Circuit board leveling equipment

Abstract

The utility model aims to provide the circuit board leveling equipment. The furnace comprises a furnace body, a plurality of layers of static platforms are arranged in the furnace body, a downward pressing platform is arranged above each layer of static platform, a driving module is arranged on one side of each downward pressing platform, the action end of each driving module is connected with the corresponding downward pressing platform, an air supply motor is arranged at the top of the furnace body, and the air supply motor is connected with the corresponding downward pressing platform. An air inlet of the air supply motor communicates with external air, an air outlet of the air supply motor communicates with a top air supply channel, the left end and the right end of the top air supply channel communicate with a left air supply channel and a right air supply channel correspondingly, and heating pipes are arranged in the left air supply channel and the right air supply channel correspondingly. The left air supply channel and the right air supply channel are each provided with a plurality of air supply outlets, and the air supply outlets are located in the furnace body. The circuit board is applied to the technical field of circuit boards.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board's technical field, especially involve a circuit board leveling equipment. BACKGROUND

[0002] With the popularization degree of electronic product more and more wide, PC, PAD, smart mobile phone, smart wear and other electronic products play a more and more important role in life and work. And electronic product is towards the direction of lighter, thinner, under the impetus of this requirement, integrated circuit develops rapidly, single-sided board, double-sided board, multilayer board and other in the background of the times, the use demand increases dramatically, flexible circuit board with its light, thin, foldable advantage, more in line with the demand of electronic product development direction.

[0003] Circuit board is the provider of electronic components electric connection. Its development has had 100 years history, its design is mainly layout design, the main advantage of using circuit board is to greatly reduce wiring and assembly error, improve automation level and production labor rate. Circuit board develops from single layer to double-sided board, multilayer board, future printed circuit board production and manufacturing technology development trend is in the direction of high density, high precision, fine aperture, fine wire, small pitch, high reliability, multilayer, high speed transmission, light, thin. In the prior art, in order to realize the light and thin of electronic equipment, the size of circuit board is generally designed to be thinner, due to the reduction of the thickness of circuit board, the circuit board is prone to warping, which affects the quality of circuit board.

[0004] On the automatic surface mounting line, if the PCB circuit board is not flat, it will cause inaccurate positioning, and the components cannot be inserted or mounted on the hole and surface mounting pad of the PCB board. The current surface mounting technology is developing towards high precision, high speed and intelligentization, which puts forward higher flatness requirement for the PCB board as the home of various components. In the IPC standard, the maximum board warping amount of double-sided mounting PCB board is allowed to be 0.75%, and the maximum board warping amount of single-sided mounting component PCB board is allowed to be 1.5%. In fact, in order to meet the mounting demand of high precision and high speed, some electronic assembly plants have more strict requirements on board warping, such as 0.5%, 0.3% and the like. Therefore, it is necessary to provide a circuit board leveling equipment, which has the advantages of simple structure and can prevent the warping and deformation of circuit board. Utility model content

[0005] The utility model overcomes the defects of prior art and provides a circuit board leveling equipment, which has the advantages of simple structure and can prevent the warping and deformation of circuit board.

[0006] The utility model adopts the technical scheme: the utility model discloses a furnace body is provided with a plurality of layers static platform in the inside, the upper side of each layer static platform is provided with the down platform, one side of down platform is provided with drive module, the action end of drive module is connected with down platform, the top of furnace body is provided with air supply motor, the air intake of air supply motor communicates with outside air, the air outlet of air supply motor is connected with top air supply channel, the left and right two ends of top air supply channel are connected with left side air supply channel and right side air supply channel respectively, the inside of left side air supply channel and the inside of right side air supply channel all are provided with heating pipe, left side air supply channel and right side air supply channel all are provided with a plurality of air inlets, the air inlet is located in the inside of furnace body.

[0007] From the above scheme, the upper surface of the static platform is used for placing the circuit board to be leveled, the drive module is used as the power source of the down platform, the down platform is matched with the static platform, the heating pipe is used for heating the internal air of the left and right air supply channels, and the internal temperature of the furnace body is controlled.

