High-efficiency heat dissipation shell of bidirectional wireless image transmission circuit board
By designing a high-efficiency heat dissipation shell for the two-way wireless image transmission circuit board made of metal, and adopting a fan and multi-airflow structure, the problem of poor heat dissipation of the equipment was solved, achieving efficient heat dissipation and lightweight design, and ensuring stable operation of the equipment.
Patent Information
- Application Number
- CN202520043074.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2035-01-09
AI Technical Summary
The heat dissipation casing of existing two-way wireless image transmission equipment cannot simultaneously meet the requirements of small size, light weight and efficient heat dissipation, resulting in excessively high equipment temperature, affecting transmission efficiency and even burning out the equipment.
A high-efficiency heat dissipation shell for a two-way wireless image transmission circuit board was designed. The shell is made of metal and has a built-in fan and multi-channel structure. Combined with heat dissipation holes and air channels, heat can be dissipated quickly. The fan airflow is introduced into the heat dissipation channels to reduce the weight of the shell.
It improves heat dissipation efficiency, reduces equipment weight, and ensures that the equipment avoids overheating while achieving miniaturization and efficient transmission, thus extending the equipment's service life.
Smart Images

Figure CN223772372U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of circuit board heat dissipation technology, and in particular relates to a high-efficiency heat dissipation shell for a two-way wireless image transmission circuit board. Background Technology
[0002] The two-way wireless video transmission device is a wireless transceiver specifically designed for automobiles, robots, drones, and other applications. Utilizing advanced multi-carrier modulation technology for complex ground environments, it boasts strong anti-interference and penetration capabilities, enabling the transmission of high-definition, stable, low-latency, real-time video image signals while in motion. Suitable for complex ground environments, the two-way wireless video transmission device can be mounted on vehicles, firefighting robots, public security robots, drones, and other facilities.
[0003] Under the premise of achieving the same function, the smaller and lighter the device, the stronger its adaptability to the environment, and the more application areas and scenarios it can be used in. Wireless image transmission transceivers are power-consuming devices that generate heat. Ordinary heat dissipation shells are either too large and heavy to meet the requirements of small size and light weight for two-way wireless image transmission devices, or they have low heat dissipation efficiency and cannot dissipate heat quickly, causing the module temperature to be too high, affecting transmission efficiency or even burning out the device. Utility Model Content
[0004] The purpose of this invention is to provide a high-efficiency heat dissipation housing for a two-way wireless image transmission circuit board to solve the above-mentioned technical problems.
[0005] To achieve the above objectives, the specific technical solution of the high-efficiency heat dissipation shell for a two-way wireless image transmission circuit board of this utility model is as follows:
[0006] A high-efficiency heat dissipation housing for a two-way wireless image transmission circuit board includes a square housing that matches the size of the circuit board. The housing comprises an upper shell and a lower shell, with a cavity between the upper and lower shells to accommodate the circuit board. The circuit board is tightly fitted between the upper and lower shells and transfers heat through them. A fan is installed at the center of the upper shell, and a multi-channel structure is formed on both sides of the fan. Multiple heat dissipation channels are provided on the lower half of the lower shell. The multi-channel structure on the upper shell and below the fan has multiple through-holes for dissipating heat. These through-holes are used to introduce the fan's airflow into the heat dissipation channels of the lower shell, thereby removing heat from the wireless image transmission module and reducing the weight of the housing.
[0007] Furthermore, the multi-air duct structure includes multiple baffles, and air ducts are formed between the baffles. The air ducts include horizontal air ducts and vertical air ducts. The horizontal air ducts are arranged on both sides of the fan to direct the fan's airflow to both sides. The vertical air ducts are arranged at the upper and lower ends of the horizontal air ducts to diffuse the fan's airflow to the upper and lower ends of the housing.
[0008] Furthermore, the baffle of the vertical air duct is designed with an arc near the horizontal air duct to guide the airflow. The arcs of the baffles on the left and right sides are opposite, with the center of the arc facing the middle of the housing, thus realizing the structure of guiding the airflow from the center to both sides of the fan.
[0009] Furthermore, the lower shell has multiple mounting holes, and screws pass through the mounting holes on the lower shell and the fixing holes on the inner side of the upper shell to fix the upper shell and the lower shell together.
[0010] Furthermore, the upper part of the housing is a mounting position for a two-way wireless image transmission circuit board, and the upper part of the lower housing has multiple grooves on its surface to reduce the overall weight of the housing.
