Chip hardness testing device

Abstract

The utility model discloses a chip hardness testing device, and belongs to the technical field of chip detection, the chip hardness testing device comprises a chip wobble plate, a three-axis transmission device and a hardness tester, the chip wobble plate is installed on the three-axis transmission device and is used for placing a chip to be tested; and the hardness tester is arranged on the three-axis transmission device and is used for testing a chip to be tested. According to the chip hardness testing device, batch automatic chip hardness testing can be carried out, testing data are automatically output and stored, manual intervention and error influences are reduced, and the testing efficiency and accuracy are greatly improved.

Description

Technical Field

[0001] This application relates to a chip hardness testing device, belonging to the field of chip testing technology. Background Technology

[0002] In the semiconductor industry, chips are a key raw material in the entire manufacturing process, and their performance directly determines the quality of the final product. With continuous technological advancements, increasing product power density, and shrinking size, the requirements for various chip performance indicators are becoming increasingly stringent, among which chip rigidity is a particularly important one.

[0003] Currently, in order to test the hardness of chips and measure their resistance to violent attacks, the industry mainly uses the probe of a hardness tester to directly squeeze the chip for hardness testing. However, most of the current testing methods are manual, which is not only inefficient and unable to conduct large-scale testing, but also subject to a lot of errors and human interference. Therefore, a simple and automated chip hardness testing device is urgently needed. Utility Model Content

[0004] The technical problem to be solved by this application is to overcome the shortcomings of the prior art and provide a chip hardness testing device that can perform batch automated chip hardness testing and automatically output and save the test data, thereby reducing manual intervention and error effects and greatly improving testing efficiency and accuracy.

[0005] The technical solution adopted by this application to solve its existing problems is:

[0006] A chip hardness testing device includes a chip rocker, a three-axis transmission device, and a hardness tester. The chip rocker is mounted on the three-axis transmission device and is used to place the chip to be tested.

[0007] The hardness tester is mounted on a three-axis transmission device and is used to test the chip under test.

[0008] Preferably, the three-axis transmission device includes a loading platform, on which the chip chuck is placed;

[0009] The three-axis transmission device also includes an X-axis transmission arm, a Y-axis transmission arm, and a Z-axis transmission arm, wherein the X-axis transmission arm and the Y-axis transmission arm drive the Z-axis transmission arm to move left and right and forward and backward.

[0010] Preferably, the hardness tester is mounted on the Z-axis drive arm, which drives the hardness tester to move up and down.

[0011] Preferably, the hardness tester includes a hardness acquisition instrument and a probe, the probe being used to extrude the chip, and the hardness acquisition instrument being used to record the chip hardness data;

[0012] The hardness tester is electrically connected to the data acquisition unit, which is used to receive the data recorded by the hardness acquisition instrument.

[0013] Preferably, the chip swivel has multiple grooves for placing chips, and the grooves in the chip swivel are axially symmetrical.

[0014] Preferably, the chip swivel has multiple grooves for placing chips, and the grooves in the chip swivel are axially symmetrical.

[0015] The chip chuck has a chamfered shape, and the groove inside the chip chuck has a circular through hole, which is connected to a vacuum device.

[0016] Preferably, the vacuum device includes a filtration and collection device and a vacuum pressure device, wherein the filtration and collection device is used to collect chip debris and the vacuum pressure device is used to provide a vacuum.

[0017] Preferably, the chip hardness testing device can be equipped with a chip chuck with different groove sizes depending on the size of the chip to be tested.

[0018] Compared with the prior art, the beneficial effects of this application are as follows:

[0019] In the chip hardness testing device provided in this application, the transmission controller of the three-axis transmission device controls the X-axis transmission arm and the Y-axis transmission arm. After the hardness tester probe, fixed on the Z-axis transmission arm, reaches directly above the first chip, the Z-axis transmission arm is controlled to move vertically downward, causing the probe to contact the chip and continuously press down until the chip breaks. The hardness acquisition instrument records the hardness data and transmits it to the data acquisition unit. Then, the transmission controller controls the X-axis transmission arm and the Y-axis transmission arm to move to the next chip position to perform hardness testing until all chips have been tested. Compared with existing testing methods, this chip hardness testing device is simple and convenient to operate, requires less manual intervention, and can achieve batch automated testing, greatly improving testing efficiency and accuracy. At the same time, the test data can be output and saved, facilitating the analysis and statistics of chip hardness and subsequent improvement work. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a chip hardness testing device according to this application;

[0021] Figure 2 This is a schematic diagram of the structure of a chip rocker disk of a chip hardness testing device according to this application;

[0022] Figure 3 This is a schematic diagram of another embodiment of the chip rocker of the chip hardness testing device of this application;

[0023] Figure 4This is a schematic diagram of the vibration buffer structure in the carrier platform of a chip hardness testing device according to this application.

