Chip compression test indenter assembly and chip compression test apparatus

Abstract

This utility model discloses a pressure head assembly and a chip pressing test device for chip pressing tests, relating to the field of chip testing technology. The pressure head assembly for chip pressing tests includes a pressure head base plate and multiple pressure heads, which are arranged in an array on the pressure head base plate. Each pressure head is provided with heat dissipation fins located on its periphery. Ventilation slots are provided on the pressure head base plate corresponding to the heat dissipation fins, allowing cold air flowing through the ventilation slots to be directed towards their respective heat dissipation fins. An airflow space is provided between the ventilation slots and the heat dissipation fins to ensure that the cold air entering through the ventilation slots is not blocked by the heat dissipation fins and can flow smoothly outwards to the heat dissipation fins, further improving the heat exchange capacity of the heat dissipation fins and the heat dissipation efficiency of the chip, thereby meeting the heat dissipation requirements of high-power chips.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a pressure head assembly and a chip pressing test device for chip pressing test. Background Technology

[0002] During the manufacturing process, chips need to be tested for performance. During testing, the chips generate a lot of heat. Increased temperature can affect test results and may damage the chips.

[0003] Currently, chip testing equipment includes a main body and a pressure head assembly. The pressure head assembly has multiple pressure heads evenly distributed on it, allowing for simultaneous pressing tests on multiple chips. The main body contains an air chamber connected to a fan. A cylinder's drive rod passes through the air chamber, pushing the pressure heads to press against the chips. Both the cylinder's drive rod and the pressure heads are hollow structures. Cold air from the air chamber enters the drive rod and flows to the pressure heads, reaching the back of the chip through the central hole of the pressure heads, exchanging heat with the chip, thus achieving chip heat dissipation. This heat dissipation method can meet the heat dissipation requirements of chips with a single chip heat output of less than 1W. However, for higher-power chips, where a single chip generates 10W-15W of heat, this method cannot meet the heat dissipation requirements. Utility Model Content

[0004] The purpose of this invention is to provide a pressure head assembly and a chip pressing test device for chip pressing, so as to improve the heat dissipation capacity when pressing chips and meet the heat dissipation requirements of high-power chips.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] The chip bonding test head assembly includes a head base plate and multiple head plates. The multiple head plates are arranged in an array on the head base plate. Each head plate is provided with heat dissipation fins located on the periphery of the head plate. The head base plate is provided with ventilation slots corresponding to the heat dissipation fins. Cold air flowing out of the ventilation slots blows towards the corresponding heat dissipation fins. An airflow space is provided between the ventilation slots and the heat dissipation fins.

[0007] As an optional solution for the pressure head assembly for the chip pressing test, multiple heat dissipation fins located on the same side of the pressure head are spaced apart in the horizontal direction.

[0008] As an optional embodiment of the pressure head assembly for the chip pressing test, multiple heat dissipation fins on the same side of the pressure head correspond to at least one ventilation slot, and the ventilation slot extends along a direction perpendicular to the extension of the heat dissipation fins.

[0009] As an optional solution for the pressure head assembly in the chip pressing test, the total number of heat dissipation fins provided on the periphery of each pressure head is the same.

[0010] As an optional solution for the pressure head assembly for the chip pressing test, N heat dissipation fins are evenly distributed on the four sides of the pressure head, and the spacing between the N heat dissipation fins is P.

[0011] As an optional solution for the pressure head assembly for the chip pressing test, the pressure head, located at least one column and / or at least one row on the edge of the pressure head base plate, has heat dissipation fins on only three sides, with the number of heat dissipation fins on the three sides being M, N, and M, respectively.

[0012] As an optional configuration for the pressure head assembly in the chip bonding test, M > N, the pressure head has N heat dissipation fins on one side, and also has a different type of fin. The width of the different type of fin is larger than the width of the heat dissipation fins, and at least two of the M heat dissipation fins are connected to the different type of fin; and / or,

[0013] M > N, where N is an even number ≥ 2, and M = 3N / 2; the spacing between adjacent heat dissipation fins on the same side is P, and the M heat dissipation fins include N / 2 heat dissipation fins extending to the opposite sides of the N heat dissipation fins.

[0014] As an optional solution for the pressure head assembly for the chip pressing test, the ventilation area of ​​a single ventilation slot in the two side areas along the length direction of the pressure head base plate is greater than the ventilation area of ​​a single ventilation slot in the middle area.

