Temperature control condenser for semiconductor processing

Abstract

The utility model discloses a temperature control condenser for semiconductor processing, which comprises a cooling box, and is characterized in that a condenser main body is fixedly connected in the cooling box, cooling liquid is arranged in the cooling box, opposite sides in the cooling box are jointly and rotationally connected with a liquid outlet pipe, and the liquid outlet pipe is connected with a liquid outlet pipe. A plurality of water spray nozzles are fixedly connected to the bottom of the liquid outlet pipe, and a first fixing plate is fixedly connected to the upper surface of the cooling box. By arranging the servo motor, the first rotating disc, the stirring column, the second rotating disc, the stirring rod and the like, the servo motor drives the first rotating disc to rotate through the rotating rod, the first rotating disc drives the stirring rod to move through the stirring column, the stirring rod drives the second rotating disc to rotate in a reciprocating mode, and the second rotating disc drives the liquid outlet pipe to rotate; and the multiple water spray nozzles on the liquid outlet pipe rotate to spray and dissipate heat on the condenser main body, the heat dissipation speed is increased, and the heat dissipation effect of the condenser main body is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of temperature control condenser especially relates to a temperature control condenser for semiconductor processing. BACKGROUND

[0002] A condenser is a device used to cool gaseous or vapor state matter into liquid state, which has a wide range of applications in refrigeration systems, air conditioning systems, industrial production and power generation, etc. The main function of the condenser is to transfer the heat in the gas or steam to the cooling medium (such as water or air) through the pipeline, so as to cool the gas or steam and change it into liquid.

[0003] However, during the processing of semiconductors, most condensers use air cooling for heat dissipation, which is relatively slow, resulting in low heat dissipation effect of the condenser. Therefore, a temperature control condenser for semiconductor processing is proposed. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the shortcomings in the prior art and provides a temperature control condenser for semiconductor processing.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a temperature control condenser for semiconductor processing, comprising a cooling box, characterized in that: the inside of the cooling box is fixedly connected with a condenser main body, the inside of the cooling box is provided with cooling liquid, the opposite side of the inside of the cooling box is jointly connected with a liquid outlet pipe, the bottom of the liquid outlet pipe is fixedly connected with a plurality of water spray nozzles, the upper surface of the cooling box is fixedly connected with a first fixed plate, the first fixed plate is provided with a rotating structure, one side of the cooling box is fixedly connected with a second fixed plate, and the second fixed plate is provided with a heat dissipation structure.

[0006] The rotating structure comprises a rotating rod rotatably connected to one side of the first fixed plate, one end of the rotating rod is fixedly connected with a first rotary disc, and one side of the first rotary disc is fixedly connected with a push column.

[0007] As a further description of the above technical scheme:

[0008] One side of the first fixed plate is fixedly connected with a servo motor, and the output shaft of the servo motor is fixedly connected with one end of the rotating rod.

[0009] As a further description of the above technical scheme:

[0010] One end of the liquid outlet pipe is fixedly connected with a second rotary disc, the upper surface of the second rotary disc is fixedly connected with a push rod, one side of the push rod is provided with a moving groove, and the moving groove is movably connected with the push column.

[0011] As a further description of the above technical scheme:

[0012] The heat dissipation structure comprises a first sprocket fixedly connected to the rotating rod, and two second sprockets are rotatably connected to one side of the second fixed plate, wherein one of the second sprockets is coaxially arranged with the first sprocket and is sleeved with a first chain.

[0013] As a further description of the above technical solution:

[0014] A rotating column is rotatably connected to one side of the second fixed plate, and a plurality of heat dissipation fan blades are fixedly connected to one end of the rotating column.

[0015] As a further description of the above technical solution:

[0016] A third sprocket is fixedly connected to the other end of the rotating column, and the third sprocket is coaxially arranged with the corresponding second sprocket and is sleeved with a second chain.

[0017] As a further description of the above technical solution:

[0018] An infusion pump is fixedly connected to the inner bottom of the cooling box, a connecting pipe is fixedly connected to the liquid outlet of the infusion pump, one end of the connecting pipe penetrates through one side of the cooling box and is fixedly connected with a cooling screw pipe, one end of the cooling screw pipe is fixedly connected with an infusion pipe, one end of the infusion pipe penetrates through the upper surface of the cooling box and is fixedly connected with a hose, and one end of the hose is fixedly connected with the upper surface of the liquid outlet pipe.

[0019] The utility model has the advantages of the following beneficial effects:

[0020] 1. Compared with the prior art, the temperature control condenser for semiconductor processing is provided with a servo motor, a first rotating disc, a driving column, a second rotating disc and a driving rod, the servo motor drives the first rotating disc to rotate through the rotating rod, the first rotating disc drives the driving rod to move through the driving column, the driving rod drives the second rotating disc to reciprocatingly rotate, and the second rotating disc drives the liquid outlet pipe to rotate, so that the plurality of water nozzles on the liquid outlet pipe rotate to spray and dissipate heat, the heat dissipation speed is accelerated, and the heat dissipation effect of the condenser main body is improved.

