VC vapor chamber

Abstract

The utility model discloses a VC vapor chamber which comprises an upper cover, a lower cover, copper columns and metal pipes, the edge of the upper cover and the edge of the lower cover are jointed and sealed, a cavity is formed between the upper cover and the lower cover, the cavity is vacuumized and filled with cooling liquid, the copper columns are distributed in the cavity, powder columns are formed on the outer sides of the copper columns, and the powder columns are filled with cooling liquid. The metal tube is located on the upper surface of the upper cover in the vertical direction, and the metal tube and the upper cover are integrally sintered and formed and form a single piece. The VC vapor chamber is used for transferring heat on a product to the upper cover through the lower cover which is in close contact with the VC vapor chamber and then dissipating heat through the metal pipe on the upper cover, the metal pipe is integrally formed on the upper cover, the secondary welding process is omitted, the metal pipe is formed in the upper cover forging process, and the production efficiency is improved. The technological process is saved, and the stability and applicability of the structure are improved.

Description

Technical Field

[0001] This utility model relates to the technical field of temperature distribution plates, and more particularly to a VC temperature distribution plate. Background Technology

[0002] With the rapid development of electronic devices, their operating capabilities are becoming increasingly powerful, generating more and more heat. Vapor chambers (VCs) are widely used as heat sinks in high-power or highly integrated electronic products. Conventional vapor chambers have metal tubes for heat dissipation. During the production process, the top cover and metal tubes are welded and assembled later, increasing the number of components and production steps, which is detrimental to long-term development. Utility Model Content

[0003] One objective of this utility model is to provide a VC heat dissipation plate, which ensures better heat dissipation by integrally molding the metal tube and the top cover from the mold, thereby reducing the assembly between the top cover and the metal tube.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A VC heat spreader includes an upper cover, a lower cover, copper pillars, and a metal tube. The edges of the upper cover and the lower cover are joined and sealed. A cavity is formed between the upper cover and the lower cover. The cavity is evacuated and filled with coolant. A plurality of copper pillars are distributed in the cavity. Powder pillars are formed on the outer side of the copper pillars. The metal tube is located on the upper surface of the upper cover in a vertical direction. The metal tube and the upper cover are integrally sintered and formed as a single piece.

[0006] As a preferred technical solution, the lower surface of the upper cover is provided with a first capillary structure layer, and the inner surface of the lower cover is provided with a second capillary structure layer.

[0007] As a preferred technical solution, both the first capillary layer and the second capillary layer are copper powder sintered layers.

[0008] As a preferred technical solution, the upper end of the copper pillar is connected to the upper cover, and the lower end of the copper pillar is connected to the lower cover.

[0009] As a preferred technical solution, both the side of the upper cover and the side of the lower cover are provided with limiting holes, and the limiting holes are aligned vertically during installation.

[0010] As a preferred technical solution, the upper cover and the lower cover are welded together.

[0011] As a preferred technical solution, the upper cover and the lower cover are thermoformed.

[0012] The beneficial effects of this utility model are as follows: It provides a VC heat spreader plate, which is used to transfer the heat on the product through the steam phenomenon formed in the internal chamber to the upper cover through the tightly contacting lower cover, and then dissipate the heat through the metal tube on the upper cover. The metal tube is integrally formed on the upper cover, eliminating the secondary welding process. The metal tube is formed during the forging process of the upper cover, saving process steps and improving the stability and applicability of the structure. Attached Figure Description

[0013] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0014] Figure 1 This is an exploded view of a VC heat spreader as described in the embodiment;

[0015] Figure 2 This is a cross-sectional view of a VC heat exchanger as described in the embodiment;

[0016] Figure 3 This is a schematic diagram of the overall structure of a VC heat spreader as described in the embodiment.

[0017] Figures 1 to 3 middle:

[0018] 1. Top cover; 2. Bottom cover; 3. Copper pillar; 4. Metal tube; 5. Chamber; 6. Powder pillar; 7. First capillary layer; 8. Second capillary layer; 9. Limiting port. Detailed Implementation

[0019] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0020] like Figures 1 to 3 As shown, in this embodiment, a VC heat spreader includes an upper cover 1, a lower cover 2, copper pillars 3, and a metal tube 4. The edge of the upper cover 1 is joined and sealed with the edge of the lower cover 2. A chamber 5 is formed between the upper cover 1 and the lower cover 2. The chamber 5 is evacuated and filled with coolant. Several copper pillars 3 are distributed in the chamber 5. Powder pillars 6 are formed on the outer side of the copper pillars 3. The metal tube 4 is located on the upper surface of the upper cover 1 in a vertical direction. The metal tube 4 and the upper cover 1 are integrally sintered and formed as a single piece.

