Water-jet guided laser processing equipment

Abstract

The utility model discloses water-jet guided laser processing equipment, and belongs to the technical field of water-jet guided laser processing. According to the technical scheme, a probe of the vibration sensor makes contact with a workpiece to collect vibration signals of the workpiece; and the signal analyzer is electrically connected with the vibration sensor, analyzes and judges the vibration signals of the workpiece, filters interference signals, retains the obtained workpiece vibration signals caused by the water beam, converts the workpiece vibration signals caused by the water beam, expands the workpiece vibration signals according to a time sequence to obtain vibration signal waveforms, and judges whether the workpiece is cut through or not according to waveform characteristics. The water-jet-guided laser processing device is applied to the aspect of water-jet-guided laser processing, solves the problems of poor accuracy, complex equipment and high cost of the existing mode for judging whether a workpiece is cut through or not during water-jet-guided laser processing, and has the characteristics of high detection precision, simple control method and low cost.

Description

TECHNICAL FIELD

[0001] The utility model belongs to water guide laser processing technical field especially relates to a water guide laser processing equipment. BACKGROUND

[0002] Water guide laser processing technology is a kind of processing method for precision drilling and cutting, its principle is through the water jet like hair, laser energy is conducted to workpiece surface, workpiece material is ablated to realize processing, it can be used for precision cutting of metal, ceramic, composite material, semiconductor material.Punching.In a large number of group hole processing or long time processing, equipment control system needs to accurately know the moment of processing a feature, i.e.the feature has been cut through completely, so as to be transferred to the next processing position in time and continue to process, reduce the time of equipment idle stroke, improve processing efficiency.

[0003] How to identify whether a feature is processed, there are two methods in engineering.One is to adopt fixed processing cycle number method, according to test, the depth of water guide laser walking a track cycle processing can be obtained, and the thickness of the processed feature is measured, the number of cycle processing that equipment should carry out can be obtained.For example, the depth of 5mm through hole, the depth of water guide laser processing one track cycle is 0.05mm, then 100 processing cycles are needed at least, and it can be processed through.Such, in the machine tool program, set the number of processing cycles, after reaching the cycle number, end processing, change to the next feature.This method has the main disadvantage that the processing depth of each cycle is not a fixed value, changes with processing depth and processing parameter, in large depth processing, the difference is particularly obvious, at the same time, the processing time of each hole is not consistent, it is difficult to use single hole test to calibrate processing time, if the time set by program is too long, although it can improve the reliability of cutting through, but it will greatly reduce the processing efficiency.Therefore, for complex workpiece, it is appropriate to adopt cutting through sensing method in engineering, directly detects the sound, light, electricity and other signals related to processing process, determines whether cutting through through analysis and judgment, can accurately judge whether cutting through, also can turn to the next working position in the first time, improve processing efficiency.

[0004] Chinese patent CN 111194249 A discloses a scheme for cutting penetration sensing using optical signals, the main features of which are: laser light reaches the workpiece surface through the water jet, reflects, and part of the reflected light will pass along the water jet back to the original path, on the laser light path, through light splitting and detection facilities, using the characteristics of reflected light wavelength and frequency, the reflected light signal is collected, and the relationship between the reflected light signal and whether the workpiece is cut through is established, realizing cutting penetration sensing and closed-loop control; Chinese patent CN 114101943 B discloses a scheme for determining the spectrum of laser light reflected back along the water jet by using a CCD, performing element quantitative analysis, and comparing with the pre-established standard element spectrum, and combining with the CCD visual image to determine the cutting penetration state; Chinese patent CN 115041811 B discloses a method for using spectral analysis of the spectrum signal returned along the water jet, and another scheme is to use an acousto-optic signal analysis device installed below the machining head and facing the machining area to collect and analyze the sound signals and light signals propagating in the air during the machining process. The common feature of the above schemes is to use the reflected light signal returned along the water jet, or through spectral analysis, or through element quantitative analysis, to determine the cutting penetration state.

[0005] However, the above-mentioned scheme requires special spectral analysis equipment, which increases the complexity of the water guide laser machining optical head and increases the cost. In addition, in the scheme using sound signals, since it is a non-contact method, there is a possibility of intermittent distortion of the sound signal detection. Practical new type content

[0006] The details of one or more embodiments of the present application are presented in the following drawings and description, so that other features, objects and advantages of the present application are more concise and easy to understand.

