Photosensitive component, lens module and electronic equipment

Abstract

The utility model relates to a photosensitive assembly, a lens module and electronic equipment, the photosensitive assembly comprises a photosensitive structure and a lens which are stacked, the photosensitive structure comprises a circuit board and a photosensitive device area arranged on the circuit board, the lens is provided with a first light-transmitting area, and the first light-transmitting area has a first projection pattern on a preset plane. The photosensitive device area is provided with a second projection pattern on a preset plane, the light incident surface of the lens part of the lens module is provided with a third projection pattern on the preset plane, and the first projection pattern and the second projection pattern at least partially coincide and are staggered from the third projection pattern. According to the embodiment of the invention, the first light-transmitting area and the photosensitive device are arranged in the area, staggered from the lens part, of the photosensitive structure and the lens, so that the number of the photosensitive devices in the lens module is increased on the basis of not increasing the size of the lens module, the photosensitive surface is increased, and the imaging quality of the lens module in a dark light environment is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic devices, and in particular, to a photosensitive assembly, a lens module, and an electronic device. BACKGROUND

[0002] With the continuous development of technology, users have increasingly high requirements for the photographing function of electronic devices. For example, users not only require to be able to take pictures with good picture quality in an environment with sufficient light, but also require to be able to take pictures with good display effects in a dark environment (such as at night).

[0003] In the related art, a larger photosensitive plate is usually arranged in a lens to improve the photosensitive surface of the lens. However, the larger photosensitive plate leads to an increase in the space occupied by the camera, which is not conducive to the miniaturization design requirement of the camera. UTILITY MODEL CONTENT

[0004] To overcome the problems in the related art, the present disclosure provides a photosensitive assembly, a lens module, and an electronic device.

[0005] According to a first aspect of an embodiment of the present disclosure, a photosensitive assembly is provided, comprising:

[0006] a photosensitive structure, comprising a circuit board and at least one photosensitive device region arranged on the circuit board;

[0007] a lens, arranged in a stacked manner with the photosensitive structure, the lens being provided with a first light-transmitting region;

[0008] wherein the first light-transmitting region has a first projection pattern on a preset plane, the photosensitive device region has a second projection pattern on the preset plane, and a light entrance surface of a lens part of the lens module has a third projection pattern on the preset plane, the first projection pattern and the second projection pattern at least partially overlap, and are both arranged offset from the third projection pattern, and the preset plane is a plane perpendicular to the stacking direction of the lens and the photosensitive structure.

[0009] In some embodiments, the photosensitive structure further comprises a light-transmitting hole, the light-transmitting hole penetrating through the circuit board along the thickness direction of the circuit board, and the light-transmitting hole has a fourth projection pattern on the preset plane;

[0010] the lens further comprises a second light-transmitting region, the second light-transmitting region being arranged in a middle region of the lens, and the second light-transmitting region has a fifth projection pattern on the preset plane;

[0011] In an assembled state, the third projection pattern, the fourth projection pattern, and the fifth projection pattern at least partially overlap.

[0012] In some embodiments,

[0013] The light-transmitting device region surrounds the light-transmitting hole.

[0014] The first light-transmitting region surrounds the second light-transmitting region, and a first light-blocking region is arranged between the first light-transmitting region and the second light-transmitting region.

[0015] In some embodiments, the first light-transmitting region and / or the light-transmitting device region is annular.

[0016] In some embodiments, the lens further comprises a second light-blocking region, which is arranged radially outward of the first light-transmitting region along a radial direction of the lens.

[0017] In some embodiments, the light-sensing structure further comprises a first light-blocking sheet and a light-sensing chip which are arranged in a stacked manner with the circuit board, and the first light-blocking sheet and the light-sensing chip are arranged on two sides of the circuit board.

[0018] The first light-blocking sheet has a sixth projection pattern on the preset plane, and a projection of the light-sensing chip on the preset plane falls within the sixth projection pattern.