[0024] In the picture:

[0025] 1. Chip chuck; 11. Groove; 12. Circular through hole; 13. Chamfer; 2. Three-axis transmission device; 21. Loading platform; 2101. Buffer body; 210101. Placement stage; 210102. Buffer plunger rod; 210103. Buffer plug; 2102. Vacuum isolation plate; 2103. Buffer spring; 2104. Vacuum through hole; 22. X-axis transmission arm; 23. Y-axis transmission arm; 24. Z-axis transmission arm; 25. Transmission controller; 3. Hardness tester; 31. Hardness acquisition instrument; 32. Probe; 4. Data acquisition unit; 5. Vacuum device; 51. Filter collection device; 52. Vacuum pressure device. Detailed Implementation

[0026] The specification and claims use certain terms to refer to specific components. Those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error.

[0027] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0028] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0029] like Figure 1-4As shown, a chip hardness testing device includes a chip rocker 1, a three-axis transmission device 2, a hardness tester 3, and a data acquisition unit 4.

[0030] The chip swivel 1 is used to place the chip to be tested for hardness. The front of the chip swivel 1 has multiple grooves 11 for placing chips. The chip to be tested can be placed into the chip swivel 1 manually or using an automatic swivel device. The chip swivel 1 with different groove sizes can be replaced according to the size of the chip to be tested.

[0031] In some alternative embodiments, such as Figure 2 As shown, the grooves 11 inside the chip swivel 1 for placing the chip are axially symmetrical, and the chip center point position can be kept consistent in each direction.

[0032] In some alternative embodiments, such as Figure 3 As shown, the grooves 11 for placing chips within the chip swivel disk 1 are axially symmetrical, ensuring consistent chip center positions in every direction. Each groove 11 has a circular through-hole 12 connected to a vacuum device 5. The vacuum device 5 includes a filter collection device 51 and a vacuum pressure device 52, with the filter collection device 51 positioned between the chip swivel disk 1 and the vacuum pressure device 52. The vacuum pressure device 52 generates vacuum pressure to provide a vacuum. The vacuum device 5 can vacuum-adsorb the chips placed within the chip swivel disk 1, thereby enhancing the limiting and fixing effect. The vacuum device 5 can also be used to collect dust generated from chip breakage after hardness testing. The upper left corner of the chip swivel disk 1 has a chamfer 13, which effectively identifies the orientation of rectangular chips after placement, preventing inconsistent placement orientations each time.

[0033] The three-axis transmission device 2 is used to place the chip swaying disk 1 and drive the hardness tester 3 to perform three-axis motion. The platform 21 of the three-axis transmission device 2 is used to place the chip swaying disk 1. The X-axis transmission arm 22 and Y-axis transmission arm 23 drive the Z-axis transmission arm 24 to perform smooth left-right and forward-backward movements, allowing the hardness tester 3, fixed on the Z-axis transmission arm 24, to move directly above the chip. The Z-axis transmission arm 24 drives the hardness tester 3 to perform smooth up-down movements, allowing the probe 32 of the hardness tester 3 to contact the chip and provide downward pressure to crush the chip. The three-axis transmission device 2 is electrically connected to a transmission controller 25, which controls the smooth movement of the X-axis transmission arm 22, Y-axis transmission arm 23, and Z-axis transmission arm 24. The controller can be programmed internally to remember multiple position points and perform repetitive back-and-forth movements.

[0034] like Figure 4As shown, the loading platform 21 has a stepped hole, and a vibration damper is installed in the stepped hole. The vibration damper includes a buffer body 2101, which includes a placement platform 210101, a buffer plunger rod 210102, and a buffer plug 210103. The placement platform 210101, the buffer plunger rod 210102, and the buffer plug 210103 are fixedly connected to each other. The placement platform 210101 is used to support the chip swivel disk 1. The vacuum isolation plate 2102 is sleeved on the buffer plunger rod 210102, slidably connected to the buffer plunger rod 210102, and fixedly connected to the loading platform 21. The buffer plug 210103 is slidably connected to the loading platform 21, and the lower end of the buffer plug 210103 is fixedly connected to one end of the buffer spring 2103, while the other end of the buffer spring 2103 is fixedly connected to the loading platform 21. A sealed space is formed between the vacuum isolation plate 2102, the buffer plug 210103 and the loading platform 21. The vacuum isolation plate 2102 and the buffer plug 210103 are provided with vacuum through holes 2104, which are connected to a vacuum pressure device 52.

[0035] The working process of the vibration damper is as follows:

[0036] The chip is placed on a chip swivel disk 1, which is placed on a placement stage 210101. The buffer 2101 is in its initial position, the vacuum is not activated, and the buffer spring 2103 is in a pre-tensioned state. When the chip is impacted, the vacuum is activated, generating an upward suction force to prevent the buffer 2101 from being excessively compressed. Simultaneously, the buffer spring 2103 begins to compress, absorbing the remaining impact energy. The combined action of the vacuum force and the buffer spring 2103 precisely controls the displacement of the buffer 2101, ensuring the chip remains within an appropriate range during testing. After the impact, the vacuum is deactivated, the buffer spring 2103 gradually returns to its original position, and the buffer 2101 returns to its initial position, ready for the next test. Chip hardness testing typically requires a stable environment. Any external vibration or impact can affect the accuracy of the test results. By introducing a vibration damper, the impact of external vibration on the testing process can be effectively reduced, ensuring the stability of the testing environment, thereby improving testing accuracy and reliability, and extending the service life of the equipment.

