Testing device for verifying influence of high-temperature outgassing of epoxy glue on gold-aluminum bonding point

Abstract

The utility model discloses a test device for verifying the influence of epoxy glue high-temperature gas release on a gold-aluminum bonding point, which comprises a shell, the inner wall of the shell is provided with a gold-plated layer, and the thickness of the gold-plated layer is 1-5 microns; the edge of the chip is bonded on the inner wall of the shell through a plurality of gold bonding wires; an epoxy glue layer is coated on the part, which is not bonded with the chip, of the inner wall of the shell; the cover plate is installed at the opening of the shell in a sealed mode. The inner wall of the shell is provided with the gold-plated layer, and the chip can be directly bonded on the gold-plated layer in the shell, so that the test process is free from interference of external factors. The shell is made of ceramic, the main component of the ceramic is Al2O3, the high-temperature resistance is excellent, excessive gas and stress release are avoided in the test process, and the interference to the test result is avoided. The airtight grade in the shell is 10-9, and the sealing requirement is met. In the test process, gas released by the epoxy glue layer cannot leak and can continuously act on the bonding points, and the test effect can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of verifying the influence of epoxy glue high temperature release gas on gold aluminum bonding, specifically relates to a kind of test device for verifying that epoxy glue high temperature release gas influences gold aluminum bonding point. BACKGROUND

[0002] As a new type of semiconductor optoelectronic device, light module is small in size, large in density, and high in internal optical path stability requirement, and is mostly packaged using COB process. The epoxy glue used in COB process may release halogen element gas under high temperature environment, which has a strong corrosive effect on the aluminum pads of silicon-based bare chips, affecting the reliability of gold aluminum bonding points. Therefore, when selecting epoxy glue, it is necessary to verify its influence on gold aluminum bonding points to select an epoxy glue that does not affect gold aluminum bonding points.

[0003] According to the corrosion mechanism of gold aluminum bonding points and halogen elements, electric field will have adsorption effect on halogen element ions. Therefore, both bare chip bonding and sealing requirements need to be met during the test. In the prior art, test devices as shown in Figure 5 and Figure 6 are used to verify epoxy glue, wherein the bonding of bare chip 100 can be achieved by designing a special printed circuit board 200, which is windowed in the chip mounting and bonding area and has a surface nickel-palladium-gold treatment. The sealing requirement can be achieved by using metal shell 300 welding method.

[0004] The existing test device has the following defects: the substrate of printed circuit board 200 usually uses glass fiber reinforced epoxy resin to provide structural strength and thickness. Printed circuit board 200 will also release gas under high temperature environment, which has certain interference factors on test results. Printed circuit board 200 is composed of multiple layers and multiple materials, and will release stress during high temperature curing, which will have stress effect on bonding point IMC layer. Metal shell 300 needs to be assembled after the bonding of bare chip 100, cannot be sealed using soldering process, can only be sealed using glue, and the air tightness level can only reach 10 -5 , which cannot meet the sealing requirement. SUMMARY

[0005] The utility model aims at providing a kind of test device for verifying that epoxy glue high temperature release gas influences gold aluminum bonding point, gold layer is equipped on the inner wall of shell, chip can be directly bonded on the gold layer in shell, can make that there is no interference of external factors in test process.

[0006] The utility model provides a kind of test device for verifying that epoxy glue high-temperature gas release influences gold-aluminum bonding point, including shell, the inner wall of the shell is equipped with gold plating layer, the thickness of the gold plating layer is 1-5 μm;Chip, the edge of the chip is bonded on the inner wall of the shell by multiple bonding gold wires;The part not bonded with the chip on the inner wall of the shell is coated with epoxy glue layer;Cover plate, the cover plate is sealed and installed at the opening of the shell.

[0007] Preferably, the thickness of the gold plating layer is 1-2 μm.

[0008] Preferably, the shell is a rectangular parallelepiped with an open top, which includes a bottom plate, four side plates are vertically arranged on the bottom plate, and the gold plating layer is arranged on the inner walls of the bottom plate and the four side plates.

[0009] Preferably, the shell is a cylindrical body with an open top, which includes a bottom plate, a side plate is circumferentially arranged on the bottom plate, and the gold plating layer is arranged on the inner walls of the bottom plate and the side plate.

[0010] Preferably, the chip is bonded on the gold plating layer of the bottom plate.

[0011] Preferably, the cover plate is sealed on the opening of the shell by parallel seam welding process.