[0015] As an optional solution for the pressure head assembly for the chip pressing test, the pressure head base plate is provided with an array of mounting holes, and the pressure head is installed in the mounting holes;

[0016] The back side of the pressure head base plate is provided with a drive plate, and the drive plate array is provided with through holes for the drive rod to pass through. The through hole array includes a first row and a second row. The mounting hole is provided corresponding to the even number of through holes in the first row. There is at least one second row between adjacent first rows.

[0017] As an optional solution for the pressure head assembly for the chip pressing test, the pressure head base plate is provided with an airflow buffer chamber communicating with the ventilation slots on the side opposite to the pressure head, and the cold air in the airflow buffer chamber flows evenly to multiple ventilation slots.

[0018] As an optional solution for the pressure head assembly for the chip pressing test, temperature monitoring points are provided at the four corners and the center of the pressure head assembly, and the temperature sensors of the temperature monitoring points are located inside the pressure head at the corresponding positions.

[0019] A chip crimping test device includes a body and a crimping head assembly for chip crimping testing as described in any of the above embodiments. The crimping head assembly is disposed on the body. An air cavity is provided inside the body. An air outlet is provided at the top of the air cavity. The air outlet communicates with the ventilation slot.

[0020] The beneficial effects of this utility model are:

[0021] The chip pressing head assembly provided by this utility model increases the heat exchange capacity between the pressing head and the surrounding air by setting heat dissipation fins on the periphery of the pressing head, thereby improving the heat dissipation efficiency of the chip. By setting ventilation slots on the bottom plate of the pressing head, the cold air entering through the ventilation slots exchanges heat with the heat dissipation fins. Moreover, an airflow space is set between the ventilation slots and the heat dissipation fins to ensure that the cold air entering through the ventilation slots is not blocked by the heat dissipation fins and can flow out smoothly and blow onto the heat dissipation fins, further improving the heat exchange capacity of the heat dissipation fins and the heat dissipation efficiency of the chip, thereby meeting the heat dissipation requirements of high-power chips.

[0022] The chip crimping test device provided by this utility model sets the above-mentioned chip crimping test pressure head assembly on the body. The cold air in the air cavity inside the body enters the ventilation slot through the air outlet at the top, and flows out smoothly through the ventilation slot to exchange heat with the heat sink fins, thereby improving the heat dissipation capacity of the heat sink fins and thus improving the heat dissipation efficiency of the chip, meeting the heat dissipation requirements of high-power chips during crimping tests. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the chip crimping test device provided in this embodiment of the utility model;

[0024] Figure 2 This is a cross-sectional view of the chip crimping test device provided in this embodiment of the utility model;

[0025] Figure 3 yes Figure 2 A magnified view of a section at point A in the middle;

[0026] Figure 4 This is a schematic diagram of the structure of the pressure head base plate partially assembled with the pressure head according to an embodiment of the present invention;

[0027] Figure 5 This is a partial structural diagram of the back side of the pressure head base plate provided in an embodiment of the present invention;

[0028] Figure 6 This is a partial top view of the pressure head assembly for chip pressing test provided in this embodiment of the utility model;

[0029] Figure 7 This is a schematic diagram of the structure of the pressure head with heat dissipation fins evenly distributed on four sides provided in an embodiment of this utility model;

[0030] Figure 8 This is a schematic diagram of the structure of the pressure head with heat dissipation fins on three sides provided in this embodiment of the utility model;

[0031] Figure 9 This is a partial structural diagram of the back side of the pressure head base plate provided in an embodiment of the present invention;

[0032] Figure 10 This is a cross-sectional view of the pressure head provided in an embodiment of this utility model.

[0033] In the picture:

[0034] 100. Chips;

[0035] 1. Pressure head base plate; 11. Ventilation slot; 12. Airflow buffer chamber; 13. Mounting hole; 14. Connection hole;

[0036] 101. Middle area; 102. Left side area; 103. Right side area;

[0037] 2. Press head; 21. Press head body; 211. Pressing surface; 22. Heat-conducting base; 221. Support column; 222. Mounting blind hole; 23. Heat dissipation fins; 24. Dissimilar fins;

[0038] 3. Body; 31. Air cavity; 311. Air outlet; 32. Air duct;

[0039] 4. Cylinder; 41. Drive rod;

