PCB laser processing equipment with three-wavelength output
The PCB laser processing equipment with three wavelength outputs solves the problems of cumbersome purchase and debugging of traditional equipment, realizes efficient production of diversified PCB processing, reduces costs and improves enterprise efficiency.
Patent Information
- Application Number
- CN202423324063.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Traditional PCB laser processing equipment mostly adopts a single-wavelength design, resulting in high equipment purchase costs, complicated switching and debugging, and difficulty in meeting diverse PCB processing needs, thus affecting production efficiency and flexibility.
The PCB laser processing equipment adopts a three-wavelength output, integrating three laser beams of 1030nm, 515nm and 343nm. Through the optical path system and laser processing mechanism, it can flexibly process different PCB materials and processes.
It improves the flexibility and production efficiency of PCB processing, reduces equipment replacement and maintenance costs, and enhances enterprise competitiveness.
Smart Images
Figure CN223762432U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCB board processing technology, and more specifically, to a PCB laser processing device with three wavelength outputs. Background Technology
[0002] In PCB manufacturing, different material layers and structures need to be processed, such as copper foil layers, insulating layers, and resin layers. The different compositions and structural characteristics of PCB materials determine their varying absorption and response characteristics to laser wavelengths. Traditional PCB laser processing equipment mostly uses single-wavelength lasers, meaning it can only process specific materials.
[0003] When PCB design and materials change, such as in modern multi-variety, small-batch PCB production models, it is often necessary to purchase new laser equipment with corresponding wavelengths to adapt to the processing requirements of different PCB products. This not only leads to a significant increase in equipment purchase costs, but also makes equipment switching, debugging, and maintenance cumbersome, seriously affecting the production efficiency and flexibility of PCB processing, and making it difficult to meet the ever-increasing diversified processing requirements of PCBs.
[0004] No effective solutions have yet been proposed to address the problems in the relevant technologies. Utility Model Content
[0005] In view of the problems in the related technologies, this utility model proposes a PCB laser processing equipment with three wavelength outputs to overcome the above-mentioned technical problems existing in the existing related technologies.
[0006] Therefore, the specific technical solution adopted by this utility model is as follows:
[0007] A PCB laser processing device with three-wavelength output includes a base and a support base. The support base is located on the top side of the base. An optical path system is provided on the top of the support base. The optical path system includes an optical transmission device. The optical transmission device has a mounting groove. An optical input port is provided on one side of the mounting groove. Three sets of optical output ports are provided on one side of the optical transmission device. A laser processing mechanism connected to the optical transmission device is provided on one side of the optical output ports. A three-wavelength output laser connected to the optical input port is provided in the mounting groove.
[0008] Preferably, the laser processing mechanism includes a first laser processing head, a second laser processing head, and a third laser processing head. Each of the first, second, and third laser processing heads is provided with a bracket, which is connected to the light transmission device via a connecting arm. A light source assembly is provided on one side of the second laser processing head.
[0009] Preferably, the first laser processing head, the second laser processing head, and the third laser processing head each include a galvanometer, a transition ring, and a field lens.
[0010] Preferably, the transition ring is provided at the bottom of the galvanometer, and the field lens is provided at the bottom of the transition ring.
[0011] Preferably, a vacuum adsorption honeycomb processing stage is provided on the top of the base and below the laser processing mechanism.
[0012] Preferably, the three-wavelength output laser can output laser beams of three different wavelengths: 1030nm, 515nm, and 343nm.
[0013] The beneficial effects of this invention are as follows: It can meet the needs of various materials and processing techniques in PCB production, such as copper foil, insulating layers, and resin layers, without frequent equipment changes, greatly improving the flexibility of PCB processing. It reduces the high costs associated with purchasing multiple single-wavelength laser devices, while also lowering equipment maintenance and management costs, thus improving the company's economic efficiency. It avoids the time spent on equipment switching and debugging, enabling rapid conversion between different PCB processing tasks, effectively improving the overall production efficiency of PCB processing, and helping companies gain an advantage in fierce market competition. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 This is a schematic diagram of the structure of a PCB laser processing device with three wavelength output according to an embodiment of the present utility model;
[0016] Figure 2 This is a schematic diagram of the optical path system in a PCB laser processing equipment with three wavelength outputs according to an embodiment of the present invention;
[0017] Figure 3 This is a schematic diagram of the laser processing mechanism in a PCB laser processing equipment with three wavelength output according to an embodiment of the present utility model;
[0018] Figure 4 This is a schematic diagram of the structure of a three-wavelength output laser in a PCB laser processing equipment with three-wavelength output according to an embodiment of the present invention;
[0019] Figure 5 This is a schematic diagram of the structure of a laser processing head in a PCB laser processing device with three wavelength outputs according to an embodiment of the present invention.
[0020] In the picture:
[0021] 1. Base; 2. Support; 3. Optical path system; 4. Optical transmission device; 5. Mounting slot; 6. Optical input port; 7. Optical output port; 8. Laser processing mechanism; 9. Three-wavelength output laser; 10. Laser processing head one; 11. Laser processing head two; 12. Laser processing head three; 13. Bracket; 14. Connecting arm; 15. Galvanometer; 16. Transition ring; 17. Field lens; 18. Vacuum adsorption honeycomb processing stage; 19. Light source assembly. Detailed Implementation
[0022] To further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention. These drawings are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should be able to understand other possible implementation methods and the advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are usually used to represent similar components.