[0019] In some embodiments, the light-sensing structure further comprises a second light-blocking sheet, which is arranged on a side of the circuit board opposite to the light-transmitting device region.

[0020] The second light-blocking sheet has a seventh projection pattern on the preset plane, and a second projection falls within the seventh projection pattern.

[0021] According to a second aspect of the embodiments of the present disclosure, a lens module is provided, which comprises a lens part and a light-sensing assembly as described in the first aspect.

[0022] In some embodiments, the lens module further comprises a first decorative piece, which is arranged between the light-sensing assembly and the lens part, and an avoiding hole is arranged in an area of the first decorative piece opposite to the light-sensing chip of the light-sensing assembly.

[0023] In an assembled state, the light-sensing chip is arranged in the avoiding hole.

[0024] In some embodiments, the lens module is provided with a plurality of lens parts, the light-sensing assembly is provided with a plurality of light-transmitting holes and a plurality of light-transmitting device regions, and the plurality of lens parts, the plurality of light-transmitting holes and the plurality of light-transmitting device regions correspond one by one.

[0025] According to a third aspect of the embodiments of the present disclosure, an electronic device is provided, which comprises a light-sensing assembly as described in the first aspect or a lens module as described in the second aspect.

[0026] The technical scheme provided by the embodiment of the present disclosure can have the following beneficial effects: the first light-transmitting area and the photosensitive device are arranged in the area of the photosensitive structure and the lens which is staggered with the lens part, the number of the photosensitive devices arranged in the lens module is increased without increasing the photosensitive assembly, the photosensitive surface is increased, and the imaging quality of the lens module in a dark environment is improved.

[0027] It should be understood that the general description above and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0028] The accompanying drawings, which are incorporated into and form part of the specification, illustrate an embodiment consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure.

[0029] Figure 1 is a schematic diagram of an electronic device according to an exemplary embodiment.

[0030] Figure 2 is an exploded view of a lens module according to an exemplary embodiment.

[0031] Figure 3 is an exploded view of a photosensitive structure according to an exemplary embodiment.

[0032] Figure 4 is a schematic diagram of a lens according to an exemplary embodiment.

[0033] Figure 5 is a schematic diagram of a lens according to another exemplary embodiment.

[0034] Figure 6 is a schematic diagram of a lens according to yet another exemplary embodiment. DETAILED DESCRIPTION

[0035] The exemplary embodiments will be described in detail hereinafter with reference to the accompanying drawings. In the following description, the same numbers refer to the same elements throughout the drawings, unless otherwise represented. The embodiments described in the following exemplary embodiments do not represent all the embodiments consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0036] To solve the problems in the related art, the present embodiment provides a photosensitive assembly, a lens module and an electronic device. The photosensitive assembly comprises a photosensitive structure and a lens which are arranged in layers. The photosensitive structure comprises a circuit board and a photosensitive device area arranged on the circuit board. The lens is provided with a first light transmission area. The first light transmission area has a first projection pattern on a preset plane. The photosensitive device area has a second projection pattern on the preset plane. The light entrance surface of the lens part of the lens module has a third projection pattern on the preset plane. The first projection pattern and the second projection pattern at least partially overlap and are arranged staggered with the third projection pattern. In the present embodiment, the first light transmission area and the photosensitive device are arranged in the area of the photosensitive structure and the lens which is staggered with the lens part. The number of the photosensitive devices arranged in the lens module is increased without increasing the size of the lens module, so as to increase the photosensitive surface and improve the imaging quality of the lens module in a dark environment.

[0037] According to an example embodiment of the present disclosure, as shown in Figure 1 and Figure 2 The present embodiment provides a photosensitive assembly 10. The photosensitive assembly 10 is one of the core components of the lens module 100. The photosensitive assembly 10 can convert the light image on the photosensitive surface into an electrical signal in a corresponding proportional relationship with the light image by using the photoelectric conversion function of the photoelectric device.

