Micro-hole machining equipment

Abstract

The utility model discloses micro-hole machining equipment, and belongs to the technical field of micro-hole machining. Comprising a pilot through hole processing device which comprises a pilot through hole processing head; the water-jet guided laser device comprises a water-jet guided laser processing head; and the control device is used for controlling the pilot through hole machining head to firstly machine the pilot through hole in the punching position of the workpiece and then controlling the water guide laser machining head to machine the pilot through hole so as to obtain a final hole. The micro-hole machining device is applied to micro-hole machining, solves the technical problem that machining efficiency is sharply reduced due to the fact that energy of laser reaching the surface of a workpiece is greatly reduced due to accumulated water interference when large-depth-diameter-ratio micro-holes are machined in the prior art, and has the advantage of being high in machining efficiency.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of micro hole processing, especially relates to a micro hole processing equipment. BACKGROUND

[0002] Water guide laser technology has been applied to the processing of micro deep holes and the cutting of parts, such as engine turbine blade film cooling holes. Its principle is to couple laser into a small-diameter high-pressure water beam, utilize the total reflection of light on the water-air interface, and conduct laser to the workpiece surface through the water beam to ablate the workpiece material and realize removal processing.

[0003] Chinese patent CN 107344258 B proposes a water guide laser and electric processing combined processing method, which aims to utilize the characteristics of the two processing methods to process a certain feature of a part respectively. For example, when processing small holes on turbine blades with ceramic coating, the ceramic coating on the surface is processed by water guide laser, and the metal matrix is processed by electric discharge machining. Its main feature is that there is a water guide laser device and an electric discharge machining device, and each device has a positioning system, called the first positioning system and the second positioning system. During processing, the workpiece is switched in the two positioning systems according to the needs of a certain processing feature.

[0004] However, when water guide laser is used to process micro holes with large depth-diameter ratio (the ratio of the depth of the hole to the diameter), as the depth increases, it is difficult to drain the accumulated water in the hole. The accumulated water will become deeper and deeper, and under the action of flow field and gravity field, the accumulated water will seriously interfere with the shape of the water beam, destroy the smooth water-air interface that can form total reflection, make the laser escape, greatly reduce the energy of the laser reaching the workpiece surface, and cause the processing efficiency to decrease sharply. UTILITARIAN CONTENT

[0005] The details of one or more embodiments of the utility model are proposed in the following drawings and description, so that other features, purposes and advantages of the application are more concise and easy to understand.

[0006] The utility model proposes a micro hole processing equipment, which solves the technical problem that the existing technology greatly reduces the energy of laser reaching the workpiece surface due to the interference of accumulated water when processing micro holes with large depth-diameter ratio, resulting in a sharp decrease in processing efficiency, and has the characteristics of high processing efficiency.

[0007] The utility model discloses a kind of micro-hole processing equipment, comprising: pilot via processing device, including pilot via processing head;Water guide laser device, including water guide laser processing head;Movement device, comprising: Y-axis movement shaft, vertically arranged in workpiece side;X-axis movement shaft, horizontally arranged above workpiece and with the Y-axis movement shaft each other vertically connected;Z-axis movement shaft, with the X-axis movement shaft is connected, and with the Y-axis movement shaft, the X-axis movement shaft two two verticals;The pilot via processing head with the water guide laser processing head is installed on the Z-axis movement shaft;And control device, control the pilot via processing head first in the punching position of workpiece and process pilot via, then control the water guide laser processing head and process pilot via to obtain final hole.

[0008] In some embodiments, the movement device further comprises a worktable for fixing the workpiece, and the worktable, the Y-axis movement shaft, the X-axis movement shaft and the Z-axis movement shaft are installed on the same machine tool base.

[0009] In some embodiments, the Z-axis movement shaft comprises a first Z-axis movement shaft connected with the pilot via processing head, and a second Z-axis movement shaft connected with the water guide laser processing head.

