A processing method and device of a surface mount package structure and a cutting apparatus

Abstract

The application provides a processing method and device of a surface-mounted packaging structure and cutting equipment, and the method comprises the following steps: after the surface-mounted packaging structure is vacuum adsorbed on a worktable, a cutting knife is controlled to cut the frame and the supporting ribs on the surface-mounted packaging structure, so that the frame and the supporting ribs are cut and separated from the plurality of packaging column structures; a water spraying assembly is controlled to spray water to the frame, and the frame is removed from the worktable along with the water flow sprayed by the water spraying assembly; the cutting knife is controlled to cut the packaging column structure, and a plurality of discrete packaging substructures are obtained; after the vacuum adsorption of the worktable on the packaging substructure and the supporting ribs is stopped, an unloading arm is controlled to transfer all the packaging substructures to a cleaning station on the cutting equipment, so that all the packaging substructures are cleaned on the cleaning station. The application can solve the technical problem of high film material and process cost in the processing of the surface-mounted packaging structure by the tape saw.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a method, apparatus and cutting equipment for processing surface mount packaging structures. Background Technology

[0002] In recent years, with the continuous development of microelectronics technology, chip packaging technology has also been advancing. Among them, surface mount packaging structures, especially SOT (Small Outline Transistor) structures, are a common form of chip packaging. They are small in size, have few pins, and are designed for surface mounting, making them suitable for direct soldering onto the surface of printed circuit boards.

[0003] In existing technologies, when processing surface-mount packaged components, due to their low rigidity, they need to be adhered to a blue film before cutting. While this film-adhesive method allows for stable processing, it requires both the film-adhesive step before processing and the film-removal step afterward. Therefore, the processing cost of this type of component is high, in addition to the material cost of the blue film, there are also additional processing costs before and after processing. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] Therefore, the present invention provides a processing method, apparatus and cutting equipment for surface mount packaging structures, which can achieve dual savings in processing costs from both aspects of film materials and film application and peeling processes, and solve the technical problem of excessively high costs of film materials and additional processes in existing tape saw processing.

[0006] According to a first aspect of the present invention, a method for processing a surface-mount package structure is provided, applied to a cutting device, the cutting device being used to cut the surface-mount package structure, the method comprising:

[0007] After the surface mount package structure is vacuum-adsorbed onto the work plate of the cutting equipment, the cutting blade on the cutting equipment is controlled to cut the frame and support ribs on the surface mount package structure so that the frame and support ribs are cut and separated from multiple package columns.

[0008] Control the water spraying component on the cutting equipment to spray water onto the frame, and move the frame away from the work plate along with the water sprayed by the water spraying component, so that the support ribs and multiple encapsulation column structures are retained on the work plate.

[0009] The cutting blade on the cutting equipment is controlled to cut the package column structure to obtain multiple discrete package substructures;

[0010] After the vacuum adsorption of the packaging substructure and support ribs by the work plate is stopped, the unloading arm is controlled to transfer all packaging substructures to the cleaning station on the cutting equipment so that all packaging substructures can be cleaned at the cleaning station.

[0011] Optionally, the cutting blade on the cutting equipment is controlled to cut the package column structure to obtain multiple discrete package substructures, including:

[0012] Based on the position information of each of the encapsulated substructures in the encapsulated structure component, the cutting path for the cutting equipment to cut the encapsulated structure component is determined; the cutting path is the cutting path for cutting each two adjacent rows of encapsulated substructures along the row direction.

[0013] For each cutting path, the cutting blade is controlled to move from one side of the package structure assembly in the row direction and cut along the cutting path to cut each package column structure into multiple discrete package substructures.

[0014] Optionally, before the cutting blade on the cutting device cuts the bezel and support ribs on the surface mount package structure to separate the bezel and support ribs from the multiple package columns, the method further includes:

[0015] A predetermined number of first target cutting channels are identified among all cutting channels;

[0016] For each first target cut, the cutting blade is controlled to perform a half-cutting process on each package column structure from one side of the package structure assembly in the row direction along the first target cut to release the stress on the package column structure.

[0017] Optionally, the cutting blade on the cutting equipment is controlled to cut the package column structure to obtain multiple discrete package substructures, including:

[0018] Control the axial rotation of the worktable so that the length direction of the support rib in the surface mount packaging structure is parallel to the X-axis direction;

[0019] The control panel moves along the X-axis and the two cutting blades are positioned on both sides of the support rib to simultaneously cut the encapsulation structure components located on both sides of the support rib.

[0020] Optionally, the working disk is controlled to move along the X-axis, and the two cutting blades are controlled to be positioned on both sides of the support rib, so that the two cutting blades simultaneously cut the encapsulation structure components located on both sides of the support rib, including:

[0021] For each encapsulation structure component, the cut path on the encapsulation structure component that is far from the support rib is taken as the second target cut path;

[0022] Control the two cutting blades to move to the positions corresponding to the two second target cutting channels, and control the two cutting blades to travel and cut along their corresponding second target cutting channels to cut and separate the single-row encapsulation substructure away from the encapsulation structure component.

[0023] For each packaged structure component after being cut and separated into single-row packaged substructures, the cut path on the packaged structure component that is far from the support rib is taken as the new second target cut path. The above steps are repeated until all cut paths in each packaged structure component have been cut.

[0024] Optionally, the unloading arm includes a suction cup and a pin assembly, the pin assembly being located on the suction cup to prevent the suction cup from vacuum-adhering to the support ribs while adsorbing the packaged substructure; controlling the unloading arm to transfer all packaged substructures to the cleaning station on the cutting equipment, so that all packaged substructures can be cleaned at the cleaning station, including:

[0025] Move the suction cup above the work plate and make the suction cup contact all the encapsulation substructures on the work plate, and make the ejector pin assembly contact the support ribs;

[0026] Adjust the vacuum level of the suction cups so that all the encapsulated substructures on the working plate are vacuum-adsorbed by the suction cups, and control the suction cups with the encapsulated substructures adsorbed to move towards the cleaning station.