[0038] As shown in Figures 2 to 4 The photosensitive assembly 10 comprises a photosensitive structure 11. The photosensitive structure 11 comprises a circuit board 111 and at least one photosensitive device area 112 arranged on the circuit board 111. The circuit board 111 is used to mount the photosensitive device area 112 and other components (such as a photosensitive chip 114) of the photosensitive structure 11. The circuit board 111 is electrically connected with the photosensitive device in the photosensitive device area 112, so that the photosensitive device area 112 transmits the collected environmental light information to the photosensitive chip 114 for photoelectric conversion processing. The photosensitive device is composed of a plurality of photosensitive devices, such as Charge Coupled Device (CCD) or Complementary Metal-Oxide Semiconductor (CMOS) image sensor,

[0039] It should be noted that the number of the photosensitive device areas 112 can be consistent with the number of the lens parts 20 of the lens module 100. For example, if the lens module 100 comprises two lens parts 20, two photosensitive device areas 112 are arranged in the photosensitive structure 11. The two photosensitive device areas 112 correspond to the two lens parts 20 one by one, so as to ensure that the lens parts 20 with different functions have the parameter-matched photosensitive device areas 112 and ensure the imaging quality of each lens part 20.

[0040] AsFigures 2 to 4 As shown, the photosensitive assembly 10 further comprises a lens 12, which is arranged in a stack with the photosensitive structure 11 and is located on a side of the photosensitive structure 11 opposite to the lens part 20. The lens 12 can provide protection for the photosensitive structure 11 and the lens part 20. In addition, the lens 12 has a light-transmitting region and a light-blocking region. The light-transmitting region can allow ambient light to pass through, and the light-blocking region can block light from passing through, for example, to control the amount of light entering and shield internal components of the lens module.

[0041] As shown in Figures 2 to 4 , the lens 12 provided by the embodiment has a first light-transmitting region 121. In the assembled state, the first light-transmitting region 121 has a first projection pattern on a preset plane, and the photosensitive device region 112 has a second projection pattern on the preset plane. The first projection pattern and the second projection pattern at least partially overlap, so that external ambient light can enter and irradiate the photosensitive device region 112 through the first light-transmitting region 121. The preset plane is a plane perpendicular to the stacking direction (z direction shown in Figure 1 ) of the lens 12 and the photosensitive structure 11. The first projection pattern and the second projection pattern at least partially overlap, that is, at least part of the photosensitive devices in the photosensitive device region can stably collect ambient light. In one example, the second projection image falls within the range of the first projection pattern, so that all photosensitive devices of the photosensitive device region 112 can stably collect ambient light.

[0042] Continuing to refer to Figure 2 , the light entrance surface of the lens part 20 of the lens module has a third projection pattern on the preset plane. The first projection pattern and the second projection pattern are arranged offset from the third projection pattern, that is, along the stacking direction (z direction shown in Figure 1 ) of the lens 12 and the photosensitive structure 11, the first light-transmitting region 121 and the photosensitive device region 112 are arranged offset from the lens part 20, so that the photosensitive device region 112 does not block light entering the lens part 20.

[0043] For example, the first light-transmitting region 121 and the photosensitive device region 112 are arranged around the lens part 20 along the optical axis of the lens part 20. The first light-transmitting region 121 and the photosensitive device region 112 can be annular (see Figure 4 ), circular arc-shaped (see Figure 5 ), point-shaped (see Figure 6 ), etc.

