SMD (Surface Mount Device) diode

Abstract

The utility model discloses a surface-mounted diode, which belongs to the technical field of diodes and comprises a chip body, an upper pin, a lower pin and a packaging piece, and the upper end and the lower end of the chip body are respectively connected with the upper pin and the lower pin. The chip body, the local part of the upper pin and the local part of the lower pin are packaged in the packaging piece, the outer sides of the horizontal sections of the upper pin and the lower pin are provided with ceramic insulating columns, the ceramic insulating columns are packaged in the packaging piece, and the tail ends of the ceramic insulating columns are flush with the tail end of the packaging piece. According to the utility model, through the arrangement of the ceramic insulating column, when the upper pin or the lower pin is cut, the acting force does not directly act on the plastic package piece, and through the buffering of the ceramic insulating column, the probability of fracture of the plastic package piece is reduced, and the yield and the processing efficiency are improved; and meanwhile, the ceramic insulating column has a good heat dissipation effect, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of diode technology, specifically to a surface mount diode. Background Technology

[0002] During the manufacturing process, the leads of surface mount diodes are designed to specific lengths to meet different soldering and heat dissipation requirements. During the fabrication of surface mount diodes, after molding, the diode leads need to be trimmed. However, during this trimming process, the leads directly contact the molding compound, which can easily cause the compound to crack, thereby damaging the diode and affecting processing efficiency. To solve the above problems, this invention addresses these issues. Utility Model Content

[0003] To address the aforementioned technical deficiencies, the purpose of this utility model is to provide a surface-mount diode that, by incorporating ceramic insulating pillars, prevents the force from directly acting on the molding compound when the upper or lower pins are cut. The buffering effect of the ceramic insulating pillars reduces the probability of molding compound breakage, thus solving the technical problems mentioned in the background art.

[0004] To solve the above-mentioned technical problems, this utility model adopts the following technical solution: This utility model provides a surface mount diode, including a chip body, an upper lead, a lower lead, and a package. The upper and lower ends of the chip body are respectively connected to the upper lead and the lower lead. The chip body, a portion of the upper lead, and a portion of the lower lead are encapsulated within the package. Ceramic insulating pillars are provided on the outer side of the horizontal sections of the upper and lower leads. The ceramic insulating pillars are encapsulated within the package, and the ends of the ceramic insulating pillars are flush with the ends of the package. By setting the ceramic insulating pillars, when the upper or lower lead is cut, the force will not directly act on the plastic package. Through the buffering effect of the ceramic insulating pillars, the probability of plastic package breakage is reduced, improving yield and processing efficiency. At the same time, the ceramic insulating pillars have good heat dissipation effect, improving heat dissipation efficiency.

[0005] Preferably, the ceramic insulating post has several extension strips evenly distributed on its upper and lower sides, and the extension strips are encapsulated within the encapsulation component; by providing the extension strips, the connection strength between the ceramic insulating post and the encapsulation component is improved, and the heat dissipation effect is further enhanced.

[0006] Preferably, the ceramic insulating column is stepped; the number of steps in the stepped column is greater than or equal to 2.

[0007] Preferably, the size of the ceramic insulating pillars gradually increases from the inside to the outside within the encapsulation; the stepped shape of the ceramic insulating pillars improves the connection strength.

[0008] Preferably, the ceramic insulating post is I-shaped; the contact area of ​​the encapsulation increases the connection strength; at the same time, the I-shaped design further strengthens the connection strength.

[0009] The beneficial effects of this utility model are as follows:

[0010] 1. By setting ceramic insulating pillars, the force will not be directly applied to the molded part when cutting the upper or lower pins. The buffering effect of the ceramic insulating pillars reduces the probability of molded part breakage and improves yield and processing efficiency. At the same time, the ceramic insulating pillars have good heat dissipation effect, improving heat dissipation efficiency.

[0011] 2. This utility model improves the connection strength between the ceramic insulating column and the encapsulation component by setting an extension strip, and at the same time further improves the heat dissipation effect. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of a surface-mount diode provided in Embodiment 1 of this utility model.

[0014] Figure 2 for Figure 1 A schematic diagram of the structure without the packaged components installed.