[0007] The utility model discloses a kind of water guide laser machining monitoring equipment, solve the existing way for judging whether water guide laser machining cuts through workpiece exists poor accuracy, equipment complex, high cost Problem, with the characteristics of high detection precision, simple control method, low cost.

[0008] The utility model discloses a water guide laser processing equipment, include: vibration sensor, probe and workpiece contact to collect the vibration signal of workpiece, signal analyzer, with vibration sensor electricity is connected, the vibration signal of workpiece is made analysis judgment, filters interference signal, and keeps getting the workpiece vibration signal caused by water beam, the workpiece vibration signal caused by water beam is transformed and is unfolded according to time sequence, obtains vibration signal waveform, in a processing cycle: if vibration signal waveform is continuous and amplitude, frequency stable waveform, judges the processing state of workpiece to be not cut through, if vibration signal waveform is intermittent and amplitude, frequency fluctuation waveform, judges the processing state of workpiece to be critical cut through, if vibration signal waveform does not exist, judges the processing state of workpiece to be all cut through, water guide laser processing device is used to process workpiece, general control device, with signal analyzer and water guide laser processing device electricity is connected, when signal analyzer judges the processing state of workpiece to be not cut through or critical cut through, controls water guide laser processing device continues to process workpiece, when signal analyzer judges the processing state of workpiece to be cut through, controls water guide laser processing device and stops workpiece processing.

[0009] In some embodiments, the signal analyzer is electrically connected to the vibration sensor through a signal amplifier, and the signal amplifier amplifies the vibration signal collected by the vibration sensor and transmits the amplified vibration signal to the signal analyzer.

[0010] In some embodiments, the workpiece is fixed on a workbench.

[0011] In some embodiments, the vibration sensor probe contacts the workpiece or the vibration sensor probe contacts the workpiece and the workbench.

[0012] In some embodiments, the water guide laser processing device includes a laser and a processing head; the laser is electrically connected to the general control device; the processing head further includes: a high-pressure water cavity, the inner wall forms a chamber, the chamber is filled with water; one side is provided with a glass window, the other side is provided with a nozzle, the nozzle is arranged opposite to the glass window; a focusing lens is arranged opposite to the glass window, and the focal point is aligned with the nozzle; the laser emitted by the laser is focused through the focusing lens, passes through the glass window and the water in the chamber, and forms a high-pressure water beam coupled with laser through the nozzle, the high-pressure water beam impacts the workpiece surface to process the workpiece and generates vibration.

[0013] In some embodiments, a mechanical control device for controlling the machine tool is further included, and the mechanical control device is electrically connected to the general control device.

[0014] Compared with the prior art, the utility model has the advantages that:

[0015] The utility model provides a water guide laser processing equipment has the characteristics of simple structure, low equipment cost, when using the water guide laser processing equipment to process work piece, through direct measurement work piece vibration characteristic, gathers the work piece vibration signal caused by water beam in water guide processing, can judge whether the punching or cutting is cut through, has the characteristics of high detection precision, simple control method, low cost, easy to promote. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this utility model, illustrate embodiments of the utility model and serve to explain the utility model, and do not constitute an improper limitation on the utility model. In the drawings:

[0017] Figure 1 The utility model provides a water guide laser processing equipment's structural schematic diagram provided by the embodiment of the utility model;

[0018] Figure 2 The utility model provides a water guide laser processing flow chart provided by the embodiment of the utility model;

[0019] Figure 3 The utility model provides a work piece's processing state is the vibration signal wave form diagram of not cutting through;

[0020] Figure 4 The utility model provides a work piece's processing state is the vibration signal wave form diagram of critical cutting through;

[0021] Figure 5 The utility model provides a work piece's processing state is the vibration signal wave form diagram of cutting through;

[0022] Figure 6 The utility model provides a machine tool processing path schematic drawing of one processing cycle provided by the embodiment of the utility model;

[0023] Figure 7 The utility model provides a blind hole or blind groove schematic drawing provided by the embodiment of the utility model;

[0024] Figure 8 The utility model provides a work piece state schematic drawing of cutting through provided by the embodiment of the utility model;

[0025] Figure 9 The utility model provides a processing head's structural schematic diagram provided by the embodiment of the utility model;

[0026] BRIEF DESCRIPTION OF DRAWINGS: 1, vibration sensor; 2, signal amplifier; 3, signal analyzer; 4, general control device; 5, mechanical control device; 6, laser; 7, workpiece; 8, workbench; 9, water beam; 10, laser; 1101, high-pressure water cavity; 1102, glass window; 1103, nozzle; 1104, focusing lens. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the utility model more clear, the following will combine with the drawings and examples to describe and explain the utility model. It should be understood that the specific examples described herein are only used to explain the utility model, and are not used to limit the utility model. Based on the examples provided by the utility model, all other examples obtained by those of ordinary skill in the art without creative labor belong to the scope of protection of the utility model.

