Glue pouring heat dissipation structure and radio frequency power supply

Abstract

The utility model discloses a glue pouring heat radiation structure and a radio frequency power supply, the glue pouring heat radiation structure comprises a pedestal, two glue blocking plates and a heat conduction packaging layer, the two glue blocking plates are respectively arranged at the left side and the right side of the pedestal, and the two glue blocking plates and the pedestal are enclosed to form an accommodating cavity used for placing a transformer module; the heat conduction packaging layer is located in the containing cavity, and at least one part of the transformer module is wrapped by the heat conduction packaging layer. According to the design, the transformer module, the base, the rubber blocking plate and the heat conduction packaging layer are combined together to form an integral packaging unit, the heat conduction packaging layer can quickly conduct heat generated by the transformer module out through the high-heat-conduction filler contained in the heat conduction packaging layer, and heat is prevented from being accumulated in a heating element; the heat conduction packaging layer wraps at least one part of the transformer module, heat generated by the transformer module can be evenly dispersed to the whole heat conduction packaging layer, and the local overheating phenomenon is prevented.

Description

Technical Field

[0001] This utility model relates to the field of radio frequency power supply technology, and more specifically, to a potting heat dissipation structure and a radio frequency power supply. Background Technology

[0002] With the rapid development of RF power supply technology, RF electronic devices are gradually moving towards higher power, miniaturization, and integration. Along with these trends, the thermal management of electronic components has become increasingly important. Especially in high-density circuits, ineffective heat dissipation can severely impact device performance and lifespan.

[0003] In RF power supplies, the transformer module is one of the core components, responsible for converting the input voltage into an output voltage suitable for the load. Because RF power supplies need to handle high-frequency AC signals, the transformer module generates a significant amount of heat during operation. Specifically, the heat from the transformer module mainly comes from the following sources:

[0004] 1. When current flows through the transformer windings, the resistance of the wires causes energy loss, which is converted into heat;

[0005] 2. The magnetic core of a transformer will experience hysteresis loss and eddy current loss in a high-frequency alternating magnetic field, resulting in heat generation;

[0006] 3. The transformer module uses switching power supply technology, and the switching devices (such as MOSFETs, IGBTs, etc.) will also generate additional heat during the switching process.

[0007] In practical applications, the power modules and transformer modules of RF power supplies generate a significant amount of heat during operation, and the working environment often involves high voltage and high current. Currently, the transformer modules in 400K RF power supplies use air cooling, but the effect is unsatisfactory. The limitations of air cooling are mainly reflected in the following aspects:

[0008] 1. Air cooling relies on airflow to remove heat, but in high-density circuits, airflow is limited and the heat dissipation effect is not ideal. Especially in the small space inside the RF power supply, the heat dissipation efficiency will further decrease if the airflow design is unreasonable or the fan fails.

[0009] 2. In order to achieve miniaturization of radio frequency electronic devices, the fans in radio frequency power supply equipment are usually small and have limited air volume, which cannot meet the heat dissipation requirements of high-power transformer modules. The operating temperature of the transformer module of the radio frequency power supply can reach above 120°C, far exceeding its normal operating temperature range (usually below 80°C). High temperature will not only affect the performance of the transformer, but also accelerate the aging of components and shorten the service life of the equipment.

[0010] 3. In high-power transformer modules, heat is not evenly distributed across all areas, but rather concentrated in certain critical components (such as the magnetic core and winding joints). Air cooling typically relies on overall airflow, making it difficult to effectively dissipate heat from localized hotspots. Therefore, even if the fan provides sufficient airflow, it cannot effectively reduce the temperature of these hotspots. Utility Model Content

[0011] In order to overcome the shortcomings of the prior art, this utility model provides a potting heat dissipation structure. Through the high thermal conductivity filler contained therein, it can quickly dissipate the heat generated by the components, thereby ensuring the stable operation of the equipment under high load. It has good coverage and heat dissipation efficiency and can evenly distribute heat to the entire encapsulation layer.

