to achieve electrical connection between the MEMS device 1 and the device to be installed. The middle part suitable for the length and shape of the structure of the device to be installed is used to adjust the position of the MEMS device 1 in the device to be installed, so as to facilitate better installation and fixation of the MEMS device 1, so that after the MEMS device 1 is welded, it can be appropriately placed on the structure of the device to be installed. Through the above settings, electrical connection and structural fixation of the MEMS device 1 and the device to be installed are achieved.

[0041] In the vibration damping device for MEMS device mounting provided in this embodiment, the flexible PCB 2 (i.e., flexible PCB) and vibration damping foam 302 are both common designs, allowing for flexible design. Different numbers of pads, different flexible PCB lengths and shapes, and different foam shapes can be designed for different products. For example, in scenarios where this vibration damping solution is used for OSW devices, when a 5-pin MEMS OSW device is mounted, both ends of the flexible PCB have 5-pin pads (5 pins). Based on the height of the OSW device, the flexible PCB length is typically set to around 13mm, effectively placing the OSW device in the mounting device. Since the OSW only operates in IL and BLOCK states, these two states are relatively less sensitive to vibration and impact. Therefore, the vibration damping foam 301 in the above embodiment can be selected, and the size of the vibration damping foam is designed according to the shape of the OSW device.

[0042] In summary, this utility model embodiment proposes a vibration damping device for MEMS device mounting, which includes a flexible PCB and a vibration damping structure. The flexible PCB connects the MEMS device and the circuit board of the device to be mounted, allowing the vibration and impact of the circuit board to be mitigated first through the flexible PCB before being transmitted to the MEMS device, thereby reducing the vibration and impact transmitted from the circuit board to the MEMS device. At the same time, the MEMS device is mounted on the vibration damping structure, which further reduces the vibration and impact experienced by the MEMS device.

[0043] Example 3

[0044] like Figure 3 As shown, this embodiment of the present invention provides a vibration damping device for mounting MEMS devices. Its vibration damping structure 3 is the same as that in embodiment 2, except that the MEMS device 1 and the flexible PCB 2 are different.

[0045] For example, when installing a 2PIN MEMS VOA device, both ends of the flexible PCB 2 have 2PIN pads. Based on the height of the Variable Optical Attenuator (VOA) device, the length of the flexible PCB is usually set to about 9mm, which can effectively place the VOA device in the device to be installed.

[0046] In this configuration, the MEMS device 1 includes a VOA device, and the pads at both ends of the flexible PCB 2 each include two pins. The pads at one end of the flexible PCB 2 are soldered to the pins of the VOA device, and the pads at the other end of the flexible PCB 2 are soldered to the pins of the circuit board of the device to be installed.

[0047] In addition to the above setting changes, the embodiment also includes shock absorbing foam 302, which is provided with a plurality of mounting portions 301 arranged side by side, the mounting portion 301 is upwardly open, and at least a part of the MEMS device 1 is fixed in the mounting portion 301.

[0048] In summary, the utility model discloses an embodiment of a kind of shock absorbing device for MEMS device installation, be provided with soft band PCB and shock absorbing structure, by soft band PCB to connect MEMS device and the circuit board of device to be installed, the vibration and impact of circuit board are alleviated first by soft band PCB, then to MEMS device, can reduce the vibration and impact from circuit board to MEMS device;At the same time, MEMS device is arranged on shock absorbing structure, can further reduce the vibration impact that MEMS device bears by shock absorbing structure.

[0049] Embodiment 4

[0050] On the basis of the above embodiment 3, since VOA device usually works in different attenuation states, with the increase of attenuation, the sensitivity of the device to vibration and impact will also increase, in such case, only using the shock absorbing foam of bottom part can not be enough, so, the embodiment selects the safer bottom + top shock absorbing foam to provide better shock absorbing capacity, the size of the shock absorbing foam of the embodiment is also designed according to the appearance of VOA device.