[0040] 5. Airflow space;

[0041] 6. Driver board; 61. Through hole;

[0042] 7. Temperature sensor. Detailed Implementation

[0043] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0044] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0045] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0046] Unless otherwise expressly specified and limited, "above" or "below" a second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of a second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of a second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0048] like Figures 1-5 As shown, this embodiment provides a chip pressing test device, including a body 3 and a pressing head assembly for chip pressing test. The pressing head assembly is disposed on the body 3. An air cavity 31 is disposed inside the body 3. An air duct 32 communicating with the air cavity 31 is also disposed on one side of the body 3. A fan (not shown in the figure) is disposed at the end of the air duct 32 away from the air cavity 31. The fan introduces external air into the air cavity 31 through the air duct 32. A cylinder 4 for driving the pressing head 2 to press the chip 100 is also fixed inside the air cavity 31. The drive rod 41 of the cylinder 4 passes through the top of the air cavity 31 and is connected to the pressing head 2 for driving the pressing head 2 to press the chip 100.

[0049] The pressure head assembly includes a pressure head base plate 1 and multiple pressure heads 2, which are arranged in an array on the pressure head base plate 1. Each pressure head 2 corresponds to pressing a chip 100. During the pressing test, the chip 100 generates a significant amount of heat. Existing high-power chips 100 can consume up to approximately 10W of power, resulting in substantial heat generation and placing higher demands on heat dissipation and temperature control during pressing tests. Existing chip pressing test equipment cannot meet the heat dissipation requirements for high-power chip pressing tests.

[0050] To address the aforementioned technical issues, this embodiment also provides a pressure head assembly for chip pressing tests. Each pressure head 2 is equipped with heat dissipation fins 23, which are located on the periphery of the pressure head 2, increasing the heat exchange capacity between the pressure head 2 and the surrounding air, thereby improving the heat dissipation efficiency of the chip 100. A ventilation slot 11 is provided on the pressure head base plate 1 corresponding to the heat dissipation fins 23, allowing cold air flowing out through the ventilation slot 11 to be directed towards its respective heat dissipation fin 23. An airflow space 5 is provided between the ventilation slot 11 and the heat dissipation fins 23, preventing part of the flow area of ​​the ventilation slot 11 from being blocked by the heat dissipation fins 23. This ensures that the airflow into the ventilation slot 11 can flow smoothly out and be directed towards the heat dissipation fins 23 through the airflow space 5, thereby improving the heat exchange capacity of the heat dissipation fins 23 and further improving the heat dissipation efficiency of the chip 100, thus meeting the heat dissipation requirements of the high-power chip 100.

[0051] It should be noted that the pressure head 2 is a floating pressure head, which can rise and fall relative to the pressure head base plate 1. The specific connection method between the floating pressure head and the pressure head base plate 1 can be referred to the existing technology design, which is not the focus of this embodiment and will not be described in detail here. In the initial state, the gap between the floating pressure head and the pressure head base plate 1 is 3mm-6mm; when testing the chip 100, after the floating pressure head presses against the chip 100, the gap between the floating pressure head and the pressure head base plate 1 is 0.5mm-3mm, so that the heat sink fins 23 do not block the ventilation slots 11 to ensure that the airflow into the ventilation slots 11 can flow out smoothly and be blown to the heat sink fins 23 through the airflow space 5.

[0052] In one embodiment, the pressure head base plate 1 is provided with an array of mounting holes 13, and the pressure head 2 is installed in the mounting holes 13. A drive plate 6 is provided on the back side of the pressure head base plate 1. The drive plate 6 is provided with an array of through holes 61 for the drive rod 41 to pass through. The array of through holes includes a first row and a second row. The mounting holes 13 are provided corresponding to the even-numbered through holes 61 in the first row, and at least one second row is provided between adjacent first rows. The mounting holes 13 on the pressure head base plate 1 are holes through which the drive rod 41 of the cylinder 4 passes and abuts against the pressure head 2. The mounting holes 13 correspond to the center position of the pressure head 2. This configuration requires minimal modification to the pressure head base plate 1 while increasing the heat exchange capacity of the pressure head 2. Moreover, the through holes 61 through which the drive rod 41 does not pass can also serve as air outlets 311. Cold air in the air cavity 31 can flow out through the through holes 61 through which the drive rod 41 does not pass to the vicinity of the pressure head 2, further dissipating heat from the pressure head 2. Of course, the drive rod 41 can also be installed in the odd-numbered through holes 61 in the first row, then the even-numbered through holes 61 will be in an unused state.