[0012] The technical solution of this utility model is as follows: a potting heat dissipation structure, comprising:

[0013] Base

[0014] Two baffles are respectively disposed on the left and right sides of the base, and the two baffles and the base together form a cavity for placing the transformer module.

[0015] A thermally conductive encapsulation layer is located within the accommodating cavity and surrounds at least a portion of the transformer module.

[0016] Furthermore, the transformer module includes a mounting plate and a magnetic assembly mounted on the mounting plate. The magnetic assembly is provided in at least two sets, each magnetic assembly including a first E-shaped magnetic core and a second E-shaped magnetic core. The first E-shaped magnetic core is disposed on one side of the mounting plate, and the second E-shaped magnetic core is disposed on the other side of the mounting plate. The first E-shaped magnetic core and the second E-shaped magnetic core are in contact through a through hole on the mounting plate.

[0017] Furthermore, the base includes a base plate, two first side plates located on the left and right sides of the base plate, and two second side plates located at the front and rear ends of the base plate. The first side plates extend along the length direction of the base plate, and the second side plates extend along the width direction of the base plate. There is a gap between the first side plates and the baffle plate, which allows the mounting plate to pass through.

[0018] Furthermore, the base plate, the first side plate, and the second side plate are an integral structure.

[0019] Furthermore, it also includes at least one horizontal bar disposed within the accommodating cavity. One end of the horizontal bar is a fixed end, and the other end of the horizontal bar is a suspended end. The lower end face of the horizontal bar is in contact with the magnetic assembly.

[0020] Furthermore, the second side plate includes a vertically arranged plate body and an extension formed by the upper end of the plate body extending in a horizontal direction. The plate body and the bottom plate are fixedly connected. The extension is provided with a plurality of fasteners, which pass through the extension and abut against the crossbar.

[0021] Furthermore, the thermally conductive encapsulation layer is a thermally conductive electronic potting compound.

[0022] In addition, this utility model also provides an radio frequency power supply, including the above-mentioned potting heat dissipation structure.

[0023] The advantages of this utility model based on the above solution are as follows:

[0024] (1) The present invention provides a potting heat dissipation structure, comprising a base, two baffles, and a thermally conductive encapsulating layer. The two baffles are respectively disposed on the left and right sides of the base, and the two baffles and the base form a cavity for placing a transformer module. The thermally conductive encapsulating layer is located in the cavity and surrounds at least a portion of the transformer module. This design combines the transformer module, the base, the baffles, and the thermally conductive encapsulating layer into a single encapsulation unit. The thermally conductive encapsulating layer, through its highly thermally conductive filler, can quickly conduct the heat generated by the transformer module away, preventing heat accumulation inside the heat-generating element. Furthermore, by surrounding at least a portion of the transformer module, the thermally conductive encapsulating layer can evenly distribute the heat generated by the transformer module throughout the entire thermally conductive encapsulating layer, preventing localized overheating.

[0025] (2) The potting heat dissipation structure provided by this utility model, compared with the traditional point-to-point heat dissipation method, can cover the surface area of ​​the transformer module with the thermally conductive encapsulation layer, ensuring that the heat is evenly distributed in the entire structure, thereby improving the heat dissipation efficiency and ensuring that the equipment operates stably under high load.

[0026] (3) The potting heat dissipation structure provided by this utility model provides an installation space for the transformer module by forming an accommodating cavity with a baffle plate and a base. The thermally conductive encapsulating layer is filled in the accommodating cavity to firmly wrap the transformer module and prevent it from shifting or vibrating during operation. Secondly, the thermally conductive encapsulating layer has a certain degree of flexibility, which can absorb external vibration and impact to a certain extent, reduce the impact of mechanical stress on the transformer module, and help extend the service life of the RF power supply. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the base structure in an embodiment of the present utility model;

[0029] Figure 2 This is a schematic diagram of the potting heat dissipation structure in an embodiment of the present utility model;

[0030] Figure 3 This is an exploded view of the potting heat dissipation structure in the embodiment of this utility model.