[0023] According to an embodiment of the present invention, a PCB laser processing device with three wavelength outputs is provided.
[0024] Example 1;
[0025] like Figure 1-5 As shown, the PCB laser processing equipment with three-wavelength output according to an embodiment of the present invention includes a base 1 and a support base 2. The support base 2 is located on the top side of the base 1. An optical path system 3 is provided on the top of the support base 2. The optical path system 3 includes an optical transmission device 4. An installation groove 5 is provided on the optical transmission device 4. An optical input port 6 is provided on one side of the installation groove 5. Three sets of optical output ports 7 are provided on one side of the optical transmission device 4. A laser processing mechanism 8 connected to the optical transmission device 4 is provided on one side of the optical output ports 7. A three-wavelength output laser 9 connected to the optical input port 6 is provided in the installation groove 5.
[0026] Example 2;
[0027] like Figure 1-5As shown, the laser processing mechanism 8 includes a first laser processing head 10, a second laser processing head 11, and a third laser processing head 12. Each of the first laser processing head 10, the second laser processing head 11, and the third laser processing head 12 is provided with a bracket 13. The bracket 13 is connected to the light transmission device 4 through a connecting arm 14. A light source assembly 19 is provided on one side of the second laser processing head 11. Each of the first laser processing head 10, the second laser processing head 11, and the third laser processing head 12 includes a galvanometer 15, a transition ring 16, and a field lens 17. The transition ring 16 is located at the bottom of the galvanometer 15, and the field lens 17 is located at the bottom of the transition ring 16.
[0028] Example 3;
[0029] like Figure 1-5 As shown, a vacuum adsorption honeycomb processing stage 18 is provided on the top of the base 1 and below the laser processing mechanism 8. The three-wavelength output laser 9 can output laser beams of three different wavelengths: 1030nm, 515nm and 343nm.
[0030] To facilitate understanding of the above-mentioned technical solutions of this utility model, the working principle or operation method of this utility model in actual process will be described in detail below.
[0031] In practical applications, during PCB manufacturing, the control system selects the appropriate laser wavelength output based on the PCB material and processing requirements, and automatically adjusts relevant parameters in the optical path system, such as the laser beam's focusing position, spot size, and energy density, thereby achieving precise processing of different types of PCBs. A 1030nm wavelength laser can be used for cutting copper foil layers; its high energy can quickly vaporize the copper foil, enabling rapid circuit cutting. A 515nm wavelength laser is suitable for heat-sensitive materials such as fiberglass boards, composite substrates, and resin boards. Due to its cold-working characteristics, the 515nm wavelength laser generates less heat during cutting, making it suitable for high-precision processing. Furthermore, the 515nm laser has good processing effects on certain insulating materials and can be used for drilling or grooving operations on insulating layers. A 343nm wavelength laser, due to its high single-photon energy and low heat-affected zone, has extremely high processing accuracy and quality, and is suitable for surface etching, drilling, and windowing of complex circuit boards and flexible printed circuit boards (FPCs).
[0032] In summary, the technical solution of this utility model can meet the needs of various materials and processing techniques in PCB production, such as copper foil, insulating layers, and resin layers, without frequent equipment changes, greatly improving the flexibility of PCB processing. It reduces the high costs associated with purchasing multiple single-wavelength laser devices, while also lowering equipment maintenance and management costs, thus improving the company's economic efficiency. It avoids the time spent on equipment switching and debugging, enabling rapid conversion between different PCB processing tasks, effectively improving the overall production efficiency of PCB processing, and helping companies gain an advantage in fierce market competition.
[0033] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A PCB laser processing apparatus having a three-wavelength output, characterized by, The utility model relates to a three-wavelength laser processing device, including base (1) and support seat (2), support seat (2) is located on the top side of base (1), the top of support seat (2) is equipped with light path system (3), light path system (3) includes light transmission device (4), is equipped with the installation slot (5) on light transmission device (4), one side in installation slot (5) is equipped with light input (6), one side of light transmission device (4) is equipped with three groups of light output (7), one side of light output (7) is equipped with the laser processing mechanism (8) connected with light transmission device (4), installation slot (5) is equipped with three wavelength output laser (9) connected with light input (6).
2. The PCB laser processing apparatus having three-wavelength outputs according to claim 1, wherein, The laser processing mechanism (8) includes laser processing head one (10), laser processing head two (11) and laser processing head three (12), the laser processing head one (10), the laser processing head two (11) and the laser processing head three (12) are equipped with support (13), the support (13) is connected with the light transmission device (4) through connecting arm (14), one side of laser processing head two (11) is equipped with light source assembly (19).
3. The PCB laser processing apparatus having three-wavelength outputs according to claim 2, wherein, The laser processing head one (10), laser processing head two (11) and laser processing head three (12) respectively include galvanometer (15), transition ring (16) and field lens (17).
4. The PCB laser processing apparatus having three-wavelength outputs according to claim 3, wherein, The bottom of the galvanometer (15) is provided with the transition ring (16), and the bottom of the transition ring (16) is provided with the field lens (17).
5. The PCB laser processing apparatus having three-wavelength outputs according to claim 1, wherein, The top of the base (1) and below the laser processing mechanism (8) are provided with a vacuum suction honeycomb processing table (18).
6. The PCB laser processing apparatus having three-wavelength outputs according to claim 1, wherein, The three-wavelength output laser (9) can output laser beams of three different wavelengths of 1030nm, 515nm and 343nm.