Drying device convenient for semiconductor chip processing

Abstract

The utility model belongs to the technical field of semiconductor chip processing, and particularly relates to a drying device convenient for semiconductor chip processing, which comprises a base, a shell fixedly arranged on the base, a drying cabin formed in the shell, an air source fixedly arranged above the shell, and a heating cabin arranged below the air source and connected in the shell, a first gear is fixedly arranged below the heating cabin, a turntable is rotatably arranged on the base below the first gear, a plurality of second gears which are engaged with the first gear to rotate are rotatably arranged on the upper end face of the turntable around the first gear in the circumferential direction, and a plurality of layers of detachable placing discs are arranged on the upper end face of each second gear; and a fixing assembly is arranged on each placing disc. Through the design of the first gear, the second gear and the like, semiconductors can revolve and rotate in the drying process, and chips can be dried at multiple angles; through the design of the fixing assembly and the like, chips with different thicknesses and heights can be stably fixed in the drying process.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor chip processing technology, and in particular relates to a drying device that facilitates semiconductor chip processing. Background Technology

[0002] With the advancement of science and technology, the semiconductor chip industry has not only achieved a qualitative leap in technology, but also experienced a significant increase in production scale and technology popularization. This has led to the progress and development of semiconductor processing technology and equipment. Semiconductor processing requires operations such as painting and cleaning on its surface. Subsequently, production personnel also need to dry it to ensure the yield and lifespan of semiconductor chips. As a result, drying equipment for semiconductor chip processing has emerged.

[0003] As disclosed in patent application CN202222080743.7, a drying device for facilitating semiconductor chip processing includes: a movable base; a housing, the housing being fixedly installed on the top of the movable base via connecting columns; a plurality of heating components being fixedly installed inside the housing; placement slots being provided on both sides of the housing and on top of the plurality of heating components; placement plates being provided inside the placement slots; and a plurality of communicating holes being provided inside the placement plates; with sliding rods fixedly installed on both sides inside the plurality of communicating holes. This utility model provides a drying device for facilitating semiconductor chip processing, which can conveniently fix the semiconductor chip in position for drying, thereby avoiding displacement or even continuous jumping of the semiconductor chip due to the influence of the drying airflow during drying, thus increasing the probability of damage to the semiconductor chip.

[0004] Existing technologies use placement tanks and heating components to fix and dry semiconductor chips, but certain shortcomings still exist in practical use:

[0005] 1. In the existing technology, the heating components and the chip are in relatively fixed positions during the chip drying process, which makes it impossible to dry the semiconductor chip from multiple angles. This may lead to uneven heating of the semiconductor chip, thereby reducing the drying effect, prolonging the operation time of the drying step, and reducing production efficiency.

[0006] 2. Existing technologies lack a design for further fixing the chip during the chip drying process. Simple placement slots cannot well accommodate and fix semiconductor chips of different thicknesses, and may even cause displacement or detachment during the chip drying process. Utility Model Content

[0007] To overcome the shortcomings of existing technologies, this invention provides a drying device that facilitates semiconductor chip processing. Through the design of a first gear and a second gear, this invention enables the semiconductor chip to not only revolve around a central axis but also rotate on its own axis during the drying process, achieving multi-angle drying. Furthermore, through the design of fixing components, chips of different thicknesses and heights can be stably fixed during the drying process.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a drying device for semiconductor chip processing, comprising a base, a housing fixedly mounted on the base, a drying chamber formed inside the housing, an air source fixedly mounted above the housing, a heating chamber connected to the housing below the air source, a first gear fixedly mounted below the heating chamber, a turntable rotatably mounted on the base below the first gear, and a plurality of second gears rotatably mounted around the first gear along the circumferential direction on the upper surface of the turntable, meshing with the first gear, and multiple detachable placement trays mounted on the upper surface of each second gear, with a fixing component mounted on each placement tray.

[0009] Preferably, the fixing component includes a fixing seat fixedly disposed at the center of the upper end face of the placement tray, a circular pressure plate rotatably disposed inside the fixing seat, the fixing seat and the circular pressure plate being connected to each other by threads, and a plurality of rubber fixing clips fixedly disposed around the fixing seat along the circumferential direction.