[0051] As Figure 4 As shown in some embodiments, the shock absorbing structure 3 includes bottom shock absorbing foam 303 and top shock absorbing foam 304, the bottom shock absorbing foam 303 is provided with a plurality of first mounting portions 305 arranged side by side, the first mounting portion 305 is upwardly open, the top shock absorbing foam 304 is provided with a plurality of second mounting portions 306 arranged side by side, the second mounting portion 306 is downwardly open, the number of the first mounting portion 305 and the second mounting portion 306 is same and one-to-one corresponding, the first mounting portion 305 and the second mounting portion 306 at each corresponding position are combined into complete mounting portion 301, and at least a part of the MEMS device 1 is fixed in the space surrounded by the first mounting portion 305 and the second mounting portion 306.

[0052] In some embodiments, one side of the bottom shock-absorbing foam 303 facing the top shock-absorbing foam 304 is provided with an adhesive, and / or one side of the top shock-absorbing foam 304 facing the bottom shock-absorbing foam 303 is provided with an adhesive; the bottom shock-absorbing foam 303 and the top shock-absorbing foam 304 are fixed by the adhesive. It should be noted that the adhesive can be provided on the bottom shock-absorbing foam 303, on the top shock-absorbing foam 304, or on both, as long as the bottom shock-absorbing foam 303 and the top shock-absorbing foam 304 can be fixed.

[0053] In some embodiments, the inner wall of the first mounting portion 305 is provided with an adhesive, and / or the inner wall of the second mounting portion 306 is provided with an adhesive; at least a part of the MEMS device 1 is fixed in the space enclosed by the first mounting portion 305 and the second mounting portion 306 by the adhesive. Similarly, the adhesive can be provided on the inner wall of the first mounting portion 305, on the inner wall of the second mounting portion 306, or on both, as long as the MEMS device 1 can be fixed in the space enclosed by the first mounting portion 305 and the second mounting portion 306.

[0054] In some embodiments, the first mounting portion 305 comprises a square slot with the opening facing upward or an arc-shaped slot with the opening facing upward, and the second mounting portion 306 comprises a square slot with the opening facing downward or an arc-shaped slot with the opening facing downward. Whether it is a square slot or an arc-shaped slot, the size needs to match the size of the MEMS device 1 to be installed; for example, if the main body part of the MEMS device 1 is cylindrical, and the first mounting portion 305 and the second mounting portion 306 are square slots, the length of the square space enclosed can be consistent with the length of the main body part of the MEMS device 1, and the width and height of the square space enclosed can be set as the diameter of the main body part of the MEMS device 1. When the first mounting portion 305 and the second mounting portion 306 are arc-shaped slots, the space enclosed is a cylindrical shape matching the diameter of the outer surface of the main body part of the MEMS device 1, so as to surround the main body part of the MEMS device 1.

[0055] In some embodiments, the MEMS device 1 comprises a VOA device, the pads at both ends of the soft-band PCB 2 each comprise two pins, the pad at one end of the soft-band PCB 2 is welded corresponding to the pins of the VOA device, and the pad at the other end of the soft-band PCB 2 is welded corresponding to the pins of the circuit board of the device to be installed.

[0056] In conclusion, the utility model discloses a kind of vibration damping device for MEMS device installation, be provided with soft band PCB and shock absorbing structure, through soft band PCB to connect MEMS device and the circuit board of device to be installed, the vibration and impact of circuit board are first relieved by soft band PCB, then pass to MEMS device, can reduce the vibration and impact from the circuit board to MEMS device;MEMS device is arranged on shock absorbing structure simultaneously, can further reduce the vibration impact that MEMS device bears by shock absorbing structure.

[0057] Finally, the embodiment also provides a kind of installation process for the vibration damping device of MEMS device installation, reference Figure 5 As shown in figure 10, first remove shock absorbing bubble cotton back adhesive, fixed in the structure of device to be installed, then soft band PCB is welded on the pin of MEMS device, then the MEMS device welded with soft band PCB is fixed in shock absorbing bubble cotton, finally, soft band PCB is welded on the circuit board of device to be installed.

[0058] The above only is the preferred embodiment of the utility model, and does not limit the utility model, any modification, equivalent replacement and improvement etc. within the spirit and principle of the utility model are included in the protection scope of the utility model. The content not being described in detail in the specification belongs to the prior art known to those skilled in the art.