[0028] Obviously, the drawings in the following description are only some examples or embodiments of the utility model, and for those of ordinary skill in the art, the utility model can be applied to other similar situations according to these drawings without creative labor. In addition, it can be understood that although the efforts made in this development process can be complex and lengthy, for those of ordinary skill in the art related to the disclosed content of the utility model, some design, manufacture or production changes based on the technical content disclosed in the utility model are only conventional technical means, and should not be understood as insufficient disclosure of the utility model.

[0029] In the utility model, the "example" means that the specific features, structures or characteristics described in combination with the example can be contained in at least one example of the utility model. The appearance of this phrase in various places in the specification does not necessarily refer to the same example, nor is it an independent or alternative example that is not mutually exclusive with other examples. Those of ordinary skill in the art explicitly and implicitly understand that the described examples of the utility model can be combined with other examples without conflict.

[0030] Unless otherwise defined, technical terms or scientific terms used in the present application shall have the ordinary meaning of the terms used in the art to which the present application belongs. The terms "one", "a", "an", "the", and similar terms used in the present application do not denote a singular quantity or a quantity of one, but can denote a singular or plural quantity. The terms "include", "contain", "have", and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but can also include steps or units that are not listed, or can also include other steps or units inherent to the process, method, product, or device. The terms "connect", "connected", "couple", and similar terms used in the present application are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The term "multiple" refers to two or more. The term "and / or" describes the relationship between the associated objects, indicating that there can be three relationships, for example, "A and / or B" can represent the three cases of A alone, A and B together, and B alone.

[0031] The embodiment of the present application provides a water guide laser 10 processing equipment, Figure 1 The structure of the water guide laser 10 processing equipment according to the embodiment of the present application is shown in the figure. Reference Figure 1As shown, the water guide laser 10 processing device comprises: a vibration sensor 1, a probe of which is in contact with the workpiece 7 to collect the vibration signal of the workpiece 7; a signal analyzer 3, which is electrically connected with the vibration sensor 1, analyzes and judges the vibration signal of the workpiece 7, filters out interference signals, retains the vibration signal of the workpiece 7 caused by the water beam 9, converts the vibration signal of the workpiece 7 caused by the water beam 9 and expands it in time sequence to obtain the vibration signal waveform: if the vibration signal waveform is a waveform with continuous amplitude and frequency, it is judged that the processing state of the workpiece 7 is not cut through; if the vibration signal waveform is a waveform with intermittent amplitude and frequency fluctuation, it is judged that the processing state of the workpiece 7 is critical cut through; if the vibration signal waveform does not exist, it is judged that the processing state of the workpiece 7 is completely cut through; a water guide laser 10 processing device for processing the workpiece 7; a general control device 4, which is electrically connected with the signal analyzer 3 and the water guide laser 10 processing device, controls the water guide laser 10 processing device to continue processing the workpiece 7 when the signal analyzer 3 judges that the processing state of the workpiece 7 is not cut through or critical cut through; controls the water guide laser 10 processing device to stop processing the workpiece 7 when the signal analyzer 3 judges that the processing state of the workpiece 7 is cut through. Further, it also comprises a signal amplifier 2 and a workbench 8, the signal analyzer 3 is electrically connected with the vibration sensor 1 through the signal amplifier 2, the signal amplifier 2 transmits the vibration signal collected by the vibration sensor 1 to the signal analyzer 3 after amplification, and the workpiece 7 is fixed on the workbench 8. The probe of the vibration sensor 1 is in contact with the workpiece 7, or the probe of the vibration sensor 1 is in contact with the workpiece 7 and the workbench 8. In some embodiments, it also comprises a mechanical control device 5 for controlling the machine tool, which is electrically connected with the general control device 4.

[0032] Regarding the above vibration sensor 1, signal analyzer 3 and general control device 4, the vibration sensor 1 has many optional models, such as MMF's general vibration sensor KS76C10, GT2 series vibration sensor of Keyence, etc.; the signal analyzer 3 is composed of an oscilloscope, signal analysis software and a computer, etc. The waveform analysis software is installed in the computer, which can use Scopeview, WFMReader, WaveView, etc. It is used to filter out noise and process the vibration waveform caused by the water beam into a visible signal, and then make a judgment through the preset judgment standard. The general control device 4 mainly includes a Huazhong CNC 848 type CNC controller for controlling the operation of the machine tool, a Siemens S7-200 type PLC module and a signal connector, etc. It is used to receive signals, man-machine dialogue and control the operation of the machine tool.