[0008] One preferred scheme is that the drive module includes a cylinder, the action end of the cylinder is provided with a linkage shaft, the top of the down platform is provided with a stress rod, and the linkage shaft is in transmission connection with the stress rod.

[0009] One preferred scheme is that the inside of the furnace body is provided with two groups of guide columns, the two groups of guide columns are symmetrically arranged left and right and arranged in the vertical direction, and the two groups of guide columns penetrate through each layer of the static platform and each layer of the down platform.

[0010] One preferred scheme is that the inner wall of the furnace body is provided with thermal insulation cotton.

[0011] One preferred scheme is that the inside of the furnace body is provided with a temperature probe, and the temperature probe is connected with an external tester.

[0012] One preferred scheme is that the left and right sides of the static platform and the down platform are respectively provided with the left and right side air supply channels.

[0013] One preferred scheme is that the number of layers of the static platform and the down platform is three. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1Is the structural diagram of the utility model;

[0015] Figure 2 Is the working principle diagram of the utility model. DETAILED DESCRIPTION

[0016] As Figure 1 and Figure 2 As shown in the embodiment, the utility model includes furnace body 1, the inside of furnace body 1 is provided with several layers static platform 2, the upper side of each layer static platform 2 is provided with lower pressure platform 3, one side of lower pressure platform 3 is provided with drive module, the action end of drive module is connected with lower pressure platform 3, the top of furnace body 1 is provided with air supply motor 5, the air inlet of air supply motor 5 is communicated with external air, the air outlet of air supply motor 5 is communicated with top air supply channel 6, the left and right ends of top air supply channel 6 are communicated with left side air supply channel 7 and right side air supply channel 8 respectively, the inside of left side air supply channel 7 and the inside of right side air supply channel 8 are provided with heating pipe 9, left side air supply channel 7 and right side air supply channel 8 are provided with several air inlets 10, air inlets 10 are located in the inside of furnace body 1.

[0017] Furnace body 1 is equipped with air supply motor 5, when air supply motor 5 is opened, external air will be sent into the inside of equipment through air supply motor 5, then is communicated to left side air supply channel 7 and right side air supply channel 8 through top air supply channel 6, and hot air is sent into the leveling furnace under the heating of heating pipe 9, to ensure constant temperature.

[0018] When heating pipe 9 starts heating, when the set temperature is 100 degrees Celsius, heating system operating temperature rises to 100 DEG C, heating pipe 9 automatically closes heating, and the timer starts timing until the set temperature and time are completed, and the equipment automatically alarms after completion.

[0019] When the circuit board exists warping, manually or mechanically hands are placed on static platform 2 according to each stack fixed number of circuit boards in turn, then air supply switch, heating switch, pressurizing switch are opened in turn, leveling timing is adjusted, leveling temperature is adjusted, and leveling is started, when the circuit board is impacted by temperature, the main material glass fiber cloth will be in softening state, at this time, when receiving pressure effect, the softened glass fiber is heated and pressed, molecular structure will change, and finally the effect that the circuit board is overall flat is achieved.

[0020] As Figure 1 and Figure 2 As shown in the embodiment, the drive module includes cylinder 11, the action end of cylinder 11 is provided with linkage shaft 12, the top of lower pressure platform 3 is provided with stress rod 13, linkage shaft 12 and stress rod 13 are drivingly connected.

[0021] When the air cylinder 11 is opened, the force transmitted by the air cylinder 11 is transmitted to the force receiving rod 13 through the linkage shaft 12, so that the pressing platform 3 is driven downward, and when the air cylinder 11 is closed, the pressing platform 3 is driven upward.

[0022] As shown in Figure 1 and Figure 2 In this embodiment, the inside of the furnace body 1 is provided with two groups of guide columns 14, which are symmetrically arranged left and right and vertically arranged, and each group of guide columns 14 penetrates each layer of the static platform 2 and each layer of the pressing platform 3. The guide column 14 plays a guiding and supporting role for the lifting of the pressing platform 3.