[0027] Optionally, after the unloading arm transfers all packaged substructures to the cleaning station on the cutting equipment, the process further includes:

[0028] Control the water spraying component to spray water onto the support ribs, and move the support ribs off the work plate along with the water sprayed by the water spraying component, so as to complete the cleaning of the work plate.

[0029] According to a second aspect of the present invention, a processing apparatus for a surface-mount package structure is provided, applied to a cutting device for cutting the surface-mount package structure, the apparatus comprising:

[0030] The first cutting control module is used to control the cutting blade on the cutting equipment to cut the frame and support ribs on the surface mount package structure after the surface mount package structure is vacuum adsorbed onto the working plate of the cutting equipment, so that the frame and support ribs are cut and separated from multiple package columns.

[0031] The water spray control module is used to control the water spray component on the cutting equipment to spray water onto the frame, and move the frame away from the working plate along with the water flow sprayed by the water spray component, so that the support ribs and multiple encapsulation column structures are retained on the working plate.

[0032] The second cutting control module is used to control the cutting blade on the cutting equipment to cut the package column structure to obtain multiple discrete package substructures;

[0033] The handling control module is used to control the unloading arm to transfer all the packaged substructures to the cleaning station on the cutting equipment after the vacuum adsorption of the working disc on the packaged substructures and support ribs is stopped, so that all the packaged substructures can be cleaned at the cleaning station.

[0034] According to a third aspect of the present invention, a cutting device is provided, including an unloading arm, a memory, and a processor. The unloading arm includes a suction cup and a pin assembly, the pin assembly being located on the suction cup for preventing the suction cup from vacuum adsorbing the support ribs when the suction cup adsorbs the packaged substructure. The memory is used to store executable instructions for the processor. The processor is configured to execute the executable instructions in the memory to implement the steps of the method as described in the first aspect or its various implementations.

[0035] According to a fourth aspect of the present invention, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps of the method as described in the first aspect or its various implementations.

[0036] Compared with the prior art, the beneficial effects of the present invention are:

[0037] The surface mount packaging structure processing method provided by this invention eliminates the blue film application and removal steps required in the existing tape saw processing. By using a working tray to vacuum adsorb the surface mount packaging structure, the surface mount packaging structure is fixed on the working tray. This eliminates the need to consume blue film or other film materials, saving on film material procurement costs. It also eliminates the film application process before cutting and processing the surface mount packaging structure and the film removal process after processing, reducing the equipment occupation, manual operation, and time consumption corresponding to these two additional processes, thereby significantly reducing the processing cost of the additional processes. Attached Figure Description

[0038] Figure 1 An application scenario diagram provided for one embodiment of this application;

[0039] Figure 2 A flowchart illustrating a surface-mount packaging structure processing method according to one embodiment of this application is provided.

[0040] Figure 3A schematic diagram of a surface mount packaging structure provided in one embodiment of this application;

[0041] Figure 4 A partial structural schematic diagram of a surface mount packaging structure provided in one embodiment of this application;

[0042] Figure 5 A schematic diagram of the structure of a cutting device according to an embodiment of this application;

[0043] Figure 6 A schematic diagram of the structure of a suction cup provided in one embodiment of this application;

[0044] Figure 7 An exploded view of a suction cup from one embodiment of this application;

[0045] Figure 8 A schematic diagram of the cutting path in the packaging structure component according to one embodiment of this application;

[0046] Figure 9 A schematic diagram of a first target cut line in a packaging structure component, provided as an embodiment of this application;

[0047] Figure 10 A schematic diagram of a processing apparatus for a surface mount packaging structure provided in one embodiment of this application;

[0048] Figure 11 This is a schematic block diagram of a cutting device according to one embodiment of the present application. Detailed Implementation

[0049] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0050] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0051] In existing technologies, when processing surface-mount packaged structures, due to their low rigidity, the surface-mount packaged structures are typically glued onto a blue film before being cut and fed into a tape saw. Because the individual packaged substructures within these structures are small and difficult to process, while the film-applying method in a tape saw can stably process them, the tape saw requires a film-applying step before processing, and a film-removing step after processing. Therefore, the material cost of the film and the additional processing costs before and after processing are significant when using a tape saw for this type of workpiece.

[0052] To address at least one of the technical problems existing in the prior art or related technologies, this invention provides a processing method, apparatus, and cutting equipment for surface mount packaging structures. The method includes: after the surface mount packaging structure is vacuum-adsorbed onto the working plate of a cutting equipment, controlling the cutting blade on the cutting equipment to cut the frame and support ribs on the surface mount packaging structure, so that the frame and support ribs are separated from multiple packaging columns; controlling a water spray assembly on the cutting equipment to spray water onto the frame, removing the frame from the working plate with the water spray, leaving the support ribs and multiple packaging columns on the working plate; controlling the cutting blade on the cutting equipment to cut the packaging columns, obtaining multiple discrete packaging substructures; after stopping the vacuum adsorption of the packaging substructures and support ribs by the working plate, controlling the unloading arm to transfer all packaging substructures to a cleaning station on the cutting equipment, so that all packaging substructures are cleaned at the cleaning station. This application achieves dual savings in processing costs from both the aspects of film materials and the film application and peeling processes, solving the technical problem of excessively high film material and additional process costs in existing tape saw processing.

[0053] It should be understood that the technical solution of this application can be applied to the following scenarios, but is not limited to:

[0054] In some possible ways, Figure 1 An application scenario diagram provided for an embodiment of this application, such as Figure 1 As shown, this application scenario may include a cutting device 110 and a network device 120. The cutting device 110 can establish a connection with the network device 120 via a wired network or a wireless network.

[0055] For example, the cutting device 110 can be a cutting machine or a dicing machine, but is not limited thereto. The network device 120 can be a desktop computer, a laptop computer, a tablet computer, etc., but is not limited thereto. In one embodiment of this application, the network device 120 can send a request message to the cutting device 110, which can be used to request control of the cutting blade on the cutting device to cut the frame and support ribs on the surface mount package structure. Further, the network device 120 can receive a response message sent by the cutting device 110, which includes control of the cutting blade on the cutting device to cut the frame and support ribs on the surface mount package structure.