[0033] The aforementioned water-guided laser processing equipment 10 features a simple structure and low cost. The workpiece 7 is fixedly mounted on the worktable 8. The probe of the vibration sensor 1 directly contacts the workpiece 7, and if necessary, can also contact the worktable 8. The vibration sensor 1 converts mechanical vibration signals into electrical or optical signals. The signal amplifier 2 is connected to the vibration sensor 1 via wires or optical fibers, amplifying the signal gain and transmitting it to the signal analyzer 3. The signal analyzer 3 filters out interference signals, identifies and analyzes the vibration signals caused by the water jet 9, establishes a correlation with the drilling status, and then transmits the analysis results to the central control device 4 via wires. Based on the above results, the central control device 4 issues the next operating instructions to the mechanical control device 5 and the laser 6, etc.

[0034] In some embodiments, the water-guided laser processing apparatus 10 includes a laser 6 and a processing head; the laser 6 is electrically connected to the main control device 4; such as Figure 9 As shown, the processing head further includes: a high-pressure water chamber 1101, the inner wall of which forms a cavity filled with water; a glass window 1102 on one side and a nozzle 1103 on the other side, the nozzle 1103 being opposite to the glass window 1102; a focusing lens 1104, which is opposite to the glass window 1102 and whose focal point is aligned with the nozzle 1103; the laser 10 emitted by the laser 6 is focused by the focusing lens 1104 and passes through the glass window 1102 together with the water in the cavity through the nozzle 1103 to form a high-pressure water jet 9 coupled with the laser 10, the high-pressure water jet 9 impacts the surface of the workpiece 7 to process the workpiece 7 and generate vibration.

[0035] Regarding the above-mentioned water-guided laser 10 processing equipment, the central control device 4 issues processing program instructions, driving the laser 6 and the mechanical control device 5 to work together, so that the water beam 9 coupled with the laser 10 executes a processing trajectory cycle at the first processing position of the workpiece 7, for example, processing once along the contour of a hole or once along the kerf position. Simultaneously, after receiving the start instruction from the central control device 4, the vibration sensor 1 collects the vibration signal on the workpiece 7 in real time, regardless of whether the water beam 9 is processing. The real-time vibration signal, collected by the vibration sensor 1 and amplified by the signal amplifier 2, is transmitted to the signal analyzer 3. Since the characteristics of the through-cut vibration signal are the same as or similar to those of the water beam 9 in its non-processing state, the signal analyzer 3 needs to obtain the theoretical operating state of the equipment from the central control device 4, and only analyzes and judges the vibration signals obtained during the cyclic processing process; signals from other time periods are not processed.

[0036] This utility model also discloses a method for processing with the aforementioned water-guided laser 10 processing equipment, including a monitoring process for whether the water-guided laser 10 cuts through the workpiece 7 during processing. The monitoring process includes: a signal collection step, including collecting the vibration signal of the workpiece 7 using a vibration sensor 1; a signal processing step, including analyzing and judging the vibration signal of the workpiece 7 using a signal analyzer 3, filtering interference signals (including the vibration signal of the workpiece 7 caused by the machine tool movement), and retaining the vibration signal of the workpiece 7 caused by the water jet 9; and a judgment step, converting the vibration signal of the workpiece 7 caused by the water jet 9 and unfolding it in chronological order to obtain the vibration signal waveform. Within one processing cycle: if the vibration signal waveform is... Figure 3 The continuous waveform with stable amplitude and frequency shown indicates that the machining state of workpiece 7 is incomplete cutting; if the vibration signal waveform is... Figure 4 The intermittent waveform with fluctuating amplitude and frequency shown indicates that the machining state of workpiece 7 is at critical penetration; if the vibration signal waveform... Figure 5 The absence of a waveform indicates that the workpiece 7 is fully cut through. This water-guided laser processing method directly measures the vibration characteristics of the workpiece 7, collects the vibration signal of the workpiece 7 caused by the water jet 9 during water-guided processing, and determines whether the drilling or cutting has penetrated through. It features high detection accuracy, simple control method, low cost, and ease of promotion.