[0010] In some embodiments, the water guide laser processing head comprises: a high-pressure water cavity, the inner wall of which forms a chamber, and the chamber is filled with water; one side of the water guide laser processing head is provided with a glass window, and the other side is provided with a nozzle, and the nozzle is arranged opposite to the glass window; a focusing lens is arranged opposite to the glass window, and the focal point of the focusing lens is aligned with the nozzle; after the laser is focused through the focusing lens, the laser and the water in the chamber pass through the nozzle together to form a high-pressure water beam coupled with the laser.

[0011] In some embodiments, the pilot via processing device is an electric spark device, and the electric spark device comprises an electric spark processing head, and the electric spark processing head comprises: an electrode, the electrode is a hollow electrode, and the hollow electrode is filled with gas or liquid.

[0012] In some embodiments, the control device is electrically connected with the pilot via processing device, the water guide laser device and the movement device.

[0013] In some embodiments, the pilot via processing device further comprises a pilot via processing device host, and the pilot via processing device host is electrically connected with the control device and the pilot via processing head; the water guide laser device further comprises a water guide laser device host, and the water guide laser device host is electrically connected with the control device and the water guide laser processing head.

[0014] In some embodiments, the inner diameter of the nozzle is any value in the range of 20-100 μm.

[0015] In some embodiments, the workbench is a fixed platform or a variable position workbench.

[0016] The micro-hole machining equipment also has the advantages that the pilot through hole machining device is used as a machining pilot through hole pre-process machining device, and a water guide laser machining prefabricated drainage through hole, which is beneficial to water discharge in a subsequent water guide laser machining process and improves machining efficiency.

[0017] The micro-hole machining equipment has the advantages that the structure of the movement device, the installation forms of the movement device, the pilot through hole machining device and the water guide laser device are limited, the workbench, the Y-axis movement shaft, the X-axis movement shaft and the Z-axis movement shaft are installed on the same machine tool base, and the workpiece is clamped on the workbench and is not disassembled during machining. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings, which are included to provide a further understanding of the present application and constitute a part of this application, illustrate embodiments of the present application and together with the description serve to explain the present application. In the drawings:

[0019] Figure 1 FIG. 1 is a structural schematic view of a micro-hole machining equipment provided by an embodiment of the present application;

[0020] Figure 2 FIG. 5 is a structural schematic view of a water guide laser machining head provided by an embodiment of the present application;

[0021] Figure 3 FIG. 7 is a schematic view of a punching principle of the water guide laser machining head provided by an embodiment of the present application;

[0022] Figure 4 FIG. 11 is a structural schematic view of an electric spark device and a perforating machining principle provided by an embodiment of the present application;

[0023] Figure 5 FIG. 13 is a schematic view of a machining principle A of the micro-hole machining equipment provided by an embodiment of the present application;

[0024] Figure 6 FIG. 14 is a schematic view of a machining principle B of the micro-hole machining equipment provided by an embodiment of the present application;

[0025] Figure 7The processing principle schematic view C of the micro hole processing equipment is provided in the embodiments of the utility model.

[0026] BRIEF DESCRIPTION OF DRAWINGS: 101, Y-axis movement shaft; 102, X-axis movement shaft; 103, first Z-axis movement shaft; 104, second Z-axis movement shaft; 105, workbench; 106, machine tool base; 201, pilot through hole processing head; 2011, electrode; 202, pilot through hole processing device host; 301, water guide laser processing head; 3011, high pressure water cavity; 3012, glass window; 3013, nozzle; 3014, focusing lens; 302, water guide laser device host; 40, control device; 50, workpiece; 501, pilot through hole; 502, final hole; 601, laser; 602, water beam; 603, scattered laser; 604, photo plasma; 605, water accumulation; 701, electrode center gas or liquid; 702, photo plasma. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the utility model clearer and more intelligible, the following combines the drawings and embodiments, and the utility model is described and explained. It should be understood that the specific embodiments described herein are only used to explain the utility model, and are not used to limit the utility model. Based on the embodiments provided by the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0028] Obviously, the drawings in the following description are only some examples or embodiments of the utility model, and for those skilled in the art, the utility model can be applied to other similar situations without creative labor. In addition, it can be understood that although the effort made in this development process can be complex and lengthy, for those skilled in the art related to the content disclosed by the utility model, some design, manufacture or production changes based on the technical content disclosed by the utility model are only conventional technical means, and should not be understood as insufficient disclosure of the utility model.

