Temperature monitoring system of wafer heating device

Abstract

The utility model provides a temperature monitoring system of a wafer heating device, which comprises a heating plate, a base, a temperature sensor, a PLC (programmable logic controller) temperature control cabinet, a human-computer interface, an independent power supply and an alarm, the heating plate is arranged on the base, a switch button and a temperature display screen are arranged on the base, the temperature sensor is arranged at the bottom of the heating plate, and the PLC temperature control cabinet is arranged on the human-computer interface. The PLC temperature control cabinet is electrically connected with the temperature sensor to receive and process temperature data, and the human-computer interface is electrically connected with the PLC temperature control cabinet and performs information interaction to display the temperature data and set a monitoring temperature range, so that real-time monitoring and early warning of the temperature of the heating plate are realized. The independent power supply is electrically connected with the PLC temperature control cabinet and the man-machine interface to supply power to the PLC temperature control cabinet and the man-machine interface, and the alarm is electrically connected with the PLC temperature control cabinet to receive an early warning instruction of the PLC temperature control cabinet. The temperature monitoring system of the wafer heating device has a temperature real-time monitoring mechanism and a temperature abnormity alarm mechanism, can timely identify heating abnormity of the wafer heating device, and reduces the risk of heating abnormity of materials.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor integrated circuit manufacturing technology, and relates to a temperature monitoring system for a wafer heating device. Background Technology

[0002] In the field of semiconductor wafer-level packaging manufacturing, photoresist coating and hot plate unit baking are two critical steps, and temperature control is crucial for ensuring semiconductor manufacturing quality. Temperature instability can lead to abnormal photoresist heating, thus affecting the quality of the final product. Therefore, temperature sensing technology plays a central role in monitoring the temperature stability of these steps, while an anomaly monitoring system is responsible for real-time monitoring of equipment operation and issuing timely alarms when anomalies are detected to prevent further losses. Although existing machine heating devices monitor and regulate temperature through built-in temperature sensors, several key problems remain: First, when the temperature sensor fails, the machine does not issue an alarm, and the system temperature display remains normal, making it difficult for operators to determine the timing of the anomaly and define the range of material abnormalities; second, temperature data needs to be converted before curve analysis, limiting the ability for real-time monitoring and anomaly alarms; finally, the temperature monitoring system relies on the machine's power supply, and if the power supply fails, the monitoring system will also fail. These problems limit the efficiency and reliability of temperature monitoring, thus affecting the overall quality of semiconductor manufacturing.

[0003] Therefore, how to provide a temperature monitoring system for a wafer heating device with real-time temperature monitoring and an alarm mechanism for abnormal temperature, and to promptly identify heating abnormalities in the wafer heating device, has become an important problem that needs to be solved by those skilled in the art.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a temperature monitoring system for a wafer heating device, which solves the problem that the existing wafer heating device does not alarm when the temperature is abnormal, resulting in the inability to identify the time of machine failure in a timely manner and the inability to quickly determine the range of material abnormality.

[0006] To achieve the above and other related objectives, this utility model provides a temperature monitoring system for a wafer heating device, comprising:

[0007] A heating plate and a base, wherein the heating plate is located on the base, and the base is provided with a switch button and a temperature display screen;

[0008] A temperature sensor, located at the bottom of the heating plate, is used to measure the temperature of the heating plate and generate temperature data;

[0009] The PLC temperature control cabinet is electrically connected to the temperature sensor and is used to receive and process the temperature data.

[0010] The human-machine interface is electrically connected to the PLC temperature control cabinet and interacts with information to display the temperature data and set the monitoring temperature range.

[0011] An independent power supply is electrically connected to the PLC temperature control cabinet and the human-machine interface to provide power to the PLC temperature control cabinet and the human-machine interface.

[0012] An alarm is electrically connected to the PLC temperature control cabinet to receive and respond to the alarm commands from the PLC temperature control cabinet.

[0013] Optionally, the PLC temperature control cabinet includes a PLC temperature module and a PLC controller. The PLC temperature module is used to receive and process the temperature data, and the PLC controller is used to issue the warning command to control the on / off state of the alarm.

[0014] Optionally, the PLC temperature module is further configured to transmit the temperature data to the human-machine interface, and the PLC controller is further configured to receive programming instructions for the monitored temperature range from the human-machine interface.