[0044] It should be noted that the photosensitive device area 112 in the photosensitive component 10 provided in this embodiment is not all the photosensitive devices in the lens module 100. For example, a photosensitive device can still be provided in the lens section 20. This part of the photosensitive device can receive the ambient light entering from the light-incident surface of the lens section 20 to provide part of the information of the final image, while the photosensitive device in the photosensitive device area 112 can receive the ambient light from the first light-transmitting area 121 to provide another part of the information of the final image. The two parts of information are combined to obtain the final image. That is, in the photosensitive component 10 provided in this embodiment, while ensuring the original photosensitive device (photosensitive surface) of the lens section 20, the area of ​​the photosensitive structure 11 and lens 12 that is offset from the lens section 20 is fully utilized. By setting the first light-transmitting area 121 and the photosensitive device area 112 in this offset area, the number of photosensitive devices in the lens module 100 is increased without increasing the size of the lens module, so as to increase the photosensitive surface. The processor of the electronic device can use the image information collected by the photosensitive component 10 as supplementary content to the image information collected by the lens section 20, so as to improve the imaging quality of the lens module 100 in low light environment.

[0045] In this embodiment, a first light-transmitting area and a light-sensing device are provided in the area of ​​the photosensitive structure and lens that is offset from the lens part. This increases the number of light-sensing devices in the lens module without increasing the size of the lens module, thereby increasing the photosensitive surface and improving the imaging quality of the lens module in low-light environments.

[0046] In one exemplary embodiment, such as Figures 2 to 6 As shown, this embodiment provides a photosensitive component 10, which includes a photosensitive structure 11 and a lens 12 stacked together. The photosensitive structure 11 includes a circuit board 111 and a photosensitive device area 112 disposed on the circuit board 111. The lens 12 is provided with a first light-transmitting area 121, which has a first projection pattern on a preset plane. The photosensitive device area 112 has a second projection pattern on the preset plane. The light-incident surface of the lens part of the lens module has a third projection pattern and a first projection pattern on the preset plane.

[0047] In this embodiment, as Figure 3 As shown, the photosensitive structure 11 also includes a light-transmitting hole 113, which is located along the thickness direction of the circuit board 111. Figure 1 The light-transmitting hole 113 (shown in the z-direction) penetrates the circuit board 111 and has a fourth projection pattern on a preset plane. In the assembled state, the fourth projection pattern at least partially overlaps with the third projection pattern, so that ambient light can pass through the light-transmitting hole 113 and the light-incident surface of the lens section 20 in sequence and enter the lens section 20.

[0048] Among them, such as Figure 3As shown, the photosensitive device area 112 of the photosensitive structure 11 surrounds the light transmission hole 113. It can be understood that, in this way, the photosensitive device area 112 can be closer to the light transmission hole 113 in the case of having a larger photosensitive surface, so that the photosensitive device area 112 is close to the ambient light collected by the light transmission hole 113, reducing or avoiding errors caused by different ambient light entering the light transmission hole 113 and the photosensitive device area 112. In one example, referring to Figure 3 , the photosensitive device area 112 is formed by a plurality of annular arrays of photosensitive devices.

[0049] Continuing to refer to Figure 3 , the photosensitive structure 11 further includes a first light shield 115 and a photosensitive chip 114, which are disposed on opposite sides of the circuit board 111 along the stacking direction of the lens 12 and the photosensitive structure 11 (z direction shown in Figure 1 ).

[0050] In the assembled state, the first light shield 115 has a sixth projection pattern on a predetermined plane, and the projection of the photosensitive chip 114 on the predetermined plane falls within the range of the sixth projection pattern. The first light shield 115 can block the light reflected by the devices around the photosensitive device area 112, avoiding errors in the perception of the photosensitive devices in the photosensitive device area 112 caused by non-external ambient light interference, and avoiding the structure of the circuit board 111 being observed from the outside of the electronic device. In one example, referring to Figure 3 , two photosensitive device areas 112 are provided on the circuit board 111, and the first light shield 115 is disposed between the two photosensitive device areas 112 along the arrangement direction of the two photosensitive device areas 112 (x direction shown in Figure 1 ).