[0029] In the utility model, the phrase "embodiment" means that the specific features, structures or characteristics described in combination with the embodiment can be contained in at least one embodiment of the utility model. The phrase appears at various places in the specification, and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is not mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described in the utility model can be combined with other embodiments without conflict.

[0030] Unless otherwise defined, technical terms or scientific terms used in the present application shall have the ordinary meaning of the terms to a person skilled in the art to which the present application pertains. The terms "one", "a", "an", "the" and similar terms used in the present application do not denote a quantity limitation, but can denote a singular or a plurality. The terms "comprise", "include", "have" and any variations thereof used in the present application are intended to cover a non-exclusive inclusion; for example, a process, method, system, product or device that includes a list of steps or modules (units) is not limited to the listed steps or units, but can further include other steps or units not listed or can further include other steps or units inherent to such processes, methods, products or devices. The terms "connect", "connected", "couple" and similar terms used in the present application are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The term "multiple" refers to two or more. The term "and / or" describes the relationship between associated objects, indicating that there can be three relationships, for example, "A and / or B" can represent: A alone, A and B together, and B alone. The character " / " generally represents an "or" relationship between the associated objects. The terms "first", "second" and the like used in the present application are merely to distinguish similar objects, and do not represent a specific order of the objects.

[0031] The present application provides a micro-hole processing equipment, Figure 1 The present application provides a micro-hole processing equipment, Figure 1As shown, the micro-hole processing equipment includes: a pilot through-hole 501 processing device including a pilot through-hole processing head 201; a water guide laser 601 device including a water guide laser processing head 301; a movement device including: a Y-axis movement shaft 101 vertically arranged on one side of the workpiece 50; an X-axis movement shaft 102 horizontally arranged above the workpiece 50 and connected with the Y-axis movement shaft 101 perpendicularly; a Z-axis movement shaft connected with the X-axis movement shaft 102 and perpendicular to the Y-axis movement shaft 101 and the X-axis movement shaft 102; the pilot through-hole processing head 201 and the water guide laser processing head 301 are installed on the Z-axis movement shaft; and a control device 40 controls the pilot through-hole processing head 201 to first process the pilot through-hole 501 on the punching position of the workpiece 50, and then controls the water guide laser processing head 301 to process the pilot through-hole 501 to obtain the final hole 502. When the micro-hole processing equipment is used to process the micro-hole, the pilot through-hole 501 processing device first processes the pilot through-hole 501, the diameter of the hole is much smaller than the diameter of the final hole 502 or the slit width, the pilot through-hole 501 is only used as an intermediate step to exclude the accumulated water 605 in the hole during the next water guide laser 601 processing, and the subsequent water guide laser 601 processing procedure actually plays a role in the final features of the part. The micro-hole processing equipment uses the pilot through-hole 501 processing device as a pre-processing device for processing the pilot through-hole 501, which is beneficial to the discharge of the accumulated water 605 in the subsequent water guide laser 601 processing process and improves the processing efficiency.

[0032] Regarding the above movement device, it should be noted that the movement mechanism can have various configurations, Figure 1 One of the typical configurations is shown, the pilot through-hole processing head 201 is installed on one Z-axis movement shaft, the water guide laser processing head 301 is installed on another Z-axis movement shaft, and the two Z-axis movement shafts are installed on the crossbeam of the X-axis movement shaft 102, and the X-axis movement shaft 102 is installed on the two vertical columns of the Y-axis movement shaft 101.