[0056] also, Figure 1 An example of a cutting device and a network device are provided, but in practice, other numbers of cutting devices and network devices may be included, and this application does not limit this.

[0057] In other possible implementations, the technical solution of this application can also be executed by the cutting device 110, or by the network device 120, and this application does not limit this.

[0058] After introducing the application scenarios of the embodiments of this application, the technical solution of this application will be described in detail below:

[0059] Figure 2 A flowchart illustrating a surface-mount packaging structure processing method provided in this application embodiment is shown. This method is applied to a cutting device used to cut the surface-mount packaging structure. The surface-mount packaging structure includes packaging structure components, a frame, and support ribs. The packaging structure components include multiple packaging column structures arranged sequentially along the row direction. Each packaging column structure is formed by multiple packaging substructures connected sequentially along the column direction. The first ends of each packaging column structure are connected to the frame, and the second ends of each packaging column structure are connected to the support ribs. This method can be implemented using methods such as... Figure 1 The cutting device 110 shown performs the operation, but is not limited to it. For example... Figure 2 As shown, the method may include the following steps:

[0060] S210. After the surface mount package structure is vacuum-adsorbed onto the working plate of the cutting equipment, the cutting blade on the cutting equipment is controlled to cut the frame and support ribs on the surface mount package structure so that the frame and support ribs are cut and separated from multiple package columns.

[0061] Among them, the surface mount type packaging structure can be an SOT packaging structure.

[0062] It should be noted that adjacent packaging column structures in multiple packaging column structures are not connected to each other, the borders and support ribs are parallel to the row direction, and the row direction is perpendicular to the column direction; in addition, all packaging substructures in the packaging structure assembly have the same structure and size, so the surface mount packaging structure in this application is a rectangular structure, the working tray can be a rectangular working tray, and the working tray is adapted to the shape and size of the surface mount packaging structure to be cut.

[0063] Here, when the cutting blade on the cutting device cuts the frame and support ribs on the surface mount package structure, it is done while the working disk maintains vacuum adsorption on the surface mount package structure. After the frame and support ribs are cut and separated from multiple package columns, the working disk maintains vacuum adsorption on the surface mount package structure after the cutting process. That is, multiple package columns, frame and support ribs are still vacuum adsorbed on the working disk.

[0064] In this step, by placing the surface-mount package structure on the work tray of the cutting equipment, the surface-mount package structure is vacuum-adhered to the work tray. This ensures that the surface-mount package structure can be cut without a film on the back. Simultaneously, before cutting the package columns, the cutter separates the frame and support ribs of the surface-mount package structure. This releases the constraints of the frame and support ribs on the individual package columns, preventing stress interference from the frame and support ribs during subsequent cutting. This ensures that each package column is stably adhering to the work tray, while also reducing deformation and displacement during cutting. This guarantees the dimensional accuracy and structural integrity of the final discrete package substructures, reducing the probability of defects in the cut package substructures.

[0065] S220, control the water spraying assembly on the cutting equipment to spray water onto the frame, and move the frame off the work plate with the water flow sprayed by the water spraying assembly, so that the support ribs and multiple encapsulation column structures are retained on the work plate.

[0066] Here, the water spraying component on the control cutting equipment sprays water onto the frame, which can be done under vacuum adsorption of the surface mount type packaging structure after step S210 by the working tray, or under vacuum adsorption of the surface mount type packaging structure after step S210 by the working tray.

[0067] Since the frame is located on one side of the surface mount package structure, the frame can be removed from the work tray by controlling the water spray component on the cutting equipment to spray water onto the frame.

[0068] It should be noted that the water spraying component that sprays water onto the frame in this step can be a water spray hood on the cutting equipment.

[0069] In this step, the impact force of the water jet from the water spray component is used to remove the frame, which can replace the traditional manual removal or mechanical clamping method. This avoids the scratch damage to the surface mount package structure caused by mechanical clamping, and eliminates the need to stop the machine for manual operation, thus shortening the interval between processes. At the same time, the water jet from the water spray component can simultaneously clean the cutting debris remaining on the surface of the worktable, providing a clean working environment for subsequent cutting processes.

[0070] S230: Control the cutting blade on the cutting equipment to cut the package column structure to obtain multiple discrete package substructures.

[0071] Here, the cutting blade is controlled to cut the package column structure while maintaining the vacuum adsorption of each package column structure and support rib on the working disk, so as to ensure that the cutting blade can cut each package column structure that is stably adsorbed on the working disk.

[0072] The process of controlling the cutting blade on the cutting equipment to cut the package column structure can be understood as: controlling the cutting blade to cut the connection position between every two adjacent package substructures in the same package column structure, so that the package substructures in each package column structure are cut and separated, thereby completing the cutting and separation of all package substructures on the surface mount package structure, so that all package substructures on the surface mount package structure are vacuum adsorbed on the working tray in a separated state.

[0073] S240. After the vacuum adsorption of the packaging substructure and support ribs by the stop work plate is completed, the unloading arm is controlled to transfer all packaging substructures to the cleaning station on the cutting equipment so that all packaging substructures can be cleaned at the cleaning station.

[0074] Here, when the unloading arm transfers all the packaged substructures to the cleaning station on the cutting equipment, the support ribs are not moved by the unloading arm, but remain on the work plate.

[0075] In this step, after the vacuum adsorption of the packaging substructure and support ribs by the working plate is stopped, all packaging substructures are quickly transferred to the cleaning station on the cutting equipment by controlling the unloading arm. This avoids direct contact between the packaging substructure and the workers during the transfer process, reduces the adhesion of external impurities to the packaging substructure, and improves the surface cleanliness of the packaging substructure during the transfer to the cleaning station.