[0037] The signal characteristics for determining whether workpiece 7 has been cut through are as follows: Figures 3-5 As shown:

[0038] Figure 6 This is a schematic diagram of the machining path of a machine tool for one machining cycle, where A is both the starting point and the ending point of the machining process.

[0039] Figure 3 This is a schematic diagram of the vibration signal waveform characteristics under normal processing conditions. At this time, workpiece 7 is not cut through, and the bottom of the processing area is... Figure 7 The blind hole or blind groove shown; the high-pressure water jet 9 continuously impacts the workpiece 7, generating a continuous vibration signal. After collection and conversion, the signal is unfolded in chronological order, from the beginning to the end of the processing cycle, forming... Figure 3 The continuous signal waveform shown is a characteristic of normal processing vibration signal, indicating that the processing state is incomplete cutting.

[0040] Figure 4 This is a schematic diagram of the vibration signal waveform characteristics for partial penetration. When the area is completely cut through within a machining cycle, the high-pressure water jet 9 exits from the cut point without colliding with the workpiece 7. At this point, the vibration signal caused by the water jet 9 disappears, as shown in the waveform diagram. Figure 4 The signal characteristics of a partially cut-through area are shown. When there is partial cut-through, the high-pressure water jet 9 passes through the cut-through area but still impacts and collides with the workpiece 7. At this time, the vibration signal caused by the water jet 9 is compared with the normal waveform, as shown in the figure.Figure 4 As shown, the amplitude, frequency, etc. have large changes, and the partial cutting-through signal characteristics are shown on the waveform diagram. According to the discontinuous waveform characteristics, it is determined that the processing state is a critical cutting-through.

[0041] Figure 5 The vibration signal waveform characteristic diagram for a completely cutting-through state is shown. In one processing cycle, the entire workpiece 7 is cut through, and the water beam 9 does not interfere with the workpiece 7, and does not cause the workpiece 7 to vibrate. The completely cutting-through signal characteristics are shown on the waveform diagram, i.e. no vibration waveform exists, and it is determined that the processing state is a completely cutting-through. Figure 8 As shown, the entire cutting-through state.

[0042] The water-guided laser 10 processing feature is that the laser 10 emitted by the laser 6 is coupled into a small high-pressure water beam 9 through an optical lens group, and the laser 10 is transmitted to the workpiece 7 through the water beam 9 to heat the material and achieve removal processing. It can be used for precision hole drilling, cutting, chamfering, and slotting, and can be applied to the metal, semiconductor, ceramic, and composite material processing fields. The high-pressure water beam 9 is a necessary working substance for water-guided laser 10 processing, and the water pressure before the water beam 9 is ejected is usually 3-50 MPa, and the diameter of the water beam 9 is usually 50-100 μm. After the high-pressure water beam 9 hits the workpiece 7, the pressure caused is about 0.1 N or less. The continuous impact of the water beam 9 on the workpiece 7 causes mechanical vibration of the workpiece 7. The characteristics of this vibration include phase, amplitude, frequency, etc., which are related to the material structure of the workpiece 7 and the impact of the water beam 9 thereon, and are typical. At the same time, the movement of the machine tool also forms vibration and is transmitted to the workpiece 7. The signal analyzer 3 detects all the vibration signals, retains the vibration signals caused by the water beam 9, and filters out the rest. In the hole drilling or cutting process, the water beam 9 directly acts on the bottom of the blind hole or blind slot of the workpiece 7, and when the processing is completed, a through hole or a slot is formed, at which time the water beam 9 directly passes through, and the effect of the work disappears or is very small. Detecting these two different vibration signals can identify whether the workpiece 7 is cut through.

[0043] Further, the signal analyzer 3 analyzes and judges the vibration signals of the workpiece 7 in the cyclic processing process, filters out the interference signals, and retains the vibration signals of the workpiece 7 caused by the water beam 9. The reason is that the vibration signal characteristics of the cutting-through and the characteristics of the non-processing state of the water beam 9 are the same or close, and the signal analyzer 3 needs to obtain the theoretical working state of the equipment, and only analyzes and judges the vibration signals obtained in the cyclic processing process, and does not process the signals in the rest period.