[0033] Further, the movement device further includes a worktable 105 for fixing the workpiece 50, and the worktable 105, the Y-axis movement shaft 101, the X-axis movement shaft 102, and the Z-axis movement shaft are installed on the same machine tool base 106. This embodiment defines the structure of the movement device, the installation form of the movement device, the pilot through-hole 501 processing device, and the water guide laser 601 device, and further defines that the worktable 105 and the Y-axis movement shaft 101, the X-axis movement shaft 102, and the Z-axis movement shaft are installed on the same machine tool base 106, so that they have a unified positioning reference. After the workpiece 50 is clamped on the worktable 105, it is no longer disassembled during the processing, the pilot through-hole processing head 201 and the water guide laser processing head 301 are driven by the movement device and moved to the workpiece 50 to be processed, and the processing is performed, which ensures the processing efficiency and improves the positioning accuracy. Specifically:

[0034] The aforementioned Y-axis motion axis 101 is mounted on the machine tool base 106. The workpiece 50 to be processed is clamped on the table surface of the worktable 105. The worktable 105 can be a fixed platform or a... Figure 1 The precision positioning table 105 with two rotary axes is shown in the image. All axes of the table 105 and the motion device are mounted on the same machine tool base 106, which facilitates the establishment of a unified positioning reference and reduces positioning work. The aforementioned motion axes, the table 105, and the machine tool base 106 together constitute the motion device, sharing a common positioning reference, eliminating the need for repeated positioning during machining. The structural form of the motion device is not limited to... Figure 1 The configuration shown is characterized in that the workpiece 50 is fixed on the worktable 105 and is not removed during the entire processing. The motion device can bring the pilot through hole processing head 201 and the water-guided laser processing head 301 to the processing position on the workpiece 50 and perform drilling processing.

[0035] In some embodiments, the Z-axis motion axis includes a first Z-axis motion axis 103 connected to the pilot hole machining head 201 and a second Z-axis motion axis 104 connected to the water-guided laser machining head 301.

[0036] like Figure 2 As shown, the water-guided laser processing head 301 includes: a high-pressure water cavity 3011, with its inner wall forming a chamber filled with water; a glass window 3012 on one side and a nozzle 3013 on the other side, the nozzle 3013 being positioned opposite the glass window 3012; a focusing lens 3014, positioned opposite the glass window 3012, with its focal point aligned with the nozzle 3013; after being focused by the focusing lens 3014, the laser 601 passes through the glass window 3012 and together with the water in the chamber, passes through the nozzle 3013 to form a high-pressure water beam 602 coupled with the laser 601. Specifically, the high-pressure water cavity 3011 has a light-transmitting glass window 3012 at the top and a nozzle 3013 at the bottom, the nozzle 3013 typically having a diameter of 20-100 μm. High-pressure water is ejected through the nozzle 3013, forming a slender water beam 602. Laser 601 is focused by a focusing lens and enters the high-pressure water chamber 3011 through glass window 3012. The focal point is aligned with nozzle 3013, and laser 601 is thus introduced into the water jet 602. When the incident angle of laser 601 at the water-air interface is greater than the critical angle, total internal reflection occurs, allowing laser 601 to propagate within the water jet 602 until it reaches the surface of workpiece 50, forming high-temperature photoinduced plasma 604 to ablate and remove the material, thus achieving processing. Water not only propagates laser 601 but also carries away material debris and heat generated during processing. However, if poor drainage occurs in the water-guided laser 601 processing area, it can lead to problems such as... Figure 3When the water 605 is shown, the shape of the water beam 602 will be affected, causing the laser 601 energy to dissipate, forming an escaped scattered laser 601, which cannot be effectively transmitted to the area to be processed, resulting in a significant decrease in processing efficiency or even stagnation.

[0037] As shown in Figure 4 The pilot through-hole 501 processing device is an electric spark device, which includes an electric spark processing head. The electric spark processing head includes an electrode 2011, which is a hollow electrode 2011 through which a gas or liquid passes. During the pilot through-hole 501 processing, the hollow electrode 2011 is connected to two poles of a power supply with the workpiece 50, and a gas or liquid is introduced into the hollow electrode 2011. The end of the electrode 2011 forms an electrically induced plasma 702 due to the tip discharge, which ablates and removes the material of the workpiece 50. The hollow electrode 2011 can move in the feed direction to achieve punching processing and form the pilot through-hole 501.

