Air guide cushion plate

Abstract

The utility model discloses an air guide cushion plate which comprises a base plate and a supporting frame, and the supporting frame protrudes out of the top face of the base plate and divides the top of the base plate into a plurality of working areas. Each working area is provided with a plurality of support columns, the support frame and the plurality of support columns are used for jointly supporting a circuit board to be plugged, and the width of the support frame is greater than the diameter of the support columns; an air guide groove is formed in the supporting frame and communicated with the working area. According to the air guide cushion plate, the supporting frame is matched with the supporting columns to support the circuit board, and the supporting frame divides the top of the substrate into a plurality of working areas; when the hole plugging work is carried out, the partial structure of the supporting frame corresponding to the working area is used for supporting, and the supporting columns in the working area are used for auxiliary supporting, so that the supporting strength of the air guide cushion plate on the circuit board is improved, and the stability and precision in the machining process are improved; acting force is dispersed, and the falling risk of the supporting column is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a circuit board processing technical field especially relates to a guide air cushion plate. BACKGROUND

[0002] The resin hole filling process is to fill the metalized hole or the local metalized hole of the printed circuit board with the resin ink with insulation performance, in the related technology, the guide air cushion plate is processed by drilling on the epoxy resin plate material, since the hole number of the cushion plate needs to be consistent with the hole filling hole number, the hole filling number is usually tens of thousands or hundreds of thousands, so that the space capable of designing the support point position is limited, and the size of the support point position is small. SUMMARY

[0003] The utility model discloses at least one of the technical problems in the prior art is solved, for this, the utility model provides a guide air cushion plate, can pass through the support frame of bigger size and carry out auxiliary support, thereby improving the support strength of the guide air cushion plate to the circuit board, avoid the force concentration in the support column, reduce the falling risk of the support column.

[0004] According to the first aspect embodiment of the utility model's guide air cushion plate, the guide air cushion plate includes the substrate and the support frame, the support frame protrudes from the top surface of the substrate, and separates the top of the substrate into multiple work areas, each work area is provided with multiple support columns, the support frame and multiple support columns are used for jointly supporting the hole filling circuit board, and the width size of the support frame is greater than the size of the support column, a guide groove is formed in the support frame, and the guide groove is communicated with the work area.

[0005] According to the guide air cushion plate of the utility model embodiment, at least has the following beneficial effects: the support frame and the support column cooperate to support the circuit board in the embodiment, the support frame separates the top of the substrate into multiple work areas, when the hole filling work is carried out, the part structure of the support frame corresponding to the work area is supported, and the support column in the work area is assisted to support, thereby improving the support strength of the guide air cushion plate to the circuit board, improving the stability and precision in the processing process, and dispersing the acting force, reducing the falling risk of the support column.

[0006] According to some embodiments of the utility model, the substrate is rectangular, the support frame includes a first support part and multiple second support parts, the first support part is arranged along the edge of the substrate, multiple second support parts are arranged in parallel, and the end of the second support part is connected with the first support part, or multiple second support parts are arranged staggeredly, and the end of the second support part is connected with the first support part or another second support part.

[0007] According to some embodiments of the utility model, the air guide groove includes a first air guide groove and a second air guide groove; the first air guide groove is arranged on the first support part, and the first air guide groove is communicated with the working area adjacent to the first support part; the second air guide groove is arranged on the second support part, and the second air guide groove is communicated with two adjacent working areas.

[0008] According to some embodiments of the utility model, the width of the first support part is not less than 20 mm, or the width of the second support part is not less than 20 mm.

[0009] According to some embodiments of the utility model, the substrate, the support frame and the plurality of support columns are integrated metal pieces.

[0010] According to some embodiments of the utility model, the substrate, the support frame and the plurality of support columns are integrated copper pieces, and a side surface of the integrated copper piece is etched to form the support frame and the support columns.

[0011] According to some embodiments of the utility model, the diameter of the support column is not less than 0.4 mm.

[0012] According to some embodiments of the utility model, the height of the support column protruding from the substrate is 0.9 mm to 1.1 mm.

[0013] According to some embodiments of the utility model, the support frame is provided with a plate taking groove on each of two opposite sides, and the minimum distance between the two plate taking grooves is less than the side length of the hole insertion circuit board.

[0014] According to some embodiments of the utility model, the bottom surface of the substrate is provided with a first positioning hole for a positioning pin on a table surface of a hole insertion device when the air guide backing plate is placed on the table surface; or the top surface of the substrate or the top surface of the support frame is provided with a second positioning hole for installing a pin shaft to position the hole insertion circuit board.