[0044] As shown in FIG. 6, the signal analyzer 3 is connected to the vibration sensor 2 and the water beam 9, and the signal analyzer 3 is connected to the machine tool 1 and the water beam 9. Figure 2As shown, the method comprises: using the water-guided laser 10 to perform a first machining cycle on the to-be-machined position of the workpiece 7, while the vibration sensor 1 collects the vibration signal of the first machining cycle of the workpiece 7, and the signal analyzer 3 analyzes and judges the vibration signal of the first machining cycle of the workpiece 7: if the machining state of the workpiece 7 is cut-through, stop machining; if the machining state of the workpiece 7 is not cut-through or critical cut-through, use the water-guided laser 10 to perform a second machining cycle on the to-be-machined position of the workpiece 7 until the machining state of the workpiece 7 is cut-through. Further, the signal analyzer 3 judges whether it is cut-through; if it is not cut-through, i.e. "no", return to the single-hole machining start; if it is cut-through, i.e. "yes", according to the machining instruction given by the total control device 4, judge whether all the to-be-machined features on the workpiece 7 are completed; if "no", the total control device 4 issues a machining instruction and moves to the next position for continuous machining; if "yes", the total control device 4 issues a stop instruction and completes the machining.

[0045] Regarding the above machining cycle, the water-guided laser 10 machining has the feature of layer-by-layer machining, and the depth of material removal is about 0.05-0.2mm according to different material properties and process parameters. When cutting or drilling, each layer is called a machining cycle, and if it is not cut-through, a blind hole or blind groove as shown will be formed. Figure 7 If it is not cut-through, the machining cycle is continued until the machining is completed, and a through hole or a slit as shown is formed. Figure 8 If it is not cut-through, the machining cycle is continued until the machining is completed, and a through hole or a slit as shown is formed.

[0046] The technical features of the above-mentioned embodiments can be combined in any way. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described, but as long as the combinations of the technical features do not contradict, they should be considered as within the scope of the present application.

[0047] The above-mentioned embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be pointed out that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A water guided laser processing apparatus, characterized by, The application relates to a water guide laser processing device and a method for judging the processing state of a workpiece. The application comprises: a vibration sensor, a probe of which is in contact with a workpiece to collect vibration signals of the workpiece; a signal analyzer, which is electrically connected with the vibration sensor, analyzes the vibration signals of the workpiece, filters interference signals, retains the vibration signals of the workpiece caused by a water beam, converts the vibration signals of the workpiece caused by the water beam and expands the vibration signals in time sequence to obtain a vibration signal waveform, and judges the processing state of the workpiece as follows within one processing cycle: if the vibration signal waveform is a continuous waveform with stable amplitude and frequency, the processing state of the workpiece is judged as not cut-through; if the vibration signal waveform is an intermittent waveform with fluctuating amplitude and frequency, the processing state of the workpiece is judged as critical cut-through; if the vibration signal waveform does not exist, the processing state of the workpiece is judged as completely cut-through; a water guide laser processing device, which is used for processing the workpiece; 2. The water guided laser processing apparatus according to claim 1, characterized by a general control device, which is electrically connected with the signal analyzer and the water guide laser processing device, controls the water guide laser processing device to continue processing the workpiece when the signal analyzer judges that the processing state of the workpiece is not cut-through or critical cut-through, and controls the water guide laser processing device to stop processing the workpiece when the signal analyzer judges that the processing state of the workpiece is cut-through.

3. The water guided laser processing apparatus according to claim 1, wherein The application further comprises a signal amplifier, the signal analyzer is electrically connected with the vibration sensor through the signal amplifier, and the signal amplifier transmits the vibration signals collected by the vibration sensor to the signal analyzer after amplification.

4. The water guided laser processing apparatus according to claim 3, wherein The application further comprises a workbench, and the workpiece is fixed on the workbench.

5. The water guided laser processing apparatus according to claim 1, wherein The probe of the vibration sensor is in contact with the workpiece, or the probe of the vibration sensor is in contact with the workpiece and the workbench.

6. The water guided laser processing apparatus according to claim 5, wherein The water guide laser processing device comprises a laser and a processing head; the laser is electrically connected with the general control device. The processing head further comprises: a high-pressure water cavity, the inner wall of which forms a cavity, the cavity is filled with water, one side of the cavity is provided with a glass window, and the other side of the cavity is provided with a nozzle, and the nozzle is arranged opposite to the glass window; 7. The water guided laser processing apparatus according to claim 1, wherein a focusing lens, which is arranged opposite to the glass window and has a focusing point aligned with the nozzle; the laser emitted by the laser is focused through the focusing lens, passes through the glass window and the water in the cavity, and forms a high-pressure water beam coupled with laser through the nozzle, the high-pressure water beam impacts the surface of the workpiece to process the workpiece and generates vibration. The application further comprises a mechanical control device for controlling a machine tool, and the mechanical control device is electrically connected with the general control device.

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