[0076] Using the above method, before cutting the package columns on the surface mount package structure, the cutting blade is controlled to cut and separate the frame and support ribs on the surface mount package structure. This releases the constraints of the frame and support ribs on the individual package columns within the surface mount package structure, preventing stress interference from the frame and support ribs during subsequent cutting. Simultaneously, during the cutting process, a water spray assembly automatically removes the cut frame from the work tray with the water flow, eliminating the need for manual cleaning of frame residue and avoiding disruption to the processing rhythm. This also provides a clean processing environment for subsequent cutting of each package column structure, preventing residual frame from affecting the cutting operation. Furthermore, after the surface mount package structure is cut, an unloading arm transfers the package substructure to the cleaning station, achieving automated connection between cutting, unloading, and cleaning, reducing manual intervention, further improving overall processing efficiency, and adapting to batch processing needs. Therefore, this application eliminates the blue film application and removal steps required in the existing tape saw processing. By using a working tray to vacuum-adsorb the surface mount packaging structure, the surface mount packaging structure is fixed on the working tray. This eliminates the need to consume blue film or other film materials, saving on film procurement costs. It also eliminates the film application process before cutting and processing the surface mount packaging structure and the film removal process after processing. This reduces the equipment occupation, manual operation, and time consumption associated with these two additional processes, significantly reducing the processing costs of these additional processes. Therefore, this application achieves dual savings in processing costs from both material and process perspectives, solving the technical problem of excessively high film material and additional process costs in existing tape saw processing.

[0077] In some possible implementations, controlling a cutting blade on a cutting device to cut the package array structure to obtain multiple discrete package substructures may include the following steps:

[0078] S310. Based on the position information of each of the encapsulation substructures in the encapsulation structure component, determine the cutting path for the cutting device to cut the encapsulation structure component.

[0079] See here. Figure 8 The cutting path is the cutting path that cuts each pair of adjacent encapsulation substructures along the row direction.

[0080] Since all the encapsulated substructures in the encapsulated structure component have the same shape and size, the encapsulated substructures in the same row are located on the same straight line. Therefore, the cutting path between each two adjacent rows of encapsulated substructures is a straight path parallel to the row direction.

[0081] In this step, by determining the cutting path for the packaging structure component based on the position information of each packaging substructure in the packaging structure component, the cutting accuracy of the cutting equipment can be improved. Furthermore, determining the cutting path based on the position information of each packaging substructure in the packaging structure component can ensure that the cutting path is accurately matched with the arrangement position of each packaging substructure in the packaging structure component, avoiding overcutting, undercutting, or substructure damage caused by path offset, thereby ensuring the dimensional accuracy and structural integrity of the discrete packaging substructure.

[0082] S320. For each cutting path, control the cutting blade to move from one side of the packaging structure component in the row direction and cut each packaging column structure along the cutting path to cut the packaging column structure into multiple discrete packaging substructures.

[0083] Since there is no connection between two adjacent package columns, after the dicing blade completes the cutting of each dicing pass, the package column structure can be cut into multiple discrete package substructures.

[0084] Here, by controlling the cutting blade to move along the direction of travel and cut each cutting path from one side of the packaged structure component, the cutting blade can complete the sequential cutting of each package column structure in the packaged structure component along the cutting path where the cutting blade is located in a single movement, without the need to plan the movement for each package column separately, reducing the number of invalid movements of the cutting blade, thereby shortening the cutting time of the packaged structure component and improving the overall processing efficiency.

[0085] Meanwhile, by controlling the cutting blade to move from one side of the package structure assembly in the row direction and cut each package column structure along the cutting track, the frequency of starting and stopping the cutting blade and the frequency of reversing the cutting blade can be reduced, thereby reducing the wear of the cutting blade caused by frequent impacts and speed changes, and extending the service life of the cutting blade. At the same time, the continuous cutting action of the cutting blade can also avoid start-stop errors and ensure the consistency of the cutting quality of the package substructures cut by the cutting blade in the same batch.

[0086] Using the above method, it is possible to cut and separate the package substructure of each row in the surface mount package structure from the surface mount package structure, so as to quickly cut the surface mount package structure into multiple discrete package substructures.

[0087] In some possible embodiments, before the cutting blade on the cutting device cuts the bezels and support ribs on the surface mount package structure to separate the bezels and support ribs from the multiple package columns, the following steps may also be included:

[0088] S410. Determine a preset number of first target cutting paths among all cutting paths.

[0089] See here. Figure 9 The first target cutting channel can be determined from all cutting channels based on the number of cutting channels and a preset number. For example, if the number of cutting channels is 40 and the preset number is 3, the multiple packaging column structures can be divided into 4 equal parts in the column direction. That is, the 10 consecutive cutting channels in the 40 cutting channels are taken as a region, and the cutting channel between the two regions is taken as the first target cutting channel. Here, the 10th cutting channel, the 20th cutting channel, and the 30th cutting channel are taken as the first target cutting channel.

[0090] S420. For each first target cutting ridge, control the cutting blade to perform a half-cutting process on each package column structure from one side of the package structure assembly in the row direction along the first target cutting ridge, so as to release the stress on the package column structure.

[0091] It should be noted that the semi-cutting process of each package column structure along the first target cutting track can be understood as follows: after the cutting blade completes the semi-cutting process of each package column structure, the two package substructures located on both sides of the first target cutting track are still connected to each other. That is, the bottom of the connection between the two package substructures located on both sides of the first target cutting track is not cut off, so as to release the stress in each package column structure and reduce the curling of the package column structure on the working plate.

[0092] Using the above method, a preset number of first target cutting channels are determined from all cutting channels; then, for each first target cutting channel, the cutting blade is controlled to perform a half-cutting process on each packaging column structure from one side of the packaging structure assembly in the row direction along the first target cutting channel, so as to release the stress in each packaging column structure, thereby releasing the stress in the entire packaging structure assembly. This avoids the surface mount packaging structure from curling on the work tray before the frame and support ribs are cut and separated, thus ensuring that the surface mount packaging structure can be stably adsorbed on the work tray before being cut, while also reducing the positional displacement caused by curling, further reducing the scrap of the cut packaging substructures.