[0053] In this embodiment, half of the through holes 61 in the first row are equipped with drive rods 41, that is, one-quarter of the through holes 61 in the through hole array of the drive plate 6 are mounting holes 13, so as to satisfy the spatial layout of the pressure head 2 with heat dissipation fins 23 in the row and column directions.

[0054] In addition, when performing crimping tests on lower power chips 100, the pressure head base plate 1 can be replaced with the original pressure head base plate 1, and a drive rod 41 can be added. This is also applicable to the crimping of lower power chips 100, so that the chip crimping test device can meet the crimping test requirements of both higher power chips 100 and lower power chips 100, making it more versatile and reducing production costs.

[0055] Specifically, such as Figures 6-10 As shown, the pressure head 2 includes a heat-conducting base 22 and a pressure head body 21. The pressure head body 21 is located above the heat-conducting base 22, and the heat dissipation fins 23 are located on the periphery of the heat-conducting base 22. Support columns 221 are provided at diagonal positions on the periphery of the heat-conducting base 22. A connecting hole 14 is also provided on the pressure head base plate 1. The support column 221 is screwed or interference-fitted with the connecting hole 14 to fix the pressure head 2 on the pressure head base plate 1.

[0056] Furthermore, the heat-conducting base 22 and the pressure head body 21 are set as an integral structure, eliminating or reducing the air layer between the heat-conducting base 22 and the pressure head 2, so as to reduce the thermal resistance of heat transfer and further improve the heat dissipation efficiency.

[0057] The end of the pressure head body 21 away from the heat-conducting base 22 is set as a pressure surface 211, which abuts against the chip 100 to perform a pressure test on the chip 100.

[0058] Furthermore, the height of the heat dissipation fins 23 is equal to the height of the heat-conducting base 22. The heat generated by the chip 100 is quickly transferred to the heat-conducting base 22 through the pressure head body 21. The heat dissipation fins 23 around the heat-conducting base 22 exchange heat quickly with the heat-conducting base 22, thereby improving the heat dissipation efficiency.

[0059] In one embodiment, multiple heat dissipation fins 23 located on the same side of the pressure head 2 are spaced apart in the horizontal direction. The spaced arrangement of the heat dissipation fins 23 forms a directional airflow channel, and the thermal resistance gradient field generated by the spaced distribution effectively suppresses the peak heat flux density phenomenon, thus achieving uniform heat dissipation.

[0060] In one embodiment, the multiple heat dissipation fins 23 on the same side of the pressure head 2 on the pressure head base plate 1 correspond to at least one ventilation slot 11. The ventilation slot 11 extends along the extension direction perpendicular to the heat dissipation fins 23, so that one ventilation slot 11 can blow air evenly on the multiple heat dissipation fins 23 located on the same side of the pressure head 2, further improving the heat dissipation uniformity.

[0061] In this embodiment, two ventilation slots 11 are provided at intervals on the same side of the pressure head 2. The cold air flowing out through the two ventilation slots 11 is evenly blown towards multiple heat dissipation fins 23 on the same side, and the flow direction of the cold air is perpendicular to the extension direction of the heat dissipation fins 23, so that the cold air flowing out through the two ventilation slots 11 can be blown to different positions of multiple heat dissipation fins 23, thereby improving heat dissipation efficiency.

[0062] In one embodiment, the total number of heat dissipation fins 23 provided on the periphery of each pressure head 2 is the same; this ensures that the heat dissipation capacity of each pressure head 2 is consistent, thereby ensuring the temperature uniformity of multiple pressure heads 2.

[0063] In one embodiment, such as Figure 7 As shown, N heat dissipation fins 23 are evenly distributed on all four sides of the pressure head 2, where N is a positive integer and the spacing between the N heat dissipation fins 23 is P. Heat dissipation fins 23 are also provided on all four sides of the thermally conductive base 22 to form an annular airflow channel. The total number of heat dissipation fins 23 around a single pressure head 2 is 4N, ensuring that the heat dissipation capacity on each side of the pressure head 2 is consistent, thereby ensuring the uniformity of the junction temperature of the chip 100.

