SMD (Surface Mount Device) LED lamp bead bracket

Abstract

The utility model discloses an SMD LED lamp bead support, which comprises a support main body, pins and a radiator, the top end of the support main body is provided with an inner cavity, the bottom of the support main body is provided with a mounting groove, the inner side of the mounting groove is provided with a through hole, the pins are arranged on the two sides of the support main body, and the radiator is arranged on the support main body. The radiator comprises a copper column inserted in the support body in a penetrating mode, a copper plate arranged at the bottom of the copper column, a plurality of cooling fins arranged at the bottom of the copper plate, a first heat conduction glue layer arranged on the outer surface of the copper column and the outer surface of the copper plate, and a second heat conduction glue layer arranged at the bottoms of the cooling fins. According to the SMD LED lamp bead support, the radiator is arranged, under the condition that use of the SMD LED lamp bead support is not affected, the efficient heat dissipation effect of the bottom is achieved, the problem of low heat dissipation efficiency caused by bottom heat accumulation is solved, and meanwhile the fixing effect can be improved through the grooves.

Description

TECHNICAL FIELD

[0001] The utility model relates to patch LED lamp pearl support technical field, concretely is a kind of patch LED lamp pearl support. BACKGROUND

[0002] Patch LED lamp pearl support is a supporting structure of electronic components, usually used to install and fix LED lamp pearl, especially in surface mount technology (SMT). With the function of heat dissipation, conduction, the heat generated by LED lamp pearl can be conducted out through the material with good heat conduction performance, improve the stability and service life of product, while the metal lead and other components of support play the role of conduction, ensure that LED lamp pearl can work normally. At present, the air of the bottom of existing patch LED lamp pearl support after installation is not circulated, heat is not easy to dissipate, not suitable for high-power lighting, the use range is small, there is certain deficiency, for this, we propose a kind of patch LED lamp pearl support. INVENTION CONTENTS

[0003] The utility model aims at solving the problems in prior art or related art.

[0004] Therefore, the technical scheme adopted by the utility model is as follows: a patch LED lamp pearl support, including support main part, pin and radiator, the top of support main part is equipped with inner chamber, the pin is arranged at the both sides of support main part, the radiator includes copper column inserted in support main part, copper plate arranged at the bottom of copper column, a plurality of radiating fins arranged at the bottom of copper plate, first heat-conducting adhesive layer arranged on the outer surface of copper column and copper plate and second heat-conducting adhesive layer arranged at the bottom of radiating fin.

[0005] Preferably, the bottom of the support main body is provided with a mounting groove, and a through hole is formed in the inner side of the mounting groove.

[0006] Preferably, it further includes a reflective layer, the reflective layer is arranged on the inner side of the inner chamber, and the reflective layer is PCT.

[0007] Preferably, the pin is provided with four, and the four pins are symmetrically distributed on the both sides of the support main body.

[0008] Preferably, the first heat-conducting adhesive layer is formed by applying heat-conducting adhesive on the outer surface of the copper column and the copper plate.

[0009] Preferably, the second heat-conducting adhesive layer is formed by applying heat-conducting adhesive on the bottom of the radiating fin.

[0010] The utility model discloses obtained beneficial effect has as follows through adopting above -mentioned technical scheme, the utility model discloses through setting up radiator, realizes bottom high -efficient heat dissipation effect under the condition that does not influence the use of paster LED lamp pearl support, avoids the problem of low heat dissipation efficiency because of bottom heat accumulation, can improve fixed effect through setting up recess simultaneously, can smear the outer surface of copper column and copper plate and form first heat -conducting adhesive layer when using, and then the copper column is aligned with through -hole, and inserts and bonds, and the heat of LED lamp pearl after bonding can be conducted to the fin through copper column, first heat -conducting adhesive layer and copper plate, then through the fin and dissipates, can improve the heat dissipation efficiency of support, and because the setting of radiator, the bottom of support main part has certain heat dissipation space, air circulation, and heat is easy to disperse, is applicable to high -power illumination, and the use range is big, and then the bottom of fin can smear heat -conducting adhesive, forms second heat -conducting adhesive layer after smearing, then the fin can bond with the lamp panel through second heat -conducting adhesive layer, can improve fixed effect, and the recess in pin can inject solder, improves fixed effect through increasing the contact area with solder, and stability is high. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 It is structure schematic diagram of the utility model;

[0012] Figure 2 It is structure schematic diagram of the utility model Figure 1 It is structure schematic diagram of one view angle of support main body;

[0013] Figure 3 It is structure schematic diagram of another view angle of support main body of the utility model Figure 1

[0014] Figure 4 It is structure schematic diagram of radiator of the utility model Figure 1

[0015] Reference Signs:

[0016] 100, support main body;101, inner chamber;102, installation slot;103, through -hole;

[0017] 200, reflective layer;

[0018] 300, pin;301, recess;

[0019] 400, radiator;401, copper column;402, copper plate;403, fin;404, first heat -conducting adhesive layer;405, second heat -conducting adhesive layer. DETAILED DESCRIPTION

[0020] ​​To make the purpose, technical scheme and advantages of the present application more clear, specific embodiments will be described below in conjunction with the accompanying drawings. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0021] Some embodiments of the present application will be described below in conjunction with the accompanying drawings to provide a patch LED lamp bead support. Embodiment 1

[0022] Referring to Figures 1-4 For the first embodiment of the present application, the embodiment provides a patch LED lamp bead support, which comprises a support body 100, a pin 300 and a heat sink 400.