[0093] In some possible implementations, see [link to relevant documentation]. Figure 3 and Figure 4There are two encapsulation structure components 1. The two encapsulation structure components 1 are respectively connected to the two sides of the support rib 2. The side of each encapsulation structure component 1 away from the support rib 2 is respectively connected to a frame 3. Here, each encapsulation structure component 1 includes encapsulation column structures 101 connected sequentially along the row direction, and each encapsulation column structure 101 includes encapsulation substructures 1011 connected sequentially along the width direction. The two frame 3 and the support rib 2 are arranged in parallel and along the row direction. At the same time, the two frame 3 and the support rib 2 are parallel to each cut track 4 in the surface mount encapsulation structure.

[0094] See Figure 5 The cutting equipment has two cutting blades 5, which are coaxially arranged and can move along the Y-axis; the working disc 6 can move along the X-axis.

[0095] Here, by selecting a cutting device with two cutting blades 5, after the position of the surface mount package structure is adjusted on the working plate 6, the two cutting blades 5 can simultaneously cut the two package structure components 1 located on both sides of the support rib 2, thereby improving the cutting efficiency of the surface mount package structure.

[0096] Accordingly, controlling the cutting blade on the cutting equipment to cut the package array structure to obtain multiple discrete package substructures may include the following steps:

[0097] S510: Control the axial rotation of the working disk so that the length direction of the support rib in the surface mount packaging structure is parallel to the X-axis direction.

[0098] Here, by controlling the axial rotation of the working disk, the surface mount packaging structure that is vacuum-adsorbed on the worktable can be positioned by the axial rotation of the working disk. After the length direction of the support rib in the surface mount packaging structure is parallel to the X-axis direction, that is, parallel to the plane where the cutting blade is located, the working disk is controlled to stop axial rotation, thereby completing the position adjustment of the surface mount packaging structure, and thus making the cutting blade parallel to each cutting track in the surface mount packaging structure.

[0099] S520: Control the working disk to move along the X-axis and control the two cutting blades to be located on both sides of the support rib, so as to control the two cutting blades to cut the encapsulation structure components located on both sides of the support rib simultaneously.

[0100] After the surface mount package structure completes its position adjustment by rotating axially with the work tray, two cutting blades are controlled to simultaneously cut the two package structure components located on both sides of the support rib. Compared with the method of cutting the package structure component located on only one side of the support rib with one cutting blade, this can effectively shorten the time consumed by the cutting equipment to cut the surface mount package structure in a single batch and improve the overall production efficiency.

[0101] Meanwhile, by controlling two cutting blades to cut the packaging structure components located on both sides of the support rib simultaneously, the cutting force on the two packaging structure components located on both sides of the support rib can be made symmetrical and balanced. This reduces the eccentric force generated when cutting the packaging structure component located on one side of the support rib, thus avoiding warping and damage to the individual packaging substructures after cutting and separation, and further improving the yield of the final packaging substructure product.

[0102] Using the above method, the two cutting blades can be used to simultaneously process the two packaging structure components located on both sides of the support rib by controlling the axial rotation and movement of the working disc. This makes full use of the two cutting blades in the cutting equipment, effectively shortens the time consumed by the cutting equipment to cut the surface mount packaging structure in a single batch, and improves the overall production efficiency.

[0103] In some possible implementations, controlling the working disk to move along the X-axis and controlling the two cutting blades to be positioned on both sides of the support rib, so as to control the two cutting blades to simultaneously cut the encapsulation structure components located on both sides of the support rib, may include the following steps:

[0104] S610. For each packaged structure component, the cut path on the packaged structure component that is far from the support rib is taken as the second target cut path.

[0105] In this step, by using the cuts on each encapsulation structure component that are far from the support rib as the second target cuts, the second target cuts corresponding to each of the two encapsulation structure components can be quickly determined.

[0106] S620: Control the two cutting blades to move to positions corresponding to the two second target cutting paths, and control the two cutting blades to travel and cut along their corresponding second target cutting paths to cut and separate the single-row encapsulation substructure away from the encapsulation structure assembly.

[0107] By controlling the two cutting blades to move to positions corresponding to the two second target cutting paths, and controlling the two cutting blades to travel and cut along their corresponding second target cutting paths, it can be ensured that the cutting progress and cutting parameters (cutting speed and depth) of the encapsulation structure components located on both sides of the support rib are completely consistent.

[0108] S630. For each package structure component after being cut and separated into single-row package substructures, the cut path on the package structure component that is far from the support rib is taken as the new second target cut path, and the above steps are repeated until all cut paths in each package structure component are cut.

[0109] Here, by using the cutting path on the packaged structure assembly furthest from the support rib as the new second target cutting path, the second target cutting path can be dynamically updated. This allows the newly determined second target cutting path to adapt to the positional changes of the packaged structure assembly after each cutting step, preventing misalignment during the cutting of the packaged structure assembly located on both sides of the support rib by the two cutting blades. Simultaneously, by using the cutting path furthest from the support rib as the new second target cutting path, the packaged structure assembly can be cut progressively, dispersing the cutting stress and preventing damage caused by stress concentration during the cutting process. This further reduces the cutting defect rate and improves product yield.

[0110] Furthermore, by using the cut path on the packaged structure assembly that is far from the support rib as the new second target cut path, it is also convenient to adjust the position of the cutting blade relative to the new second target cut path. That is, each time the position of the cutting blade is adjusted, it can be moved one length of the packaged substructure in the column direction towards the support rib.

[0111] Using the above method, it is possible to achieve progressive cutting of the encapsulation structure components located on both sides of the support rib, "from the side away from the support rib towards the support rib". Moreover, by cutting only the second target cutting ridge corresponding to a single row of encapsulation substructures each time, it is possible to ensure that every cutting ridge in the encapsulation structure component is cut, and to avoid generating tensile force on the uncut encapsulation column structure during the cutting process. This avoids stress concentration caused by tensile force during the cutting process, which may damage the encapsulation structure component, further reducing the cutting defect rate and improving the product yield.

