Frame for semiconductor light-emitting device

Abstract

The utility model discloses a frame for a semiconductor light-emitting device, and relates to the technical field of semiconductor light-emitting device packaging. According to the device, the semiconductor light-emitting device body can be packaged in the frame of the packaging shell and the base plate through the packaging plate, when the semiconductor light-emitting device body needs to be replaced, the limiting plate slides towards the spring, the packaging plate can be removed, the semiconductor light-emitting device body can be replaced, and after replacement, the semiconductor light-emitting device body can be replaced. When the packaging plate is installed on the base plate, the limiting plate slides towards the direction of the spring due to the inclined radian arranged at one end of the limiting plate when the limiting plate is pressed by the packaging plate, the spring stores elastic potential energy in the process, and when the packaging plate is placed and the limiting plate is not pressed by the packaging plate any more, the limiting plate slides towards the direction of the spring. At the moment, the elastic potential energy stored by the spring can drive the limiting plate to reset, so that the limiting plate presses and fixes the packaging plate, and the semiconductor light-emitting device body can be conveniently replaced when damaged.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor light-emitting device packaging technology, and in particular to a frame for semiconductor light-emitting devices. Background Technology

[0002] Semiconductor light-emitting device frames have a wide range of applications in semiconductor light-emitting devices, such as LED lights and displays. In these applications, the performance and reliability of the frames directly affect the performance and lifespan of the entire device.

[0003] In the prior art, the structure of most semiconductor light-emitting device frames is fixed. Therefore, after the semiconductor light-emitting device is packaged, if the internal packaged semiconductor light-emitting device is damaged, the fixed structure of the semiconductor light-emitting device frame is not conducive to the quick replacement of the damaged semiconductor light-emitting device.

[0004] Based on the above problems, a framework for semiconductor light-emitting devices is proposed. Utility Model Content

[0005] In view of this, the main purpose of this utility model is to provide a frame for semiconductor light-emitting devices, which solves the above-mentioned problems.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a frame for a semiconductor light-emitting device, comprising a package shell and a base plate disposed at the bottom of the package shell, wherein the base plate has a plurality of mounting slots, and semiconductor light-emitting device bodies are respectively mounted inside the plurality of mounting slots; a package plate is disposed between the package shell and the base plate; a plurality of guide grooves are rectangularly distributed inside the package shell; a limiting plate is slidably disposed inside the plurality of guide grooves; a spring is disposed between the limiting plate and the inner wall of the package shell; and a guide component is disposed inside the guide groove for maintaining the limiting plate to slide horizontally within the guide groove.

[0007] As a preferred embodiment, the guide slide assembly includes a limiting groove and a limiting block. The limiting groove is symmetrically distributed on both sides of the limiting plate, and several sets of limiting blocks are provided on the limiting plate corresponding to the limiting groove, and the limiting blocks are slidably connected to the limiting groove.

[0008] As a preferred embodiment, the encapsulation plate is made of transparent reinforced glass.

[0009] As a preferred embodiment, one end of the limiting plate is provided with an inclined arc.

[0010] As a preferred embodiment, the base plate is provided with several sets of springs arranged in a rectangular pattern.

[0011] As a preferred embodiment, the base plate is connected with connecting wires.

[0012] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, its main features are:

[0013] This device encapsulates the semiconductor light-emitting device within a frame consisting of a packaging shell and a base plate using a packaging plate. When the semiconductor light-emitting device needs to be replaced, the packaging plate can be removed by sliding towards the spring via a limiting plate, allowing for the replacement of the semiconductor light-emitting device. After replacement, when the packaging plate is installed onto the base plate, the inclined arc at one end of the limiting plate causes it to slide towards the spring under pressure from the packaging plate. During this process, the spring stores elastic potential energy. Once the packaging plate is in place and the limiting plate is no longer under pressure from the packaging plate, the stored elastic potential energy drives the limiting plate to reset, thus holding and fixing the packaging plate in place. This method facilitates convenient replacement of the semiconductor light-emitting device when it is damaged.

[0014] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the vertical structure of an embodiment of the present utility model;

[0016] Figure 2 This is a top view of an embodiment of the present utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the present invention with the encapsulation board removed;

[0018] Figure 4 This is a partial sectional view of an embodiment of the present utility model;

[0019] Figure 5 This is a schematic diagram of the semiconductor light-emitting device body structure according to an embodiment of the present invention.

[0020] Explanation of reference numerals in the attached drawings: 1. Encapsulation shell; 2. Base plate; 3. Mounting groove; 4. Semiconductor light-emitting device body; 5. Encapsulation plate; 6. Guide groove; 7. Limiting groove; 8. Limiting plate; 9. Limiting block; 10. Spring; 11. Connecting wire. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the scope of the present utility model.