[0021] 2. Compared with the prior art, the temperature control condenser for semiconductor processing is provided with a first sprocket, a second sprocket, a third sprocket, a first chain, a second chain, a rotating column and heat dissipation fan blades, the rotating rod drives the first sprocket to rotate, the first sprocket drives one of the second sprockets to rotate through the first chain, one of the second sprockets drives the second chain to rotate through the other second sprocket, the second chain drives the third sprocket to rotate, and the third sprocket drives the plurality of heat dissipation fan blades to rotate through the rotating column, so that the plurality of heat dissipation fan blades blow on the cooling screw pipe, the cooling of the cooling liquid in the cooling screw pipe is accelerated, the temperature of the cooling liquid is prevented from being too high, and the cooling effect of the condenser main body is affected. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 A first perspective three-dimensional structure schematic view of the temperature-controlled condenser for semiconductor processing is provided in the utility model;

[0023] Figure 2 A second perspective three-dimensional structure schematic view of the temperature-controlled condenser for semiconductor processing is provided in the utility model;

[0024] Figure 3 A sectional view of the temperature-controlled condenser for semiconductor processing is provided in the utility model;

[0025] Figure 4 A rotating structure and heat dissipation structure schematic view of the temperature-controlled condenser for semiconductor processing is provided in the utility model;

[0026] Figure 5 A rotating structure and heat dissipation structure exploded view of the temperature-controlled condenser for semiconductor processing is provided in the utility model.

[0027] Legend:

[0028] 1, cooling box; 2, condenser main body; 3, first fixed plate; 4, rotating structure; 401, servo motor; 402, first rotary disc; 403, dial column; 404, second rotary disc; 405, dial rod; 5, second fixed plate; 6, heat dissipation structure; 601, first sprocket; 602, second sprocket; 603, third sprocket; 604, first chain; 605, second chain; 606, rotating column; 607, heat dissipation fan blade; 7, infusion pump; 8, cooling screw pipe; 9, infusion pipe; 10, hose; 11, liquid outlet pipe; 12, water spray nozzle. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0030] Reference Figures 1 to 5The utility model provides a kind of temperature control condenser for semiconductor processing:Including cooling box 1, it is characterized by: the inside fixed connection of cooling box 1 has condenser main body 2, the inside of cooling box 1 is equipped with cooling liquid, the inside of cooling box 1 is relatively side common rotation connection has liquid outlet pipe 11, the bottom fixed connection of liquid outlet pipe 11 has multiple water jet nozzles 12, the inside bottom of cooling box 1 is fixedly connected with infusion pump 7, the liquid outlet end fixed connection of infusion pump 7 has connecting pipe, one end of connecting pipe is through the side of cooling box 1 and is fixedly connected with cooling screw pipe 8, one end of cooling screw pipe 8 is fixedly connected with infusion pipe 9, one end of infusion pipe 9 is through the upper surface of cooling box 1 and is fixedly connected with hose 10, one end of hose 10 is fixedly connected with the upper surface of liquid outlet pipe 11, the upper surface of cooling box 1 is fixedly connected with first fixed plate 3, and rotating structure 4 is equipped on first fixed plate 3, one side of cooling box 1 is fixedly connected with second fixed plate 5, and heat dissipation structure 6 is equipped on second fixed plate 5;

[0031] In order to realize the purpose of rotation, rotating structure 4 includes rotating rod connected on the side of first fixed plate 3, one side of first fixed plate 3 is fixedly connected with servo motor 401, the output shaft of servo motor 401 is fixedly connected with one end of rotating rod, one end of rotating rod is fixedly connected with first rotary disc 402, one side of first rotary disc 402 is fixedly connected with push column 403, one end of liquid outlet pipe 11 is fixedly connected with second rotary disc 404, the upper surface of second rotary disc 404 is fixedly connected with push rod 405, one side of push rod 405 is provided with moving slot, moving slot is movably connected with push column 403, servo motor 401 drives first rotary disc 402 to rotate through rotating rod, first rotary disc 402 drives push rod 405 to move through push column 403, push rod 405 drives second rotary disc 404 to reciprocate, second rotary disc 404 drives liquid outlet pipe 11 to rotate, so that multiple water jet nozzles 12 on liquid outlet pipe 11 rotate and spray heat dissipation to condenser main body 2, accelerate the speed of heat dissipation, improve the heat dissipation effect of condenser main body 2;

[0032] In order to achieve the purpose of heat dissipation, the heat dissipation structure 6 includes a first sprocket 601 fixedly connected to the rotating rod, one side of the second fixed plate 5 is rotatably connected with two second sprockets 602, one of the second sprockets 602 is sleeved with a first chain 604, the other end of the rotating column 606 is fixedly connected with a third sprocket 603, the third sprocket 603 is sleeved with a second chain 605, one end of the rotating column 606 is fixedly connected with a plurality of heat dissipation fan blades 607, the rotating rod drives the first sprocket 601 to rotate, the first sprocket 601 drives one of the second sprockets 602 to rotate through the first chain 604, one of the second sprockets 602 drives the second chain 605 to rotate through the other second sprocket 602, the second chain 605 drives the third sprocket 603 to rotate, the third sprocket 603 drives the plurality of heat dissipation fan blades 607 to rotate through the rotating column 606, the plurality of heat dissipation fan blades 607 blow on the cooling spiral pipe 8, accelerate the cooling of the cooling liquid in the cooling spiral pipe 8, avoid the temperature of the cooling liquid being too high, affect the cooling effect of the condenser main body 2.