[0012] Preferably, the air tightness level in the shell is 10 -9 .

[0013] Preferably, the material of the shell is ceramic.

[0014] Compared with the prior art, the utility model has the following advantages and positive effects:

[0015] The gold plating layer is arranged on the inner wall of the shell, and the chip can be directly bonded on the gold plating layer in the shell, so that the test process is not disturbed by external factors.

[0016] The material of the shell can be ceramic. The main component of ceramic is Al2O3, which has excellent high-temperature resistance. During the test process, no excess gas and stress are released, which does not interfere with the test results.

[0017] The air tightness level in the shell is 10 -9 , which meets the sealing requirement. During the test process, the gas released by the epoxy glue layer does not leak and can continuously act on the bonding point, which can improve the test effect.

[0018] Other features and advantages of the utility model will become more apparent after reading the specific implementation manner of the utility model in combination with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1is a structural schematic view of an embodiment of the test device for verifying the influence of high-temperature gas release of epoxy glue on gold-aluminum bonding points of the utility model;

[0020] Figure 2 is a structural schematic view of one of the embodiments of the shell (without showing the gold plating layer and the epoxy glue layer) of the utility model;

[0021] Figure 3 is a structural schematic view of two of the embodiments of the shell (without showing the gold plating layer and the epoxy glue layer) of the utility model;

[0022] Figure 4 is a structural schematic view of one of the embodiments of the side plate of the utility model;

[0023] Figure 5 is a structural schematic view of the existing test device for verifying the influence of high-temperature gas release of epoxy glue on gold-aluminum bonding points;

[0024] Figure 6 is Figure 5 a structural exploded view. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the following will be combined with the drawings and embodiments, and the utility model will be further described in detail.

[0026] As Figures 1-4 shown, the test device for verifying the influence of high-temperature gas release of epoxy glue on gold-aluminum bonding points of the utility model comprises a shell, the inner wall of the shell is provided with a gold plating layer 11, the thickness of the gold plating layer 11 is 1-5 microns; a chip 20, the edge of the chip 20 is bonded on the inner wall of the shell through a plurality of bonding gold wires 21; the part of the inner wall of the shell which is not bonded with the chip 20 is coated with an epoxy glue layer 12; a cover plate 30, the cover plate 30 is sealingly installed at the opening of the shell.

[0027] The thickness of the gold plating layer 11 is 1-5 microns, preferably the thickness of the gold plating layer 11 is 1-2 microns, which can meet the bonding requirements of the chip 20 and improve the stability and reliability of the bonding of the chip 20.

[0028] The shell can be integrally formed through a processing technology, or formed into an integral piece through other modes commonly used in the art, which is not specifically limited here, so that the shell structure is stable and reliable and has a long service life.

[0029] In the embodiment, the shell is a rectangular parallelepiped with an open top, which comprises a bottom plate 31, four side plates 32 are vertically arranged on the bottom plate 31, and the inner walls of the bottom plate 31 and the four side plates 32 are provided with the gold plating layer 11.

[0030] Alternatively, in other preferred embodiments, the housing is a cylindrical shape with an open top, including a base plate, side plates circumferentially provided on the base plate, and a gold-plated layer on the inner walls of the base plate and side plates.

[0031] The chip 20 is bonded to the gold-plated layer 11 of the base plate 31. Specifically, multiple bonding wires 21 are provided at equal intervals along the edge of the chip 20. One end of the bonding wire 21 is connected to the chip 20 and the other end is connected to the gold-plated layer 11 of the base plate 31.

[0032] The non-chip 20 bonding portions on the inner wall of the housing are coated with epoxy adhesive to form an epoxy adhesive layer 12. The epoxy adhesive can be any epoxy adhesive commonly used in this technical field, and no specific limitation is made here.

[0033] Specifically, the gold-plated layers 11 of the four side plates 32 are coated with epoxy adhesive layers 12, and the parts of the base plate 31 that are not bonded to the chip 20 are also coated with epoxy adhesive layers 12.

[0034] The cover plate 30 is sealed to the opening of the shell using a parallel seam welding process, which enables the airtightness level of the shell to be 10. -9 This meets the sealing requirements. During the test, the gas released from the epoxy adhesive layer 12 will not leak and can continue to act on the bonding points, which can improve the test results.