[0015] Additional aspects and advantages of the utility model will be given in part in the following description, part will become obvious from the following description, or be understood through the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0016] The utility model will be further described below in combination with the drawings and embodiments, wherein:

[0017] Figure 1 It is the structure schematic view of air guide backing plate in the utility model embodiment;

[0018] Figure 2 It is Figure 1 It is the local enlarged view of area A;

[0019] Figure 3 Figure 1 is a sectional structure schematic view of a guide air cushion plate applied to a hole plugging device in the embodiment of the present application.

[0020] Reference signs:

[0021] 100, guide air cushion plate;

[0022] 10, base plate; 11, working area;

[0023] 21, support frame; 211, first support part; 212, second support part; 22, guide air groove; 221, first guide air groove; 222, second guide air groove; 23, plate taking groove;

[0024] 30, support column;

[0025] 41, first positioning hole; 42, second positioning hole;

[0026] 200, hole plugging device;

[0027] 300, circuit board;

[0028] 400, positioning pin;

[0029] 500, pin shaft. DETAILED DESCRIPTION

[0030] The embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only, and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0031] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as a limitation of the present application.

[0032] In the description of the present application, the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, more than, etc. are understood as not including the number, above, below, etc. are understood as including the number. If it is described as first, second, it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of indicated technical features.

[0033] In the description of the utility model, unless otherwise expressly limited, the words such as setting, installing, connecting should be understood broadly, and the skilled in the art can determine the specific meaning of the above words in the utility model according to the specific content of the technical scheme.

[0034] In the description of the utility model, the description of the reference terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0035] The application provides a kind of air guide cushion plate, as shown in Figures 1 to 3 As shown in the drawings, in some embodiments, the air guide cushion plate 100 includes a base plate 10 and a support frame 21, the base plate 10 provides a stable installation base for the support frame 21 and the support column 30, and also serves as the main part of the entire air guide cushion plate 100, bearing all the weight and stress of the circuit board 300 during the processing. The support frame 21 protrudes from the top surface of the base plate 10 and separates the top of the base plate 10 into multiple work areas 11; each work area 11 is provided with multiple support columns 30, and the support frame 21 and the multiple support columns 30 jointly support the circuit board (hereinafter referred to as the circuit board 300), and the width of the support frame 21 is greater than the diameter of the support column 30; the support frame 21 is provided with air guide grooves 22, which are in communication with the work areas 11, and the air guide grooves 22 can guide the gas in the hole on the circuit board 300 during the hole plugging process to flow from the work area 11 to the outside, thereby reducing the generation of bubbles and voids and improving the quality and efficiency of hole plugging.

[0036] In this embodiment, when plugging holes in the circuit board 300, the circuit board 300 is placed on the air guide cushion plate 100. The support frame 21 and the support column 30 of the air guide cushion plate 100 jointly support the circuit board 300, specifically, the support frame 21 separates the top of the base plate 10 into multiple work areas 11, thereby forming multiple support areas for the circuit board 300; the width of the support frame 21 is greater than the size of the support column 30, which can resist greater external forces. The support column 30 provides additional support points for the circuit board 300 based on the support frame 21. These support points can disperse the force, further enhancing the stability of the structure. Compared with the traditional scattered point-shaped support points, the support frame 21 and the support column 30 jointly form a stable support system in this embodiment, thereby improving the support strength of the air guide cushion plate 100 on the circuit board 300 and improving the stability and precision during the processing; and avoiding the concentration of force on a few support columns, reducing the risk of falling of the support points.

[0037] Although the support part is provided with the air guide groove 22, the size of the continuous structure on the support part is much larger than the size of the support column 30, and the overall stability and rigidity of the support part are better than those of the conventional scattered point-shaped support points, thereby preventing the support part and the support column 30 from being deformed or damaged due to uneven stress during processing.

[0038] The support column 30 is generally provided in a cylindrical shape, the extension length of the support frame 21 is greater than the diameter of the support column 30, the size of the support frame 21 perpendicular to the extension direction is the width of the support frame 21, and the width of the support frame 21 is also greater than the diameter of the support column 30. The distribution of the support column 30 is designed according to the holes on the circuit board 300, and in other embodiments, the support column 30 can also adopt other regular or irregular shapes.

