Device for detecting wafer basket

Abstract

The utility model discloses a device for detecting a wafer basket, and relates to the technical field of semiconductor manufacturing, and the device comprises a fixed table which is provided with a detection hole; a lifting platen; a capacitive proximity switch is mounted below the fixed table; the bracket comprises a vertical sliding part; a horizontal sliding part; the locking part is used for fixing the capacitance type proximity switch at the adjusted specific position, the capacitance type proximity switch is installed below the fixing table, and an inductive head of the capacitance type proximity switch conducts non-contact detection on the bottom of the wafer basket through a detection hole in the fixing table; through the adjustable support design of the vertical sliding part, the horizontal sliding part and the locking part, the up-and-down position and the front-and-back position of the capacitive proximity switch can be flexibly adjusted and reliably fixed, and the problem that the detection accuracy is affected due to the fact that the microswitch is prone to loosening in long-term contact with the wafer basket is solved; therefore, the detection device does not need to be contacted with the wafer basket, and the detection accuracy is not affected by looseness.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a device for detecting a wafer basket. BACKGROUND

[0002] With the rapid development of semiconductor manufacturing technology, the precision and efficiency requirements of wafer processing are constantly improving. In the wafer manufacturing process, the wafer basket, as an important bearing and transfer device, is used to carry wafers on the production line and realize stable transmission from one processing step to another. Accurate detection of the wafer basket is crucial to ensure the reliability of the equipment operation, the processing quality of the wafer, and the efficient operation of the production line.

[0003] Currently, the detection of the wafer basket usually uses a micro switch sensor. The micro switch detects the presence of the wafer basket by directly contacting it and outputs a detection signal according to the trigger state. This detection method has been widely used in semiconductor equipment, but its technical implementation is subject to mechanical structure. When the wafer basket is in place but not fully compressed, the micro switch may not be effectively triggered. The pressing part of the micro switch sensor is prone to looseness or wear during long-term use, affecting the accuracy and reliability of the detection. Since the mechanical life of the micro switch is limited, frequent replacement will increase the maintenance cost of the equipment. Since the micro switch needs to directly contact the wafer basket, its installation position is usually inside the equipment, making it difficult to disassemble and replace, which brings inconvenience to the operation and maintenance of the equipment.

[0004] Therefore, we need a device for detecting a wafer basket to solve the problem that the micro switch is prone to looseness when in contact with the wafer basket for a long time, which affects the accuracy of the detection. The detection device does not need to contact the wafer basket and will not affect the accuracy of the detection due to looseness. Content of the utility model

[0005] The purpose of the present application is to solve the problem that the micro switch is prone to failure when in contact with the wafer basket for a long time, which affects the accuracy of the detection. To solve the above problem, the present application provides a device for detecting a wafer basket, which can make the detection device not need to contact the wafer basket and will not affect the accuracy of the detection due to failure.

[0006] To achieve the above object, the embodiment of the present application adopts the following technical scheme: a fixed table is used for supporting a wafer basket, and a detection hole is formed in the fixed table; a lifting table plate is fixed at the lower end of the fixed table; a capacitive proximity switch is installed below the fixed table, and the sensing head of the capacitive proximity switch is arranged in the detection hole and used for detecting the distance between the bottom of the wafer basket and the capacitive proximity switch; a support is used for fixing the capacitive proximity switch, and the support is detachably connected to the lifting table plate through bolts, and the support comprises: a vertical sliding part arranged on one side of the lifting table plate, which is used for adjusting the up-down position of the capacitive proximity switch; a horizontal sliding part arranged on one side of the fixed table, which is used for adjusting the front-back position of the capacitive proximity switch; and a locking part arranged on the horizontal sliding part, which is used for fixing the capacitive proximity switch at a specific position after adjustment.

[0007] In the above technical scheme, the embodiment of the present application installs the capacitive proximity switch below the fixed table, the sensing head of the capacitive proximity switch performs non-contact detection on the bottom of the wafer basket through the detection hole on the fixed table, and the adjustable support design of the vertical sliding part, the horizontal sliding part and the locking part enables the up-down and front-back positions of the capacitive proximity switch to be flexibly adjusted and reliably fixed, thereby solving the problem that the micro switch is prone to loosening during long-term contact with the wafer basket and affecting the accuracy of detection, and enabling the detection device to be free of contact with the wafer basket and not to be affected by loosening to affect the accuracy of detection.