[0112] In some possible implementations, see [link to relevant documentation]. Figure 6 and Figure 7 The unloading arm includes a suction cup 7 and a pin assembly 8. The pin assembly 8 is located on the suction cup 7 and is used to prevent the suction cup 7 from vacuum adsorbing the support rib when the suction cup 7 adsorbs the encapsulated substructure.

[0113] Here, there are multiple ejector pin assemblies 8. After the suction cup 7 moves above the packaged structure assembly that has been cut, the multiple ejector pin assemblies 8 are respectively set along the length direction of the support ribs in the packaged structure assembly.

[0114] Specifically, the suction cup 7 includes a suction cup body 701 and a base 702. The suction cup body 701 has a pre-drilled air passage and is bolted to the base 702. The suction cup body 701 has multiple first through holes 703 along a straight line. The ejector pin assembly 8 includes a connecting plate 801 and multiple ejector pins 802. The connecting plate 801 is located between the suction cup body 701 and the base 702, and has multiple second through holes 803 along its length. The connecting plate 801 is positioned above the location of the multiple first through holes 703 on the suction cup body 701. The positions of 703 and multiple second through holes 803 correspond one-to-one; the first end of the ejector pin 802 passes through the second through hole 803 and the first through hole 703 in sequence, and the first end of the ejector pin 802 protrudes from the surface of the suction cup body 701, and the second end of the ejector pin 802 is fixed on the connecting plate 801; when the suction cup body 701 performs vacuum adsorption on the encapsulation substructure on the working plate, the first end of the ejector pin 802 contacts the support rib, and maintains a gap between the upper surface of the support rib and the suction cup body 701, thereby preventing the suction cup body 701 from performing vacuum adsorption on the support rib, and realizing the precise separation of the encapsulation substructure and the support rib by the suction cup 7.

[0115] Therefore, by using the coordinated design of the suction cup and ejector pin assembly, the ejector pin assembly can contact the support rib when the suction cup adsorbs the packaged substructure, effectively preventing the suction cup from creating a vacuum adsorption on the support rib. This achieves precise separation and adsorption of the packaged substructure and support rib by the unloading arm, avoiding the situation where the support rib is transferred to the cleaning station along with the packaged substructure due to accidental adsorption.

[0116] Accordingly, controlling the unloading arm to transfer all package substructures to the cleaning station on the cutting equipment so that all package substructures can be cleaned at the cleaning station can include the following steps:

[0117] S710, Move the suction cup above the working plate and make the suction cup contact all the encapsulation substructures on the working plate, and make the ejector pin assembly contact the support rib.

[0118] Here, when the suction cup is moved above the working plate, after confirming that the ejector pin assembly is directly above the support rib, the suction cup is then brought into contact with all the encapsulation substructures on the working plate, and the ejector pin assembly is brought into contact with the support rib, so as to ensure that the suction cup in the unloading arm can accurately separate and adsorb the encapsulation substructures and the support ribs in subsequent steps.

[0119] S720: Adjust the vacuum level of the suction cup so that all the encapsulated substructures on the working plate are vacuum-adsorbed by the suction cup, and control the suction cup with the encapsulated substructures adsorbed to move towards the cleaning station.

[0120] Here, while all the encapsulation substructures on the working plate are vacuum-adsorbed by the suction cup, the ejector pin assembly contacts the support rib, creating a gap between the upper surface of the support rib and the suction cup. This prevents the suction cup from vacuum-adsorbing the support rib, thus preventing the suction cup from adsorbing the support rib.

[0121] Using the above method, all packaged substructures on the working plate can be adsorbed in one batch. Compared with transferring a single or a small number of substructures at a time, the transfer time is greatly shortened and the overall processing efficiency is improved. At the same time, the vacuum adsorption method of the packaged substructures is gentle, which can avoid the squeezing and scratching of the packaged substructures by mechanical gripping. Moreover, the transfer process after adsorption is stable, reducing the risk of substructures falling or being damaged, and improving the safety and reliability of the transfer operation.

[0122] In some possible embodiments, after the unloading arm transfers all the packaged substructures to the cleaning station on the cutting equipment, the method further includes: controlling the water spray assembly to spray water onto the support ribs, so that the support ribs are removed from the work tray by the water flow sprayed by the water spray assembly, thereby completing the cleaning of the work tray.

[0123] Here, the water spraying component that sprays water onto the support ribs can be a water mist curtain.

[0124] After the controlled unloading arm transfers all the package substructures to the cleaning station on the cutting equipment, water spraying is applied to the support ribs. The impact force of the water flow removes the support ribs from the work tray, eliminating the need for manual cleaning or mechanical clamping, thus achieving automated and efficient cleaning of the support ribs. Simultaneously, the water spray from the water spraying assembly washes away residual cutting debris, dust, and other impurities from the work tray surface, cleaning the work tray's working surface and preventing residual impurities from affecting the vacuum adsorption stability and cutting accuracy of the next batch of surface mount package structures. This further improves the automation level and overall production efficiency of surface mount package structure processing.

[0125] Figure 10 This is a schematic diagram of a processing apparatus for a surface mount packaging structure according to an embodiment of the present invention, as shown below. Figure 10 As shown, this device is applied to a cutting device used to cut surface-mount package structures. The surface-mount package structure includes package structure components, a frame, and support ribs. The package structure components include multiple package column structures arranged sequentially along the row direction. Each package column structure is formed by multiple package substructures connected sequentially along the column direction. The first end of each package column structure is connected to the frame, and the second end of each package column structure is connected to the support ribs. The device includes:

[0126] The first cutting control module 810 is used to control the cutting blade on the cutting device to cut the frame and support ribs on the surface mount package structure after the surface mount package structure is vacuum adsorbed onto the working plate of the cutting device, so that the frame and support ribs are cut and separated from the multiple package column structures.

[0127] The water spray control module 820 is used to control the water spray component on the cutting equipment to spray water onto the frame, and to move the frame away from the work plate along with the water flow sprayed by the water spray component, so that the support ribs and multiple encapsulation column structures are retained on the work plate.

[0128] The second cutting control module 830 is used to control the cutting blade on the cutting equipment to cut the package column structure to obtain multiple discrete package substructures.