[0015] Figure 3 This is a schematic diagram of a surface-mount diode provided in Embodiment 2 of this utility model.

[0016] Figure 4 for Figure 3 A schematic diagram of the structure without the packaged components installed.

[0017] Figure 5 This is a schematic diagram of a surface-mount diode provided in Embodiment 3 of this utility model.

[0018] Figure 6 for Figure 5 A schematic diagram of the structure without the packaged components installed.

[0019] Explanation of reference numerals in the attached figures:

[0020] 1-Chip body, 2-Upper pin, 3-Lower pin, 4-Package, 5-Ceramic insulating pillar, 51-Extension strip. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example 1:

[0023] Please see Figures 1 to 2 As shown, this embodiment provides a surface mount diode, including: a chip body 1, an upper lead 2, a lower lead 3, and a package 4. The upper and lower ends of the chip body 1 are respectively connected to the upper lead 2 and the lower lead 3. The electrical surface of the chip body 1 is connected to the upper lead 2, and the mounting surface of the chip body 1 is connected to the lower lead 3 through surface mount adhesive. A portion of the chip body 1, the upper lead 2, and the lower lead 3 are encapsulated in the package 4, which is a flat plastic package. Ceramic insulating pillars 5 are provided on the outer side of the horizontal sections of the upper lead 2 and the lower lead 3. The ceramic insulating pillars 5 are encapsulated in the package 4, and the ends of the ceramic insulating pillars 5 are flush with the ends of the package 4. By setting the ceramic insulating pillars 5, when the upper lead 2 or the lower lead 3 is cut, the force will not be directly applied to the plastic package 4. Through the buffering effect of the ceramic insulating pillars 5, the probability of the plastic package 4 breaking is reduced, thereby improving the yield and processing efficiency. At the same time, the ceramic insulating pillars 5 have good heat dissipation effect, improving the heat dissipation efficiency. Furthermore, several extension strips 51 are evenly distributed on the upper and lower sides of the ceramic insulating post 5, and the extension strips 51 are encapsulated in the encapsulation component 4; by setting the extension strips 51, the connection strength between the ceramic insulating post 5 and the encapsulation component 4 is improved, and the heat dissipation effect is further improved.

[0024] Example 2:

[0025] Please see Figure 3 and Figure 4 As shown, the ceramic insulating post 5 is a stepped column shape, and the number of steps in the stepped post is greater than or equal to 2. Furthermore, within the encapsulation 4, the size of the ceramic insulating post 4 gradually increases from the inside to the outside; the stepped column shape of the ceramic insulating post 5 improves the connection strength.

[0026] Example 3:

[0027] Please see Figure 5 and Figure 6 As shown, the ceramic insulating post 4 is I-shaped; this increases the contact area between the ceramic insulating post 4 and the encapsulation component 4, thereby improving the connection strength; at the same time, the I-shaped design further strengthens the connection strength.

[0028] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A surface-mount diode, comprising a chip body (1), an upper pin (2), a lower pin (3), and a package (4), wherein the upper and lower ends of the chip body (1) are respectively connected to the upper pin (2) and the lower pin (3), and a portion of the chip body (1), the upper pin (2), and the lower pin (3) are encapsulated within the package (4), characterized in that, Ceramic insulating pillars (5) are provided on the outer side of the horizontal section of the upper pin (2) and the lower pin (3). The ceramic insulating pillars (5) are encapsulated in the package (4), and the end of the ceramic insulating pillars (5) is flush with the end of the package (4).

2. A surface mount diode as described in claim 1, characterized in that, The ceramic insulating post (5) has several extension strips (51) evenly distributed on its upper and lower sides, and the extension strips (51) are encapsulated in the encapsulation component (4).

3. A surface mount diode as described in claim 1, characterized in that, The ceramic insulating column (5) is stepped columnar.

4. A surface mount diode as described in claim 3, characterized in that, Within the encapsulation (4), the size of the ceramic insulating pillar (5) gradually increases from the inside to the outside.

5. A surface mount diode as described in claim 1, characterized in that, The ceramic insulating column (5) is an I-shaped column.

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