[0008] Further, according to the embodiment of the present application, the locking part is arranged in a knob type, and the position of the capacitive proximity switch is fixed by rotating the locking part.

[0009] Further, according to the embodiment of the present application, the detection hole is arranged in a rectangular or circular shape, and the hole diameter of the detection hole is greater than the diameter of the sensing head of the capacitive proximity switch.

[0010] Further, according to the embodiment of the present application, the hole diameter of the detection hole covers the bottom area of a 6-inch to 8-inch wafer basket.

[0011] Further, according to the embodiment of the present application, the adjustment range of the horizontal sliding part is the same as the hole diameter range of the detection hole.

[0012] Further, according to the embodiment of the present application, the number of detection holes is multiple, and the detection holes are distributed at different positions of the fixed table.

[0013] Further, according to the embodiment of the present application, the vertical sliding parts are symmetrically arranged at both ends of the support.

[0014] Further, according to the embodiment of the present application, the inner surface of the detection hole is subjected to corrosion and oxidation prevention treatment.

[0015] Further, according to the embodiment of the present application, a non-slip pad is arranged between the support and the contact surface of the fixing table.

[0016] Further, according to the embodiment of the present application, a scale line is arranged on the vertical sliding part and the horizontal sliding part.

[0017] Compared with the prior art, the present application has the following beneficial effects: the present application installs a capacitive proximity switch below the fixing table, the sensing head of the capacitive proximity switch performs non-contact detection on the bottom of the wafer basket through the detection hole on the fixing table, and the adjustable support design of the vertical sliding part, the horizontal sliding part and the locking part can flexibly adjust and reliably fix the up-down and front-back positions of the capacitive proximity switch, solve the problem that the micro switch is prone to looseness during long-term contact with the wafer basket, which affects the accuracy of detection, and make the detection device not need to contact the wafer basket, which will not affect the accuracy of detection due to looseness. BRIEF DESCRIPTION OF DRAWINGS

[0018] The present application will be further described below in combination with the drawings and embodiments.

[0019] Figure 1 is a wafer basket state of a device for detecting a wafer basket.

[0020] Figure 2 is an empty load state of a device for detecting a wafer basket.

[0021] Figure 3 is an isometric view of a device for detecting a wafer basket.

[0022] Figure 4 is a top view of a device for detecting a wafer basket.

[0023] Figure 5 is a bottom view of a device for detecting a wafer basket.

[0024] Figure 6 is Figure 3 is a partial enlarged view "I" of

[0025] Figure 7 is a full sectional view of the improved support.

[0026] In the drawings

[0027] 1, fixing table 11, detection hole 2, lifting table plate

[0028] 3, support 31, vertical sliding part 32, horizontal sliding part

[0029] 33, locking part 34, rotating shaft 4, capacitive proximity switch

[0030] 5, wafer basket Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this utility model clear and complete, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of this utility model, and are merely used to explain the embodiments of this utility model. They are not intended to limit the embodiments of this utility model. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0032] In the description of this utility model, it should be noted that the terms "center," "middle," "upper," "lower," "left," "right," "inner," "outer," "top," "bottom," "side," "vertical," and "horizontal," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "a," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] For purposes of simplicity and illustration, the principles of the embodiments are described primarily by way of example. In the following description, numerous specific details are set forth to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that these embodiments may not be limited to these specific details in practice. In some instances, well-known methods and apparatus have not been described in detail to avoid unnecessarily obscuring these embodiments. Furthermore, all embodiments can be used in combination with each other.

[0035] Example 1: As Figures 1-6 As shown, an apparatus for detecting wafer baskets includes:

[0036] The fixed table 1 is used for supporting the wafer basket 5, and a plurality of detection holes 11 are formed in the upper surface of the fixed table 1. The detection holes 11 are rectangular or circular, the diameter of the detection holes 11 is greater than the diameter of the sensing head of the capacitive proximity switch 4, and the inner surface of the detection holes 11 is subjected to corrosion and oxidation prevention treatment, so as to prolong the service life of the equipment and ensure the detection stability. The diameter of the detection holes 11 covers the bottom area of the 6-inch to 8-inch wafer basket 5, and is distributed at different positions of the fixed table 1 according to requirements, and is suitable for wafer baskets 5 of different sizes and specifications.