[0129] The transport control module 840 is used to control the unloading arm to transfer all the packaged substructures to the cleaning station on the cutting equipment after the vacuum adsorption of the packaged substructures and support ribs by the stop work plate, so that all the packaged substructures can be cleaned at the cleaning station.

[0130] In some possible implementations, the second cutting control module 830 includes:

[0131] The cutting path determination unit is used to determine the cutting path of the cutting equipment for cutting the packaging structure component based on the position information of each packaging substructure in the packaging structure component; the cutting path is the cutting path for cutting each two adjacent rows of packaging substructures along the row direction.

[0132] The cutting control unit controls the cutting blade to move along the cutting path from one side of the package structure assembly in the row direction to cut each package column structure into multiple discrete package substructures for each cutting path.

[0133] In some possible embodiments, the device further includes:

[0134] The first target cutting path determination module is used to determine a preset number of first target cutting paths among all cutting paths;

[0135] The semi-cutting processing module is used to control the cutting blade to perform semi-cutting processing on each package column structure from one side of the package structure assembly in the row direction along the first target cutting track for each first target cutting track, so as to release the stress on the package column structure.

[0136] In some possible implementations, the cutting control unit includes:

[0137] The worktable control subunit is used to control the axial rotation of the worktable so that the length direction of the support rib in the surface mount packaging structure is parallel to the X-axis direction;

[0138] The cutting control subunit is used to control the movement of the working disk along the X-axis and to control the two cutting blades to be located on both sides of the support rib, so as to control the two cutting blades to cut the encapsulation structure components located on both sides of the support rib simultaneously.

[0139] In some possible implementations, the cutting control subunit includes:

[0140] The second target cutting channel determination sub-unit is used to determine the cutting channel on the packaging structure component that is far away from the support rib as the second target cutting channel for each packaging structure component.

[0141] The traveling cutting control subunit is used to control the two cutting blades to move to the positions corresponding to the two second target cutting paths, and to control the two cutting blades to travel and cut along their corresponding second target cutting paths, so as to cut and separate the single-row encapsulation substructure away from the encapsulation structure assembly.

[0142] The repeat execution subunit is used to, for each package structure component after being cut and separated into single-row package substructures, take the cut path on the cut package structure component that is far away from the support rib as the new second target cut path, and repeat the above steps until all cut paths in each package structure component have been cut.

[0143] In some possible embodiments, the unloading arm includes a suction cup and a pin assembly, the pin assembly being located on the suction cup to prevent the suction cup from vacuum-adhering to the support ribs while the suction cup is adsorbing the packaged substructure; the handling control module 840 includes:

[0144] The suction cup control unit is used to move the suction cup above the work plate and to make the suction cup contact all the encapsulation substructures located on the work plate, and to make the ejector pin assembly contact the support ribs.

[0145] The adsorption control unit is used to adjust the vacuum level of the suction cups so that all the encapsulated substructures on the working plate are vacuum adsorbed by the suction cups, and to control the suction cups with the encapsulated substructures adsorbed to move towards the cleaning station.

[0146] In some possible embodiments, the device further includes:

[0147] The cleaning control module controls the water spray assembly to spray water onto the support ribs, moving the support ribs off the work plate along with the water flow from the water spray assembly, thus completing the cleaning of the work plate.

[0148] This disclosure provides an embodiment of a cutting device. Optionally, the cutting device includes a memory for storing processor-executable instructions; a processor configured to execute the executable instructions in the memory to implement the steps of the cutting device control method provided in this disclosure.

[0149] Figure 6 and Figure 7 The cutting device provided in one embodiment of the present invention includes an unloading arm, which includes a suction cup 7 and a pin assembly 8. The pin assembly 8 is located on the suction cup 7 and is used to prevent the suction cup 7 from vacuum adsorbing the support rib when the suction cup 7 adsorbs the encapsulated substructure.

[0150] Figure 11 This is a schematic block diagram of a cutting device 110 according to an embodiment of the present invention.

[0151] like Figure 11 As shown, the cutting device 110 may further include:

[0152] The system includes a memory 1101 and a processor 1102. The memory 1101 stores computer programs and transfers the program code to the processor 1102. In other words, the processor 1102 can retrieve and run the computer programs from the memory 1101 to implement the methods described in the embodiments of the present invention.

[0153] For example, the processor 1102 can be used to execute the above-described method embodiments according to instructions in the computer program.

[0154] In some embodiments of the present invention, the cutting device 110 may include, but is not limited to:

[0155] General-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0156] In some embodiments of the present invention, the memory 1101 includes, but is not limited to:

[0157] Volatile memory and / or non-volatile memory. Non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DR RAM).

[0158] In some embodiments of the present invention, the computer program may be divided into one or more modules, which are stored in the memory 1101 and executed by the processor 1102 to perform the method provided by the present invention. The one or more modules may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0159] like Figure 11 As shown, the cutting device 110 may further include:

[0160] Transceiver 1103, which can be connected to processor 1102 or memory 1101.

[0161] The processor 1102 can control the transceiver 1103 to communicate with other devices; specifically, it can send information or data to other devices or receive information or data sent by other devices. The transceiver 1103 may include a transmitter and a receiver. The transceiver 1103 may further include antennas, and the number of antennas may be one or more.

[0162] It should be understood that the various components in the cutting equipment are connected through a bus system, which includes a data bus, a power bus, a control bus, and a status signal bus.

[0163] The present invention also provides a computer storage medium having a computer program stored thereon, which, when executed by a computer, enables the computer to perform the methods of the above-described method embodiments. Alternatively, one embodiment of the present invention also provides a computer program product containing instructions that, when executed by a computer, cause the computer to perform the methods of the above-described method embodiments.

[0164] When implemented using software, it can be implemented entirely or partially as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., Digital Video Disc (DVD)), or a semiconductor medium (e.g., Solid State Disk (SSD)).

[0165] Those skilled in the art will recognize that the modules and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0166] In the several embodiments provided by this invention, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or modules may be electrical, mechanical, or other forms.