[0010] Preferably, the plurality of rubber clamps are used to fix the semiconductor chip in pairs, and each rubber clamp has a fixing corrugation on its upper part.

[0011] Preferably, the lower end face of the heating chamber is provided with a plurality of first vent holes, the bottom of the heating chamber is connected to an air supply cylinder, and the outer circumference of the air supply cylinder is provided with a plurality of second vent holes.

[0012] Preferably, a support column is connected to the lower end face of the heating chamber inside the air supply cylinder, and the lower end face of the support column is connected and fixed to the upper end face of the first gear.

[0013] Preferably, the lower part of the outer casing is provided with a plurality of third vent holes.

[0014] Preferably, a door panel is rotatably provided on one side of the outer circular surface of the outer shell, and the door panel is connected to the outer shell by a plurality of hinges.

[0015] Preferably, multiple metal heating meshes are fixedly installed inside the heating chamber.

[0016] Preferably, a drive motor is fixedly installed inside the base, and the output end of the drive motor is connected to the lower end face of the turntable.

[0017] In summary, compared with existing technologies, the beneficial effects of this solution are as follows:

[0018] (1) The present invention uses the design of the first gear and the second gear to enable the semiconductor to not only revolve around the sun but also rotate on its own axis during the drying process, thereby enabling the fixed air outlet to achieve the effect of drying the chip from multiple angles, improving the effect of chip drying and enhancing the efficiency of chip drying.

[0019] (2) The present invention uses a fixing component and other design to ensure that chips of different thicknesses and heights can be stably fixed on the placement tray during the drying process, thereby enhancing the stability of the overall drying process and ensuring the drying effect. Attached Figure Description

[0020] Figure 1 This is a perspective view of the present utility model;

[0021] Figure 2 Top view of this utility model;

[0022] Figure 3 for Figure 2 A three-dimensional sectional view at point AA;

[0023] Figure 4 for Figure 3 A magnified view of a section at point B in the middle;

[0024] Figure 5 Front view of this utility model;

[0025] Figure 6 for Figure 5 A three-dimensional sectional view at point CC;

[0026] In the diagram: base 10, bracket 11, outer shell 12, door panel 13, hinge 14, air source 15, heating chamber 16, metal heating mesh 17, first vent 18, support column 19, air supply cylinder 20, second vent 21, first gear 22, drive motor 23, turntable 24, second gear 25, placement tray 26, rubber fixing clamp 27, fixing corrugated 28, support column 29, fixing seat 30, circular pressure plate 31, drying chamber 32, third vent 33. Detailed Implementation

[0027] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Example 1:

[0028] Reference Appendix Figure 1 Appendix Figure 2 and appendix Figure 3A drying device for semiconductor chip processing includes a base 10, a support 11 fixedly mounted on the base 10, and a housing 12 fixedly mounted on the base 10 within the support 11. The housing 12 forms a drying chamber 32, and a door panel 13 is rotatably mounted on one side of the housing 12. Multiple hinges 14 connect the door panel 13 and the housing 12. The drying chamber 32 formed inside the housing 12 is the drying area for semiconductor chips. Production personnel can open the device by cooperating with the door panel 13 and the hinges 14 to place the semiconductor chips to be dried into the drying chamber 32 for drying. The specific hinges 14 are existing technology, and different sizes can be purchased according to different requirements during equipment manufacturing. This solution will not elaborate further.

[0029] Further, see attached document. Figure 1 Appendix Figure 3 and appendix Figure 4 An air source 15 is fixedly installed on the upper surface of the bracket 11. A heating chamber 16 is connected to the lower surface of the top plate of the outer shell 12 below the air source 15. Multiple metal heating meshes 17 are fixedly installed inside the heating chamber 16. Multiple first vent holes 18 are provided below the metal heating meshes 17 on the lower surface of the heating chamber 16. A support column 19 is also fixedly installed on the lower surface of the heating chamber 16. An air supply cylinder 20 is provided on the outside of the support column 19. Multiple second vent holes 21 are provided on the air supply cylinder 20. The air source 15 can continuously draw air into the heating chamber 16. The multiple metal heating meshes 17 in the heating chamber 16 can be heated into dry high-temperature air by the air flow. Subsequently, part of the dry high-temperature air is sprayed downward to the surface of the semiconductor chip, and another part of the dry high-temperature air is transported downward through the air supply cylinder 20 and sprayed outward from the multiple second vent holes 21 on the outer circumference of the air supply cylinder 20, spraying towards the semiconductor chip from a side angle.