[0064] Furthermore, an aluminum nitride ceramic coating is applied to the surface of the heat dissipation fins 23 to increase the thermal conductivity of the heat dissipation fins 23 and further improve the heat dissipation capacity of the heat dissipation fins 23.

[0065] Furthermore, the spacing P of the heat dissipation fins 23 is set to be greater than the thickness of the heat dissipation fins 23, thereby increasing the amount of cold air entering the space between the heat dissipation fins 23 through the ventilation slots 11, and exchanging heat with the heat dissipation fins 23 more quickly.

[0066] Due to structural limitations of the body 3, heat dissipation fins 23 cannot be installed on the side of the pressure head 2 located near the edge of the pressure head base plate 1. To ensure the heat dissipation capacity of the pressure head 2 where heat dissipation fins 23 cannot be installed on one side, as follows... Figure 8 As shown, in one embodiment, at least one column and / or at least one row of pressure heads 2 located on the edge of the pressure head base plate 1 have heat dissipation fins 23 on only three sides. The number of heat dissipation fins 23 on each side of the pressure head 2 with heat dissipation fins 23 on three sides are M, N, and M, respectively. The pressure head 2 with heat dissipation fins 23 on only three of its four sides is located on the edge of the pressure head base plate 1 to adapt to the structure of the body 3. This ensures that the heat dissipation capacity of the heat dissipation fins 23 on the periphery of the pressure head 2 located on the edge of the pressure head base plate 1 is consistent with the heat dissipation capacity of the other pressure heads 2, without affecting the installation of other components.

[0067] The pressure head base plate 1 has two opposite edges along its length and two opposite edges along its width. In this embodiment, a row of pressure heads 2 with heat dissipation fins 23 on only three sides is provided along one edge along the length of the pressure head base plate 1, and a row of pressure heads 2 with heat dissipation fins 23 on only three sides is provided along one edge along the width. It should be noted that, due to space limitations, the pressure heads 2 located at the connection position between adjacent edges of the pressure head base plate 1 only have heat dissipation fins 23 on both sides.

[0068] In one embodiment, M > N, and the pressure head 2 has a different type of fin 24 on one side of the N heat dissipation fins 23. The width of the different type of fin 24 is greater than the width of the heat dissipation fins 23, and at least two of the M heat dissipation fins 23 are connected to the different type of fin 24. The arrangement of the different type of fin 24 ensures the connection of the additional heat dissipation fins 23 on both sides of the M heat dissipation fins 23, while ensuring the heat dissipation capacity of the pressure head 2 with heat dissipation fins 23 on only three sides.

[0069] In one embodiment, M > N, where N is an even number ≥ 2, and M = 3N / 2; the spacing between adjacent heat dissipation fins 23 on the same side is P, and the M heat dissipation fins 23 include N / 2 heat dissipation fins 23 extending to the opposite sides of the N heat dissipation fins 23. This ensures that the total number of heat dissipation fins 23 on the periphery of the pressure head 2 located at the edge of the pressure head base plate 1 remains 4N, and the heat dissipation capacity is consistent with the heat dissipation capacity of other pressure heads 2.

[0070] Cold air is delivered from the air duct 32 to the air chamber 31 of the body 3, and then flows to the pressure head assembly through the air outlet 311 at the top of the air chamber 31. Due to the structural limitations of the fan and air duct 32, the airflow input into the air chamber 31 has a higher velocity in the middle region 101 than in the two side regions. Therefore, the airflow blowing towards the pressure head assembly also shows the same trend.

[0071] In one embodiment, to ensure the uniformity of airflow to each ventilation slot 11 of the pressure head base plate 1, such as... Figure 9As shown, along the length of the pressure head base plate 1, the ventilation area of ​​a single ventilation slot 11 in the two side areas is larger than that in the middle area 101. Since the flow velocity of cold air towards the middle area 101 of the pressure head base plate 1 is greater than that towards the two side areas, the ventilation area of ​​a single ventilation slot 11 in the two side areas of the pressure head base plate 1 is set to be larger than that of a single ventilation slot 11 in the middle area 101 of the pressure head base plate 1, thereby ensuring that the amount of cold air flowing to each pressure head 2 through the ventilation slot 11 is basically the same.