[0037] The three-axis transmission device 2 has a limiting block on its loading platform 21, which can effectively fix the chip swivel 1. It is also equipped with a vision inspection device on the Z-axis transmission arm 24. The vision inspection device can perform visual inspection on the chips on the chip swivel 1, record the center position of all chips and automatically transmit it to the transmission controller 25, thereby increasing testing efficiency and accuracy.

[0038] The hardness tester 3 is used to test the hardness of the chip and output the hardness test value. The hardness tester 3 is electrically connected to the data acquisition unit 4, and can receive and save the hardness value recorded by the hardness acquisition instrument 31 for subsequent analysis and statistical work. The hardness acquisition instrument 31 is connected to the probe 32, which is used to record the chip hardness value and output the value to the data acquisition unit 4. The probe 32 is used to contact and press the chip to test the chip hardness.

[0039] This application provides a chip hardness testing device. The chip to be tested is placed in the groove 11 on the front of the chip swivel 1. The chip swivel 1 is placed on the carrier platform 21. The transmission controller 25 of the three-axis transmission device 2 controls the X-axis transmission arm 22 and Y-axis transmission arm 23 to drive the hardness tester 3 fixed on the Z-axis transmission arm 24 to move horizontally to the center of each chip. The Z-axis transmission arm 24 drives the probe 32 of the hardness tester 3 to contact and press the chip to perform the hardness test. The hardness test data is collected by the hardness acquisition instrument 31 and transmitted to the data acquisition unit 4 for data recording and storage. Compared with existing testing methods, this chip hardness testing device is simple and convenient to operate, requires less manual intervention, and can realize batch automated testing, which greatly improves the testing efficiency and accuracy. At the same time, the test data can be output and saved, which facilitates the analysis and statistics of chip hardness and subsequent improvement work.

[0040] The chip chuck groove size, three-axis transmission control method, and data transmission method not described in detail in this invention are all existing technologies and will not be elaborated further.

[0041] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A chip hardness testing device, characterized in that: it comprises a chip turntable (1), a three-axis transmission device (2) and a hardness tester (3), the chip turntable (1) is installed on the three-axis transmission device (2) and used to place the chip to be tested; the hardness tester (3) is installed on the three-axis transmission device (2) and used to test the chip to be tested.

2. The chip hardness testing device according to claim 1, characterized in that: the three-axis transmission device (2) comprises a support platform (21), and the chip turntable (1) is placed on the support platform (21); the three-axis transmission device (2) further comprises an X-axis transmission arm (22), a Y-axis transmission arm (23) and a Z-axis transmission arm (24), and the X-axis transmission arm (22) and the Y-axis transmission arm (23) drive the Z-axis transmission arm (24) to move left and right and forward and backward.

3. The chip hardness testing device according to claim 2, characterized in that: the hardness tester (3) is installed on the Z-axis transmission arm (24), and the Z-axis transmission arm (24) drives the hardness tester (3) to move up and down.

4. The chip hardness testing device according to claim 3, characterized in that: the hardness tester (3) comprises a hardness collection instrument (31) and a probe (32), the probe (32) is used to press the chip, and the hardness collection instrument (31) is used to record the chip hardness data; the hardness tester (3) is electrically connected with a data collection unit (4), and the data collection unit (4) is used to receive the data recorded by the hardness collection instrument (31).

5. The chip hardness testing device according to claim 1 or 2 or 3 or 4, characterized in that: the chip turntable (1) is provided with a plurality of grooves (11) for placing the chip, and the grooves (11) in the chip turntable (1) are axisymmetric.

6. The chip hardness testing device according to claim 1 or 2 or 3 or 4, characterized in that: the chip turntable (1) is provided with a plurality of grooves (11) for placing the chip, and the grooves (11) in the chip turntable (1) are axisymmetric; the chip turntable (1) has a chamfer (13), the grooves (11) in the chip turntable (1) have circular through holes (12), and the circular through holes (12) are connected with a vacuum device (5).

7. The chip hardness testing device according to claim 6, characterized in that: the vacuum device (5) comprises a filtering and collecting device (51) and a vacuum pressure device (52), the filtering and collecting device (51) is used to collect the chip debris, and the vacuum pressure device (52) is used to provide vacuum.

8. The chip hardness testing device according to claim 5, characterized in that: the three-axis transmission device (2) is electrically connected with a transmission controller (25), the transmission controller (25) controls the movement of the X-axis transmission arm (22), the Y-axis transmission arm (23) and the Z-axis transmission arm (24); and the chip hardness testing device can replace the chip turntable (1) with different groove sizes according to the size of the chip to be tested. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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