[0023] As shown in Figure 1 and Figure 2 In this embodiment, the inner wall of the furnace body 1 is provided with heat preservation cotton, which is made of high-grade heat preservation cotton that is resistant to high temperature and environmentally friendly and non-polluting, to prevent the internal temperature of the furnace body from being lost.

[0024] As shown in Figure 1 and Figure 2 In this embodiment, the inside of the furnace body 1 is provided with a temperature probe 15, which is connected with an external tester. When the heating pipe 9 starts to heat, the temperature probe 15 monitors the temperature change in real time. When the heating pipe 9 starts to heat, when the set temperature is 100 degrees Celsius, the heating system runs to 100℃, the heating pipe 9 automatically closes the heating, and the timer starts to count, until the completion of the set temperature and time, after completion, the equipment automatically alarms.

[0025] As shown in Figure 1 and Figure 2 In this embodiment, the left air supply channel 7 and the right air supply channel 8 are respectively arranged on the left and right sides of the static platform 2 and the pressing platform 3, to ensure that the temperature in the furnace is rapidly raised.

[0026] As shown in Figure 1 and Figure 2 In this embodiment, the static platform 2 and the pressing platform 3 are both three layers, and the multi-layer distribution is conducive to improving the leveling efficiency.

[0027] In the embodiment, the furnace body 1 adopts a design of opposite double-door explosion-proof door buckle, the internal material adopts 430# stainless steel plate, the external material adopts SS41# stainless steel plate treated by anti-rust coating, the inside of the furnace body 1 is provided with a temperature controller, a timer and a blowing fan, the timer is 9999 minutes display, the temperature reaches the start timing, the blowing system adopts horizontal forced circulation blowing, special air path design, the blowing motor 5 adopts a special motor for hot air oven, the blowing fan adopts a powerful multi-wing type wind wheel, the height of each static platform is about 150 mm, the effective pressing plate table size is 685 mm*570 mm, and the temperature controller plays a role in controlling the internal temperature of the furnace body.

Claims

1. A circuit board leveling device, characterized in that: It includes a furnace body (1), inside which are arranged several layers of static platforms (2), and above each layer of static platform (2) is a pressing platform (3). A driving module is arranged on one side of the pressing platform (3), and the actuating end of the driving module is connected to the pressing platform (3). A blower motor (5) is arranged on the top of the furnace body (1). The air inlet of the blower motor (5) is connected to the outside air, and the air outlet of the blower motor (5) is connected to the top air supply channel (6). The left and right ends of the top air supply channel (6) are respectively connected to the left air supply channel (7) and the right air supply channel (8). Heating tubes (9) are arranged inside the left air supply channel (7) and the right air supply channel (8). Several air outlets (10) are opened in the left air supply channel (7) and the right air supply channel (8). The air outlets (10) are located inside the furnace body (1).

2. The circuit board leveling device according to claim 1, characterized in that: The drive module includes a cylinder (11), the actuating end of the cylinder (11) is provided with a linkage shaft (12), the top of the pressing platform (3) is provided with a force rod (13), and the linkage shaft (12) is connected to the force rod (13) in a transmission connection.

3. The circuit board leveling device according to claim 1, characterized in that: The furnace body (1) is provided with two sets of guide columns (14). The two sets of guide columns (14) are arranged symmetrically on the left and right and in the vertical direction. The two sets of guide columns (14) penetrate each layer of the static platform (2) and each layer of the pressure platform (3).

4. The circuit board leveling device according to claim 1, characterized in that: The inner wall of the furnace body (1) is provided with heat insulation cotton.

5. The circuit board leveling device according to claim 1, characterized in that: A temperature probe (15) is installed inside the furnace body (1), and the temperature probe (15) is connected to an external testing instrument.

6. The circuit board leveling device according to claim 1, characterized in that: The left air supply channel (7) and the right air supply channel (8) are respectively located on the left and right sides of the static platform (2) and the pressure platform (3).

7. The circuit board leveling device according to claim 1, characterized in that: Both the static platform (2) and the pressure platform (3) have three layers.

Images