[0015] Optionally, the human-machine interface includes a user interface, which includes a display module and an input module. The display module is used to display the real-time temperature and temperature change curve, and the input module is used to set the monitored temperature range.

[0016] Optionally, there are multiple temperature sensors, each disposed on the bottom of a different heating plate, for monitoring the temperature of the multiple heating plates.

[0017] Optionally, the monitored temperature range may be one or more.

[0018] Optionally, the alarm includes an audible and visual buzzer.

[0019] Optionally, the connection method between the PLC temperature control cabinet and the human-machine interface includes one of serial port, Ethernet and USB.

[0020] Optionally, the temperature sensor includes a K-type thermocouple wire.

[0021] Optionally, the temperature sensor has a measurement range of -200℃ to 1370℃.

[0022] As described above, the temperature monitoring system of the wafer heating device of this invention includes a heating plate, a base, a temperature sensor, a PLC temperature control cabinet, a human-machine interface, an independent power supply, and an alarm. The heating plate is located on the base, which is equipped with a switch button and a temperature display screen. The temperature sensor is located at the bottom of the heating plate. The PLC temperature control cabinet is electrically connected to the temperature sensor to receive and process temperature data. The human-machine interface is electrically connected to the PLC temperature control cabinet and interacts with it to display temperature data and set the monitoring temperature range, enabling real-time monitoring and early warning of the heating plate temperature. The independent power supply is electrically connected to the PLC temperature control cabinet and the human-machine interface to provide power to them. The alarm is electrically connected to the PLC temperature control cabinet to receive early warning commands from it. This temperature monitoring system for the wafer heating device of this invention features real-time temperature monitoring and an abnormal temperature alarm mechanism, enabling timely identification of heating abnormalities in the wafer heating device, reducing the risk of abnormal material heating, and thus improving product quality. Attached Figure Description

[0023] Figure 1 The diagram shown is a structural schematic of the temperature monitoring system of the wafer heating device of this utility model.

[0024] Figure 2 The diagram shown is a block diagram illustrating the control principle of the temperature monitoring system of the wafer heating device of this invention.

[0025] Figure 3 The diagram shows the connection circuit of the PLC temperature control cabinet, temperature sensor, and alarm of this utility model.

[0026] Explanation of reference numerals in the attached figures

[0027] 1 Heating plate

[0028] 2. Base

[0029] 201 Switch Button

[0030] 202 Temperature Display Screen

[0031] 3 Temperature sensor

[0032] 4 PLC temperature control cabinet

[0033] 5. User Interface

[0034] 6. Alarm Detailed Implementation

[0035] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0036] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components.

[0037] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0038] In the detailed description of the embodiments of this utility model, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0039] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for devices in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it may be the only layer between the two layers, or there may be one or more layers in between.

[0040] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0041] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0042] Please see Figure 1The diagram shows the structure of the temperature monitoring system of the wafer heating device of this utility model. The temperature monitoring system includes: a heating plate 1, a base 2, a temperature sensor 3, a programmable logic controller (PLC) temperature control cabinet 4, a human-machine interface 5, and an alarm 6. The heating plate 1 is located on the base 2, which is equipped with a switch button 201 and a temperature display screen 202. The temperature sensor 3 is located at the bottom of the heating plate 1 and is used to measure the temperature of the heating plate 1 and generate temperature data. The PLC temperature control cabinet 4 is electrically connected to the temperature sensor 3 and is used to receive and process the temperature data. The human-machine interface 5 is electrically connected to the PLC temperature control cabinet 4 and interacts with it to display the temperature data and set the monitoring temperature range, so as to realize real-time monitoring and early warning of the temperature of the heating plate 1. The alarm 6 is electrically connected to the PLC temperature control cabinet 4 to receive and respond to the early warning commands of the PLC temperature control cabinet 4.

[0043] For details, please refer to Figure 2 The diagram shows the control principle block diagram of the temperature monitoring system of the wafer heating device of this utility model. The temperature monitoring system of the wafer heating device also includes an independent power supply. The independent power supply is electrically connected to the PLC temperature control cabinet 4 and the human-machine interface 5, and is used to supply power to the PLC temperature control cabinet 4 and the human-machine interface 5, so as to ensure that the temperature monitoring system can still work normally in the event of a problem with the machine power supply, thereby increasing the independence and reliability of the temperature monitoring system. In this embodiment, the independent power supply adopts a 24V power supply.