[0038] In some embodiments, the control device 40 is electrically connected to the pilot through-hole 501 processing device, the water-guided laser 601 device, and the motion device. Further, the pilot through-hole 501 processing device further includes a pilot through-hole processing device host 202, which is electrically connected to the control device 40 and the pilot through-hole processing head 201. The water-guided laser 601 device further includes a water-guided laser device host 302, which is electrically connected to the control device 40 and the water-guided laser processing head 301. The control device 40 is connected to and controls the motion device, the water-guided laser 601 processing device, and the pilot through-hole 501 processing device. It realizes human-computer interaction and issues processing instructions to the above devices for processing. The water-guided laser 601 device is composed of a water-guided laser processing head 301, a water-guided laser device host 302, and optical fibers, cables, pipelines, etc. connecting the two. The pilot through-hole processing head 201 is connected to the pilot through-hole processing device host 202 through cables, pipelines, etc. The water-guided laser processing head 301 is connected to the water-guided laser device host 302 through optical fibers, cables, pipelines, etc.

[0039] The process of using the above-mentioned micro-hole processing equipment to process the workpiece 50 is as shown in Figures 5-7 Specifically, the position, shape, and other data information of the hole to be processed in the workpiece 50 are imported into the CAM programming software, which can be a two-dimensional drawing or a three-dimensional data model. The CAM programming software determines the processing position, motion path, and process parameters, generates processing codes, and transmits them into the hole machine tool control device 40. The workpiece 50 is positioned on the workbench 105. The posture and position of the workpiece 50 in the machine tool should be consistent with the data information imported into the CAM programming software, which can usually be ensured by positioning fixtures or positioning measurement devices.

[0040] The first Z-axis movement shaft 103 drives the EDM head to move from the initial parking position to the position to be machined on the workpiece 50, and a pilot hole 501 is drilled on the workpiece 50. The diameter of the pilot hole 501 is smaller than the diameter of the final hole 502. Generally, it can be 15-80% of the diameter of the final hole 502, and the minimum is not less than the diameter of the water beam 602 of the water-guided laser 601. The commonly used water beam 602 diameter of the water-guided laser 601 is 40-150 μm. The optimal diameter of the pilot hole 501 machined by the EDM can be determined by experiment, and the smaller the diameter, the higher the comprehensive efficiency.

[0041] After the pilot hole 501 is machined, the movement device drives the EDM head to return to the initial parking position. The second Z-axis movement shaft 104 drives the water-guided laser machining head 301 to move from the initial parking position to the machining position, and continues to machine at the position of the pilot hole 501 until the required hole, i.e. the final hole 502, is obtained.

[0042] During the machining process, all the through holes to be machined can be machined by EDM, and then the water-guided laser 601 is used for reaming; or one or several through holes are machined by EDM, and then the water-guided laser 601 is used for machining, and the process is repeated until all the holes are machined. It should be noted that the EDM in the present scheme can also be replaced by a common laser 601 machining in air, such as picosecond femtosecond ultrafast laser 601 machining, etc., which is also used to machine a smaller diameter hole for drainage in advance to facilitate subsequent water-guided laser 601 machining.

[0043] The utility model discloses still disclose a micro hole machining method using the above-mentioned micro hole machining equipment for the micro hole of workpiece 50, comprising: first, machining the pilot hole 501 on the punching position of workpiece 50, then using the water-guided laser 601 to machine the pilot hole 501, and obtaining the final hole 502. The diameter of the pilot hole 501 is not less than the diameter of the water beam 602 of the water-guided laser 601, and the diameter of the pilot hole 501 is 15-80% of the diameter of the final hole 502.