[0167] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. For example, the functional modules in the various embodiments of this application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.

[0168] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for processing a surface-mount package structure, applied to a cutting device, wherein the cutting device is used to cut the surface-mount package structure, characterized in that... The method includes: After the surface mount packaging structure is vacuum-adsorbed onto the working plate of the cutting equipment, the cutting blade on the cutting equipment is controlled to cut the frame and support ribs on the surface mount packaging structure, so that the frame and support ribs are cut and separated from the multiple packaging column structures. Control the water spraying assembly on the cutting equipment to spray water onto the frame, and move the frame off the working plate along with the water sprayed by the water spraying assembly, so that the support ribs and multiple packaging column structures are retained on the working plate; The cutting blade on the cutting device is controlled to cut the packaging column structure to obtain multiple discrete packaging substructures; After the vacuum adsorption of the packaging substructure and the support rib by the working disk is stopped, the unloading arm is controlled to transfer all the packaging substructures to the cleaning station on the cutting equipment so that all the packaging substructures can be cleaned at the cleaning station.

2. The processing method of the surface mount packaging structure according to claim 1, characterized in that, The cutting device controls the cutting blade to cut the package column structure, resulting in multiple discrete package substructures, including: Based on the position information of each of the encapsulation substructures in the encapsulation structure assembly, the cutting path of the cutting device for the encapsulation structure assembly is determined; the cutting path is the cutting path for cutting each two adjacent rows of the encapsulation substructures along the row direction. For each of the cutting paths, the cutting blade is controlled to move from one side of the packaging structure assembly in the row direction and cut along the cutting path to each of the packaging column structures, so as to cut the packaging column structure into multiple discrete packaging substructures.

3. The processing method of the surface mount packaging structure according to claim 2, characterized in that, Before the cutting blade on the cutting device cuts the frame and the support rib on the surface mount package structure to separate the frame and the support rib from the plurality of package columns, the method further includes: A predetermined number of first target cutting channels are determined from all the cutting channels; For each of the first target cuts, the cutting blade is controlled to perform a half-cutting process on each of the package column structures from one side of the package structure assembly in the row direction, along the first target cut, in order to release the stress on the package column structure.

4. The processing method of the surface mount packaging structure according to claim 2, characterized in that, The cutting device controls the cutting blade to cut the package column structure, resulting in multiple discrete package substructures, including: The working disk is controlled to rotate axially so that the length direction of the support rib in the surface mount packaging structure is parallel to the X-axis direction. The working disk is controlled to move along the X-axis, and the two cutting blades are controlled to be located on both sides of the support rib, so as to control the two cutting blades to cut the packaging structure components located on both sides of the support rib simultaneously.

5. The processing method of the surface mount packaging structure according to claim 4, characterized in that, The control of moving the working disk along the X-axis and controlling the two cutting blades to be positioned on both sides of the support rib, so as to control the two cutting blades to simultaneously cut the encapsulation structure components located on both sides of the support rib, includes: For each of the aforementioned encapsulation structure components, the cut path on the encapsulation structure component that is away from the support rib is designated as the second target cut path. Control the two cutting blades to move to positions corresponding to the two second target cutting paths, and control the two cutting blades to travel and cut along their corresponding second target cutting paths, so as to cut and separate the single row of the encapsulation substructure away from the support rib from the encapsulation structure assembly. For each encapsulation structure component after being cut and separated into single rows of encapsulation substructures, the cut path on the encapsulation structure component that is far from the support rib is taken as a new second target cut path, and the above steps are repeated until all cut paths in each encapsulation structure component have been cut.

6. The processing method of the surface mount packaging structure according to claim 1, characterized in that, The unloading arm includes a suction cup and a pin assembly. The pin assembly is located on the suction cup and is used to prevent the suction cup from vacuum adsorbing the support rib when the suction cup adsorbs the packaging substructure. The control unloading arm transfers all the packaged substructures to the cleaning station on the cutting equipment, so that all the packaged substructures can be cleaned at the cleaning station, including: Move the suction cup above the working plate and bring the suction cup into contact with all the encapsulation substructures located on the working plate, and bring the ejector pin assembly into contact with the support rib; Adjust the vacuum level of the suction cup so that all the encapsulation substructures on the working plate are vacuum-adsorbed by the suction cup, and control the suction cup with the encapsulation substructures adsorbed to move towards the cleaning station.

7. The processing method of the surface mount packaging structure according to claim 1, characterized in that, After the control unloading arm transfers all the packaged substructures to the cleaning station on the cutting equipment, the process further includes: The water spraying assembly is controlled to spray water onto the support ribs, causing the support ribs to be removed from the working disc along with the water flow from the water spraying assembly, thereby completing the cleaning of the working disc.

8. A processing apparatus for surface-mount packaging structures, applied to a cutting device, the cutting device being used to cut surface-mount packaging structures, characterized in that... The device includes: The first cutting control module is used to control the cutting blade on the cutting device to cut the frame and support ribs on the surface mount packaging structure after the surface mount packaging structure is vacuum adsorbed onto the working plate of the cutting device, so that the frame and support ribs are cut and separated from the multiple packaging column structures. A water spray control module is used to control the water spray component on the cutting equipment to spray water onto the frame, so that the frame is moved off the working plate along with the water sprayed by the water spray component, so that the support rib and the multiple packaging column structures are retained on the working plate; The second cutting control module is used to control the cutting blade on the cutting device to cut the packaging column structure to obtain multiple discrete packaging substructures; The transport control module is used to control the unloading arm to transfer all the packaged substructures to the cleaning station on the cutting equipment after the vacuum adsorption of the working disk on the packaged substructure and the support rib is stopped, so that all the packaged substructures can be cleaned at the cleaning station.

9. A cutting device, characterized in that, include: The unloading arm includes a suction cup and a pin assembly, the pin assembly being located on the suction cup and used to prevent the suction cup from vacuum adsorbing the support rib when the suction cup adsorbs the encapsulation substructure; Memory is used to store processor-executable instructions; A processor is configured to execute executable instructions in the memory to implement the steps of the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 7.

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