Heat dissipation device of industrial computer

Abstract

The utility model provides a heat dissipation device of an industrial computer, which belongs to the technical field of heat dissipation devices, and comprises a case, a mainboard is arranged in the case, a heat dissipation mechanism is arranged on the mainboard, the heat dissipation mechanism comprises a mounting bracket, the mounting bracket is connected with the mainboard through a quick release mechanism, a heat conduction plate is clamped at the bottom of the mounting bracket, and a heat dissipation plate is arranged on the heat conduction plate. A cooling fan is arranged at the top of the mounting support, a cooling liquid box is further arranged in the case, a noise reduction mechanism is arranged above the cooling mechanism and comprises a sound absorption cotton layer, and the sound absorption cotton layer is located on the inner side of the case. According to the device, through the arrangement of the quick release mechanism, a user can quickly and conveniently mount and dismount the heat dissipation device, and the maintenance efficiency of the device is improved; when maintenance or upgrading is needed, a user can pull the clamping column to enable the clamping column to be separated from the clamping seat so as to separate the installation support and the main board.

Description

TECHNICAL FIELD

[0001] The utility model belongs to heat dissipation device technical field, more specifically, especially relate to a heat dissipation device of industrial computer. BACKGROUND

[0002] In the field of industrial control and automation, industrial computers are widely used in various complex production and monitoring scenarios as common control devices to ensure stable operation of the system. However, traditional heat dissipation devices are usually fixed with bolts, which makes the installation and disassembly process cumbersome and increases the time cost of maintenance and upgrading. In addition, traditional industrial computer heat dissipation devices usually use single air cooling, which has limited heat dissipation effect. The air cooling method is difficult to quickly remove a large amount of heat in a high-temperature environment, and the noise generated by the cooling fan is too large, which easily affects the comfort of the working environment and interferes with the operators, thereby reducing the work efficiency. SUMMARY

[0003] To solve the above technical problems, the utility model provides a heat dissipation device of industrial computer to solve the technical problems of the prior art, that is, the traditional heat dissipation device is usually fixed with bolts, which makes the installation and disassembly process cumbersome and increases the time cost of maintenance and upgrading.

[0004] The purpose and effect of the heat dissipation device of the industrial computer are achieved by the following specific technical means:

[0005] A heat dissipation device of an industrial computer comprises a machine case, a mainboard is arranged in the machine case, a heat dissipation mechanism is arranged on the mainboard, the heat dissipation mechanism comprises a mounting bracket, the mounting bracket is connected with the mainboard through a quick release mechanism, a heat conduction plate is arranged at the bottom of the mounting bracket, a heat dissipation plate is arranged on the heat conduction plate, a cooling fan is arranged at the top of the mounting bracket, a cooling liquid tank is further arranged in the machine case, a noise reduction mechanism is arranged above the heat dissipation mechanism, the noise reduction mechanism comprises a sound-absorbing cotton layer, and the sound-absorbing cotton layer is arranged on the inner side of the machine case.

[0006] According to a preferred embodiment, the quick release mechanism comprises a clamping seat and a clamping column, the clamping seat is arranged at the bottom of the machine case, a clamping groove is arranged on the mainboard and the mounting bracket, the clamping column penetrates the mainboard and the mounting bracket through the clamping groove, and one end of the clamping column is clamped in the clamping seat.

[0007] According to a preferred embodiment, the clamping column and the clamping seat are in multiple groups, a spring is sleeved on the clamping column, limit blocks are arranged at both ends of the spring, and the limit blocks are fixedly connected with the mounting bracket and the clamping column, respectively.

[0008] According to a preferred embodiment, a limit groove is arranged on the clamping seat, a clamping block is arranged at one end of the clamping column, and the clamping block is clamped in the limit groove.

[0009] According to a preferred embodiment, a liquid cooling pipe is arranged in the heat-conducting plate, and the liquid cooling pipe is connected with the cooling liquid tank through a pipeline, and a micro pump is arranged on the pipeline.