[0039] The circuit board 300 is generally rectangular, and the corresponding substrate 10 can also be designed as a rectangle. It can be understood that in the case of a circular or other shape of the circuit board 300, the shape of the substrate 10 should also be adjusted accordingly to ensure matching with the circuit board 300. It should be noted that the size of the substrate 10 should be greater than that of the circuit board 300. Hereinafter, the substrate 10 is taken as an example of a rectangle for description.

[0040] The support frame 21 includes a first support part 211 and a plurality of second support parts 212. The first support part 211 is arranged along the edge of the substrate 10 to form a ring-shaped structure, specifically, the first support part 211 is arranged along the edge of the substrate 10 to form a rectangular frame, and the first support part 211 includes a horizontal beam and a vertical beam. At least part of the second support part 212 is connected with the first support part 211 to divide the top of the substrate 10 into a plurality of work areas 11. The second support part 212 can have a plurality of connection modes, for example, both ends of the second support part 212 can be connected with the first support part 211; one end of the second support part 212 can be connected with the first support part 211 and the other end can be connected with another second support part 212; both ends of the second support part 212 can be connected with one second support part 212 respectively.

[0041] In the case of a rectangular substrate 10, the plurality of second support parts 212 can be arranged in parallel, for example, the second support part 212 can be parallel to the horizontal beam or parallel to the vertical beam, so as to divide the top of the substrate 10 into a plurality of work areas 11 along a certain direction.

[0042] The plurality of second support parts 212 can also be arranged in a staggered manner, for example, part of the second support parts 212 are parallel to the horizontal beam and part of the second support parts 212 are parallel to the vertical beam, so as to divide the top into a plurality of rectangular work areas 11 arranged in an array.

[0043] It should be noted that the second support part 212 can also be arranged at an angle with the cross beam or the longitudinal beam, and the present application does not limit this. The number and layout of the second support part 212 can be designed according to the size, shape and working requirements of the circuit board 300.

[0044] In some embodiments, the substrate 10 is rectangular, and the first support part 211 is arranged along the edge of the substrate 10 to form a rectangular frame, and the first support part 211 includes a cross beam and a vertical beam. The number of the second support part 212 is two, one of which is parallel to the cross beam and connected to the two longitudinal beams at both ends; the other is parallel to the longitudinal beam and connected to the two cross beams at both ends; that is, the two second support parts 212 form a cross shape, and the entire support frame 21 forms a Chinese character field shape. When the circuit board 300 is placed on the air guide pad 100, the circuit board 300 can be pressed by the roller at the part corresponding to the second support part 212, so as to avoid the circuit board 300 from being deviated during the jack processing.

[0045] It should be noted that the part of the working area 11 corresponding to the circuit board 300 is the actual product area, so that the roller does not contact the product area of the circuit board 300, thereby reducing the risk of foreign matter polluting the product surface.

[0046] The first support part 211 and the second support part 212 can each form an air guide groove 22. For the convenience of description, the air guide groove 22 on the first support part 211 is defined as the first air guide groove 221, and the air guide groove 22 on the second support part 212 is defined as the second air guide groove 222. The air guide groove 22 on the first support part 211 can communicate the working area 11 located at the edge with the outside, and the air guide groove 22 on the second support part 212 can communicate two adjacent working areas 11. Thus, each working area 11 can be communicated with the outside through the air guide groove 22 and the adjacent working area 11.

[0047] In order to ensure the support strength of the support part to the circuit board 300, the width of the first support part 211 is not less than 20 mm, and the width of the second support part 212 is not less than 20 mm.

[0048] In some embodiments, the opposite sides of the support frame 21 are respectively provided with a plate taking groove 23, and the minimum distance between the two plate taking grooves 23 is less than the side length of the circuit board 300. When the circuit board 300 is placed on the air guide pad 100, the two side edges of the circuit board 300 are pressed on the plate taking groove 23, so that a certain gap is formed between the bottom surface of the circuit board 300 and the bottom wall of the plate taking groove 23, facilitating manual taking or mechanical clamp taking, avoiding the circuit board 300 from slipping on the surface of the air guide pad 100 when the circuit board 300 is taken or placed, and reducing the risk of the ink in the hole of the circuit board 300 contacting the air guide pad 100.

[0049] The depth of the plate taking groove 23 is greater than or equal to 1 mm, which provides sufficient space for taking and placing the circuit board 300.

[0050] In some embodiments, the bottom surface of the substrate 10 has a first positioning hole 41, the air guide pad 100 is installed on the table surface of the jack device 200, and the positioning pin 400 on the table surface of the jack device 200 passes through the first positioning hole 41. When the air guide pad 100 is placed on the table surface of the jack device 200, the first positioning hole 41 is used for the positioning pin 400 on the table surface to pass through; improve the accurate position and stability of the air guide pad 100 on the device, thereby improving the processing precision and work efficiency.