Claims

1. A vibration damping device for MEMS device mounting, characterized by, The application relates to a shock-absorbing structure for MEMS devices, comprising a MEMS device (1), a flexible PCB (2) and a shock-absorbing structure (3) provided with a plurality of mounting portions (301), each of which is used for mounting a MEMS device (1). One end of the flexible PCB (2) is connected with one end of the MEMS device (1); the other end of the flexible PCB (2) is located outside the shock-absorbing structure (3) and is used for being connected with a circuit board of a device to be installed, and the shock-absorbing structure (3) is fixed on the device to be installed.

2. The vibration damping apparatus for MEMS device mounting according to claim 1, characterized by, The shock-absorbing structure (3) comprises shock-absorbing foam (302), and a plurality of the mounting portions (301) are arranged side by side on the shock-absorbing foam (302); the mounting portion (301) is open upward, and at least a part of the MEMS device (1) is fixed in the mounting portion (301).

3. The vibration damping apparatus for MEMS device mounting according to claim 2, characterized by, An inner wall of the mounting portion (301) is provided with adhesive, and at least a part of the MEMS device (1) is fixed in the mounting portion (301) through the adhesive.

4. The vibration damping apparatus for MEMS device mounting according to claim 2, characterized by, The mounting portion (301) comprises a square slot open upward or an arc-shaped slot open upward.

5. The vibration damping apparatus for MEMS device mounting according to claim 2, characterized by, The MEMS device (1) comprises an OSW device, and the pads at both ends of the flexible PCB (2) each comprise five pins; the pads at one end of the flexible PCB (2) are welded with the pins of the OSW device in correspondence, and the pads at the other end of the flexible PCB (2) are welded with the pins of the circuit board of the device to be installed in correspondence.

6. The vibration damping apparatus for MEMS device mounting according to claim 1, wherein The shock-absorbing structure (3) comprises bottom shock-absorbing foam (303) and top shock-absorbing foam (304); a plurality of first mounting portions (305) are arranged side by side on the bottom shock-absorbing foam (303), and the first mounting portion (305) is open upward; a plurality of second mounting portions (306) are arranged side by side on the top shock-absorbing foam (304), and the second mounting portion (306) is open downward; the number of the first mounting portions (305) and the second mounting portions (306) is the same and the positions of the first mounting portions (305) and the second mounting portions (306) correspond to each other one by one; the first mounting portion (305) and the second mounting portion (306) at each corresponding position are combined to form a complete mounting portion (301), and at least a part of the MEMS device (1) is fixed in the space surrounded by the first mounting portion (305) and the second mounting portion (306).

7. The vibration damping apparatus for MEMS device mounting according to claim 6, characterized by, One side of the bottom shock-absorbing foam (303) facing the top shock-absorbing foam (304) is provided with adhesive, and / or one side of the top shock-absorbing foam (304) facing the bottom shock-absorbing foam (303) is provided with adhesive; the bottom shock-absorbing foam (303) and the top shock-absorbing foam (304) are fixed through the adhesive.

8. The vibration damping apparatus for MEMS device mounting according to claim 6, characterized by, An inner wall of the first mounting portion (305) is provided with adhesive, and / or an inner wall of the second mounting portion (306) is provided with adhesive; at least a part of the MEMS device (1) is fixed in the space surrounded by the first mounting portion (305) and the second mounting portion (306) through the adhesive.

9. The vibration damping apparatus for MEMS device mounting according to claim 6, characterized by, The first mounting part (305) comprises an upwardly open square slot or an upwardly open arc slot, and the second mounting part (306) comprises a downwardly open square slot or a downwardly open arc slot.

10. The vibration damping apparatus for MEMS device mounting according to claim 6, wherein The MEMS device (1) comprises a VOA device, the pads at both ends of the soft-band PCB (2) each comprise two pins, the pad at one end of the soft-band PCB (2) is welded with the pins of the VOA device in correspondence, and the pad at the other end of the soft-band PCB (2) is welded with the pins of the circuit board of the device to be mounted in correspondence.

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