[0030] Further, see attached document. Figure 1 With appendix Figure 5 The outer casing 12 also has multiple third vent holes 33 on its side. After the high-temperature airflow carries away the moisture from the semiconductor chip, it can be discharged through the third vent holes 33.

[0031] Further, see attached document. Figure 3 Appendix Figure 4 and appendix Figure 6 A drive motor 23 is fixedly installed inside the base 10. A turntable 24 is rotatably installed on the base 10. The output end of the drive motor 23 is connected to the lower end face of the turntable 24. Multiple second gears 25 are rotatably installed on the turntable 24. A first gear 22 is fixedly installed in the middle of the multiple second gears 25 at the lower end face of the support column 19. Multiple detachable placement plates 26 are provided on the upper end face of each second gear 25 along the vertical direction. Adjacent placement plates 26 are supported by the support column 29. Each placement plate 26 is provided with a fixing component.

[0032] The drive motor 23 can drive the turntable 24 to rotate. During the rotation of the turntable 24, multiple second gears 25 are driven by the turntable 24 to revolve. Since a first gear 22 is fixedly set in the middle of the multiple second gears 25, and the multiple second gears 25 are meshed with the first gear 22, the multiple second gears 25 will also rotate on their own axis in cooperation with the first gear 22 during the revolution, and drive multiple fixed components on the second gears 25 to complete their own rotation while revolving. During drying, multiple semiconductor chips are fixed on each placement tray 26. The above settings enable the placement trays to dry the semiconductor chips from multiple angles by high-temperature airflow through revolution and rotation during the drying process, thereby improving the drying effect and shortening the drying time.

[0033] Specifically, initially, production personnel can open the door panel 13 and take out multiple placement trays 26 from the drying chamber 32. Each placement tray 26 is equipped with a fixing component, which allows production personnel to stably fix semiconductor chips onto the placement tray 26. After fixing, production personnel can continue to put the placed tray 26 back onto the second gear 25. During the entire process of fixing semiconductor chips, production personnel can control the drive motor 23 to rotate the turntable 24 to the adjacent position of the door panel 13, making it convenient for production personnel to take out the placement tray 26.

[0034] During drying, the air source 15 is first turned on to continuously draw air into the heating chamber 16. Multiple metal heating meshes 17 inside the heating chamber 16 are responsible for heating the passing air into dry, high-temperature air. Subsequently, part of the air is sprayed downwards from the first vent 18 below the heating chamber 16 onto the surface of the semiconductor chip, while another part of the air is sprayed from the outer surface onto the semiconductor chip through the air delivery cylinder 20 and the second vent 21 on it.

[0035] Meanwhile, the drive motor 23 in the base 10 drives the turntable 24 to rotate. Multiple second gears 25 are rotatably arranged on the turntable 24. When the turntable 24 rotates, the multiple second gears 25 are revolving. A first gear 22 is fixedly arranged on the lower end face of the support column 19 between the multiple second gears 25. During the revolving process of the multiple second gears 25, each second gear 25 meshes with the first gear 22, so that the multiple second gears 25 can rotate on their own axis while revolving. This allows the multiple placement disks 26 on the second gears 25 and the multiple semiconductor chips to be subjected to high-temperature airflow at different angles. The high-temperature airflow carries away the moisture of the semiconductors and is discharged from the third vent 33.

[0036] After drying, production personnel can first open the door panel 13 to remove the placement tray 26 from the drying chamber 32, and then remove the multiple semiconductor chips from the fixing components. Example 2:

[0037] Reference Appendix Figure 3 Appendix Figure 4 and appendix Figure 6 The fixing component includes multiple rubber fixing clips 27 arranged in a circumferential array on the placement plate 26. A fixing seat 30 is also fixedly installed at the center of the upper end face of the placement plate 26. A circular pressure plate 31 is rotatably installed inside the fixing seat 30. The fixing seat 30 and the circular pressure plate 31 are engaged with each other by threads.