[0031] In the diagram, 1. Base; 11. Base plate; 12. First side plate; 13. Second side plate; 131. Plate body; 132. Extension; 14. Fixing hole; 15. Fixing stud; 2. Baffle plate; 3. Transformer module; 31. Mounting plate; 32. Magnetic assembly; 321. First E-shaped magnetic core; 322. Second E-shaped magnetic core; 4. Horizontal bar; 5. Fastener. Detailed Implementation

[0032] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of the present invention by way of example, but should not be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments.

[0033] To better understand this utility model, the following description, in conjunction with the accompanying drawings and embodiments, will further illustrate the present utility model:

[0034] See Figures 1-2 As shown in the figure, the present invention provides a potting heat dissipation structure, including a base 1, two baffle plates 2 and a thermally conductive encapsulation layer.

[0035] Two baffle plates 2 are respectively disposed on the left and right sides of the base 1, and the two baffle plates 2 and the base 1 form a cavity for placing the transformer module 3; the thermally conductive encapsulating layer is located in the cavity and surrounds at least a part of the transformer module 3.

[0036] Specifically, two baffle plates 2 are respectively set on the left and right sides of the base 1, and the two baffle plates 2 and the base 1 form an accommodating cavity. This design can provide an installation position for the transformer module 3 on the one hand, and facilitate the injection of thermally conductive electronic potting compound on the other hand. After the thermally conductive electronic potting compound cools and solidifies, it forms a thermally conductive encapsulation layer wrapped around the surface of the transformer module 3.

[0037] See Figures 2-3 As shown in the figure, the potting heat dissipation structure provided by this utility model combines the transformer module 3, the base 1, the baffle plate 2 and the thermally conductive encapsulation layer to form an integral encapsulation unit. The thermally conductive encapsulation layer, through its high thermal conductivity filler, can quickly conduct the heat generated by the transformer module 3 away, avoiding the accumulation of heat inside the heat-generating element. Secondly, the thermally conductive encapsulation layer surrounds at least a part of the transformer module 3, which can evenly distribute the heat generated by the transformer module 3 to the entire thermally conductive encapsulation layer, preventing local overheating.

[0038] Compared to traditional point-to-point heat dissipation methods, the thermally conductive encapsulation layer can cover the surface area of ​​transformer module 3, ensuring that heat is evenly distributed throughout the structure, thereby improving heat dissipation efficiency and ensuring stable operation of the equipment under high load.

[0039] It is worth mentioning that the cavity formed by the baffle plate 2 and the base 1 provides installation space for the transformer module 3. The thermally conductive encapsulation layer fills the cavity to firmly encapsulate the transformer module 3, preventing displacement or vibration during operation. Secondly, the thermally conductive encapsulation layer has a certain degree of flexibility, which can absorb external vibration and impact to a certain extent, reducing the impact of mechanical stress on the transformer module 3 and helping to extend the service life of the RF power supply.

[0040] See Figure 3 As shown, the transformer module 3 includes a mounting plate 31 and a magnetic assembly 32 mounted on the mounting plate 31. The magnetic assembly 32 is provided with at least two sets, including a first E-shaped magnetic core 321 and a second E-shaped magnetic core 322. The first E-shaped magnetic core 321 is provided on one side of the mounting plate 31, and the second E-shaped magnetic core 322 is provided on the other side of the mounting plate 31. The first E-shaped magnetic core 321 and the second E-shaped magnetic core 322 are in contact with each other through a through hole on the mounting plate 31.

[0041] It should be noted that the number of magnetic groups 32 in this embodiment includes, but is not limited to, two groups. Those skilled in the art can choose the number of magnetic groups 32 according to actual production needs, which will not be elaborated here.

[0042] See Figures 1-2As shown, the base 1 includes a base plate 11, two first side plates 12 located on the left and right sides of the base plate 11, and two second side plates 13 located at the front and rear ends of the base plate 11. The first side plates 12 extend along the length of the base plate 11, and the second side plates 13 extend along the width of the base plate 11. There is a gap between the first side plates 12 and the baffle plate 2 to allow the mounting plate 31 to pass through. The base plate 11, the first side plates 12, and the second side plates 13 are integrally formed. This design eliminates the joints between components, enhancing the overall stability and structural strength of the base 1.