[0011] Furthermore, the heat dissipation holes are arranged in the air ducts on the left and right sides of the lower half of the housing, with multiple holes arranged in one air duct.
[0012] Furthermore, the upper end of the housing has antenna mounting threads on both sides for mounting the antenna.
[0013] Furthermore, the lower end of the housing has multiple interface grooves for housing multiple interfaces of the bidirectional wireless image transmission circuit board.
[0014] Furthermore, the casing is made of a metal material with high thermal conductivity.
[0015] The high-efficiency heat dissipation housing of the bidirectional wireless image transmission circuit board of this utility model has the following advantages: The high-efficiency heat dissipation housing of the bidirectional wireless image transmission circuit board of this utility model is provided with a fan and air duct on the upper shell to improve heat dissipation efficiency. At the same time, heat dissipation through holes are provided in the air duct to introduce the airflow of the fan into the heat dissipation air duct of the lower shell. The heat of the wireless image transmission module is carried away through the heat dissipation air duct, which can reduce the weight of the housing and further improve heat dissipation efficiency. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the upper shell structure of this utility model;
[0017] Figure 2 This is a schematic diagram of the lower shell structure of this utility model;
[0018] Figure 3 This is a schematic diagram of the lower end structure of the shell of this utility model;
[0019] The markings in the diagram are as follows: 11. Upper shell; 12. Lower shell; 2. Fan; 3. Multi-air duct structure; 31. Baffle; 32. Air duct; 321. Horizontal air duct; 322. Vertical air duct; 4. Mounting hole; 5. Heat dissipation air duct; 6. Groove; 7. Heat dissipation through hole; 8. Antenna mounting thread; 9. Interface groove. Detailed Implementation
[0020] To better understand the purpose, structure, and function of this utility model, the following description, in conjunction with the accompanying drawings, provides a more detailed account of a high-efficiency heat dissipation housing for a two-way wireless image transmission circuit board.
[0021] like Figure 1-3 As shown, the present invention discloses a high-efficiency heat dissipation housing for a bidirectional wireless image transmission circuit board, comprising a housing, the housing being square in shape and matching the size of the bidirectional wireless image transmission circuit board, the housing comprising an upper shell 11 and a lower shell 12, wherein there is a cavity between the upper shell 11 and the lower shell 12 to accommodate the bidirectional wireless image transmission circuit board, the housing being made of a metal material with high thermal conductivity, the bidirectional wireless image transmission circuit board being tightly fitted between the upper shell 11 and the lower shell 12, and heat being transferred through the upper shell 11 and the lower shell 12.
[0022] A fan 2 is installed at the center of the upper shell 11. A multi-air duct structure 3 is formed on both sides of the fan 2. The air generated by the fan 2 is diffused to the entire surface of the shell through the multi-air duct structure 3 and flows out to both sides, improving the heat dissipation efficiency. The multi-air duct structure 3 includes multiple baffles 31, and air ducts 32 are formed between the baffles 31. The air ducts 32 include horizontal air ducts 321 and vertical air ducts 322. The horizontal air ducts 321 are located on both sides of the fan 2 to direct the air from the fan 2 to both sides. The vertical air ducts 322 are located at the upper and lower ends of the horizontal air ducts 321 to diffuse the air from the fan 2 to the upper and lower ends of the shell.
[0023] In order for the airflow of fan 2 to enter the vertical air duct 322 well, the baffle 31 of the vertical air duct 322 is designed with an arc near the horizontal air duct 321 to guide the airflow. The left and right baffles 31 have opposite arcs, with the center of the arc facing the middle of the housing, so as to realize the structure of guiding the airflow of fan 2 from the center to both sides, which further improves the heat dissipation efficiency.
[0024] The lower shell 12 has multiple mounting holes 4. The upper shell 11 and the lower shell 12 are fixedly connected through the mounting holes 4. Specifically, screws pass through the mounting holes 4 on the lower shell 12 and the fixing holes on the inside of the upper shell 11 to fix the upper shell 11 and the lower shell 12.
[0025] The upper half of the housing is the mounting position for the bidirectional wireless image transmission circuit board. The upper half of the lower housing 12 has multiple grooves 6 to reduce the overall weight of the housing. To further improve heat dissipation, the lower half of the lower housing 12 has multiple heat dissipation ducts 5. The multi-duct structure 3 on the upper housing 11 and below the fan 2 has multiple through-holes 7. These through-holes 7 direct the airflow from the fan 2 into the heat dissipation ducts 5 of the lower housing 12, carrying away the heat from the wireless image transmission module and reducing the weight of the housing. Specifically, the heat dissipation holes 7 are located within the air ducts 32 on the left and right sides of the lower half of the housing, with multiple holes within each air duct 32.