[0051] Continuing to refer to Figure 2 and Figure 3 , the photosensitive structure 11 further includes a second light shield 116, which is disposed on the side of the circuit board 111 opposite the photosensitive device area 112. The second light shield 116 has a seventh projection pattern on a predetermined plane, and the second projection pattern falls within the range of the seventh projection pattern, that is, the area of the second light shield 116 is greater than or equal to the area of the photosensitive device area 112, so that the second light shield 116 can block the internal light (such as a flash) of the electronic device from being collected by the photosensitive device area 112, thereby improving the perception accuracy of the photosensitive device area 112. In one example, referring to Figure 3The second light-shielding sheet 116 covers the side of the circuit board 111 facing the inside of the electronic device. In some alternative embodiments (not shown in the drawings), the second light-shielding sheet can be arranged to face the light-sensing device area, i.e., the second projection pattern coincides with the seventh projection pattern.

[0052] The first light-shielding sheet 115 and the second light-shielding sheet 116 can be made of various light-proof materials and are attached to the circuit board 111. For example, the first light-shielding sheet 115 and the second light-shielding sheet 116 can be black polyester films.

[0053] In an example embodiment, as shown in Figures 2 to 6 The present embodiment provides a light-sensing assembly 10, which includes a light-sensing structure 11 and a lens 12 arranged in layers. The light-sensing structure 11 includes a circuit board 111 and a light-sensing device area 112 arranged on the circuit board 111. The lens 12 is provided with a first light-transmitting area 121, which has a first projection pattern on a preset plane. The light-sensing device area 112 has a second projection pattern on the preset plane. The light entrance surface of the lens part of the lens module has a third projection pattern on the preset plane. The first projection pattern and the second projection pattern at least partially overlap and are arranged to be offset from the third projection pattern.

[0054] In the present embodiment, as shown in Figure 4 The lens 12 includes a second light-transmitting area 122 arranged in the middle region of the lens 12. In the assembled state, the second light-transmitting area 122 has a fifth projection pattern on the preset plane. The light-transmitting hole 113 of the light-sensing structure 11 has a fourth projection pattern on the preset plane. The third projection pattern, the fourth projection pattern and the fifth projection pattern at least partially overlap, so that ambient light can pass through the second light-transmitting area 122, the light-transmitting hole and the light entrance surface of the lens part 20 in sequence and enter the lens part 20.

[0055] In the present embodiment, as shown in Figures 4 to 6As shown, the lens 12 further comprises a first light-shielding region 123, and the first light-transmitting region 121 of the lens 12 surrounds the second light-transmitting region 122. The lens 12 further comprises the first light-shielding region 123 in the form of a ring, the first light-shielding region 123 is used to separate the first light-transmitting region 121 and the second light-transmitting region 122, that is, the inner circle of the first light-shielding region 123 is connected with the outer periphery of the second light-transmitting region 122, and the outer circle of the first light-shielding region 123 is connected with the inner circle of the first light-transmitting region 121. In this embodiment, the first light-shielding region 123 is arranged to define the boundary of the second light-transmitting region 122, so as to control the amount of light entering the lens part 20, and the first light-shielding region 123 can also block the circuit board 111 and the fourth adhesive layer 42 (used for bonding and fixing the lens 12 and the second decorative part 40) from being visible, so as to avoid the structure of the circuit board 111 and the fourth adhesive layer 42 being observed from the outside of the equipment, and improve the appearance delicacy of the lens module 100 and the electronic equipment provided with the light-sensing assembly 10 of this embodiment.

[0056] Continuing to refer to Figures 4 to 6 , the lens 12 further comprises a second light-shielding region 124, which is arranged on the radially outer side of the first light-transmitting region 121 along the radial direction of the lens 12, and the inner circle of the second light-shielding region 124 is connected with the outer circle of the first light-transmitting region 121. It should be noted that the first light-shielding region 123 and the second light-shielding region 124 can be formed by ink printed on the transparent glass. In an alternative embodiment, ink can be printed on the transparent glass to form a light-shielding layer except for the second light-transmitting region 122, and then the ink of the first light-transmitting region 121 is removed, so as to obtain the lens 12 provided in this embodiment.