[0010] According to a preferred embodiment, a plurality of heat dissipation fins are arranged on the heat dissipation plate, the heat dissipation fins are trapezoidal, and the heat dissipation fins are arranged along the length direction of the heat dissipation plate, and the heat dissipation fins are provided with sawtooth-shaped protrusions on both sides.

[0011] According to a preferred embodiment, the noise reduction mechanism further comprises a sound insulation felt layer and a sound insulation plate, the sound insulation plate is in contact with the inner side of the case, the sound insulation felt layer is arranged between the sound insulation plate and the sound-absorbing cotton layer, and the sound insulation plate, the sound-absorbing cotton layer and the sound insulation felt layer are connected through glue.

[0012] Compared with the prior art, the utility model has the advantages of the following beneficial effects:

[0013] 1、The utility model discloses a quick -detach mechanism's setting makes the user can install and detach the heat dissipation device fast conveniently, has promoted the maintenance efficiency of this device, when needing maintenance or upgrading, the user can make it from the card seat by pulling the card column, separates the mounting support with the mainboard, makes the user not need the tedious operation bolt, has saved time and energy, has improved the convenience of this device in maintenance and upgrading aspect, lets the user can manage and maintain the heat dissipation device of industrial computer.

[0014] 2、When using the device, the user can use the heat dissipation mode that the liquid cooling pipe is combined with the heat dissipation fan to improve the heat dissipation effect significantly, so that the industrial computer of the user can still keep good operating condition under high temperature environment, improve the heat dissipation performance of the device, then through the setting of the noise reduction mechanism, the device can reduce the noise generated in the heat dissipation process, create a quiet and comfortable working environment for the user, reduce the interference of noise to the operator, improve the performance of the device in the working environment comfort degree, thereby guaranteeing the work efficiency and physical and mental health of the operator. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the structure schematic diagram after the utility model is assembled;

[0016] Figure 2 It is the structure schematic diagram after the utility model is split;

[0017] Figure 3 It is Figure 2 The enlarged view of a area in figure 6;

[0018] Figure 4 It is the card column structure schematic diagram of the utility model;

[0019] Figure 5 is a fin structure schematic diagram of the utility model.

[0020] In the figure, the corresponding relationship of component name and drawing number is:

[0021] 11, case; 12, mainboard; 13, mounting bracket; 14, card seat; 15, card column; 16, spring; 17, limiting block; 18, heat conduction plate; 19, heat dissipation plate; 21, heat dissipation fan; 22, cooling liquid tank; 23, sound-absorbing cotton layer; 24, soundproof felt layer; 25, soundproof board; 26, liquid cooling pipe; 28, micro pump; 29, fin. DETAILED DESCRIPTION

[0022] The embodiment of the utility model will be further described in detail in combination with the drawings and examples. The following examples are used to illustrate the technical scheme of the utility model, but cannot be used to limit the protection scope of the utility model.

[0023] Embodiment:

[0024] As Figures 1 to 5 shown, the utility model provides a kind of heat dissipation device of industrial computer, including case 11, and case 11 provides the installation foundation for internal component.Case 11 is equipped with mainboard 12, and mainboard 12 carries important operation task as core component.Mainboard 12 is equipped with heat dissipation mechanism, and heat dissipation mechanism includes mounting bracket 13, by the setting of mounting bracket 13, entire heat dissipation component can be supported, so that user can confidently rely on its stability, improves the structural reliability of the device.Installing bracket 13 is connected with mainboard 12 by quick release mechanism, and quick release mechanism includes card seat 14 and card column 15, card seat 14 is located in the bottom of case 11, and mainboard 12 and mounting bracket 13 are equipped with clamping groove, card column 15 is penetrated mainboard 12 and mounting bracket 13 by clamping groove, and card column 15 one end is clamped in card seat 14.User can realize quick separation or connection of mounting bracket 13 and mainboard 12 by pulling card column 15, so that the device can quickly complete installation and disassembly, improve the convenience of the device maintenance and upgrade, improve the convenience of user operation.