[0037] The fixed table 1 is used for supporting the wafer basket 5, and a plurality of detection holes 11 are formed in the upper surface of the fixed table 1. The detection holes 11 are rectangular or circular, the diameter of the detection holes 11 is greater than the diameter of the sensing head of the capacitive proximity switch 4, and the inner surface of the detection holes 11 is subjected to corrosion and oxidation prevention treatment, so as to prolong the service life of the equipment and ensure the detection stability. The diameter of the detection holes 11 covers the bottom area of the 6-inch to 8-inch wafer basket 5, and is distributed at different positions of the fixed table 1 according to requirements, and is suitable for wafer baskets 5 of different sizes and specifications.

[0038] The support 3 is detachably connected with the lifting platform 2 through bolts, and is used for fixing the capacitive proximity switch 4.

[0039] The vertical sliding part 31 is symmetrically arranged at the two ends of the support 3 on one side of the lifting platform 2, and is used for adjusting the up-down position of the capacitive proximity switch 4, so that the height of the sensing head of the capacitive proximity switch 4 can adapt to wafer baskets 5 of different thicknesses. The vertical sliding part 31 is provided with scale lines, so as to facilitate the adjustment of the position of the capacitive proximity switch 4.

[0040] The horizontal sliding part 32 is arranged on one side of the fixed table 1, and is used for adjusting the front-back position of the capacitive proximity switch 4, so that the sensing head is aligned with the position of the detection hole 11. The adjustment range of the horizontal sliding part 32 is consistent with the diameter range of the detection hole 11, and can cover the bottom area of the 6-inch to 8-inch wafer basket 5, and is suitable for wafer baskets 5 of different models. The horizontal sliding part 32 is also provided with scale lines, which are used for indicating the adjusted position and facilitating operation.

[0041] The locking part 33 adopts a knob type design, and is arranged on the horizontal sliding part 32. The capacitive proximity switch 4 can be fixed at a specific position after adjustment by rotating the locking part 33. The adjustment and locking are convenient, and the stability of the capacitive proximity switch 4 can be ensured in long-term operation, and the position deviation caused by vibration and other external factors can be avoided.

[0042] A non-slip pad is arranged between the contact surface of the support 3 and the fixed table 1. The non-slip pad can absorb part of the vibration, prevent the influence of the vibration in the equipment operation on the detection accuracy, and protect the surfaces of the support 3 and the fixed table 1 from being abraded.

[0043] By installing the capacitive proximity switch 4 below the fixed table 1, the sensing head of the capacitive proximity switch 4 performs non-contact detection on the bottom of the wafer basket 5 through the detection hole 11 on the fixed table 1, and the adjustable bracket 3 designed by the vertical sliding part 31, the horizontal sliding part 32 and the locking part 33 can flexibly adjust and reliably fix the up-down and front-back positions of the capacitive proximity switch 4, solve the problem that the micro switch is easy to loosen during long-term contact with the wafer basket 5, which affects the accuracy of detection, and make the detection device not contact with the wafer basket 5, which will not affect the accuracy of detection due to loosening.

[0044] Embodiment two: as shown in the embodiment one, on the basis of the embodiment one, the bracket 3 is further improved, including: Figure 7

[0045] A rotating shaft 34 is arranged at the connection between the vertical sliding part 31 and the horizontal sliding part 32, one end of the rotating shaft 34 is fixed at the top of the vertical sliding part 31, and the other end is rotatably connected with the horizontal sliding part 32;

[0046] The rotating shaft 34 is designed in a cylindrical shape, with a positioning groove in the middle part for limiting the rotation range, and a rolling bearing or a sliding bushing is arranged in the mounting hole to reduce the friction during rotation;

[0047] A screw thread is arranged at the top of the rotating shaft 34, and the screw nut is matched with the vertical sliding part 31 to realize locking;

[0048] By rotating the screw nut counterclockwise to loosen the locking structure, the horizontal sliding part 32 is released, so that it can rotate freely around the rotating shaft 34, the rotation angle of the horizontal sliding part 32 is adjusted manually, so that the sensing head of the capacitive proximity switch 4 is aligned with the target detection area, and by arranging the rotating shaft 34 between the horizontal sliding part 32 and the vertical sliding part 31 and adopting the screw nut locking, it can adapt to different wafer baskets 5 with bottom concave or arc design, and through angle adjustment, the sensing head can be directly aligned with the key detection point, improving the detection precision.