[0057] According to the exemplary embodiments of the present disclosure, as shown in Figure 1 and Figure 2 , the present embodiment provides a lens module 100, which comprises a lens part 20 and the light-sensing assembly 10 provided in any of the preceding embodiments of the present disclosure. The lens part 20 is, for example, a main camera lens, a telephoto lens, a wide-angle lens, a macro lens, a depth-of-field lens, etc. Referring to Figure 2 , the light-sensing assembly 10 at least comprises a light-sensing structure 11 and a lens 12 arranged in layers, the light-sensing structure 11 comprises a circuit board 111 and a light-sensing device region 112 arranged on the circuit board 111, and the lens 12 is provided with a first light-transmitting region 121, which is opposite to the light-sensing device region 112 and is arranged away from the lens part 20 along the stacking direction (z direction shown in Figure 1 ) of the light-sensing structure 11 and the lens 12.

[0058] As can be seen from the above, in the lens module 100 provided in the embodiment, on the basis of guaranteeing the original photosensitive device (photosensitive surface), the area of the photosensitive structure 11 and the lens 12 that is staggered with the lens part 20 is fully utilized, the first light transmission area 121 and the photosensitive device area 112 are arranged in the staggered area, the number of photosensitive devices arranged in the lens module 100 is increased without increasing the size of the lens module, the photosensitive surface is increased, and the imaging quality of the lens module 100 in a dark environment is improved.

[0059] As shown in Figure 2 , the lens module 100 further comprises a first decorative part 30, the first decorative part 30 is used for mounting the lens part 20 and the photosensitive structure 11 of the photosensitive assembly 10, the first decorative part 30 can be adhesively connected with the inner surface of the shell 200 (back cover) of the electronic device through a first adhesive layer 31, the first decorative part 30 can be adhesively connected with the photosensitive structure 11 through a third adhesive layer 32, the first decorative part 30 is arranged between the photosensitive assembly 10 and the lens part 20, the area of the first decorative part 30 that is opposite to the second photosensitive chip 114 of the photosensitive assembly 10 is provided with a clearance hole 30a, the photosensitive chip 114 is arranged in the clearance hole 30a so as to electrically connect the photosensitive chip 114 with the central processor of the electronic device. In the embodiment, the photosensitive assembly 10 is arranged between the first decorative part 30 and the shell 200 of the electronic device, and the clearance hole 30a is arranged in the first decorative part 30 so as to connect the photosensitive chip 114 of the photosensitive assembly 10 with the central processor (Soc) of the electronic device, on the premise of not damaging the waterproof capability of the whole machine, the space on the side of the first decorative part 30 that is opposite to the lens part 20 is fully utilized, and the imaging quality is improved without increasing the size of the lens module 100.

[0060] As shown in Figure 2 , the lens module 100 further comprises a second decorative part 40, the second decorative part 40 is used for mounting the lens 12 of the photosensitive assembly 10, the second decorative part 40 can be adhesively connected with the outer surface of the shell 200 (back cover) of the electronic device through a second adhesive layer 41, the second decorative part 40 can be fastened with the first decorative part 30 through a fastener, and the first decorative part 30 and the second decorative part can be clamped and fixed to the shell 200 of the electronic device by rotating the fastener. The second decorative part 40 can be an appearance decorative part of the lens module 100 in the related art, which will not be described herein again.

[0061] As shown in Figure 2 , the lens module 100 is provided with a plurality of lens parts 20, the photosensitive assembly 10 is provided with a plurality of light transmission holes 113 and a plurality of photosensitive device areas 112, and the plurality of lens parts 20, the plurality of light transmission holes 113 and the plurality of photosensitive device areas 112 correspond one by one. Figure 2, it is shown that the lens module 100 is provided with two lens parts 20, one of which is a main camera lens, and the other is a sub-camera lens. The two light transmission holes 113 in the photosensitive assembly 10 are arranged on the same circuit board 111, one of which is opposite the main camera lens, and the other is opposite the sub-camera lens. In this embodiment, the circuit board 111 of the photosensitive structure 11 can be adaptively arranged to improve the imaging quality of multiple lens parts 20 at the same time through one circuit board 111, which simplifies the number of components and facilitates assembly.