[0033] Working principle: the infusion pump 7 sends the cooling liquid in the cooling box 1 from the connecting pipe into the cooling spiral pipe 8, from the cooling spiral pipe 8 into the infusion pipe 9, and then into the liquid outlet pipe 11 through the hose 10, and is sprayed from the plurality of water nozzles 12, at the same time, the servo motor 401 drives the first rotating disc 402 to rotate through the rotating rod, the first rotating disc 402 drives the second rotating disc 404 to reciprocate through the rotating column 403, the second rotating disc 404 drives the liquid outlet pipe 11 to rotate, so that the plurality of water nozzles 12 on the liquid outlet pipe 11 rotate and spray heat dissipation on the condenser main body 2, accelerate the heat dissipation speed, improve the heat dissipation effect of the condenser main body 2, at the same time, the rotating rod drives the first sprocket 601 to rotate, the first sprocket 601 drives one of the second sprockets 602 to rotate through the first chain 604, one of the second sprockets 602 drives the second chain 605 to rotate through the other second sprocket 602, the second chain 605 drives the third sprocket 603 to rotate, the third sprocket 603 drives the plurality of heat dissipation fan blades 607 to rotate through the rotating column 606, the plurality of heat dissipation fan blades 607 blow on the cooling spiral pipe 8, accelerate the cooling of the cooling liquid in the cooling spiral pipe 8, avoid the temperature of the cooling liquid being too high, affect the cooling effect of the condenser main body 2.

[0034] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. A temperature-controlled condenser for semiconductor processing, comprising a cooling box (1), characterized in that: The inside of the cooling box (1) is fixedly connected with a condenser main body (2), the inside of the cooling box (1) is provided with cooling liquid, the opposite sides of the inside of the cooling box (1) are jointly rotatably connected with liquid outlet pipes (11), the bottoms of the liquid outlet pipes (11) are fixedly connected with a plurality of water spray nozzles (12), the upper surface of the cooling box (1) is fixedly connected with a first fixed plate (3), the first fixed plate (3) is provided with a rotating structure (4), one side of the cooling box (1) is fixedly connected with a second fixed plate (5), and the second fixed plate (5) is provided with a heat dissipation structure (6). The rotating structure (4) comprises a rotating rod rotatably connected to one side of the first fixed plate (3), one end of the rotating rod is fixedly connected with a first rotating disc (402), and one side of the first rotating disc (402) is fixedly connected with a pushing column (403).

2. The temperature-controlled condenser for semiconductor processing of claim 1, wherein: One side of the first fixed plate (3) is fixedly connected with a servo motor (401), and the output shaft of the servo motor (401) is fixedly connected with one end of the rotating rod.

3. The temperature-controlled condenser for semiconductor processing of claim 1, wherein: One end of the liquid outlet pipe (11) is fixedly connected with a second rotating disc (404), the upper surface of the second rotating disc (404) is fixedly connected with a pushing rod (405), and one side of the pushing rod (405) is provided with a moving groove.

4. The temperature-controlled condenser for semiconductor processing of claim 1, wherein: The heat dissipation structure (6) comprises a first sprocket (601) fixedly connected to the rotating rod, two second sprockets (602) are rotatably connected to one side of the second fixed plate (5), and one of the second sprockets (602) and the first sprocket (601) are jointly movably sleeved with a first chain (604).

5. The temperature-controlled condenser for semiconductor processing of claim 4, wherein: A rotating column (606) is rotatably connected through one side of the second fixed plate (5), and one end of the rotating column (606) is fixedly connected with a plurality of heat dissipation fan blades (607).

6. The temperature-controlled condenser for semiconductor processing of claim 5, wherein: The other end of the rotating column (606) is fixedly connected with a third sprocket (603), and the third sprocket (603) and the corresponding second sprocket (602) are jointly movably sleeved with a second chain (605).

7. The temperature-controlled condenser for semiconductor processing of claim 1, wherein: The inside bottom of the cooling box (1) is fixedly connected with a liquid delivery pump (7), the liquid outlet end of the liquid delivery pump (7) is fixedly connected with a connecting pipe, one end of the connecting pipe penetrates through one side of the cooling box (1) and is fixedly connected with a cooling screw pipe (8), one end of the cooling screw pipe (8) is fixedly connected with a liquid delivery pipe (9), one end of the liquid delivery pipe (9) penetrates through the upper surface of the cooling box (1) and is fixedly connected with a hose (10), and one end of the hose (10) is fixedly connected with the upper surface of the liquid outlet pipe (11).

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