[0035] The shell can be made of ceramic, whose main component is Al2O3. It has excellent high-temperature resistance and will not release excess gas or stress during the test, thus not interfering with the test results. At the same time, gold plating is performed on the ceramic surface, with a gold plating layer 11. After the chip 20 is mounted, it can be directly wire bonded to the gold plating layer 11 on the ceramic surface.

[0036] During the experiment, a comparative experimental setup can be set up, which is similar to the experimental setup in this embodiment.

[0037] The setup is basically the same, except that the inner wall of the shell of the comparative test device does not have an epoxy adhesive layer 12.

[0038] The experimental process of this utility model's experimental device for verifying the effect of high-temperature gas release of epoxy adhesive on aluminum-gold bonding points includes:

[0039] The experimental apparatus of this embodiment and the experimental apparatus of the comparative example were subjected to high-temperature baking at multiple temperature gradient points.

[0040] After baking, the test device was disassembled, and a tensile test was performed on the gold-aluminum bonding points inside the shell to determine whether the gold-aluminum bonding points were damaged.

[0041] The test results of the test device of the embodiment and the test device of the comparative example are compared and analyzed to determine whether the epoxy glue has an influence on the gold-aluminum bonding point of the chip 20; if the gold-aluminum bonding point is damaged, it indicates that the epoxy glue has an influence on the gold-aluminum bonding point of the chip 20, and is not suitable for the bonding of the chip 20. If the gold-aluminum bonding point is not damaged, it indicates that the epoxy glue has no influence on the gold-aluminum bonding point of the chip 20, and can be suitable for the bonding of the chip 20.

[0042] In the embodiment, the gold-plated layer 11 is arranged on the inner wall of the shell, and the chip 20 can be directly bonded on the gold-plated layer 11 in the shell, so that the test process is not disturbed by external factors.

[0043] In the embodiment, the material of the shell can be ceramic, and the main component of the ceramic is Al2O3, which has excellent high-temperature resistance, and no extra gas and stress are released in the test process, so that the test results are not disturbed.

[0044] In the embodiment, the airtightness of the shell is 10 -9 , which meets the sealing requirement. In the test process, the gas released by the epoxy glue layer 12 cannot be leaked and can continuously act on the bonding point, so that the test effect is improved.

[0045] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, the technical solutions recorded in the foregoing embodiments can still be modified by those of ordinary skill in the art, or some technical features can be replaced equivalently; and these modifications or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions claimed by the present application.

Claims

1. A test device for verifying the effect of high-temperature outgassing of epoxy glue on gold-aluminum bonding points, characterized in that it comprises: Comprising a shell, an inner wall of the shell is provided with a gold plating layer, the thickness of the gold plating layer is 1-5 μm; a chip, an edge of the chip is bonded on the inner wall of the shell by a plurality of bonding wires; the part of the inner wall of the shell which is not bonded with the chip is coated with an epoxy glue layer; a cover plate, the cover plate is sealingly installed at the opening of the shell.

2. The test device for verifying the influence of high-temperature release gas of epoxy glue on gold-aluminum bonding points according to claim 1, wherein the thickness of the gold plating layer is 1-2 μm.

3. The test device for verifying the influence of high-temperature release gas of epoxy glue on gold-aluminum bonding points according to claim 1, wherein the shell is a rectangular parallelepiped with an open top, comprising a bottom plate, four side plates are vertically arranged on the bottom plate, and the inner walls of the bottom plate and the four side plates are provided with the gold plating layer.

4. The test device for verifying the influence of high-temperature release gas of epoxy glue on gold-aluminum bonding points according to claim 1, wherein the shell is a cylinder with an open top, comprising a bottom plate, a side plate is circumferentially arranged on the bottom plate, and the inner walls of the bottom plate and the side plate are provided with the gold plating layer.

5. The test device for verifying the influence of high-temperature release gas of epoxy glue on gold-aluminum bonding points according to claim 3 or 4, wherein the chip is bonded on the gold plating layer of the bottom plate.

6. The test device for verifying the influence of high-temperature release gas of epoxy glue on gold-aluminum bonding points according to claim 1, wherein the cover plate is sealingly installed at the opening of the shell by parallel seam welding process.

7. The test device for verifying the influence of high-temperature release gas of epoxy glue on gold-aluminum bonding points according to claim 1, wherein The hermeticity level inside the housing is 10 -9 .

8. The test device for verifying the influence of high-temperature release gas of epoxy glue on gold-aluminum bonding points according to claim 1, wherein the material of the shell is ceramic.

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