[0072] Specifically, such as Figure 9 As shown, the two sides are the area formed by two rows of mounting holes 13 on the left side of the pressure head base plate 1 (i.e., the left side area 102) and the area formed by two rows of mounting holes 13 on the right side of the pressure head base plate 1 (i.e., the right side area 103). As the equipment size widens or narrows, the number of rows in the two sides can be increased or decreased accordingly. The width of the ventilation slots 11 in the left side area 102 and the right side area 103 of the pressure head base plate 1 is greater than the width of the ventilation slots 11 in the middle area 101; and / or, the length of the ventilation slots 11 in the left side area 102 and the right side area 103 of the pressure head base plate 1 is greater than the length of the ventilation slots 11 in the middle area 101, so that the ventilation area of ​​a single ventilation slot 11 in the left side area 102 and the right side area 103 of the pressure head base plate 1 is greater than the ventilation area of ​​a single ventilation slot 11 in the middle area 101.

[0073] Continue to refer to Figure 2 and Figure 3 In one embodiment, the pressure head base plate 1 is provided with an airflow buffer chamber 12 communicating with the ventilation slots 11 on the side opposite to the pressure head 2. The cold air in the airflow buffer chamber 12 flows evenly to the multiple ventilation slots 11, and the cold air flowing out of the ventilation slots 11 blows towards the heat dissipation fins 23 corresponding to each of them. The cold air in the air cavity 31 inside the body 3 first enters the airflow buffer chamber 12, and then flows evenly from the airflow buffer chamber 12 to the multiple ventilation slots 11. The cold air flowing out of the ventilation slots 11 blows towards the heat dissipation fins 23 corresponding to each of them, so that the heat dissipation capacity of the heat dissipation fins 23 of all pressure heads 2 is basically the same, thereby satisfying the uniformity of junction temperature of the high-power chip 100 under high temperature and low temperature production conditions, so that the temperature difference between the highest and lowest temperatures is ≤5℃.

[0074] An air outlet 311 is provided at the top of the air cavity 31. The air outlet 311 is connected to the airflow buffer cavity 12, and the air outlet 311 is staggered from the ventilation slot 11. This prevents the cold air flowing out of the air outlet 311 from directly entering the corresponding ventilation slot 11, which would cause uneven airflow in each ventilation slot 11. This improves the uniformity of junction temperature during the chip 100 press-fit test and further enhances the uniformity of junction temperature of the high-power chip 100 under high-temperature and low-temperature production conditions.

[0075] In one embodiment, temperature monitoring points are provided at the four corners and the center of the pressure head assembly, and the temperature sensors 7 of the temperature monitoring points are located inside the pressure head 2 at the corresponding positions. For the temperature of the high-power chip 100, detecting the ambient temperature cannot obtain the actual temperature of the high-power chip 100; it is necessary to monitor the chip 100's casing temperature in real time. This effectively avoids damage to the chip 100 due to abnormal temperature rise and allows for more precise control of the chip 100's casing temperature. To achieve temperature uniformity when the pressure head assembly presses against the chip 100, temperature monitoring points are set at different positions on the pressure head assembly, and the temperature of the chip 100 is determined by the detection values ​​of the temperature sensors 7 at each position.

[0076] In one embodiment, such as Figure 10 As shown, a blind mounting hole 222 is provided inside the pressure head 2. The blind mounting hole 222 extends obliquely from the bottom of the pressure head 2 towards the end near the pressing surface 211 of the pressure head 2. The temperature sensor 7 is located inside the blind mounting hole 222. The blind mounting hole 222 is located inside the pressure head 2 and extends obliquely from the bottom of the heat-conducting base 22 to a position near the pressing surface 211 of the pressure head body 21. This allows the detection head of the temperature sensor 7 to be in close contact with the pressing surface 211, and the pressing surface 211 to be in close contact with the chip 100. Therefore, the real-time temperature of the chip 100 can be obtained through thermal resistance heat transfer, improving the accuracy of the temperature detection of the chip 100.

[0077] The chip pressing head assembly provided in this embodiment improves the heat dissipation capacity of a single pressing head 2 by modifying its own structure without changing the internal air cavity 31 of the body 3. This also ensures the uniformity of heat dissipation for each pressing head 2 on the pressing head base plate 1, thereby guaranteeing that the junction temperature of the chip 100 is ≤5℃ when the pressing head assembly presses the chip 100. Furthermore, by setting temperature monitoring points at different locations on the pressing head assembly and placing the temperature sensors 7 of these monitoring points inside the corresponding pressing heads 2, the real-time temperature of the chip 100 at the corresponding locations can be detected more accurately, further ensuring the uniformity of the junction temperature during the chip 100 pressing test.