[0062] According to an example embodiment of the present disclosure, as shown in Figure 1 and Figure 2 , the present embodiment provides an electronic device, such as a smart phone, a tablet computer, a camera, a notebook computer, a smart wearable device, etc. The electronic device is provided with the photosensitive assembly 10 or the lens module 100 provided by any of the preceding embodiments of the present disclosure. The electronic device provided by the present embodiment can have any technical effects of the photosensitive assembly 10 or the lens module 100 provided by the preceding embodiments of the present disclosure, which will not be described here.

[0063] Other embodiments of the present disclosure will be readily apparent to those skilled in the art upon considering the specification and practice of the embodiments disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure following the general principles thereof and including such departures from the present disclosure that come within known or customary practice in the art to which the present disclosure pertains. The specification and examples are to be regarded as illustrative only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0064] It should be understood that the present disclosure is not limited to the precise structures described above and shown in the drawings, and that various modifications and changes can be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A photosensitive component, characterized in that, The application relates to a light-sensing assembly. The light-sensing structure comprises a circuit board and at least one light-sensing device area arranged on the circuit board. The lens is arranged with a first light-transmitting area. The first light-transmitting area has a first projection pattern on a preset plane, the light-sensing device area has a second projection pattern on the preset plane, and the light entrance surface of the lens part of the lens module has a third projection pattern on the preset plane.

2. The photosensitive assembly of claim 1, wherein, The first projection pattern and the second projection pattern at least partially overlap and are arranged away from the third projection pattern. The light-sensing structure further comprises a light-transmitting hole penetrating through the circuit board along the thickness direction of the circuit board. The lens further comprises a second light-transmitting area arranged in the middle region of the lens. The third projection pattern, the fourth projection pattern and the fifth projection pattern at least partially overlap in the assembled state.

3. The light-sensing assembly according to claim 2, wherein The light-sensing device area surrounds the light-transmitting hole.

4. The photosensitive assembly according to any one of claims 1 to 3, wherein The first light-transmitting area surrounds the second light-transmitting area, and a first light-blocking area is arranged between the first light-transmitting area and the second light-transmitting area.

5. The photosensitive assembly of claim 4, wherein, The first light-transmitting area and / or the light-sensing device area are annular.

6. The photosensitive assembly of any of claims 1-3, wherein, The lens further comprises a second light-blocking area arranged on the radial outer side of the first light-transmitting area along the radial direction of the lens. The light-sensing structure further comprises a first light-blocking sheet and a light-sensing chip arranged in layers with the circuit board.

7. The photosensitive assembly of claim 6, wherein, The first light-blocking sheet has a sixth projection pattern on the preset plane, and the projection of the light-sensing chip on the preset plane falls within the sixth projection pattern. The light-sensing structure further comprises a second light-blocking sheet arranged on the side of the circuit board opposite to the light-sensing device area.

8. A lens module, characterized by, The second light-blocking sheet has a seventh projection pattern on the preset plane, and the second projection pattern falls within the range of the seventh projection pattern.

9. The lens module according to claim 8, wherein, The lens module further comprises a first decorative piece arranged between the light-sensing assembly and the lens part. The area of the first decorative piece opposite to the light-sensing chip of the light-sensing assembly is arranged with a clearance hole. 10.The lens module according to claim 8, wherein, The light-sensing chip is arranged in the clearance hole in the assembled state.

11. An electronic device, comprising: The lens module is arranged with a plurality of lens parts, a plurality of light-transmitting holes and a plurality of light-sensing device areas. The light-sensing assembly according to any one of claims 1-7 or the lens module according to any one of claims 8-10.

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