[0044] When the water guide laser 601 processes the micro hole, it is layer by layer removal processing. Deep hole needs to be processed repeatedly for dozens or even hundreds of times. Before drilling through, the inside of the hole will accumulate water 605. Usually, the high-pressure water jet 602 will flush away the water below the water jet 602, and the water jet 602 can reach the bottom of the hole. The laser 601 can be conducted to the surface of the workpiece 50 along with the water jet 602 to melt or gasify the material and achieve processing. However, as the depth increases, especially for small diameter and large depth-diameter ratio holes, the high-pressure water jet 602 will be disturbed by the reflected and upwelling accumulated water 605 when it travels, resulting in a sharp increase in processing difficulty. Not only the processing efficiency is greatly reduced, but also the water jet 602 shape may be damaged, causing the processing to be interrupted, or the quality of the processed hole shape is poor. The above-mentioned micro hole processing method provided by the utility model processes a smaller diameter through hole than the final required hole diameter first, called a pilot through hole 501, and then enlarges the hole. At this time, due to the existence of the pilot through hole 501, the accumulated water 605 can be discharged from the bottom, so the water jet 602 of the water guide laser 601 can avoid the influence of the accumulated water 605, thereby improving the processing efficiency.

[0045] The above-mentioned micro hole processing method first manufactures a pilot through hole 501 with a diameter smaller than the diameter of the final hole 502 on the workpiece 50, and then uses the water guide laser 601 to process the pilot through hole 501 at the same position for subsequent hole expansion processing. The pilot through hole 501 is used as a water guide laser 601 processing pre-drainage through hole, thereby facilitating the discharge of accumulated water 605 during subsequent water guide laser 601 processing, greatly improving the processing efficiency. This method can be used for micro group hole processing of turbine blades and combustion chambers of an aero-engine. Compared with single water guide laser 601 processing, the efficiency can be significantly improved. Further, compared with simply using water guide laser 601 processing, the processing efficiency of the above-mentioned method provided by the utility model can be improved by several times when processing small diameter and large depth-diameter ratio holes.

[0046] The technical solution is further limited that the diameter of the pilot through hole 501 is not less than the diameter of the water beam 602 of the water guide laser 601, and the diameter of the pilot through hole 501 is 15-80% of the diameter of the final hole 502. The reason is that if the diameter of the pilot through hole 501 is too small, it is not conducive to subsequent water guide laser processing, and if the diameter is too large, the processing time is too long, which reduces the overall processing efficiency. Taking the diameter of the water beam 602 and the diameter of the final hole 502 as references, the smaller the diameter of the final hole 502, the more difficult it is to drain water during water guide laser processing, and the greater the demand for the drainage effect of the pilot through hole 501, the greater the diameter ratio of the pilot through hole 501 to the final hole 502, which can be up to 80%. If it is larger, it will not be conducive to improving the overall processing efficiency. The larger the diameter of the final hole 502, the greater the ability to drain water, and the relatively lower the demand for the drainage of the pilot through hole 501, the smaller the diameter ratio of the pilot through hole 501 to the final hole 502, which can be as small as 15% of the diameter of the final hole 502 or not less than the diameter of the water beam 602. If it is smaller, it will not be conducive to the drainage effect. The diameter of the pilot through hole 501 can also be 20%, 30%, 40%, 50%, 60%, 70% of the diameter of the final hole 502, and any point value within the range.

[0047] In some embodiments, an electric spark or ultrafast laser 601 is used to process a pilot through hole 501 at the punching position of the workpiece 50. The pilot through hole 501 is smaller in diameter, and the water guide laser 601 has lower efficiency in processing the pilot through hole 501 due to the problem of accumulated water 605, so electric spark drilling or ultrafast laser 601 punching can be used. Among them, electric spark drilling is a micro-hole precision drilling method that has been widely used, which can process deep holes with a diameter of 0.015mm to 3mm. It uses a rod-shaped electrode 2011 made of conductive material. After electrification, the medium between the electrode 2011 and the workpiece 50 is ionized to produce high-temperature plasma to ablate and remove the material of the workpiece 50. The electrode 2011 can be hollow or solid. Among them, the hollow electrode 2011 passes water or gas medium, which can process more precise holes.