[0022] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0023] Please see Figures 1 to 5 This utility model provides a frame for a semiconductor light-emitting device, including a package shell 1 and a base plate 2 at the bottom of the package shell 1. The package shell 1 and the base plate 2 are fixedly connected by bolts. The base plate 2 has several sets of mounting slots 3, specifically forty sets, divided into eight horizontal sets and five vertical sets. Semiconductor light-emitting device bodies 4 are installed inside the mounting slots 3 respectively. A package plate 5 is provided between the package shell 1 and the base plate 2. The package plate 5 is made of transparent tempered glass. By using transparent tempered glass, the package plate 5 can ensure the protection of the semiconductor light-emitting device body 4 while maintaining light transmission when the mounting slots 3 emit light. The package shell 1 has several sets of guide grooves 6 arranged in a rectangular pattern, specifically four sets. Limiting plates 8 are slidably installed inside the guide grooves 6 respectively. The limiting plates 8 are used to press and hold the package plate 5. The limiting plate 8 has an inclined arc at one end, and a spring 10 is provided between the limiting plate 8 and the inner wall of the encapsulation shell 1. This device can encapsulate the semiconductor light-emitting device body 4 inside the frame of the encapsulation shell 1 and the base plate 2 through the encapsulation plate 5. When it is necessary to replace the semiconductor light-emitting device body 4, the limiting plate 8 slides towards the spring 10, and the encapsulation plate 5 can be removed, so that the semiconductor light-emitting device body 4 can be replaced. After replacement, when the encapsulation plate 5 is installed on the base plate 2, the inclined arc at one end of the limiting plate 8 will cause the limiting plate 8 to slide towards the spring 10 when it is under the pressure of the encapsulation plate 5. During this process, the spring 10 will store elastic potential energy. When the encapsulation plate 5 is placed and the limiting plate 8 is no longer under the pressure of the encapsulation plate 5, the elastic potential energy stored in the spring 10 will drive the limiting plate 8 to reset, so that the limiting plate 8 holds and fixes the encapsulation plate 5.

[0024] Please see Figures 1 to 5The guide groove 6 is provided with a guide assembly for keeping the limiting plate 8 sliding horizontally within the guide groove 6. The guide assembly includes a limiting groove 7 and a limiting block 9. The limiting groove 7 is symmetrically distributed on both sides of the limiting plate 8. Several sets of limiting blocks 9 are provided on the limiting plate 8 corresponding to the limiting groove 7, and the limiting blocks 9 are slidably abutting against the limiting groove 7. When the limiting plate 8 slides inside the guide groove 6, the limiting blocks 9 will slide inside the limiting groove 7, thereby keeping the limiting plate 8 sliding horizontally within the guide groove 6.

[0025] Please see Figures 1 to 5 The base plate 2 is provided with several sets of springs 10 arranged in a rectangular pattern. Specifically, there are four sets of springs 10, which are used to reduce the impact transmission force when the device as a whole is impacted after the encapsulation plate 5 is installed. At the same time, they can buffer the encapsulation plate 5 during installation to avoid damage to the device during installation.

[0026] Please see Figures 1 to 5 The base plate 2 is connected to a connecting wire 11, which is used to connect the device to an external circuit for power supply, and together with the base plate 2, enables the semiconductor light-emitting device body 4 to emit light.

[0027] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A frame for a semiconductor light emitting device, characterized by: The utility model relates to a semiconductor light emitting device package structure, including the package shell (1) and the base plate (2) of package shell (1) bottom setting, a plurality of groups of installation slot (3) are set up on the base plate (2), a plurality of groups the semiconductor light emitting device body (4) is installed respectively in the inner portion of installation slot (3), the package plate (5) is set up between package shell (1) and base plate (2), a plurality of groups of guide slide groove (6) are set up in the package shell (1) and are in rectangular distribution, a plurality of groups the limit plate (8) is slidably set up in the inner portion of guide slide groove (6) respectively, the spring (10) is set up between limit plate (8) and the inner wall of package shell (1), the guide slide assembly for keeping limit plate (8) horizontal sliding in guide slide groove (6) is set up in the inner portion of guide slide groove (6).

2. A frame for a semiconductor light emitting device according to claim 1, wherein: The guide slide assembly includes limit slot (7) and limit block (9), the limit slot (7) is symmetrically distributed and set up on both sides of limit plate (8), the limit block (9) is set up with a plurality of groups on limit plate (8) corresponding limit slot (7), and the limit block (9) and limit slot (7) are slidably connected.

3. The frame for a semiconductor light emitting device according to claim 1, wherein: The package plate (5) is made of transparent reinforced glass material.

4. The frame for a semiconductor light emitting device of claim 1, wherein: One end of the limit plate (8) is provided with an inclined arc.

5. The frame for a semiconductor light emitting device of claim 1, wherein: The base plate (2) is provided with a plurality of springs (10) in a rectangular distribution.

6. The frame for a semiconductor light emitting device of claim 1, wherein: The base plate (2) is connected with a connecting wire (11).

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