[0026] The upper end of the housing has antenna mounting threads 8 on both sides for mounting the antenna. The lower end of the housing has multiple interface grooves 9 for accommodating multiple interfaces of the bidirectional wireless image transmission circuit board, including power interface, communication serial port, network interface, etc.
[0027] It is understood that this utility model has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this utility model. Furthermore, under the teachings of this utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of this utility model.
Claims
1. A high efficiency heat dissipation enclosure for a two-way wireless graphic transmission circuit board, comprising a housing, the housing is square-shaped and matches the size of the two-way wireless graphic transmission circuit board, the housing comprises an upper housing (11) and a lower housing (12), a cavity for accommodating the two-way wireless graphic transmission circuit board is formed between the upper housing (11) and the lower housing (12), the two-way wireless graphic transmission circuit board is tightly fitted between the upper housing (11) and the lower housing (12) and transfers heat through the upper housing (11) and the lower housing (12), characterized in that, The upper shell (11) is centrally provided with a fan (2), and a plurality of air duct structures (3) are formed on both sides of the fan (2); a plurality of heat dissipation air ducts (5) are arranged on the lower half of the lower shell (12); a plurality of heat dissipation through holes (7) are arranged in the air duct structures (3) on the upper shell (11) and on the lower side of the fan (2), and the heat dissipation through holes (7) are used to guide the air flow of the fan (2) into the heat dissipation air ducts (5) of the lower shell (12), so as to take away the heat of the wireless map transmission module and reduce the weight of the shell.
2. The high efficiency heat dissipating enclosure for a two-way wireless graphic transmission circuit board of claim 1, wherein, The plurality of air duct structures (3) include a plurality of baffles (31), and the baffles (31) form air ducts (32) therebetween; the air ducts (32) include horizontal air ducts (321) and vertical air ducts (322); the horizontal air ducts (321) are arranged on both sides of the fan (2) and are used to guide the air flow of the fan (2) to both sides; and the vertical air ducts (322) are arranged at the upper and lower ends of the horizontal air ducts (321) and are used to diffuse the air flow of the fan (2) to the upper and lower ends of the shell.
3. The high efficiency heat dissipating enclosure for a two-way wireless graphic transmission circuit board of claim 2, wherein, The baffles (31) of the vertical air ducts (322) are designed with an arc at a position close to the horizontal air ducts (321), so as to play a guiding role, and the arcs of the baffles (31) on the left and right sides are opposite, the arc centers are directed to the middle of the shell, and the structure of guiding the air flow of the fan (2) from the center to both sides is realized.
4. The high efficiency heat dissipating enclosure for two-way wireless graphic transmission circuit board of claim 1, wherein, The lower shell (12) is provided with a plurality of mounting holes (4), and screws pass through the mounting holes (4) on the lower shell (12) and are connected with fixing holes in the inner side of the upper shell (11), so as to fixedly connect the upper shell (11) and the lower shell (12).
5. The high efficiency heat dissipating enclosure for two-way wireless graphic transmission circuit boards of claim 1, wherein, The upper half of the shell is a two-way wireless map transmission circuit board mounting position, and a plurality of grooves (6) are arranged on the upper half of the lower shell (12), so as to reduce the overall weight of the shell.
6. The high efficiency heat dissipating enclosure for two-way wireless graphic transmission circuit boards of claim 1, wherein, The heat dissipation through holes (7) are arranged in the air ducts (32) on the left and right sides of the lower half of the shell, and a plurality of heat dissipation through holes (7) are arranged in one air duct (32).
7. The high efficiency heat dissipating enclosure for two-way wireless graphic transmission circuit boards of claim 1, wherein, The upper end of the shell is provided with antenna mounting threads (8) on both sides, which are used to mount antennas.
8. The high efficiency heat dissipating enclosure for two-way wireless graphic transmission circuit boards of claim 1, wherein, The lower end of the shell is provided with a plurality of interface grooves (9), which are used to place a plurality of interfaces of the two-way wireless map transmission circuit board.
9. The high efficiency heat dissipating enclosure for two-way wireless graphic transmission circuit boards of claim 1, wherein, The shell is made of a metal material with high thermal conductivity.