[0043] In this embodiment, the potting heat dissipation structure further includes at least one horizontal strip 4, which is disposed within the accommodating cavity. One end of the horizontal strip 4 is a fixed end, and the other end is a suspended end. The lower end face of the horizontal strip 4 is in contact with the magnetic assembly 32. Specifically, the main function of the horizontal strip 4 provided in this embodiment is to apply a certain pressure by contacting the magnetic assembly 32 with its lower end face, ensuring that the magnetic assembly 32 does not shift or vibrate during operation. It should be noted that the number of horizontal strips 4 in this embodiment can be selected according to actual production needs, and this application will not elaborate further.

[0044] See Figure 1 As shown, the second side plate 13 includes a vertically arranged main body 131 and an extension 132 extending horizontally from the upper end of the main body 131. The main body 131 and the base plate 11 are fixedly connected. Multiple fasteners 5 are provided on the extension 132, and the multiple fasteners 5 pass through the extension 132 and abut against the crossbar 4. With this design, the clamping force of the crossbar 4 on the magnetic assembly 32 can be controlled by adjusting the screw-in depth of the fasteners 5 above the suspended end of the crossbar 4.

[0045] Specifically, the fastener 5 passes through the extension 132 and abuts against the crossbar 4. By rotating the fastener 5, the descent height of the suspended end of the crossbar 4 can be adjusted, thereby changing the pressure of the crossbar 4 on the magnetic assembly 32. This design allows for flexible adjustment of the clamping force according to actual conditions, thus adapting to different installation requirements. Secondly, the connection and cooperation between the fastener 5, the extension 132, and the crossbar 4 not only provides a clamping effect on the magnetic assembly 32 but also prevents the crossbar 4 from shaking during operation. Especially in high-vibration environments, the fastener 5 ensures that the crossbar 4 always maintains a stable clamped state.

[0046] In this embodiment, the thermally conductive encapsulation layer is a thermally conductive electronic potting compound, and the base 1 is made of aluminum alloy.

[0047] To further illustrate this point, this embodiment also provides a method for manufacturing a potting heat dissipation structure, as detailed below:

[0048] Step 1: Manufacture base 1, which has fixing holes 14 and fixing studs 15.

[0049] Step 2: Install the transformer module onto the base 1, and lock the transformer module and the base shell together with screws. Then install the crossbar 4, and adjust the screwing depth of the fastener 5 above the suspended end of the crossbar 4 to control the crossbar 4 to press the magnetic assembly 32.

[0050] Step 3: Place the baffle plates 2 on both sides of the base 1 and fix them to the base 1 with screws to assemble an integral part with an internal accommodating cavity. Then pour thermal conductive gel into the accommodating cavity. After the thermal conductive gel is left for half an hour, it cools and solidifies to form a thermally conductive encapsulating layer.

[0051] It should be noted that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art, or the orientation or positional relationship that the product is usually placed in during use. It is only for the purpose of facilitating the description of this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0052] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0053] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.

Claims

1. A glue-filling heat dissipation structure, characterized in that, The application relates to a transformer module and a filling structure thereof. The application relates to a transformer module and a filling structure thereof. The application relates to a transformer module and a filling structure thereof. The application relates to a transformer module and a filling structure thereof.

2. The glue-filling heat radiating structure according to claim 1, wherein: The application relates to a transformer module and a filling structure thereof.

3. The glue-filling heat dissipation structure according to claim 2, wherein: The application relates to a transformer module and a filling structure thereof.

4. The glue-filling heat radiating structure according to claim 3, wherein: The application relates to a transformer module and a filling structure thereof.

5. The glue-filling heat radiating structure according to claim 3, wherein: The application relates to a transformer module and a filling structure thereof.

6. The glue-filling heat dissipation structure according to claim 5, wherein: The application relates to a transformer module and a filling structure thereof.

7. The glue-filling heat radiating structure according to claim 4, wherein: The application relates to a transformer module and a filling structure thereof.

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