[0023] Specifically, the top end of the support body 100 is provided with an inner cavity 101, the bottom of the support body 100 is provided with a mounting groove 102, the inner side of the mounting groove 102 is provided with a through hole 103, and the through hole 103 is a circular hole. In use, the inner cavity 101 is used for mounting the patch LED lamp bead, and the mounting groove 102 and the through hole 103 are used for mounting the heat sink 400, so as to quickly dissipate the heat generated by the patch LED lamp bead.

[0024] Specifically, the pin 300 is arranged on both sides of the support body 100, and the pin 300 is provided with four, which are symmetrically distributed on both sides of the support body 100. The outer side of the four pins 300 is provided with a groove 301, and in use, the four pins 300 can be tightly attached to the lamp panel. After being tightly attached, solder can be injected into the groove 301, and then soldered. By increasing the contact area with the solder, the fixing effect is improved, and the stability is high.

[0025] Specifically, the heat sink 400 comprises the copper column 401 inserted into the support body 100, the copper plate 402 arranged at the bottom of the copper column 401, the plurality of heat dissipation fins 403 arranged at the bottom of the copper plate 402, the first heat-conducting glue layer 404 arranged on the outer surface of the copper column 401 and the copper plate 402, and the second heat-conducting glue layer 405 arranged at the bottom of the heat dissipation fin 403. The first heat-conducting glue layer 404 is formed by applying heat-conducting glue on the outer surface of the copper column 401 and the copper plate 402. The second heat-conducting glue layer 405 is formed by applying heat-conducting glue on the bottom of the heat dissipation fin 403. In use, the outer surface of the copper column 401 and the copper plate 402 can be coated with heat-conducting glue to form the first heat-conducting glue layer 404. Then, the copper column 401 is aligned with the through hole 103 and is inserted and bonded. After bonding, the heat generated by the LED lamp bead can be conducted to the heat dissipation fin 403 through the copper column 401, the first heat-conducting glue layer 404 and the copper plate 402, and then dissipated through the heat dissipation fin 403, so that the heat dissipation efficiency of the support can be improved. In addition, due to the arrangement of the heat sink 400, the bottom of the support body 100 has a certain heat dissipation space, air flows, heat is easy to dissipate, is suitable for high-power lighting, has a wide range of use, and then the bottom of the heat dissipation fin 403 can be coated with heat-conducting glue to form the second heat-conducting glue layer 405. Then, the heat dissipation fin 403 can be bonded to the lamp panel through the second heat-conducting glue layer 405, so that the fixing effect can be improved. Embodiment 2

[0026] With reference to Figure 1 and Figure 2 The second embodiment of the utility model differs from the first embodiment in that it further comprises a reflective layer 200 arranged on the inner side of the inner cavity 101. The reflective layer 200 is PCT. In use, PCT performs excellently in terms of heat resistance, long-term anti-yellowing at high temperature, reflectivity, anti-UV irradiation and other performances, and has good environmental adaptability.

[0027] The working principle and use process of the utility model are as follows: in use, the outer surface of the copper column 401 and the copper plate 402 can be coated with heat-conducting glue to form the first heat-conducting glue layer 404. Then, the copper column 401 is aligned with the through hole 103 and is inserted and bonded. After bonding, the heat generated by the LED lamp bead can be conducted to the heat dissipation fin 403 through the copper column 401, the first heat-conducting glue layer 404 and the copper plate 402, and then dissipated through the heat dissipation fin 403, so that the heat dissipation efficiency of the support can be improved. In addition, due to the arrangement of the heat sink 400, the bottom of the support body 100 has a certain heat dissipation space, air flows, heat is easy to dissipate, is suitable for high-power lighting, has a wide range of use, and then the bottom of the heat dissipation fin 403 can be coated with heat-conducting glue to form the second heat-conducting glue layer 405. Then, the heat dissipation fin 403 can be bonded to the lamp panel through the second heat-conducting glue layer 405, so that the fixing effect can be improved. Meanwhile, the solder can be injected into the groove 301 of the pin 300 to increase the contact area with the solder and improve the fixing effect, so that the stability is high.

[0028] Although the embodiments of the utility model have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the utility model, and the scope of the utility model is defined by the claims and their equivalents.

Claims

1. A surface-mount LED bead bracket, characterized in that, include: The top of the support body (100) is provided with an inner cavity (101). Pins (300) are arranged on both sides of the bracket body (100); The radiator (400) includes a copper column (401) inserted into the bracket body (100), a copper plate (402) disposed at the bottom of the copper column (401), a plurality of heat sinks (403) disposed at the bottom of the copper plate (402), a first thermally conductive adhesive layer (404) disposed on the outer surface of the copper column (401) and the copper plate (402), and a second thermally conductive adhesive layer (405) disposed at the bottom of the heat sinks (403).

2. The SMD LED bead bracket according to claim 1, characterized in that, The bottom of the bracket body (100) is provided with an installation groove (102), and the inner side of the installation groove (102) is provided with a through hole (103), which is a round hole.

3. The SMD LED bead bracket according to claim 1, characterized in that, It also includes a reflective layer (200), which is disposed on the inner side of the inner cavity (101), and the reflective layer (200) is PCT.

4. The SMD LED bead bracket according to claim 1, characterized in that, The pin (300) is provided in four parts, and the four pins (300) are symmetrically distributed on both sides of the support body (100). A groove (301) is provided on the outer side of each of the four pins (300).

5. A surface-mount LED bead bracket according to claim 1, characterized in that, The first thermally conductive adhesive layer (404) is formed by applying thermally conductive adhesive to the outer surfaces of the copper pillar (401) and the copper plate (402).

6. A surface-mount LED bead bracket according to claim 1, characterized in that, The second thermally conductive adhesive layer (405) is formed by applying thermally conductive adhesive to the bottom of the heat sink (403).

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