[0044] As an example, the bottom of the heating plate 1 is fixed to the base 2 by multiple fixing posts.

[0045] As an example, the alarm 6 includes an audible and visual buzzer.

[0046] As an example, a window is provided on one side wall of the PLC temperature control cabinet 4, and the human-machine interface 5 is located inside the window. That is, the human-machine interface 5 is embedded in one side wall of the PLC temperature control cabinet 4 through the window.

[0047] For example, please refer to [link / reference]. Figure 2 The PLC temperature control cabinet 4 includes a PLC temperature module and a PLC controller. The PLC temperature module is used to receive and process the temperature data, and the PLC controller is used to issue the warning command to control the on / off state of the alarm 6.

[0048] Specifically, the PLC temperature module is also used to transmit the temperature data to the human-machine interface 5, and the PLC controller is also used to receive the programming instructions of the monitored temperature range from the human-machine interface 5, thereby realizing the information interaction between the PLC temperature control cabinet 4 and the human-machine interface 5.

[0049] As an example, the human-machine interface 5 is provided with a user interface, which includes a display module and an input module. The display module is used to display the real-time temperature and temperature change curve, and the input module is used to set the monitored temperature range. The human-machine interface 5 is used to monitor and display the temperature value in real time, thereby achieving dual protection for the accuracy and reliability of temperature monitoring.

[0050] For details, please refer to [link / reference]. Figure 2 The working principle of the temperature monitoring system for the wafer heating device is as follows: The temperature sensor 3 detects the temperature of the heating plate 1, converts the detected temperature data into an electrical signal, and transmits it to the PLC temperature module. The temperature module calculates and processes the electrical signal containing the temperature data and transmits the processing result to the human-machine interface 5. The human-machine interface 5 displays the temperature value of the heating plate 1 in real time on the display module and plots a temperature change curve. Simultaneously, the operator can set the monitored temperature range through the input module of the human-machine interface 5. After setting, the human-machine interface 5 sends a programming instruction to the PLC controller to set the monitored temperature range. When the temperature value of the heating plate 1 exceeds the monitored temperature range, the PLC controller issues a warning instruction, activating the alarm 6 to remind the operator to handle the heating abnormality promptly.

[0051] As an example, the monitored temperature range can be one or more. Multiple different temperature control ranges, i.e. multiple monitored temperature ranges, are set in the human-machine interface 5 according to different wafer manufacturing processes, so as to facilitate real-time monitoring of abnormal temperature conditions.

[0052] As an example, the connection method between the PLC temperature control cabinet 4 and the human-machine interface includes one of serial port, Ethernet and USB. Among them, the Ethernet connection method has the advantages of fast transmission speed, long transmission distance and strong scalability. In this embodiment, the connection method between the PLC temperature control cabinet 4 and the human-machine interface 5 is preferably Ethernet.

[0053] As an example, the temperature sensor 3 includes a K-type thermocouple wire.

[0054] As an example, the temperature sensor 3 has a temperature measurement range of -200℃ to 1370℃ and a measurement accuracy of ±1.5℃.

[0055] For example, please refer to Figure 3The diagram shows the connection circuit of the PLC temperature control cabinet, temperature sensor, and alarm in the temperature monitoring system of this utility model. There are multiple temperature sensors 3, which are respectively set at the bottom of different heating plates 1 to monitor the temperature of multiple wafer heating devices simultaneously.

[0056] Specifically, in existing temperature monitoring systems, a single UI interface typically monitors only the temperature of one wafer heating device. If monitoring multiple wafer heating devices is required, paper records or system output are necessary, increasing both cost and operational complexity. However, in some embodiments of this invention, multiple (e.g., 10) temperature sensors 3 are simultaneously connected to the same PLC temperature control cabinet 4. The human-machine interface 5 enables simultaneous monitoring of the temperatures of multiple heating plates 1 (i.e., simultaneous monitoring of multiple wafer heating devices), thereby improving work efficiency and reducing costs. The temperature anomaly alarm mechanism works as follows: when the temperature of any one of the temperature sensors 3 exceeds the monitored temperature range, the PLC temperature control cabinet 4 immediately outputs 24V to activate the alarm 6 circuit and trigger an alarm.