[0025] As Figure 2 , 4As shown, the card column 15 and the card seat 14 are in multiple groups, the spring 16 is arranged on the card column 15, the spring 16 realizes the resilience of the card column 15, the limiting block 17 is arranged at both ends of the spring 16, and the limiting block 17 is fixedly connected with the mounting bracket 13 and the card column 15 respectively. By arranging the limiting block 17 at both ends of the spring 16 and fixing the limiting block 17 with the mounting bracket 13 and the card column 15 respectively, the device can ensure that the spring 16 remains stable during the extension and retraction process and does not deviate or fall off, thereby improving the stability and reliability of the structure of the device.

[0026] As shown in Figure 2 , 5 , the heat-conducting plate 18 is arranged at the bottom of the mounting bracket 13, has excellent heat-conducting performance, and can conduct heat. The heat-conducting plate 18 is provided with the heat-dissipating plate 19, the heat-dissipating plate 19 is provided with multiple groups of heat-dissipating fins 29, the heat-dissipating fins 29 are trapezoidal, the heat-dissipating fins 29 are arranged along the length direction of the heat-dissipating plate 19, and the heat-dissipating fins 29 are provided with sawtooth-shaped protrusions on both sides. The heat-dissipating fins 29 can increase the heat-dissipating area, improve the heat-dissipating efficiency, and improve the heat-dissipating performance of the device.

[0027] The mounting bracket 13 is provided with the heat-dissipating fan 21 at the top, which enhances air flow and accelerates heat dissipation. The cabinet 11 is also provided with the cooling liquid tank 22, the liquid cooling pipe 26 is arranged in the heat-conducting plate 18, the liquid cooling pipe 26 is connected with the cooling liquid tank 22 through a pipeline, and the pipeline is provided with the micro pump 28. The device can realize the circulation of the cooling liquid through the operation of the micro pump 28, so that the device can combine the advantages of air cooling and liquid cooling to further improve the heat-dissipating effect and ensure the stable operation of the industrial computer.

[0028] As shown in Figure 2 , 3 , the noise reduction mechanism is arranged above the heat-dissipating mechanism and includes the sound-absorbing cotton layer 23, which is arranged on the inner side of the cabinet 11 and can absorb part of the noise. The noise reduction mechanism also includes the soundproof felt layer 24 and the soundproof plate 25, the soundproof plate 25 is in contact with the inner side of the cabinet 11, the soundproof felt layer 24 is arranged between the soundproof plate 25 and the sound-absorbing cotton layer 23, and the soundproof plate 25 is connected with the sound-absorbing cotton layer 23 and the soundproof felt layer 24 through glue. Through the arrangement of these multiple layers of soundproof materials, the noise can be blocked and reduced, so that the user is not disturbed by the noise in the working environment, the use comfort of the device is improved, and the working experience of the user is improved.

[0029] The specific use mode and effect of the embodiment are as follows:

[0030] When the heat dissipation device needs to be installed for the industrial computer, the heat conduction plate 18 is first clamped at the bottom of the mounting bracket 13, then the mounting bracket 13 is aligned with the mainboard 12, the clamping column 15 is inserted into the clamping groove on the mounting bracket 13 through the mainboard 12, and one end of the clamping column 15 is clamped into the clamping seat 14, thereby completing the quick connection of the mounting bracket 13 and the mainboard 12. Start the micro pump 28 to make the cooling liquid circulate between the liquid cooling pipe 26 and the cooling liquid tank 22, and turn on the cooling fan 21.

[0031] During the operation of the computer, the heat dissipation fins 29 quickly dissipate heat, the cooling liquid in the liquid cooling pipe 26 absorbs heat, and the cooling fan 21 accelerates air flow, which together dissipate heat for the computer. When the heat dissipation device needs to be maintained or upgraded, pull the clamping column 15 to make it come out of the clamping seat 14, and the mounting bracket 13 can be quickly disassembled.