[0048] In some of the embodiments, the micro-hole includes: a micro-hole with a diameter of 0.3-0.6mm and a depth-diameter ratio greater than 10:1, a micro-hole with a diameter of 0.8-1.2mm and a depth-diameter ratio greater than 15:1, a micro-hole with a diameter greater than 1.2mm and a depth-diameter ratio greater than 25:1. The micro-hole with the above size has high processing difficulty, and the prior art has the problems of low processing efficiency and poor quality of the processed through hole when processing the micro-hole in the above form. The micro-hole processing method provided in the above embodiments of the utility model solves the above problems by first manufacturing a pilot through hole 501 with a diameter smaller than that of the final hole 502 on the workpiece 50, and then using water guide laser 601 to perform subsequent hole expansion processing on the pilot through hole 501 at the same position, and has the characteristics of high processing efficiency and high processing quality of the final hole 502.

[0049] The technical features of the above embodiments can be combined arbitrarily, and to make the description concise, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present application.

[0050] The above embodiments only express several implementation manners of the utility model, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the utility model patent. It should be pointed out that for ordinary skilled persons in the art, without departing from the concept of the utility model, a number of modifications and improvements can be made, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A micro-hole processing apparatus characterized by comprising: The application relates to a pilot hole machining device, a water-guided laser device, a motion device and a control device. The pilot hole machining device comprises a pilot hole machining head. The water-guided laser device comprises a water-guided laser machining head. The motion device comprises: A Y-axis motion shaft vertically arranged on one side of a workpiece; An X-axis motion shaft horizontally arranged above the workpiece and connected with the Y-axis motion shaft; A Z-axis motion shaft connected with the X-axis motion shaft and vertically arranged with the Y-axis motion shaft and the X-axis motion shaft; the pilot hole machining head and the water-guided laser machining head are installed on the Z-axis motion shaft. The control device controls the pilot hole machining head to machine a pilot hole on a punching position of the workpiece, and then controls the water-guided laser machining head to machine the pilot hole to obtain a final hole.

2. The micro-hole processing apparatus according to claim 1, wherein The motion device further comprises a workbench for fixing the workpiece, and the workbench, the Y-axis motion shaft, the X-axis motion shaft and the Z-axis motion shaft are installed on the same machine tool base.

3. The micro-hole processing apparatus according to claim 1, wherein The Z-axis motion shaft comprises a first Z-axis motion shaft connected with the pilot hole machining head and a second Z-axis motion shaft connected with the water-guided laser machining head.

4. The micro-hole processing apparatus according to claim 1, wherein The water-guided laser machining head comprises: A high-pressure water cavity with an inner wall surrounding a cavity, the cavity being filled with water; one side of the cavity is provided with a glass window, and the other side of the cavity is provided with a nozzle, and the nozzle is arranged opposite to the glass window; A focusing lens arranged opposite to the glass window, and a focal point of the focusing lens is aligned with the nozzle; after laser is focused through the focusing lens, the laser passes through the glass window and the water in the cavity to form a high-pressure water beam coupled with laser through the nozzle.

5. The micro-hole processing apparatus according to claim 1, wherein The pilot hole machining device is an electric spark device, and the electric spark device comprises an electric spark machining head, the electric spark machining head comprises an electrode, and the electrode is a hollow electrode, and the hollow electrode is filled with gas or liquid.

6. The micro-hole processing apparatus according to claim 1, wherein The control device is electrically connected with the pilot hole machining device, the water-guided laser device and the motion device.

7. The micro-hole processing apparatus according to claim 1, wherein The pilot hole machining device further comprises a pilot hole machining device main machine, the pilot hole machining device main machine is electrically connected with the control device and the pilot hole machining head; the water-guided laser device further comprises a water-guided laser device main machine, and the water-guided laser device main machine is electrically connected with the control device and the water-guided laser machining head.

8. The micro-hole processing apparatus according to claim 4, wherein The inner diameter of the nozzle is any value in the range of 20-100 mu m.

9. The micro-hole processing apparatus according to claim 2, wherein The workbench is a fixed platform or a variable-position workbench.

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