[0078] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A pressure head assembly for chip bonding testing, comprising a pressure head base plate (1) and a plurality of pressure heads (2), wherein the plurality of pressure heads (2) are arranged in an array on the pressure head base plate (1), characterized in that, Each pressure head (2) is provided with heat dissipation fins (23), which are located on the periphery of the pressure head (2). A ventilation groove (11) is provided on the pressure head base plate (1) corresponding to the heat dissipation fins (23). The cold air flowing out through the ventilation groove (11) blows towards the heat dissipation fins (23) corresponding to them. An airflow space (5) is provided between the ventilation groove (11) and the heat dissipation fins (23).

2. The pressure head assembly for chip crimping testing according to claim 1, characterized in that, Multiple heat dissipation fins (23) located on the same side of the pressure head (2) are spaced apart in the horizontal direction.

3. The pressure head assembly for chip pressing test according to claim 2, characterized in that, The plurality of heat dissipation fins (23) on the same side of the pressure head (2) correspond to at least one ventilation slot (11), the ventilation slot (11) extending in a direction perpendicular to the extension of the heat dissipation fins (23).

4. The pressure head assembly for chip pressing test according to claim 2, characterized in that, The total number of heat dissipation fins (23) arranged around each pressure head (2) is the same.

5. The pressure head assembly for chip crimping testing according to claim 1, characterized in that, The pressure head (2) has N heat dissipation fins (23) evenly distributed on its four sides, and the spacing between the N heat dissipation fins (23) is P.

6. The pressure head assembly for chip crimping testing according to claim 1, characterized in that, The pressure head (2) located at least one column and / or at least one row on the edge of the pressure head base plate (1) has heat dissipation fins (23) on only three sides, and the number of heat dissipation fins (23) on each side of the pressure head (2) with heat dissipation fins (23) on three sides is M, N and M respectively.

7. The pressure head assembly for chip crimping testing according to claim 6, characterized in that, M > N, the pressure head (2) has N heat dissipation fins (23) on one side, and also has a different type of fin (24), the width of the different type of fin (24) is greater than the width of the heat dissipation fins (23), and at least two of the M heat dissipation fins (23) are connected to the different type of fin (24); and / or, M > N, N is an even number ≥ 2, M = 3N / 2; the spacing between adjacent heat dissipation fins (23) on the same side is P, and M heat dissipation fins (23) include N / 2 heat dissipation fins (23) extending to the opposite sides of N heat dissipation fins (23).

8. The pressure head assembly for chip crimping testing according to claim 1, characterized in that, Along the length of the pressure head base plate (1), the ventilation area of ​​a single ventilation slot (11) provided on both sides is greater than the ventilation area of ​​a single ventilation slot (11) provided in the middle area (101).

9. The pressure head assembly for chip crimping testing according to any one of claims 1-8, characterized in that, The pressure head base plate (1) is provided with an array of mounting holes (13), and the pressure head (2) is installed in the mounting holes (13); The back of the pressure head base plate (1) is provided with a drive plate (6), and the drive plate (6) is arrayed with through holes (61) for the drive rod (41) to pass through. The through hole array includes a first row and a second row. The mounting hole (13) is provided corresponding to the even number of through holes (61) in the first row. There is at least one second row between adjacent first rows.

10. The pressure head assembly for chip crimping testing according to any one of claims 1-8, characterized in that, The pressure head base plate (1) is provided with an airflow buffer chamber (12) on the side opposite to the pressure head (2) and connected to the ventilation slot (11). The cold air in the airflow buffer chamber (12) flows evenly to the multiple ventilation slots (11).

11. The pressure head assembly for chip crimping testing according to any one of claims 1-8, characterized in that, Temperature monitoring points are provided at the four corners and the center of the pressure head assembly, and the temperature sensors (7) of the temperature monitoring points are located inside the pressure head (2) at the corresponding positions.

12. A chip bonding test apparatus, characterized in that, The device includes a body (3) and a pressure head assembly for chip pressing test as described in any one of claims 1-11. The pressure head assembly is disposed on the body (3). A wind cavity (31) is provided inside the body (3). An air outlet (311) is provided at the top of the wind cavity (31). The air outlet (311) communicates with the ventilation slot (11).

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