[0032] Through the quick disassembly mechanism, the time for installing and disassembling the heat dissipation device is shortened, the difficulty of maintenance and upgrading is reduced, and the work efficiency is improved. The liquid cooling pipe 26 and the cooling fan 21 are combined, and through the setting of the heat dissipation fins 29, the heat generated during the operation of the industrial computer can be timely taken away, so that the computer can stably operate in a high temperature environment, and the service life of the computer hardware is prolonged. The multi-layer noise reduction material setting of the sound-absorbing cotton layer 23, the soundproof felt layer 24 and the soundproof board 25 reduces the noise generated during the heat dissipation process, provides a quiet and comfortable working environment for the operator, and reduces the interference of noise on work.

[0033] The above shows and describes the basic principles and main features of the present application and the advantages of the present application. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments.

Claims

1. A heat dissipating device for an industrial computer, comprising a machine case (11) in which a main board (12) is arranged, characterized in that: The mainboard (12) is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a mounting bracket (13), the mounting bracket (13) is connected with the mainboard (12) through a quick release mechanism, the bottom of the mounting bracket (13) is provided with a heat conduction plate (18), the heat conduction plate (18) is provided with a heat dissipation plate (19), the top of the mounting bracket (13) is provided with a heat dissipation fan (21), the cabinet (11) is also provided with a cooling liquid tank (22), the heat dissipation mechanism is provided with a noise reduction mechanism, the noise reduction mechanism comprises a sound-absorbing cotton layer (23), and the sound-absorbing cotton layer (23) is located in the inside of the cabinet (11).

2. The heat dissipation device of an industrial computer according to claim 1, wherein: The quick release mechanism comprises a clamping seat (14) and a clamping column (15), the clamping seat (14) is located in the bottom of the cabinet (11), the mainboard (12) and the mounting bracket (13) are provided with clamping grooves, the clamping column (15) penetrates the mainboard (12) and the mounting bracket (13) through the clamping grooves, and one end of the clamping column (15) is clamped in the clamping seat (14).

3. The heat dissipation device of an industrial computer according to claim 2, wherein: The clamping column (15) and the clamping seat (14) are a plurality of groups, the clamping column (15) is provided with a spring (16), the spring (16) is provided with a limiting block (17) at both ends, and the limiting block (17) is fixedly connected with the mounting bracket (13) and the clamping column (15) respectively.

4. The heat dissipation device of an industrial computer according to claim 3, wherein: The clamping seat (14) is provided with a limiting groove, and one end of the clamping column (15) is provided with a clamping block.

5. The heat dissipating device for industrial computer as claimed in claim 1, wherein: The heat conduction plate (18) is provided with a liquid cooling pipe (26), the liquid cooling pipe (26) is connected with the cooling liquid tank (22) through a pipeline, and the pipeline is provided with a micro pump (28).

6. The heat dissipation device of an industrial computer according to claim 5, wherein: The heat dissipation plate (19) is provided with a plurality of heat dissipation fins (29), the heat dissipation fin (29) is a trapezoidal shape, the heat dissipation fin (29) is arranged along the length direction of the heat dissipation plate (19), and the heat dissipation fin (29) is provided with a sawtooth-shaped protrusion on both sides.

7. The heat dissipation device of an industrial computer according to claim 6, wherein: The noise reduction mechanism further comprises a sound insulation felt layer (24) and a sound insulation plate (25), the sound insulation plate (25) is in contact with the inside of the cabinet (11), the sound insulation felt layer (24) is arranged between the sound insulation plate (25) and the sound-absorbing cotton layer (23), and the sound insulation plate (25) is connected with the sound-absorbing cotton layer (23) and the sound insulation felt layer (24) through glue.

Images