[0038] As a further embodiment, considering that different semiconductor chips have different thicknesses, the multiple rubber clamps 27 on the placement tray 26 are arranged in pairs. Each pair of rubber clamps 27 can fix one semiconductor chip. The rubber clamps 27 are made of high-temperature resistant material, and the rubber itself has a certain elasticity. During installation, the production personnel only need to pry open the rubber clamps 27 and insert the semiconductor chip into them. Considering that the device will drive multiple semiconductor chips to revolve and rotate during the entire drying process, in order to enhance the stability of semiconductor chip fixing, the production personnel can rotate the circular pressure plate 31 to press the semiconductor chip downward and fix the semiconductor chip tightly on the placement tray 26 by means of threaded engagement.

[0039] Further, see attached document. Figure 4 With appendix Figure 6 Each rubber clamp 27 has a groove with a fixing corrugation 28. The fixing corrugation 28 not only increases the air permeability but also increases the friction on the inside of the rubber clamp 27, so that the rubber clamp 27 can fix the semiconductor chip more stably.

[0040] The specification and claims use certain terms to refer to specific components. Those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error.

[0041] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes said element.

[0042] The foregoing description illustrates and describes several preferred embodiments of this application. However, as previously stated, it should be understood that this application is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the application concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of this application should be within the protection scope of the appended claims.

Claims

1. A baking apparatus for facilitating processing of semiconductor chips, comprising a base (10), characterized in that, The base (10) is fixedly provided with a shell (12), the shell (12) is formed with a drying cabin (32) inside, the shell (12) is fixedly provided with an air source (15) above, the air source (15) is connected and provided with a heating cabin (16) inside the shell (12) below, the heating cabin (16) is fixedly provided with a first gear (22) below, the first gear (22) is rotatably provided with a rotating disc (24) on the base (10) below, a plurality of second gears (25) rotatably engaged with the first gear (22) are rotatably arranged on the end face of the rotating disc (24) in the circumferential direction, a plurality of detachable placing discs (26) are arranged on the end face of each second gear (25), and a fixing assembly is arranged on each placing disc (26).

2. The drying apparatus for facilitating processing of semiconductor chips according to claim 1, wherein The fixing assembly comprises a fixing seat (30) fixedly arranged on the end face of the placing disc (26) at the center, a circular pressing plate (31) is rotatably arranged in the fixing seat (30), the fixing seat (30) and the circular pressing plate (31) are connected with each other through threads, and a plurality of rubber fixing clamps (27) are fixedly arranged around the fixing seat (30) in the circumferential direction.

3. The drying apparatus of claim 2, wherein the drying apparatus is configured to facilitate processing of semiconductor chips. The plurality of rubber fixing clamps (27) are used for fixing a semiconductor chip in each group, and a fixed corrugation (28) is arranged on the upper part of each rubber fixing clamp (27).

4. The drying apparatus of claim 1, wherein A plurality of first air holes (18) are arranged on the lower end face of the heating cabin (16), a gas feeding cylinder (20) is connected and arranged on the lower end face of the heating cabin (16), and a plurality of second air holes (21) are arranged on the outer circular face of the gas feeding cylinder (20).

5. The drying apparatus of claim 4, wherein the drying apparatus is configured to facilitate processing of semiconductor chips. A supporting column (19) is connected and arranged in the gas feeding cylinder (20) on the lower end face of the heating cabin (16), and the lower end face of the supporting column (19) is connected and fixed with the upper end face of the first gear (22).

6. The drying apparatus of claim 1, wherein A plurality of third air holes (33) are arranged on the lower part of the shell (12).

7. The drying apparatus of claim 6, wherein the drying apparatus is configured to facilitate processing of semiconductor chips. A door plate (13) is rotatably arranged on one side of the outer circular face of the shell (12), and the door plate (13) and the shell (12) are connected through a plurality of hinges (14).

8. The drying apparatus of claim 4, wherein the drying apparatus is characterized by: A plurality of metal heating nets (17) are fixedly arranged in the heating cabin (16).

9. The drying apparatus of claim 1, wherein the drying apparatus is configured to facilitate processing of semiconductor chips. A driving motor (23) is fixedly arranged in the base (10), and the output end of the driving motor (23) is connected with the lower end face of the rotating disc (24).

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