[0057] As an example, the working process of the temperature monitoring system of the wafer heating device of this utility model is as follows:

[0058] (1) Temperature display

[0059] Once the independent power supply is confirmed to be turned on, the PLC temperature control cabinet 4 and the human-machine interface 5 are powered on. After the human-machine interface 5 starts normally, it displays the real-time temperature value, temperature change curve and monitoring temperature range of the heating plate 1.

[0060] (2) Abnormal alarm

[0061] If the real-time temperature value of any of the temperature sensors 3 exceeds the monitored temperature range, the alarm 6 will light up and sound to promptly notify the operator that the wafer heating device has a heating abnormality.

[0062] In summary, the temperature monitoring system of this wafer heating device includes a heating plate, a base, a temperature sensor, a PLC temperature control cabinet, a human-machine interface, an independent power supply, and an alarm. The heating plate is located on the base, which is equipped with a switch button and a temperature display screen. The temperature sensor is located at the bottom of the heating plate. The PLC temperature control cabinet is electrically connected to the temperature sensor to receive and process temperature data. The human-machine interface is electrically connected to the PLC temperature control cabinet and interacts with it to display temperature data and set the monitoring temperature range, enabling real-time monitoring and early warning of the heating plate temperature. The independent power supply is electrically connected to the PLC temperature control cabinet and the human-machine interface to provide power. The alarm is electrically connected to the PLC temperature control cabinet to receive early warning commands from it. This temperature monitoring system for the wafer heating device features real-time temperature monitoring and an abnormal temperature alarm mechanism, enabling timely identification of heating abnormalities in the wafer heating device, reducing the risk of material heating abnormalities, and thus improving product quality. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and has high industrial application value.

[0063] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A temperature monitoring system for a wafer heating device, characterized in that, The application relates to a temperature monitoring system for multiple heating plates, comprising the following parts: a heating plate and a base, wherein the heating plate is arranged on the base, and the base is provided with an on-off button and a temperature display screen; a temperature sensor arranged at the bottom of the heating plate, used for measuring the temperature of the heating plate and forming temperature data; a PLC temperature control cabinet electrically connected with the temperature sensor, used for receiving and processing the temperature data; a man-machine interface electrically connected with the PLC temperature control cabinet and used for information interaction, used for displaying the temperature data and setting a monitoring temperature range; an independent power supply electrically connected with the PLC temperature control cabinet and the man-machine interface, used for supplying power for the PLC temperature control cabinet and the man-machine interface; an alarm electrically connected with the PLC temperature control cabinet and used for receiving and responding to a pre-warning instruction of the PLC temperature control cabinet.

2. The temperature monitoring system of a wafer heating apparatus according to claim 1, wherein: The PLC temperature control cabinet comprises a PLC temperature module and a PLC controller, the PLC temperature module is used for receiving and processing the temperature data, and the PLC controller is used for sending the pre-warning instruction to control the on-off state of the alarm.

3. The temperature monitoring system of a wafer heating apparatus according to claim 2, wherein: The PLC temperature module is also used for transmitting the temperature data to the man-machine interface, and the PLC controller is also used for receiving a programming instruction of the man-machine interface for setting the monitoring temperature range.

4. The temperature monitoring system of a wafer heating apparatus according to claim 1, wherein: The man-machine interface is provided with a user interface, the user interface comprises a display module and an input module, the display module is used for displaying real-time temperature and a temperature change curve, and the input module is used for setting the monitoring temperature range.

5. The temperature monitoring system of a wafer heating apparatus according to claim 1, wherein: The number of the temperature sensors is multiple, and multiple temperature sensors are arranged at the bottom of different heating plates respectively, and used for monitoring the temperature of multiple heating plates.

6. The temperature monitoring system of a wafer heating apparatus according to claim 1, wherein: The monitoring temperature range is one or multiple.

7. The temperature monitoring system of a wafer heating apparatus according to claim 1, wherein: The alarm comprises an audible and visual buzzer.

8. The temperature monitoring system of a wafer heating apparatus according to claim 1, wherein: The connection mode of the PLC temperature control cabinet and the man-machine interface comprises one of a serial port, Ethernet and USB.

9. The temperature monitoring system of a wafer heating apparatus according to claim 1, wherein: The temperature sensor comprises a K-type thermocouple wire.

10. The temperature monitoring system of a wafer heating apparatus according to claim 9, wherein: The measurement range of the temperature sensor is -200 DEG C to 1370 DEG C.

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