[0049] Embodiment three: as shown in the embodiment one, on the basis of the embodiments 1-2, the embodiment further provides a use method of the device for detecting the wafer basket, including: Figures 1-7 The capacitive proximity switch 4 is installed on the bracket 3, and the sensing head is ensured to be in the detection hole 11. The bracket 3 is fixed on the lifting table plate 2 by the bolts of the bracket 3, and whether it is firm is checked.

[0050] According to the height of the wafer basket 5, the up-down position of the capacitive proximity switch 4 is adjusted through the vertical sliding part 31.

[0051]

[0052] ​​According to the scale line on the vertical sliding part 31, the distance between the inductive head and the detection hole 11 is ensured to meet the detection requirements of the wafer basket 5.

[0053] According to the requirements of the wafer basket 5, the angle of the horizontal sliding part 32 is adjusted by the rotating shaft 34, so that the inductive head of the capacitive proximity switch 4 is aligned with the target detection area.

[0054] According to the position of the detection hole 11, the front and back positions of the capacitive proximity switch 4 are adjusted by the horizontal sliding part 32, and the inductive head of the capacitive proximity switch 4 is ensured to be in the required position according to the scale line.

[0055] After the adjustment is completed, the capacitive proximity switch 4 is fixed at the specific position after adjustment by the rotating locking part 33, so as to ensure that it will not deviate during operation.

[0056] When the capacitive proximity switch 4 needs to be replaced, the capacitive proximity switch 4 is quickly removed by removing the bolts on the support 3, and then reinstalled after replacement.

[0057] Although the above describes the specific embodiments of the present application for the purpose of enabling those skilled in the art to understand the present application, the present application is not limited to the scope of the specific embodiments, and all applications created by utilizing the concept of the present application within the spirit and scope of the present application as defined and determined by the appended claims are within the protection of the present application.

Claims

1. An apparatus for detecting a wafer basket, comprising: a fixed table for supporting a wafer basket, the fixed table having a detection hole formed therein; a lifting table plate fixed to a lower end of the fixed table; characterized in that a capacitive proximity switch is mounted below the fixed table, an inductive head of the capacitive proximity switch being disposed in the detection hole for detecting a distance between a bottom of the wafer basket and the capacitive proximity switch; a bracket for fixing the capacitive proximity switch, the bracket being detachably connected to the lifting table plate by a bolt, the bracket comprising: a vertical sliding portion disposed on one side of the lifting table plate, the vertical sliding portion being used for adjusting an up-and-down position of the capacitive proximity switch; a horizontal sliding portion disposed on one side of the fixed table, the horizontal sliding portion being used for adjusting a front-and-back position of the capacitive proximity switch; a locking portion disposed on the horizontal sliding portion, the locking portion being used for fixing the capacitive proximity switch at a specific position after adjustment.

2. The apparatus of claim 1, wherein, The locking portion is provided in a knob type, and the position of the capacitive proximity switch is fixed by rotating the locking portion.

3. The apparatus of claim 1, wherein, The detection hole is provided in a rectangular or circular shape, and a hole diameter of the detection hole is greater than a diameter of the inductive head of the capacitive proximity switch.

4. The apparatus of claim 3, wherein, The hole diameter of the detection hole covers a bottom area of the wafer basket of 6 inches to 8 inches.

5. The apparatus of claim 3, wherein the plurality of sensors are disposed on a plurality of sensor arms. An adjustment range of the horizontal sliding portion is the same as a hole diameter range of the detection hole.

6. The apparatus of claim 3, wherein, The detection hole is provided in a plurality of numbers and is distributed at different positions of the fixed table.

7. The apparatus of claim 1, wherein, The vertical sliding portion is symmetrically disposed at both ends of the bracket.

8. The apparatus of claim 1, wherein, An inner surface of the detection hole is subjected to anti-corrosion and anti-oxidation treatment.

9. The apparatus of claim 1, wherein, An anti-skid pad is disposed between a contact surface of the bracket and the fixed table.

10. The apparatus of claim 1, wherein, Scale lines are provided on the vertical sliding portion and the horizontal sliding portion.

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