[0051] The diameter of the first positioning hole 41 can be set to 4 mm, and the number of the first positioning hole 41 can be 6. The 6 first positioning holes 41 are respectively matched with the positioning pins 400 on the table surface of the jack device 200. The 6 first positioning holes 41 are divided into two groups, each group including 3 first positioning holes 41, and the 3 first positioning holes 41 in the same group are arranged at intervals. The two groups of first positioning holes 41 are respectively arranged close to the opposite edges of the substrate 10. Such a layout can not only ensure the stability of the air guide pad 100 in the horizontal direction, but also tolerate small errors in the processing or installation process to some extent.

[0052] In some embodiments, the top surface of the substrate 10 or the top surface of the support frame 21 has a second positioning hole 42, which can be matched with a pin shaft 500. The pin shaft 500 is partially exposed to the second positioning hole 42, and the structure of the pin shaft 500 exposed to the second positioning hole 42 is used for positioning the circuit board 300, so that the position of the support column 30 matches the position of the hole on the circuit board 300, avoiding misalignment and deviation of the circuit board 300 during processing.

[0053] The diameter of the second positioning hole 42 is 2 mm, and the number of the second positioning hole 42 is 3 or more. The specific number can be adjusted according to the size and shape of the circuit board 300. Through the cooperation of multiple second positioning holes 42 and the pin shaft 500, the circuit board 300 can remain stable during processing and is not easy to displace due to vibration or external force interference, thereby ensuring the processing quality.

[0054] In some embodiments, the number of second positioning holes 42 is 5, of which four positioning holes correspond to the four corners of the circuit board 300, respectively, for ensuring the stable positioning of the circuit board 300 in the horizontal direction. In addition, one positioning hole can correspond to the center position of the circuit board 300, or two positioning holes can be arranged on one corner to increase stability.

[0055] The substrate 10, the support frame 21 and the plurality of support columns 30 are an integral metal piece, that is, the whole air guide pad 100 is an integral metal piece. The integral metal piece eliminates the joint surface problems caused by traditional connection methods such as welding and bolt connection between the substrate 10, the support frame 21 and the support columns 30. The continuity of the metal material ensures the strength and rigidity of the whole structure, so that the connection between the support columns 30 and the substrate 10 is more firm and reliable. The risk of falling of the support columns 30 due to loosening or external force is reduced.

[0056] Furthermore, compared with the multilayer structure such as the copper-clad plate, the integral structure is less likely to have problems such as warping of the plate surface. The actual measured CPK of the copper thickness after grinding can reach 1.67, which can better contact the support circuit board 300, thereby supporting the circuit board 300 and avoiding deformation of the circuit board 300.

[0057] The substrate 10, the support frame 21 and the plurality of support columns 30 are an integral copper piece. The support frame 21 and the support columns 30 are etched on one side surface of the integral copper piece. The etching process applied on the integral copper piece can accurately form the shape and size of the support frame 21 and the support columns 30, meeting the requirements of high-precision processing. In addition, the etching process forms structural burrs, batch edges and other abnormalities, which is beneficial to provide the surface of the support columns 30 and avoid scratching the circuit board 300. Through the etching process, the unetched part of the integral copper piece forms the support frame 21 and the support columns 30. The etching also forms gap spaces such as the air guide groove 22, the gap between the support columns 30 and the support columns 30, and the gap between the support columns 30 and the support frame 21, thereby realizing the air guide function. Compared with the traditional air guide holes opposite to the holes on the circuit board 300, the etching process has higher efficiency.

[0058] Since the air guide groove 22 and the support columns 30 are both formed by etching, the depth of the air guide groove 22 should be consistent with the protruding height of the support columns 30. That is, the bottom wall of the air guide groove 22 and the top surface of the substrate 10 tend to be coplanar, which is beneficial to form a smooth air guide path.

[0059] It can be understood that the depth of the air guide groove 22 and the protruding height of the support columns 30 can also be inconsistent in the region by using a partition etching method or using different etching parameters. The present embodiment does not limit this.

[0060] In the prior art, the epoxy resin pad is usually processed by machining air guide holes opposite to the holes on the circuit board 300 one by one. The actual number of drilled holes is 881348, and the processing efficiency is 10000 holes / h. Therefore, the total processing time is 3.67 days. However, by using the etching process in the present embodiment, the processing time is only 4h, which is 3.51 days shorter than the traditional method, and the processing time is shortened by 95.4%.