[0021] The upper cover 1 and the lower cover 2 are made of metals with good thermal conductivity, such as copper or aluminum. Both the upper cover 1 and the lower cover 2 are plate-shaped structures. The middle part of the lower cover 2 is recessed to form a chamber 5. After the upper cover 1 and the lower cover 2 are combined, the chamber 5 can hold the copper pillar 3 and the coolant. The chamber 5 is a sealed space. By vacuuming, a vacuum effect is created inside the chamber 5. The coolant is filled and sealed. The coolant is a low-boiling-point liquid, such as pure water, methanol, refrigerant, acetone or ammonia. Heat is transferred from the lower cover 2 to the upper cover 1 and then dissipated through the integrally formed metal tube 4, achieving rapid heat transfer and uniform heat dissipation.

[0022] The lower surface of the upper cover 1 is provided with a first capillary structure layer 7, and the inner surface of the lower cover 2 is provided with a second capillary structure layer 8. The construction of the capillary structure layer is not limited and can be any existing capillary structure. The three-dimensional adsorption and circulation effect can be achieved by utilizing capillary action.

[0023] Both the first capillary layer 7 and the second capillary layer 8 are copper powder sintered layers. The upper end of the copper pillar 3 is connected to the upper cover 1, and the lower end of the copper pillar 3 is connected to the lower cover 2. The copper pillar 3 itself bears the supporting role, preventing the upper cover 1 and the lower cover 2 from deforming or collapsing, so that the heat dissipation process has better strength. At the same time, when assembling the upper cover 1 and the lower cover 2, the upper cover 1 and the lower cover 2 are positioned.

[0024] Both the upper cover 1 and the lower cover 2 are provided with limiting ports 9. The limiting ports 9 are aligned vertically and installed. The entire heat equalization plate is installed into the actual working position through the limiting ports 9, and then the heat equalization work is carried out after positioning.

[0025] During the installation of the heat exchange plate, the upper cover 1 and the lower cover 2 are welded together or hot-pressed together.

[0026] It should be stated that the above-described specific embodiments are merely preferred embodiments of this utility model and the technical principles applied thereto. Within the scope of the technology disclosed in this utility model, any variations or substitutions that are easily conceived by those skilled in the art should be covered within the protection scope of this utility model.

Claims

1. A VC thermal uniform plate, characterized in that, The application relates to a copper column cooling device, which comprises an upper cover, a lower cover, copper columns and metal tubes, the edge of the upper cover is sealed with the edge of the lower cover, a chamber is formed between the upper cover and the lower cover, the chamber is vacuumized and filled with cooling liquid, a plurality of copper columns are distributed in the chamber, the outer side of the copper column is formed with a powder column, the metal tube is located on the upper surface of the upper cover along the vertical direction, the metal tube and the upper cover are integrally sintered and formed, and the metal tube and the upper cover constitute a single piece.

2. The VC thermal uniform plate according to claim 1, characterized in that, The lower surface of the upper cover is provided with a first capillary structure layer, and the inner surface of the lower cover is provided with a second capillary structure layer.

3. The VC thermal spreader of claim 2, wherein, The first capillary structure layer and the second capillary structure layer are both copper powder sintering layers.

4. The VC thermal uniform plate according to claim 1, characterized in that, The upper end of the copper column is connected to the upper cover, and the lower end of the copper column is connected to the lower cover.

5. The VC thermal uniform plate according to claim 1, characterized in that, The side edges of the upper cover and the lower cover are both provided with limiting openings, and the limiting openings are vertically aligned and installed.

6. The VC thermal spreader of claim 1, wherein, The upper cover and the lower cover are welded and formed.

7. The VC thermal spreader of claim 1, wherein, The upper cover and the lower cover are hot-pressed and formed.

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