[0061] The minimum diameter of the support column 30 formed by etching processing can be 0.40 mm. In the hole plugging process, the support column 30 can be added in a place where a support point cannot be formed in a traditional manner due to the small minimum support point. In the embodiment, the number of support columns 30 is increased by 15%. The increased number of support columns 30 can better support the circuit board 300, thereby improving the uniformity of the hole plugging oil.

[0062] In a traditional scheme of processing a gas guide hole opposite to each hole on the circuit board 300, the size of the minimum support point is 0.6 mm. When the minimum distance between two holes on the circuit board 300 is less than 1.6 mm, a support point cannot be set. In the embodiment, the support column 30 can still be set when the minimum distance between two holes on the circuit board 300 is 1.4 mm to 1.6 mm.

[0063] In other embodiments, the support frame 21 and the support column 30 can also be formed by material removal processing of an integral metal piece, such as laser processing. The support column 30 can also be set as a circular truncated cone with a small upper part and a large lower part. In this way, the connection strength of the support column 30 can be improved without changing the distance between the edge of the support column 30 in contact with the circuit board 300 and the edge of the hole on the circuit board 300. The risk of the support column 30 falling off is reduced, which is beneficial to improve the service life of the gas guide pad 100.

[0064] The overall thickness of the gas guide pad 100 is 3 mm, which ensures that the gas guide pad 100 has sufficient strength and stability during installation and use. The protruding height of the support column 30 is 1 mm, which ensures that the bottom surface of the circuit board 300 and the top surface of the base plate 10 have sufficient gaps, which is beneficial to the exhaust of gas.

[0065] In actual application, a certain tolerance range is allowed, i.e., the protruding height of the support column 30 can be between 0.9 mm and 1.1 mm.

[0066] The embodiments of the utility model are described in detail above in combination with the drawings, but the utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the purpose of the utility model. In addition, the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.

Claims

1. A gas guide pad characterized by, Comprising a substrate; a support frame protruding from a top surface of the substrate and separating a top portion of the substrate into a plurality of work areas; each of the work areas is provided with a plurality of support columns, the support frame and the plurality of support columns are used to jointly support a to-be-punched circuit board, and a width dimension of the support frame is greater than a dimension of the support columns; a gas guide groove is formed in the support frame, and the gas guide groove is in communication with the work areas.

2. The airway cushion plate of claim 1, wherein, The substrate is rectangular, the support frame includes a first support portion and a plurality of second support portions, and the first support portion is arranged along an edge of the substrate; the plurality of second support portions are arranged in parallel, and end portions of the second support portions are connected to the first support portion; or, the plurality of second support portions are arranged in a staggered manner, and end portions of the second support portions are connected to the first support portion or to another second support portion.

3. The airway cushion plate of claim 2, wherein, The gas guide groove includes a first gas guide groove and a second gas guide groove; the first gas guide groove is arranged in the first support portion, and the first gas guide groove is in communication with the work area adjacent to the first support portion; the second gas guide groove is arranged in the second support portion, and the second gas guide groove is in communication with two adjacent work areas.

4. The airway cushion plate of claim 2, wherein, The width of the first support portion is not less than 20 mm, or the width of the second support portion is not less than 20 mm.

5. The airway cushion of claim 1, wherein The substrate, the support frame, and the plurality of support columns are an integral metal piece.

6. The airway cushion plate of claim 5, wherein, The substrate, the support frame, and the plurality of support columns are an integral copper piece, and a side surface of the integral copper piece is etched to form the support frame and the support columns.

7. The airway cushion plate of any one of claims 1 to 6, wherein, The diameter of the support column is not less than 0.4 mm.

8. The airway cushion plate of any one of claims 1 to 6, wherein, The height of the support column protruding from the substrate is 0.9 mm to 1.1 mm.

9. The airway cushion plate of any one of claims 1 to 6, wherein, The support frame is provided with a plate taking groove on each of two opposite sides, and the minimum distance between the two plate taking grooves is less than the side length of the to-be-punched circuit board.

10. The airway cushion plate of any one of claims 1 to 6, wherein, The bottom surface of the substrate has a first positioning hole for a positioning pin on a table surface of a punching device when the gas guide backing plate is placed on the table surface; or, the top surface of the substrate or the top surface of the support frame has a second positioning hole for a mounting pin shaft to position the to-be-punched circuit board.

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